JP2013518433A5 - - Google Patents

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Publication number
JP2013518433A5
JP2013518433A5 JP2012551157A JP2012551157A JP2013518433A5 JP 2013518433 A5 JP2013518433 A5 JP 2013518433A5 JP 2012551157 A JP2012551157 A JP 2012551157A JP 2012551157 A JP2012551157 A JP 2012551157A JP 2013518433 A5 JP2013518433 A5 JP 2013518433A5
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JP
Japan
Prior art keywords
tsvs
integrated circuit
tsv
substrate
circuit device
Prior art date
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Pending
Application number
JP2012551157A
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English (en)
Japanese (ja)
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JP2013518433A (ja
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Publication date
Priority claimed from US12/888,135 external-priority patent/US8294261B2/en
Application filed filed Critical
Publication of JP2013518433A publication Critical patent/JP2013518433A/ja
Publication of JP2013518433A5 publication Critical patent/JP2013518433A5/ja
Pending legal-status Critical Current

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JP2012551157A 2010-01-29 2010-12-17 Ｉｃデバイスのエンハンストされた熱放散のための突出するｔｓｖ Pending JP2013518433A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US29982610P 2010-01-29 2010-01-29
US61/299,826 2010-01-29
US12/888,135 US8294261B2 (en) 2010-01-29 2010-09-22 Protruding TSV tips for enhanced heat dissipation for IC devices
US12/888,135 2010-09-22
PCT/US2010/061033 WO2011093956A2 (en) 2010-01-29 2010-12-17 Protruding tsv tips for enhanced heat dissipation for ic devices

Publications (2)

Publication Number Publication Date
JP2013518433A JP2013518433A (ja) 2013-05-20
JP2013518433A5 true JP2013518433A5 (enExample) 2014-02-06

Family

ID=44320033

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012551157A Pending JP2013518433A (ja) 2010-01-29 2010-12-17 Ｉｃデバイスのエンハンストされた熱放散のための突出するｔｓｖ

Country Status (4)

Country Link
US (1) US8294261B2 (enExample)
JP (1) JP2013518433A (enExample)
CN (1) CN102870203B (enExample)
WO (1) WO2011093956A2 (enExample)

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