JP2013545889A5 - - Google Patents

Download PDF

Info

Publication number
JP2013545889A5
JP2013545889A5 JP2013532892A JP2013532892A JP2013545889A5 JP 2013545889 A5 JP2013545889 A5 JP 2013545889A5 JP 2013532892 A JP2013532892 A JP 2013532892A JP 2013532892 A JP2013532892 A JP 2013532892A JP 2013545889 A5 JP2013545889 A5 JP 2013545889A5
Authority
JP
Japan
Prior art keywords
substrate
dimethylsilane
chamber
substep
hours
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2013532892A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013545889A (ja
JP5710770B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2011/054835 external-priority patent/WO2012047945A2/en
Publication of JP2013545889A publication Critical patent/JP2013545889A/ja
Publication of JP2013545889A5 publication Critical patent/JP2013545889A5/ja
Application granted granted Critical
Publication of JP5710770B2 publication Critical patent/JP5710770B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2013532892A 2010-10-05 2011-10-05 耐摩耗性コーティングの製造方法 Active JP5710770B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US38977710P 2010-10-05 2010-10-05
US61/389,777 2010-10-05
US201161507650P 2011-07-14 2011-07-14
US61/507,650 2011-07-14
PCT/US2011/054835 WO2012047945A2 (en) 2010-10-05 2011-10-05 Wear resistant coating, article, and method

Publications (3)

Publication Number Publication Date
JP2013545889A JP2013545889A (ja) 2013-12-26
JP2013545889A5 true JP2013545889A5 (enExample) 2015-01-15
JP5710770B2 JP5710770B2 (ja) 2015-04-30

Family

ID=44936522

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013532892A Active JP5710770B2 (ja) 2010-10-05 2011-10-05 耐摩耗性コーティングの製造方法

Country Status (6)

Country Link
US (3) US10604660B2 (enExample)
EP (1) EP2625307B1 (enExample)
JP (1) JP5710770B2 (enExample)
KR (3) KR101854162B1 (enExample)
CN (1) CN103237920B (enExample)
WO (1) WO2012047945A2 (enExample)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5735522B2 (ja) 2009-10-27 2015-06-17 シルコテック コーポレイション 化学気相成長コーティング、物品、及び方法
WO2012047945A2 (en) 2010-10-05 2012-04-12 Silcotek Corp. Wear resistant coating, article, and method
US9340880B2 (en) 2009-10-27 2016-05-17 Silcotek Corp. Semiconductor fabrication process
US9975143B2 (en) 2013-05-14 2018-05-22 Silcotek Corp. Chemical vapor deposition functionalization
US20150030885A1 (en) * 2013-07-29 2015-01-29 Silcotek Corp. Coated article and chemical vapor deposition process
US11292924B2 (en) * 2014-04-08 2022-04-05 Silcotek Corp. Thermal chemical vapor deposition coated article and process
SG10201506024WA (en) * 2014-08-21 2016-03-30 Silcotek Corp Semiconductor fabrication process
US9915001B2 (en) 2014-09-03 2018-03-13 Silcotek Corp. Chemical vapor deposition process and coated article
SG10201506694QA (en) * 2014-09-03 2016-04-28 Silcotek Corp Chemical vapor deposition process and coated article
US10316408B2 (en) * 2014-12-12 2019-06-11 Silcotek Corp. Delivery device, manufacturing system and process of manufacturing
US20160289824A1 (en) * 2015-04-01 2016-10-06 Silcotek Corp. Article including a coating and process including an article with a coating
US20160289585A1 (en) * 2015-04-01 2016-10-06 Silcotek Corp. Thermal chemical vapor deposition coated product and process of using a thermal vapor deposition coated product
US20160289124A1 (en) * 2015-04-01 2016-10-06 Silcotek Corp. Thermal chemical vapor deposition product and process of using a thermal chemical vapor deposition product
WO2017040623A1 (en) 2015-09-01 2017-03-09 Silcotek Corp. Thermal chemical vapor deposition coating
US10029346B2 (en) * 2015-10-16 2018-07-24 Applied Materials, Inc. External clamp ring for a chemical mechanical polishing carrier head
US10519854B2 (en) 2015-11-20 2019-12-31 Tenneco Inc. Thermally insulated engine components and method of making using a ceramic coating
US10578050B2 (en) 2015-11-20 2020-03-03 Tenneco Inc. Thermally insulated steel piston crown and method of making using a ceramic coating
GB201520964D0 (en) * 2015-11-27 2016-01-13 Porvair Filtration Group Ltd Filtration material and method of manufacture thereof
US10323321B1 (en) 2016-01-08 2019-06-18 Silcotek Corp. Thermal chemical vapor deposition process and coated article
US10487403B2 (en) * 2016-12-13 2019-11-26 Silcotek Corp Fluoro-containing thermal chemical vapor deposition process and article
US11161324B2 (en) * 2017-09-13 2021-11-02 Silcotek Corp. Corrosion-resistant coated article and thermal chemical vapor deposition coating process
US11709155B2 (en) 2017-09-18 2023-07-25 Waters Technologies Corporation Use of vapor deposition coated flow paths for improved chromatography of metal interacting analytes
US12181452B2 (en) 2017-09-18 2024-12-31 Waters Technologies Corporation Use of vapor deposition coated flow paths for improved chromatography of metal interacting analytes
US11709156B2 (en) 2017-09-18 2023-07-25 Waters Technologies Corporation Use of vapor deposition coated flow paths for improved analytical analysis
US12180581B2 (en) 2017-09-18 2024-12-31 Waters Technologies Corporation Use of vapor deposition coated flow paths for improved chromatography of metal interacting analytes
WO2020112938A1 (en) * 2018-11-29 2020-06-04 Silcotek Corp Fluid contact process, coated article, and coating process
EP3930867B1 (en) 2019-02-27 2025-11-12 Waters Technologies Corporation Chromatographic seal and coated flow paths for minimizing analyte adsorption
WO2020252306A1 (en) 2019-06-14 2020-12-17 Silcotek Corp. Nano-wire growth
WO2021081287A1 (en) 2019-10-25 2021-04-29 Nusil Technology Llc Silicone compositions and methods related thereto
US11918936B2 (en) 2020-01-17 2024-03-05 Waters Technologies Corporation Performance and dynamic range for oligonucleotide bioanalysis through reduction of non specific binding
US12473635B2 (en) 2020-06-03 2025-11-18 Silcotek Corp. Dielectric article
WO2022026070A1 (en) 2020-07-30 2022-02-03 Silcotek Corp. Heat exchanger process
US20220073754A1 (en) * 2020-09-04 2022-03-10 Silcotek Corp. Coated medical device product and process
US12352734B2 (en) 2020-09-24 2025-07-08 Waters Technologies Corporation Chromatographic hardware improvements for separation of reactive molecules
US20220136110A1 (en) * 2020-10-30 2022-05-05 Silcotek Corp. De-icing process and product
CN118414209A (zh) * 2021-11-03 2024-07-30 西尔科特克公司 具有暴露于高于600摄氏度的温度的含非晶硅涂层的工艺、部件和系统

Family Cites Families (133)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2523257C2 (de) 1975-05-26 1982-10-28 Siemens AG, 1000 Berlin und 8000 München Verfahren zur Beschichtung von Innenflächen bei rohrförmigen Hohlkörpern mit Tantal durch chemische Dampfphasenabscheidung
FR2371524A1 (fr) 1976-11-18 1978-06-16 Alsthom Atlantique Procede de depot d'une couche mince par decomposition d'un gaz dans un plasma
DE2829568C2 (de) 1978-07-05 1982-12-02 Fa. Hermann C. Starck Berlin, 1000 Berlin Verfahren zur Abscheidung von gleichmäßigen, festhaftenden Schichten hochschmelzender Metalle auf induktiv erhitzten Metallrohr-Innenflächen durch Gasphasenreduktion sowie Vorrichtung zur Durchführung des Verfahrens
US4402997A (en) 1982-05-17 1983-09-06 Motorola, Inc. Process for improving nitride deposition on a semiconductor wafer by purging deposition tube with oxygen
US4560589A (en) 1982-09-22 1985-12-24 Shin-Etsu Chemical Co., Ltd. Method for providing a coating layer of silicon carbide on substrate surface
US4579752A (en) 1984-10-29 1986-04-01 At&T Bell Laboratories Enhanced corrosion resistance of metal surfaces
US4671997A (en) 1985-04-08 1987-06-09 United Technologies Corporation Gas turbine composite parts
US4714632A (en) 1985-12-11 1987-12-22 Air Products And Chemicals, Inc. Method of producing silicon diffusion coatings on metal articles
US4792460A (en) 1986-07-15 1988-12-20 Electric Power Research Institute, Inc. Method for production of polysilanes and polygermanes, and deposition of hydrogenated amorphous silicon, alloys thereof, or hydrogenated amorphous germanium
US4741964A (en) 1986-07-17 1988-05-03 International Business Machines Corporation Structure containing hydrogenated amorphous silicon and process
US4684542A (en) 1986-08-11 1987-08-04 International Business Machines Corporation Low pressure chemical vapor deposition of tungsten silicide
GB2195663B (en) 1986-08-15 1990-08-22 Nippon Telegraph & Telephone Chemical vapour deposition method and apparatus therefor
US4720395A (en) 1986-08-25 1988-01-19 Anicon, Inc. Low temperature silicon nitride CVD process
US4749631B1 (en) 1986-12-04 1993-03-23 Multilayer ceramics from silicate esters
US4753856A (en) 1987-01-02 1988-06-28 Dow Corning Corporation Multilayer ceramic coatings from silicate esters and metal oxides
JPH01206629A (ja) * 1988-02-15 1989-08-18 Toshiba Corp 薄膜の形成方法
US4842888A (en) 1988-04-07 1989-06-27 Dow Corning Corporation Ceramic coatings from the pyrolysis in ammonia of mixtures of silicate esters and other metal oxide precursors
JPH089766B2 (ja) 1989-07-10 1996-01-31 大同ほくさん株式会社 鋼の窒化方法
US5160544A (en) 1990-03-20 1992-11-03 Diamonex Incorporated Hot filament chemical vapor deposition reactor
US5128515A (en) 1990-05-21 1992-07-07 Tokyo Electron Sagami Limited Heating apparatus
US5270082A (en) * 1991-04-15 1993-12-14 Lin Tyau Jeen Organic vapor deposition process for corrosion protection of metal substrates
FR2675947A1 (fr) 1991-04-23 1992-10-30 France Telecom Procede de passivation locale d'un substrat par une couche de carbone amorphe hydrogene et procede de fabrication de transistors en couches minces sur ce substrat passive.
TW203633B (enExample) 1991-06-03 1993-04-11 L Air Liquide Sa Pour L Expl Des Proce
EP0552375B1 (en) 1991-07-16 2004-06-02 Seiko Epson Corporation Method of forming a semiconductor film with a chemical vapor deposition apparatus
US5208069A (en) 1991-10-28 1993-05-04 Istituto Guido Donegani S.P.A. Method for passivating the inner surface by deposition of a ceramic coating of an apparatus subject to coking, apparatus prepared thereby, and method of utilizing apparatus prepared thereby
US5374412A (en) 1992-07-31 1994-12-20 Cvd, Inc. Highly polishable, highly thermally conductive silicon carbide
CA2104340A1 (en) 1992-08-31 1994-03-01 Grish Chandra Hermetic protection for integrated circuits
US5825078A (en) 1992-09-23 1998-10-20 Dow Corning Corporation Hermetic protection for integrated circuits
US5249554A (en) * 1993-01-08 1993-10-05 Ford Motor Company Powertrain component with adherent film having a graded composition
US5299731A (en) 1993-02-22 1994-04-05 L'air Liquide Corrosion resistant welding of stainless steel
TW347149U (en) 1993-02-26 1998-12-01 Dow Corning Integrated circuits protected from the environment by ceramic and barrier metal layers
US5465680A (en) * 1993-07-01 1995-11-14 Dow Corning Corporation Method of forming crystalline silicon carbide coatings
EP0653501B1 (en) 1993-11-11 1998-02-04 Nissin Electric Company, Limited Plasma-CVD method and apparatus
US5413813A (en) 1993-11-23 1995-05-09 Enichem S.P.A. CVD of silicon-based ceramic materials on internal surface of a reactor
US5818071A (en) 1995-02-02 1998-10-06 Dow Corning Corporation Silicon carbide metal diffusion barrier layer
US5756404A (en) 1995-12-07 1998-05-26 Micron Technologies, Inc. Two-step nitride deposition
US5939333A (en) 1996-05-30 1999-08-17 Micron Technology, Inc. Silicon nitride deposition method
US5997742A (en) 1996-11-13 1999-12-07 Transgenomic, Inc. Method for performing polynucleotide separations using liquid chromatography
US5994675A (en) 1997-03-07 1999-11-30 Semitool, Inc. Semiconductor processing furnace heating control system
US6021152A (en) 1997-07-11 2000-02-01 Asm America, Inc. Reflective surface for CVD reactor walls
US5874368A (en) 1997-10-02 1999-02-23 Air Products And Chemicals, Inc. Silicon nitride from bis(tertiarybutylamino)silane
US6566281B1 (en) 1997-10-15 2003-05-20 International Business Machines Corporation Nitrogen-rich barrier layer and structures formed
JP4166346B2 (ja) 1997-10-27 2008-10-15 日本碍子株式会社 耐蝕性部材、耐蝕性部材の製造方法および腐食性物質の加熱装置
US5981403A (en) 1997-11-24 1999-11-09 Lucent Technologies, Inc. Layered silicon nitride deposition process
FI104383B (fi) 1997-12-09 2000-01-14 Fortum Oil & Gas Oy Menetelmä laitteistojen sisäpintojen päällystämiseksi
US6511760B1 (en) 1998-02-27 2003-01-28 Restek Corporation Method of passivating a gas vessel or component of a gas transfer system using a silicon overlay coating
US6159871A (en) 1998-05-29 2000-12-12 Dow Corning Corporation Method for producing hydrogenated silicon oxycarbide films having low dielectric constant
IL125690A0 (en) 1998-08-06 1999-04-11 Reiser Raphael Joshua Furnace for processing semiconductor wafers
US6258454B1 (en) 1998-09-01 2001-07-10 Agilent Technologies Inc. Functionalization of substrate surfaces with silane mixtures
US6444326B1 (en) * 1999-03-05 2002-09-03 Restek Corporation Surface modification of solid supports through the thermal decomposition and functionalization of silanes
CA2303732C (en) 1999-04-09 2010-05-25 Daido Tokushuko Kabushiki Kaisha Multi-layered anti-coking heat resisting metal tube and the method for manufacturing thereof
US6312808B1 (en) 1999-05-03 2001-11-06 Guardian Industries Corporation Hydrophobic coating with DLC & FAS on substrate
US6338901B1 (en) 1999-05-03 2002-01-15 Guardian Industries Corporation Hydrophobic coating including DLC on substrate
US6277480B1 (en) 1999-05-03 2001-08-21 Guardian Industries Corporation Coated article including a DLC inclusive layer(s) and a layer(s) deposited using siloxane gas, and corresponding method
US6406793B1 (en) * 1999-09-22 2002-06-18 Shin-Etsu Chemical Co., Ltd. Addition-reaction silicone pressure sensitive adhesive composition
US6472076B1 (en) 1999-10-18 2002-10-29 Honeywell International Inc. Deposition of organosilsesquioxane films
JP2001207123A (ja) 1999-11-16 2001-07-31 Sentan Kagaku Gijutsu Incubation Center:Kk 高硬度高滑水性膜およびその製造方法
KR100338361B1 (ko) 2000-01-28 2002-05-30 유승렬 탄화수소 열분해 반응기 튜브 내벽에 코크의 저감을 위한온라인 코팅 방법
EP1123991A3 (en) 2000-02-08 2002-11-13 Asm Japan K.K. Low dielectric constant materials and processes
FR2805583B1 (fr) * 2000-02-28 2002-05-17 Renault Piece de friction metallique comportant une couche a proprietes de frottement et d'usure ameliorees
US6458718B1 (en) 2000-04-28 2002-10-01 Asm Japan K.K. Fluorine-containing materials and processes
US6630413B2 (en) 2000-04-28 2003-10-07 Asm Japan K.K. CVD syntheses of silicon nitride materials
KR20010106905A (ko) 2000-05-24 2001-12-07 황 철 주 저유전율 ＳｉＯＣ 박막의 형성방법
JP4484185B2 (ja) 2000-08-29 2010-06-16 コバレントマテリアル株式会社 シリコン半導体基板の化学的気相薄膜成長方法
US6531398B1 (en) 2000-10-30 2003-03-11 Applied Materials, Inc. Method of depositing organosillicate layers
US6765178B2 (en) 2000-12-29 2004-07-20 Applied Materials, Inc. Chamber for uniform substrate heating
US6998579B2 (en) 2000-12-29 2006-02-14 Applied Materials, Inc. Chamber for uniform substrate heating
WO2002080244A2 (en) 2001-02-12 2002-10-10 Asm America, Inc. Improved process for deposition of semiconductor films
US6531415B1 (en) 2002-01-30 2003-03-11 Taiwan Semiconductor Manufacturing Company Silicon nitride furnace tube low temperature cycle purge for attenuated particle formation
US6936309B2 (en) 2002-04-02 2005-08-30 Applied Materials, Inc. Hardness improvement of silicon carboxy films
EP1504138A2 (en) 2002-05-08 2005-02-09 Applied Materials, Inc. Method for using low dielectric constant film by electron beam
US20070243317A1 (en) 2002-07-15 2007-10-18 Du Bois Dale R Thermal Processing System and Configurable Vertical Chamber
US6808745B2 (en) 2002-08-22 2004-10-26 Eastman Kodak Company Method of coating micro-electromechanical devices
JP4358492B2 (ja) 2002-09-25 2009-11-04 レール・リキード−ソシエテ・アノニム・プール・レテュード・エ・レクスプロワタシオン・デ・プロセデ・ジョルジュ・クロード 熱化学気相成長法によるシリコン窒化物膜またはシリコンオキシ窒化物膜の製造方法
JP4148759B2 (ja) 2002-11-13 2008-09-10 三井化学株式会社 ガスバリアフィルムの製造方法
GB2395492A (en) 2002-11-25 2004-05-26 Thermo Electron Corp Improvements in deposition methods for the production of semiconductors
US7070833B2 (en) 2003-03-05 2006-07-04 Restek Corporation Method for chemical vapor deposition of silicon on to substrates for use in corrosive and vacuum environments
JP4300876B2 (ja) * 2003-05-28 2009-07-22 株式会社Ｉｈｉ 摺動部材及びその製造方法
US20050271893A1 (en) * 2004-06-04 2005-12-08 Applied Microstructures, Inc. Controlled vapor deposition of multilayered coatings adhered by an oxide layer
WO2005053828A2 (en) 2003-11-07 2005-06-16 Ahwahnee Technology, Inc. Systems and methods for manufacture of carbon nanotubes
CA2546898C (en) 2003-11-20 2016-11-22 Sigma-Aldrich Co. Polysilazane thermosetting polymers for use in chromatographic systems and applications
WO2006008941A1 (ja) 2004-07-22 2006-01-26 Toyo Tanso Co., Ltd. サセプタ
JP4470023B2 (ja) 2004-08-20 2010-06-02 レール・リキード−ソシエテ・アノニム・プール・レテュード・エ・レクスプロワタシオン・デ・プロセデ・ジョルジュ・クロード シリコン窒化物膜の製造方法
US7867627B2 (en) 2004-12-13 2011-01-11 Silcotek Corporation Process for the modification of substrate surfaces through the deposition of amorphous silicon layers followed by surface functionalization with organic molecules and functionalized structures
US7678712B2 (en) 2005-03-22 2010-03-16 Honeywell International, Inc. Vapor phase treatment of dielectric materials
US7875556B2 (en) 2005-05-16 2011-01-25 Air Products And Chemicals, Inc. Precursors for CVD silicon carbo-nitride and silicon nitride films
US20070042118A1 (en) 2005-08-22 2007-02-22 Yoo Woo S Encapsulated thermal processing
KR100672829B1 (ko) 2005-08-31 2007-01-22 삼성전자주식회사 전하 트랩 절연체의 제조 방법 및 소노스 타입의 비휘발성메모리 장치의 제조방법
GB2452190B (en) * 2006-05-17 2011-12-28 G & H Technologies Llc Wear resistant depositied coating, method of coating deposition and applications therefor
US7902080B2 (en) 2006-05-30 2011-03-08 Applied Materials, Inc. Deposition-plasma cure cycle process to enhance film quality of silicon dioxide
US7429717B2 (en) 2006-07-12 2008-09-30 Applied Materials, Inc. Multizone heater for furnace
ITMI20062030A1 (it) 2006-10-23 2008-04-24 Calzoni Srl Apparecchiatura di guida per la movimentazione di supporti porta sensori e simili di sommergibili
US7860379B2 (en) 2007-01-15 2010-12-28 Applied Materials, Inc. Temperature measurement and control of wafer support in thermal processing chamber
SE0701028L (sv) * 2007-04-27 2008-10-28 Sandvik Intellectual Property Skär
WO2009032488A1 (en) * 2007-08-28 2009-03-12 International Business Machines Corporation Improved low k porous sicoh dielectric and integration with post film formation treatment
US20090078202A1 (en) 2007-09-26 2009-03-26 Neocera, Llc Substrate heater for material deposition
US7964442B2 (en) * 2007-10-09 2011-06-21 Applied Materials, Inc. Methods to obtain low k dielectric barrier with superior etch resistivity
US8278205B2 (en) 2008-03-12 2012-10-02 Tokyo Electron Limited Semiconductor device and method for manufacturing the same
CN102171384B (zh) * 2008-05-28 2013-12-25 乔治洛德方法研究和开发液化空气有限公司 碳化硅基抗反射涂层
CA2739920C (en) 2008-10-07 2017-12-12 Ross Technology Corporation Spill-resistant surfaces having hydrophobic and oleophobic borders
FR2940966B1 (fr) 2009-01-09 2011-03-04 Saint Gobain Substrat hydrophobe comprenant un primage du type oxycarbure de silicium active par plasma
US8536491B2 (en) 2009-03-24 2013-09-17 Taiwan Semiconductor Manufacturing Co., Ltd. Rotatable and tunable heaters for semiconductor furnace
JP5716663B2 (ja) 2009-04-30 2015-05-13 コニカミノルタ株式会社 防汚性積層体
GB2471271A (en) 2009-06-19 2010-12-29 Univ Dublin City Method of coating the channels of a microfluidic device
US8980382B2 (en) 2009-12-02 2015-03-17 Applied Materials, Inc. Oxygen-doping for non-carbon radical-component CVD films
US9340880B2 (en) 2009-10-27 2016-05-17 Silcotek Corp. Semiconductor fabrication process
JP5735522B2 (ja) 2009-10-27 2015-06-17 シルコテック コーポレイション 化学気相成長コーティング、物品、及び方法
WO2012047945A2 (en) 2010-10-05 2012-04-12 Silcotek Corp. Wear resistant coating, article, and method
CN102844848A (zh) 2010-03-05 2012-12-26 应用材料公司 通过自由基成分化学气相沉积的共形层
US20110259879A1 (en) 2010-04-22 2011-10-27 Applied Materials, Inc. Multi-Zone Induction Heating for Improved Temperature Uniformity in MOCVD and HVPE Chambers
JP5337269B2 (ja) 2010-04-27 2013-11-06 東京エレクトロン株式会社 アモルファスシリコン膜の成膜方法および成膜装置
JP4967066B2 (ja) 2010-04-27 2012-07-04 東京エレクトロン株式会社 アモルファスシリコン膜の成膜方法および成膜装置
TWI432191B (zh) 2010-06-11 2014-04-01 Taiwan Sunpan Biotechnology Dev Co Ltd 分離自藤黃樹脂的化合物以及包含有此等化合物的藥學組成物
US8552346B2 (en) 2011-05-20 2013-10-08 Applied Materials, Inc. Methods and apparatus for controlling temperature of a multi-zone heater in an process chamber
JP6256953B2 (ja) 2012-03-26 2018-01-10 シルコテック コーポレーション コーティングされた物品及び化学蒸着方法
JP2013227628A (ja) 2012-04-26 2013-11-07 Kojima Press Industry Co Ltd 樹脂製品の製造方法並びに樹脂製品
USD689107S1 (en) 2012-11-19 2013-09-03 Silcotek Corp. Weldment fixture
USD713024S1 (en) 2012-11-19 2014-09-09 Silcotek Corp. Chemical vapor deposition fixture
WO2014123084A1 (ja) 2013-02-07 2014-08-14 ピーエスフォー ルクスコ エスエイアールエル 半導体装置およびその製造方法
JP6125279B2 (ja) 2013-03-05 2017-05-10 株式会社日立国際電気 半導体装置の製造方法、基板処理装置およびプログラム
US9975143B2 (en) 2013-05-14 2018-05-22 Silcotek Corp. Chemical vapor deposition functionalization
US20150024152A1 (en) 2013-07-19 2015-01-22 Agilent Technologies, Inc. Metal components with inert vapor phase coating on internal surfaces
US20150030885A1 (en) 2013-07-29 2015-01-29 Silcotek Corp. Coated article and chemical vapor deposition process
US11292924B2 (en) 2014-04-08 2022-04-05 Silcotek Corp. Thermal chemical vapor deposition coated article and process
KR102396247B1 (ko) 2014-08-12 2022-05-09 도쿄엘렉트론가부시키가이샤 기판 처리 방법
US9915001B2 (en) 2014-09-03 2018-03-13 Silcotek Corp. Chemical vapor deposition process and coated article
US10316408B2 (en) 2014-12-12 2019-06-11 Silcotek Corp. Delivery device, manufacturing system and process of manufacturing
US20160354758A1 (en) 2015-06-03 2016-12-08 Tadeusz Gorecki Thermally Modified Polymeric Organosilicon Material, Method for Preparing Said Material and the Uses Thereof
GB201520964D0 (en) 2015-11-27 2016-01-13 Porvair Filtration Group Ltd Filtration material and method of manufacture thereof
US10087521B2 (en) 2015-12-15 2018-10-02 Silcotek Corp. Silicon-nitride-containing thermal chemical vapor deposition coating
US10323321B1 (en) 2016-01-08 2019-06-18 Silcotek Corp. Thermal chemical vapor deposition process and coated article
US10487403B2 (en) 2016-12-13 2019-11-26 Silcotek Corp Fluoro-containing thermal chemical vapor deposition process and article
US11709155B2 (en) 2017-09-18 2023-07-25 Waters Technologies Corporation Use of vapor deposition coated flow paths for improved chromatography of metal interacting analytes

Similar Documents

Publication Publication Date Title
JP2013545889A5 (enExample)
WO2011126748A3 (en) Depositing conformal boron nitride films
WO2007112058A3 (en) Carbon precursors for use during silicon epitaxial firm formation
WO2004079031A3 (en) Chemical vapor deposition of silicon on to substrates
WO2012044622A3 (en) Low-temperature dielectric film formation by chemical vapor deposition
JP2013505368A5 (enExample)
EA201490034A1 (ru) Способ получения оконного стекла, содержащего пористый слой
JP2009071291A5 (enExample)
WO2009149167A3 (en) Low temperature deposition of silicon-containing films
KR20210146421A (ko) 플루오로-어닐링된 필름으로 코팅된 물품
MY156300A (en) A chemical vapour deposition system and process
WO2012092301A3 (en) Method and apparatus for masking substrates for deposition
WO2009042636A3 (en) Method of preparing cross-linked organic glasses for air-gap sacrificial layers
TW201130055A (en) Method for manufacturing oxide semiconductor film and method for manufacturing semiconductor device
PH12012500396A1 (en) Method for cleaning the surface of a silicon substrate
FI3114248T3 (fi) Germaniumin tai germaniumoksidin atomikerroskasvatus
CN109320275B (zh) 一种抗氧化SiC纤维增强陶瓷基复合材料的制备方法
US20130302616A1 (en) Method for coating a graphite material with pyrolytic boron nitride and a coated article obtained by that method
CN107858684B (zh) 金属-类金刚石复合涂层及其制备方法与用途以及涂层工具
JP2012190865A5 (enExample)
CN107604338B (zh) 在绝缘衬底上制备大面积双层石墨烯薄膜的方法
JP2015233137A5 (enExample)
JP2015204434A (ja) サセプタ処理方法及びサセプタ処理用プレート
CN106915975A (zh) 石墨发热体炉内碳素材料表面SiC-C涂层的制备方法
JP2019507083A5 (enExample)