JP2013510240A5 - - Google Patents
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- JP2013510240A5 JP2013510240A5 JP2012538017A JP2012538017A JP2013510240A5 JP 2013510240 A5 JP2013510240 A5 JP 2013510240A5 JP 2012538017 A JP2012538017 A JP 2012538017A JP 2012538017 A JP2012538017 A JP 2012538017A JP 2013510240 A5 JP2013510240 A5 JP 2013510240A5
- Authority
- JP
- Japan
- Prior art keywords
- metal
- component
- network
- particle
- particle mixture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000000203 mixture Substances 0.000 claims description 72
- 229910052751 metal Inorganic materials 0.000 claims description 62
- 239000002184 metal Substances 0.000 claims description 62
- 239000002245 particle Substances 0.000 claims description 34
- 229910000765 intermetallic Inorganic materials 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 17
- 239000002923 metal particle Substances 0.000 claims description 15
- 229910045601 alloy Inorganic materials 0.000 claims description 11
- 239000000956 alloy Substances 0.000 claims description 11
- 229910052738 indium Inorganic materials 0.000 claims description 8
- 239000000155 melt Substances 0.000 claims description 8
- 239000000654 additive Substances 0.000 claims description 7
- 230000000996 additive effect Effects 0.000 claims description 7
- 229910052797 bismuth Inorganic materials 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 7
- 229910052697 platinum Inorganic materials 0.000 claims description 7
- 229910052725 zinc Inorganic materials 0.000 claims description 7
- 229910052787 antimony Inorganic materials 0.000 claims description 6
- 229910052733 gallium Inorganic materials 0.000 claims description 6
- 239000007795 chemical reaction product Substances 0.000 claims description 5
- 230000004907 flux Effects 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 229910052718 tin Inorganic materials 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 229910052745 lead Inorganic materials 0.000 claims description 3
- 229910001092 metal group alloy Inorganic materials 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 229910020836 Sn-Ag Inorganic materials 0.000 claims description 2
- 229910020888 Sn-Cu Inorganic materials 0.000 claims description 2
- 229910020988 Sn—Ag Inorganic materials 0.000 claims description 2
- 229910019204 Sn—Cu Inorganic materials 0.000 claims description 2
- 229910052793 cadmium Inorganic materials 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 239000010419 fine particle Substances 0.000 claims description 2
- 229910052741 iridium Inorganic materials 0.000 claims description 2
- 229910052742 iron Inorganic materials 0.000 claims description 2
- 229910052748 manganese Inorganic materials 0.000 claims description 2
- 238000002844 melting Methods 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims description 2
- 150000007522 mineralic acids Chemical class 0.000 claims description 2
- 229910052763 palladium Inorganic materials 0.000 claims description 2
- 229910052698 phosphorus Inorganic materials 0.000 claims description 2
- 229920000642 polymer Polymers 0.000 claims description 2
- 239000002243 precursor Substances 0.000 claims description 2
- 229910052702 rhenium Inorganic materials 0.000 claims description 2
- 239000002904 solvent Substances 0.000 claims description 2
- 229910052714 tellurium Inorganic materials 0.000 claims description 2
- 229910052716 thallium Inorganic materials 0.000 claims description 2
- 229920001169 thermoplastic Polymers 0.000 claims description 2
- -1 alkanolamines Chemical class 0.000 claims 1
- 150000001735 carboxylic acids Chemical class 0.000 claims 1
- 150000002989 phenols Chemical class 0.000 claims 1
- 239000010949 copper Substances 0.000 description 4
- 230000001143 conditioned effect Effects 0.000 description 3
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017123929A JP6976029B2 (ja) | 2009-11-05 | 2017-06-26 | 冶金ネットワーク組成物の調製およびその使用方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US25836509P | 2009-11-05 | 2009-11-05 | |
| US61/258,365 | 2009-11-05 | ||
| PCT/US2010/055562 WO2011078918A2 (en) | 2009-11-05 | 2010-11-05 | Preparation of metallurgic network compositions and methods of use thereof |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017123929A Division JP6976029B2 (ja) | 2009-11-05 | 2017-06-26 | 冶金ネットワーク組成物の調製およびその使用方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013510240A JP2013510240A (ja) | 2013-03-21 |
| JP2013510240A5 true JP2013510240A5 (enExample) | 2014-03-06 |
| JP6203493B2 JP6203493B2 (ja) | 2017-09-27 |
Family
ID=44196381
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012538017A Active JP6203493B2 (ja) | 2009-11-05 | 2010-11-05 | 冶金ネットワーク組成物の調製およびその使用方法 |
| JP2017123929A Active JP6976029B2 (ja) | 2009-11-05 | 2017-06-26 | 冶金ネットワーク組成物の調製およびその使用方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017123929A Active JP6976029B2 (ja) | 2009-11-05 | 2017-06-26 | 冶金ネットワーク組成物の調製およびその使用方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US8840700B2 (enExample) |
| JP (2) | JP6203493B2 (enExample) |
| KR (3) | KR20120096928A (enExample) |
| TW (1) | TWI481728B (enExample) |
| WO (1) | WO2011078918A2 (enExample) |
Families Citing this family (49)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010114874A2 (en) | 2009-04-02 | 2010-10-07 | Ormet Circuits Inc. | Conductive compositions containing blended alloy fillers |
| KR20120096928A (ko) | 2009-11-05 | 2012-08-31 | 오르멧 서키츠 인코퍼레이티드 | 야금 망상 조성물의 제조 및 그것의 사용 방법 |
| US8557146B1 (en) | 2012-03-26 | 2013-10-15 | E I Du Pont De Nemours And Company | Polymer thick film solder alloy/metal conductor compositions |
| US9583453B2 (en) | 2012-05-30 | 2017-02-28 | Ormet Circuits, Inc. | Semiconductor packaging containing sintering die-attach material |
| JP2013256584A (ja) * | 2012-06-12 | 2013-12-26 | Panasonic Corp | 熱硬化性樹脂組成物およびフラックス組成物とそれを用いた半導体装置 |
| US20140120356A1 (en) * | 2012-06-18 | 2014-05-01 | Ormet Circuits, Inc. | Conductive film adhesive |
| US12053934B2 (en) | 2012-06-18 | 2024-08-06 | Ormet Circuits, Inc. | Conductive film adhesive |
| US9005330B2 (en) | 2012-08-09 | 2015-04-14 | Ormet Circuits, Inc. | Electrically conductive compositions comprising non-eutectic solder alloys |
| US8986579B2 (en) * | 2012-10-10 | 2015-03-24 | E I Du Pont De Nemours And Company | Lamination of polymer thick film conductor compositions |
| US11440142B2 (en) | 2012-11-16 | 2022-09-13 | Ormet Circuits, Inc. | Alternative compositions for high temperature soldering applications |
| US9605162B2 (en) | 2013-03-15 | 2017-03-28 | Honda Motor Co., Ltd. | Corrosion inhibiting compositions and methods of making and using |
| US9816189B2 (en) | 2013-03-15 | 2017-11-14 | Honda Motor Co., Ltd. | Corrosion inhibiting compositions and coatings including the same |
| JP6184731B2 (ja) | 2013-04-25 | 2017-08-23 | Ｄｏｗａエレクトロニクス株式会社 | 銀−ビスマス粉末、導電性ペースト及び導電膜 |
| JP6486369B2 (ja) * | 2013-09-05 | 2019-03-20 | ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング | 金属焼結フィルム組成物 |
| US20160012931A1 (en) * | 2014-07-11 | 2016-01-14 | Tyco Electronics Corporation | Conductive Particle |
| US20160108204A1 (en) * | 2014-10-17 | 2016-04-21 | Toyota Motor Engineering & Manufacturing North America, Inc. | Transient Liquid Phase Compositions Having Multi-Layer Particles |
| US9731384B2 (en) | 2014-11-18 | 2017-08-15 | Baker Hughes Incorporated | Methods and compositions for brazing |
| US9687940B2 (en) * | 2014-11-18 | 2017-06-27 | Baker Hughes Incorporated | Methods and compositions for brazing, and earth-boring tools formed from such methods and compositions |
| KR20160076393A (ko) * | 2014-12-22 | 2016-06-30 | 엘지전자 주식회사 | 태양 전지 모듈 |
| US9831201B2 (en) | 2015-03-11 | 2017-11-28 | Guy F. Burgess | Methods for forming pillar bumps on semiconductor wafers |
| US10612112B2 (en) | 2015-04-09 | 2020-04-07 | Electronics And Telecommunications Research Institute | Noble metal material for 3-dimensional printing, method for manufacturing the same, and method for 3-dimensional printing using the same |
| KR101839876B1 (ko) * | 2015-04-09 | 2018-03-20 | 한국전자통신연구원 | 3d 프린팅용 귀금속 소재, 그 제조 방법, 및 그 소재를 이용한 3d 프린팅 방법 |
| WO2016174584A1 (en) * | 2015-04-28 | 2016-11-03 | Ormet Circuits, Inc. | Sintering pastes with high metal loading for semiconductor die attach applications |
| KR101658733B1 (ko) * | 2015-07-08 | 2016-09-21 | 엘지전자 주식회사 | 태양 전지 모듈 |
| JP6042577B1 (ja) * | 2016-07-05 | 2016-12-14 | 有限会社 ナプラ | 多層プリフォームシート |
| WO2018105125A1 (ja) * | 2016-12-09 | 2018-06-14 | 日立化成株式会社 | 組成物、接着剤、焼結体、接合体及び接合体の製造方法 |
| WO2018105127A1 (ja) * | 2016-12-09 | 2018-06-14 | 日立化成株式会社 | 接合体の製造方法、遷移的液相焼結用組成物、焼結体及び接合体 |
| WO2018105126A1 (ja) * | 2016-12-09 | 2018-06-14 | 日立化成株式会社 | 組成物、接着剤、焼結体、接合体及び接合体の製造方法 |
| US20200063008A1 (en) * | 2016-12-09 | 2020-02-27 | Hitachi Chemical Company, Ltd. | Composition, adhesive, sintered body, joined body, and method of producing joined body |
| EP3373310A1 (en) * | 2017-03-06 | 2018-09-12 | Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO | Printed temperature sensor |
| WO2018231612A2 (en) | 2017-06-12 | 2018-12-20 | Ormet Circuits, Inc. | Metallic adhesive compositions having good work lives and thermal conductivity, methods of making same and uses thereof |
| CN107649676A (zh) * | 2017-09-06 | 2018-02-02 | 王明江 | 一种3d打印用铝合金粉体材料 |
| EP3720647B1 (en) * | 2017-12-07 | 2024-09-11 | Ormet Circuits, Inc. | Metallurgical compositions with thermally stable microstructures for assembly in electronic packaging |
| JP2019141908A (ja) * | 2018-02-19 | 2019-08-29 | 有限会社 ナプラ | はんだ材、金属粒子、ペースト、金属材、複合材、半導体装置、電子部品、電気機器、光学機器および照明器具 |
| WO2020012226A1 (en) | 2018-07-10 | 2020-01-16 | Bosch Car Multimedia Portugal, S.A. | Additivated solder paste and process for applying a reactive additive element for selective control of soldering temperature on the reflow soldering method |
| WO2020017050A1 (ja) * | 2018-07-20 | 2020-01-23 | 日立化成株式会社 | 組成物、接合材料、焼結体、接合体及び接合体の製造方法 |
| JP6811798B2 (ja) * | 2018-09-28 | 2021-01-13 | 株式会社タムラ製作所 | 成形はんだ及び成形はんだの製造方法 |
| WO2020179874A1 (ja) * | 2019-03-06 | 2020-09-10 | 日立化成株式会社 | 電子部品装置を製造する方法 |
| WO2021060525A1 (ja) * | 2019-09-27 | 2021-04-01 | 昭和電工マテリアルズ株式会社 | 電磁波シールド用組成物、電磁波シールド用シート、電磁波シールド用焼結体及び電子部品装置 |
| JP2021063262A (ja) * | 2019-10-11 | 2021-04-22 | 昭和電工マテリアルズ株式会社 | 接合用金属ペースト、接合体の製造方法、及び接合体 |
| JP7500943B2 (ja) * | 2019-10-11 | 2024-06-18 | 株式会社レゾナック | 接合用金属ペースト、接合体の製造方法、及び接合体 |
| JP7559330B2 (ja) * | 2020-03-02 | 2024-10-02 | 株式会社レゾナック | 電磁波シールド用組成物、電磁波シールド用シート、電磁波シールド用焼結体及び電子部品装置 |
| JP2021182600A (ja) * | 2020-05-20 | 2021-11-25 | 昭和電工マテリアルズ株式会社 | 電子部品装置を製造する方法 |
| JP2022002254A (ja) * | 2020-06-19 | 2022-01-06 | 昭和電工マテリアルズ株式会社 | 電磁波シールド用焼結体付き物品の製造方法 |
| JP2022001663A (ja) * | 2020-06-22 | 2022-01-06 | 昭和電工マテリアルズ株式会社 | 接合構造及び半導体パッケージ |
| JP2022044463A (ja) * | 2020-09-07 | 2022-03-17 | 昭和電工マテリアルズ株式会社 | 電磁波シールド用焼結体付き樹脂構造体 |
| WO2023097174A1 (en) * | 2021-11-23 | 2023-06-01 | Ormet Circuits, Inc. | Conductive compositions for low temperature assembly of electronic components |
| CN114864134A (zh) * | 2022-05-31 | 2022-08-05 | 深圳市百柔新材料技术有限公司 | 一种纳米合金复合低温浆料、制备方法及其应用 |
| CN114974656A (zh) * | 2022-05-31 | 2022-08-30 | 深圳市百柔新材料技术有限公司 | 一种纳米复合低温浆料、制备方法及其应用 |
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| JPS53133799A (en) | 1977-04-27 | 1978-11-21 | Idearisaachi Yuugen | Electroconductive paint |
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| KR101276147B1 (ko) * | 2009-09-03 | 2013-06-18 | 가부시키가이샤 무라타 세이사쿠쇼 | 솔더 페이스트, 그것을 사용한 접합 방법, 및 접합 구조 |
| KR20120096928A (ko) | 2009-11-05 | 2012-08-31 | 오르멧 서키츠 인코퍼레이티드 | 야금 망상 조성물의 제조 및 그것의 사용 방법 |
-
2010
- 2010-11-05 KR KR1020127014423A patent/KR20120096928A/ko not_active Ceased
- 2010-11-05 KR KR1020197015899A patent/KR102108773B1/ko active Active
- 2010-11-05 JP JP2012538017A patent/JP6203493B2/ja active Active
- 2010-11-05 KR KR1020187013019A patent/KR101988188B1/ko active Active
- 2010-11-05 WO PCT/US2010/055562 patent/WO2011078918A2/en not_active Ceased
- 2010-11-05 US US12/940,203 patent/US8840700B2/en active Active
- 2010-11-05 TW TW099138257A patent/TWI481728B/zh active
-
2017
- 2017-06-26 JP JP2017123929A patent/JP6976029B2/ja active Active
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