JP2013513252A - 打込みされた側壁を有する半導体デバイスを製造する方法およびそれによって製造されたデバイス - Google Patents

打込みされた側壁を有する半導体デバイスを製造する方法およびそれによって製造されたデバイス Download PDF

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JP2013513252A
JP2013513252A JP2012543225A JP2012543225A JP2013513252A JP 2013513252 A JP2013513252 A JP 2013513252A JP 2012543225 A JP2012543225 A JP 2012543225A JP 2012543225 A JP2012543225 A JP 2012543225A JP 2013513252 A JP2013513252 A JP 2013513252A
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channel layer
region
implantation
source
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JP2013513252A5 (enExample
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シー． シェリダン，デイビッド
リトナー，アンドリュー
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エスエス エスシー アイピー、エルエルシー
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Publication of JP2013513252A publication Critical patent/JP2013513252A/ja
Publication of JP2013513252A5 publication Critical patent/JP2013513252A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
    • H10D12/01—Manufacture or treatment
    • H10D12/031—Manufacture or treatment of IGBTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/01—Manufacture or treatment
    • H10D30/051—Manufacture or treatment of FETs having PN junction gates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/80—FETs having rectifying junction gate electrodes
    • H10D30/83—FETs having PN junction gate electrodes
    • H10D30/831—Vertical FETs having PN junction gate electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/17—Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
    • H10D62/343—Gate regions of field-effect devices having PN junction gates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/83—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
    • H10D62/832—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge being Group IV materials comprising two or more elements, e.g. SiGe
    • H10D62/8325—Silicon carbide
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P30/00—Ion implantation into wafers, substrates or parts of devices
    • H10P30/20—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping
    • H10P30/202—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping characterised by the semiconductor materials
    • H10P30/204—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping characterised by the semiconductor materials into Group IV semiconductors
    • H10P30/2042—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping characterised by the semiconductor materials into Group IV semiconductors into crystalline silicon carbide
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P30/00—Ion implantation into wafers, substrates or parts of devices
    • H10P30/20—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping
    • H10P30/222—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping characterised by the angle between the ion beam and the crystal planes or the main crystal surface

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  • Junction Field-Effect Transistors (AREA)
JP2012543225A 2009-12-08 2010-12-08 打込みされた側壁を有する半導体デバイスを製造する方法およびそれによって製造されたデバイス Pending JP2013513252A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US26752409P 2009-12-08 2009-12-08
US61/267,524 2009-12-08
PCT/US2010/059374 WO2011071973A2 (en) 2009-12-08 2010-12-08 Methods of making semiconductor devices having implanted sidewalls and devices made thereby

Publications (2)

Publication Number Publication Date
JP2013513252A true JP2013513252A (ja) 2013-04-18
JP2013513252A5 JP2013513252A5 (enExample) 2014-01-30

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JP2012543225A Pending JP2013513252A (ja) 2009-12-08 2010-12-08 打込みされた側壁を有する半導体デバイスを製造する方法およびそれによって製造されたデバイス

Country Status (8)

Country Link
US (1) US8466017B2 (enExample)
EP (1) EP2510539A4 (enExample)
JP (1) JP2013513252A (enExample)
KR (1) KR20120091368A (enExample)
CN (1) CN102648514A (enExample)
AU (1) AU2010328256A1 (enExample)
CA (1) CA2780459A1 (enExample)
WO (1) WO2011071973A2 (enExample)

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JP2015028994A (ja) * 2013-07-30 2015-02-12 ルネサスエレクトロニクス株式会社 半導体装置の製造方法および半導体装置
JP2019531601A (ja) * 2016-09-09 2019-10-31 ユナイテッド シリコン カーバイド、インク． 改善された閾値電圧制御を有するトレンチ垂直ｊｆｅｔ

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US8338255B2 (en) * 2009-06-19 2012-12-25 Ss Sc Ip, Llc Methods of making vertical junction field effect transistors and bipolar junction transistors without ion implantation
US9136116B2 (en) * 2011-08-04 2015-09-15 Avogy, Inc. Method and system for formation of P-N junctions in gallium nitride based electronics
US8969912B2 (en) 2011-08-04 2015-03-03 Avogy, Inc. Method and system for a GaN vertical JFET utilizing a regrown channel
US9129838B2 (en) * 2011-11-24 2015-09-08 Sharp Kabushiki Kaisha Semiconductor device and electronic apparatus
US8969994B2 (en) 2012-08-14 2015-03-03 Avogy, Inc. Method of fabricating a gallium nitride merged P-i-N Schottky (MPS) diode by regrowth and etch back
US8937317B2 (en) 2012-12-28 2015-01-20 Avogy, Inc. Method and system for co-packaging gallium nitride electronics
US9324645B2 (en) 2013-05-23 2016-04-26 Avogy, Inc. Method and system for co-packaging vertical gallium nitride power devices
US9136397B2 (en) * 2013-05-31 2015-09-15 Infineon Technologies Ag Field-effect semiconductor device
US8947154B1 (en) 2013-10-03 2015-02-03 Avogy, Inc. Method and system for operating gallium nitride electronics
US9184281B2 (en) * 2013-10-30 2015-11-10 Infineon Technologies Ag Method for manufacturing a vertical semiconductor device and vertical semiconductor device
US9324809B2 (en) 2013-11-18 2016-04-26 Avogy, Inc. Method and system for interleaved boost converter with co-packaged gallium nitride power devices
US9543290B2 (en) 2014-01-23 2017-01-10 International Business Machines Corporation Normally-off junction field-effect transistors and application to complementary circuits
KR101669987B1 (ko) * 2014-12-03 2016-10-27 서강대학교산학협력단 경사 이온 주입을 이용한 실리콘 카바이드 트렌치 모스 장벽 쇼트키 다이오드 및 그의 제조 방법
US20160268446A1 (en) * 2015-03-10 2016-09-15 United Silicon Carbide, Inc. Trench vertical jfet with improved threshold voltage control
US10396215B2 (en) 2015-03-10 2019-08-27 United Silicon Carbide, Inc. Trench vertical JFET with improved threshold voltage control
US9905645B2 (en) 2016-05-24 2018-02-27 Samsung Electronics Co., Ltd. Vertical field effect transistor having an elongated channel
KR102314006B1 (ko) 2017-09-11 2021-10-18 삼성전자주식회사 수직 전계 트랜지스터 및 이를 포함하는 반도체 장치
CN112909088B (zh) * 2021-01-25 2022-11-08 深圳大学 静电感应晶体管及其制备方法

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JPS60247921A (ja) * 1984-05-23 1985-12-07 Toshiba Corp 半導体装置の製造方法
JPS61154029A (ja) * 1984-12-26 1986-07-12 Nec Corp ボロンのド−ピング方法
JPH09504656A (ja) * 1994-07-01 1997-05-06 ダイムラー−ベンツ アクチエンゲゼルシャフト ＳｉＣ製電界効果トランジスタ及びその製造方法
JPH10163313A (ja) * 1996-11-26 1998-06-19 New Japan Radio Co Ltd 半導体装置の製造方法
JP2004134547A (ja) * 2002-10-10 2004-04-30 Hitachi Ltd 半導体装置
US20060270203A1 (en) * 2005-05-31 2006-11-30 International Business Machines Corporation Varied impurity profile region formation for varying breakdown voltage of devices
US20070187715A1 (en) * 2003-09-25 2007-08-16 Zhao Jian H Power junction field effect power transistor with highly vertical channel and uniform channel opening

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JPS60247921A (ja) * 1984-05-23 1985-12-07 Toshiba Corp 半導体装置の製造方法
JPS61154029A (ja) * 1984-12-26 1986-07-12 Nec Corp ボロンのド−ピング方法
JPH09504656A (ja) * 1994-07-01 1997-05-06 ダイムラー−ベンツ アクチエンゲゼルシャフト ＳｉＣ製電界効果トランジスタ及びその製造方法
JPH10163313A (ja) * 1996-11-26 1998-06-19 New Japan Radio Co Ltd 半導体装置の製造方法
JP2004134547A (ja) * 2002-10-10 2004-04-30 Hitachi Ltd 半導体装置
US20070187715A1 (en) * 2003-09-25 2007-08-16 Zhao Jian H Power junction field effect power transistor with highly vertical channel and uniform channel opening
US20060270203A1 (en) * 2005-05-31 2006-11-30 International Business Machines Corporation Varied impurity profile region formation for varying breakdown voltage of devices

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015028994A (ja) * 2013-07-30 2015-02-12 ルネサスエレクトロニクス株式会社 半導体装置の製造方法および半導体装置
JP2019531601A (ja) * 2016-09-09 2019-10-31 ユナイテッド シリコン カーバイド、インク． 改善された閾値電圧制御を有するトレンチ垂直ｊｆｅｔ
JP7118050B2 (ja) 2016-09-09 2022-08-15 ユナイテッド シリコン カーバイド、インク． 改善された閾値電圧制御を有するトレンチ垂直ｊｆｅｔ

Also Published As

Publication number Publication date
AU2010328256A1 (en) 2012-06-21
US20110133212A1 (en) 2011-06-09
WO2011071973A2 (en) 2011-06-16
WO2011071973A3 (en) 2011-10-27
US8466017B2 (en) 2013-06-18
CA2780459A1 (en) 2011-06-16
EP2510539A4 (en) 2013-07-31
EP2510539A2 (en) 2012-10-17
KR20120091368A (ko) 2012-08-17
CN102648514A (zh) 2012-08-22

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