JP2013529853A - オプトエレクトロニクス部品およびその製造方法 - Google Patents
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Abstract
【選択図】図1
Description
Claims (15)
- 活性層(3)を有する半導体積層体(20)を備えた半導体チップ(1)と、金属または金属合金の接合層(14)によって前記半導体チップ(1)に接合されているキャリア(12)と、を有するオプトエレクトロニクス部品であって、
− 前記半導体チップ(1)が、第1の電気接続領域(18)および第2の電気接続領域(19)を備えており、
− 前記第1の電気接続領域(18)および前記第2の電気接続領域(19)が前記キャリア(12)の側にあり、
− 前記キャリア(12)が、前記半導体チップ(1)とは反対側のその裏面に、第1の裏面電気コンタクト(28)および第2の裏面電気コンタクト(29)を備えており、
− 前記第1の裏面電気コンタクト(28)が、前記キャリア(12)を貫いている少なくとも1つのビア(15)によって、前記第1の電気接続領域(18)に導電接続されており、
− 前記第2の裏面電気コンタクト(29)が、前記キャリア(12)を貫いている少なくとも1つのビア(16)によって、前記第2の電気接続領域(19)に導電接続されており、
− 前記第1の裏面電気コンタクト(28)もしくは前記第2の裏面電気コンタクト(29)またはその両方が、それぞれ、前記キャリア(12)を貫いている少なくとも1つのさらなるビア(15,16)によって、前記第1の電気接続領域(18)または前記第2の電気接続領域(19)に接続されている、
オプトエレクトロニクス部品。 - 前記第1の裏面電気コンタクト(28)および前記第2の裏面電気コンタクト(29)の両方が、それぞれ、前記キャリア(12)を貫いている少なくとも2つのビア(15,16)によって、前記第1の電気接続領域(18)または前記第2の電気接続領域(19)に接続されている、
請求項1に記載のオプトエレクトロニクス部品。 - 前記ビア(15,16)の少なくとも1つが、少なくとも30μmの幅を有する、
請求項1または請求項2に記載のオプトエレクトロニクス部品。 - 前記ビア(15,16)の少なくとも1つが、少なくとも60μmの幅を有する、
請求項1から請求項3のいずれかに記載のオプトエレクトロニクス部品。 - − 前記半導体積層体(20)が、n型ドープ半導体領域(2)とp型ドープ半導体領域(4)とを備えており、前記p型ドープ半導体領域(4)が前記キャリアの側にあり、
− 前記半導体チップ(1)が、前記第1の電気接続領域(18)を前記p型ドープ半導体領域(4)に接続している第1の電気接続層(8)を備えており、
− 前記半導体チップ(1)が、前記第2の電気接続領域(19)を前記n型ドープ半導体領域(2)に接続している第2の電気接続層(9)を備えており、
− 前記第2の電気接続層(9)のサブ領域が、少なくとも1つの孔(25)の中に延在しており、前記少なくとも1つの孔(25)が、前記p型ドープ半導体領域(4)と前記活性層(3)とを通って前記n型ドープ半導体領域(2)内まで達している、
請求項1から請求項4のいずれかに記載のオプトエレクトロニクス部品。 - 前記第2の電気接続層(9)が複数のサブ領域を備えており、前記複数のサブ領域が、前記活性層(3)における複数の孔(25)の中を、前記n型ドープ半導体領域(2)内まで延在している、
請求項5に記載のオプトエレクトロニクス部品。 - 前記接合層(14)が、互いに電気的に絶縁されている少なくとも2つのサブ領域(14a,14b)を備えており、前記少なくとも2つのサブ領域(14a,14b)が、電気的絶縁材料(17)によって互いに隔てられている、
請求項1から請求項6のいずれかに記載のオプトエレクトロニクス部品。 - 前記電気的絶縁材料(17)がポリマーである、
請求項7に記載のオプトエレクトロニクス部品。 - 前記ビア(15,16)が、前記接合層(14)と同じ金属または同じ金属合金から形成されている、
請求項1から請求項8のいずれかに記載のオプトエレクトロニクス部品。 - 前記第1の裏面電気コンタクト(28)および前記第2の裏面電気コンタクト(29)が、前記ビア(15,16)と同じ金属または同じ金属合金から形成されている、
請求項1から請求項9のいずれかに記載のオプトエレクトロニクス部品。 - 前記金属または前記金属合金が、Cu、Au、AuSn、またはBiAgを含んでいる、
請求項1から請求項10のいずれかに記載のオプトエレクトロニクス部品。 - 前記金属または前記金属合金に収縮巣が存在しない、
請求項1から請求項11のいずれかに記載のオプトエレクトロニクス部品。 - 請求項1から請求項12のいずれかに記載のオプトエレクトロニクス部品を製造する方法であって、以下の方法ステップ、すなわち、
− 前記キャリア(12)を形成するステップであって、前記キャリア(12)が、前記ビア(15,16)を形成するための複数の開口部(22)を備えている、ステップと、
− 前記半導体チップ(1)を形成するステップであって、前記半導体チップ(1)が前記第1の電気接続領域(18)および前記第2の電気接続領域(19)を備えており、前記第1の電気接続領域(18)と前記第2の電気接続領域(19)が、前記半導体チップ(1)内の凹部(23)によって互いに隔てられている、ステップと、
− 前記凹部(23)に電気的絶縁材料(17)を満たすステップであって、前記電気的絶縁材料(17)が前記接続領域(18,19)のサブ領域の上に突き出すように行われる、ステップと、
− 前記半導体チップ(1)の上に前記キャリア(12)を配置するステップであって、前記接続領域(18,19)の上に突き出している前記電気的絶縁材料(17)がスペーサ層として機能し、したがって前記半導体チップ(1)と前記キャリア(12)との間に空間(24)が生じる、ステップと、
− 前記キャリア(12)における前記開口部(22)を通じて前記空間(24)内に液体金属または液体金属合金を注入するステップであって、前記金属または前記金属合金が、凝固後に前記接合層(14)および前記ビア(15,16)を形成する、ステップと、
を有する、方法。 - 前記接合層(14)および前記ビア(15,16)を形成するときに前記裏面コンタクト(28,29)も形成され、前記開口部(22)の中に前記液体金属または前記液体金属合金を注入する前に、前記キャリア(12)の前記裏面に、パターニングされた層(26)が形成され、前記パターニングされた層(26)が、前記第1の裏面電気コンタクト(28)および前記第2の裏面電気コンタクト(29)を形成するためのマスクとしての役割を果たす、
請求項13に記載の方法。 - 前記電気的絶縁材料(17)がポリマーである、
請求項13または請求項14に記載の方法。
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Application Number | Priority Date | Filing Date | Title |
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DE102010025320.0 | 2010-06-28 | ||
DE102010025320.0A DE102010025320B4 (de) | 2010-06-28 | 2010-06-28 | Optoelektronisches Bauelement und Verfahren zu dessen Herstellung |
PCT/EP2011/058579 WO2012000725A1 (de) | 2010-06-28 | 2011-05-25 | Optoelektronisches bauelement und verfahren zu dessen herstellung |
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JP2013529853A true JP2013529853A (ja) | 2013-07-22 |
JP2013529853A5 JP2013529853A5 (ja) | 2014-07-10 |
JP5947293B2 JP5947293B2 (ja) | 2016-07-06 |
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US (1) | US9263655B2 (ja) |
EP (1) | EP2586068A1 (ja) |
JP (1) | JP5947293B2 (ja) |
KR (1) | KR101781061B1 (ja) |
CN (1) | CN102959741B (ja) |
DE (1) | DE102010025320B4 (ja) |
WO (1) | WO2012000725A1 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2018526828A (ja) * | 2015-09-01 | 2018-09-13 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH | オプトエレクトロニクス半導体部品およびオプトエレクトロニクス半導体部品の製造方法 |
JP2018530148A (ja) * | 2015-09-17 | 2018-10-11 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH | 素子用の支持体、素子、および、支持体または素子の製造方法 |
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- 2011-05-25 CN CN201180031995.2A patent/CN102959741B/zh active Active
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Also Published As
Publication number | Publication date |
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JP5947293B2 (ja) | 2016-07-06 |
EP2586068A1 (de) | 2013-05-01 |
DE102010025320A1 (de) | 2011-12-29 |
KR20130036756A (ko) | 2013-04-12 |
CN102959741B (zh) | 2017-05-10 |
DE102010025320B4 (de) | 2021-11-11 |
CN102959741A (zh) | 2013-03-06 |
US20130187192A1 (en) | 2013-07-25 |
KR101781061B1 (ko) | 2017-09-25 |
WO2012000725A1 (de) | 2012-01-05 |
US9263655B2 (en) | 2016-02-16 |
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