TWI481728B - 冶金網狀組合物之製備及其使用方法 - Google Patents

冶金網狀組合物之製備及其使用方法 Download PDF

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Publication number
TWI481728B
TWI481728B TW099138257A TW99138257A TWI481728B TW I481728 B TWI481728 B TW I481728B TW 099138257 A TW099138257 A TW 099138257A TW 99138257 A TW99138257 A TW 99138257A TW I481728 B TWI481728 B TW I481728B
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Taiwan
Prior art keywords
metal
alloy
composition
network
particle mixture
Prior art date
Application number
TW099138257A
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English (en)
Chinese (zh)
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TW201124542A (en
Inventor
凱薩琳 席勒
肯尼斯Ｃ 赫康
Ｇ 黛博 費森
麥克Ｃ 馬修
Original Assignee
歐爾麥特電路有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 歐爾麥特電路有限公司 filed Critical 歐爾麥特電路有限公司
Publication of TW201124542A publication Critical patent/TW201124542A/zh
Application granted granted Critical
Publication of TWI481728B publication Critical patent/TWI481728B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/10—Sintering only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/83801—Soldering or alloying
    • H01L2224/8382—Diffusion bonding
    • H01L2224/83825—Solid-liquid interdiffusion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8384—Sintering

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Powder Metallurgy (AREA)
TW099138257A 2009-11-05 2010-11-05 冶金網狀組合物之製備及其使用方法 TWI481728B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US25836509P 2009-11-05 2009-11-05

Publications (2)

Publication Number Publication Date
TW201124542A TW201124542A (en) 2011-07-16
TWI481728B true TWI481728B (zh) 2015-04-21

Family

ID=44196381

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099138257A TWI481728B (zh) 2009-11-05 2010-11-05 冶金網狀組合物之製備及其使用方法

Country Status (5)

Country Link
US (1) US8840700B2 (enExample)
JP (2) JP6203493B2 (enExample)
KR (3) KR20120096928A (enExample)
TW (1) TWI481728B (enExample)
WO (1) WO2011078918A2 (enExample)

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JP6811798B2 (ja) * 2018-09-28 2021-01-13 株式会社タムラ製作所 成形はんだ及び成形はんだの製造方法
WO2020179874A1 (ja) * 2019-03-06 2020-09-10 日立化成株式会社 電子部品装置を製造する方法
WO2021060525A1 (ja) * 2019-09-27 2021-04-01 昭和電工マテリアルズ株式会社 電磁波シールド用組成物、電磁波シールド用シート、電磁波シールド用焼結体及び電子部品装置
JP2021063262A (ja) * 2019-10-11 2021-04-22 昭和電工マテリアルズ株式会社 接合用金属ペースト、接合体の製造方法、及び接合体
JP7500943B2 (ja) * 2019-10-11 2024-06-18 株式会社レゾナック 接合用金属ペースト、接合体の製造方法、及び接合体
JP7559330B2 (ja) * 2020-03-02 2024-10-02 株式会社レゾナック 電磁波シールド用組成物、電磁波シールド用シート、電磁波シールド用焼結体及び電子部品装置
JP2021182600A (ja) * 2020-05-20 2021-11-25 昭和電工マテリアルズ株式会社 電子部品装置を製造する方法
JP2022002254A (ja) * 2020-06-19 2022-01-06 昭和電工マテリアルズ株式会社 電磁波シールド用焼結体付き物品の製造方法
JP2022001663A (ja) * 2020-06-22 2022-01-06 昭和電工マテリアルズ株式会社 接合構造及び半導体パッケージ
JP2022044463A (ja) * 2020-09-07 2022-03-17 昭和電工マテリアルズ株式会社 電磁波シールド用焼結体付き樹脂構造体
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CN114864134A (zh) * 2022-05-31 2022-08-05 深圳市百柔新材料技术有限公司 一种纳米合金复合低温浆料、制备方法及其应用
CN114974656A (zh) * 2022-05-31 2022-08-30 深圳市百柔新材料技术有限公司 一种纳米复合低温浆料、制备方法及其应用

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Also Published As

Publication number Publication date
US8840700B2 (en) 2014-09-23
JP6203493B2 (ja) 2017-09-27
JP6976029B2 (ja) 2021-12-01
KR102108773B1 (ko) 2020-05-11
JP2017222930A (ja) 2017-12-21
JP2013510240A (ja) 2013-03-21
KR20190065473A (ko) 2019-06-11
US20110171372A1 (en) 2011-07-14
TW201124542A (en) 2011-07-16
WO2011078918A3 (en) 2011-10-27
KR20120096928A (ko) 2012-08-31
WO2011078918A2 (en) 2011-06-30
KR20180054887A (ko) 2018-05-24
KR101988188B1 (ko) 2019-06-11

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