JP2013518433A - Ｉｃデバイスのエンハンストされた熱放散のための突出するｔｓｖ - Google Patents

Ｉｃデバイスのエンハンストされた熱放散のための突出するｔｓｖ Download PDF

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JP2013518433A
JP2013518433A JP2012551157A JP2012551157A JP2013518433A JP 2013518433 A JP2013518433 A JP 2013518433A JP 2012551157 A JP2012551157 A JP 2012551157A JP 2012551157 A JP2012551157 A JP 2012551157A JP 2013518433 A JP2013518433 A JP 2013518433A
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tsv
substrate
die
vias
tsvs
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JP2013518433A5 (enExample
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和明 馬渡
健吾 青屋
義克 梅田
エイ ウエスト ジェフェリー
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日本テキサス・インスツルメンツ株式会社
テキサス インスツルメンツ インコーポレイテッド
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2012551157A 2010-01-29 2010-12-17 Ｉｃデバイスのエンハンストされた熱放散のための突出するｔｓｖ Pending JP2013518433A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US29982610P 2010-01-29 2010-01-29
US61/299,826 2010-01-29
US12/888,135 US8294261B2 (en) 2010-01-29 2010-09-22 Protruding TSV tips for enhanced heat dissipation for IC devices
US12/888,135 2010-09-22
PCT/US2010/061033 WO2011093956A2 (en) 2010-01-29 2010-12-17 Protruding tsv tips for enhanced heat dissipation for ic devices

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JP2013518433A true JP2013518433A (ja) 2013-05-20
JP2013518433A5 JP2013518433A5 (enExample) 2014-02-06

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