JP6203493B2 - 冶金ネットワーク組成物の調製およびその使用方法 - Google Patents

冶金ネットワーク組成物の調製およびその使用方法 Download PDF

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JP6203493B2
JP6203493B2 JP2012538017A JP2012538017A JP6203493B2 JP 6203493 B2 JP6203493 B2 JP 6203493B2 JP 2012538017 A JP2012538017 A JP 2012538017A JP 2012538017 A JP2012538017 A JP 2012538017A JP 6203493 B2 JP6203493 B2 JP 6203493B2
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metal
composition
network
alloy
component
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JP2013510240A (ja
JP2013510240A5 (enExample
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キャサリン シエラ
キャサリン シエラ
ケニス シー． ホルコム
ケニス シー． ホルコム
ジー． デルバート フリーセン
ジー． デルバート フリーセン
ミカエル シー． マシューズ
ミカエル シー． マシューズ
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オーメット サーキッツ インク
オーメット サーキッツ インク
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/10—Sintering only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/83801—Soldering or alloying
    • H01L2224/8382—Diffusion bonding
    • H01L2224/83825—Solid-liquid interdiffusion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8384—Sintering

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Powder Metallurgy (AREA)
JP2012538017A 2009-11-05 2010-11-05 冶金ネットワーク組成物の調製およびその使用方法 Active JP6203493B2 (ja)

Priority Applications (1)

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JP2017123929A JP6976029B2 (ja) 2009-11-05 2017-06-26 冶金ネットワーク組成物の調製およびその使用方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US25836509P 2009-11-05 2009-11-05
US61/258,365 2009-11-05
PCT/US2010/055562 WO2011078918A2 (en) 2009-11-05 2010-11-05 Preparation of metallurgic network compositions and methods of use thereof

Related Child Applications (1)

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JP2017123929A Division JP6976029B2 (ja) 2009-11-05 2017-06-26 冶金ネットワーク組成物の調製およびその使用方法

Publications (3)

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JP2013510240A JP2013510240A (ja) 2013-03-21
JP2013510240A5 JP2013510240A5 (enExample) 2014-03-06
JP6203493B2 true JP6203493B2 (ja) 2017-09-27

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JP2012538017A Active JP6203493B2 (ja) 2009-11-05 2010-11-05 冶金ネットワーク組成物の調製およびその使用方法
JP2017123929A Active JP6976029B2 (ja) 2009-11-05 2017-06-26 冶金ネットワーク組成物の調製およびその使用方法

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US (1) US8840700B2 (enExample)
JP (2) JP6203493B2 (enExample)
KR (3) KR20120096928A (enExample)
TW (1) TWI481728B (enExample)
WO (1) WO2011078918A2 (enExample)

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Also Published As

Publication number Publication date
US8840700B2 (en) 2014-09-23
JP6976029B2 (ja) 2021-12-01
KR102108773B1 (ko) 2020-05-11
JP2017222930A (ja) 2017-12-21
JP2013510240A (ja) 2013-03-21
KR20190065473A (ko) 2019-06-11
US20110171372A1 (en) 2011-07-14
TWI481728B (zh) 2015-04-21
TW201124542A (en) 2011-07-16
WO2011078918A3 (en) 2011-10-27
KR20120096928A (ko) 2012-08-31
WO2011078918A2 (en) 2011-06-30
KR20180054887A (ko) 2018-05-24
KR101988188B1 (ko) 2019-06-11

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