KR20120096928A - 야금 망상 조성물의 제조 및 그것의 사용 방법 - Google Patents

야금 망상 조성물의 제조 및 그것의 사용 방법 Download PDF

Info

Publication number
KR20120096928A
KR20120096928A KR1020127014423A KR20127014423A KR20120096928A KR 20120096928 A KR20120096928 A KR 20120096928A KR 1020127014423 A KR1020127014423 A KR 1020127014423A KR 20127014423 A KR20127014423 A KR 20127014423A KR 20120096928 A KR20120096928 A KR 20120096928A
Authority
KR
South Korea
Prior art keywords
metal
alloy
composition
component
particle mixture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020127014423A
Other languages
English (en)
Korean (ko)
Inventor
캐서린 시어러
케니스 씨 홀콤
지 델버트 프리젠
마이클 씨 매튜스
Original Assignee
오르멧 서키츠 인코퍼레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 오르멧 서키츠 인코퍼레이티드 filed Critical 오르멧 서키츠 인코퍼레이티드
Publication of KR20120096928A publication Critical patent/KR20120096928A/ko
Ceased legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/10Sintering only
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026Alloys based on copper
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838Bonding techniques
    • H01L2224/83801Soldering or alloying
    • H01L2224/8382Diffusion bonding
    • H01L2224/83825Solid-liquid interdiffusion
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838Bonding techniques
    • H01L2224/8384Sintering

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Powder Metallurgy (AREA)
KR1020127014423A 2009-11-05 2010-11-05 야금 망상 조성물의 제조 및 그것의 사용 방법 Ceased KR20120096928A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US25836509P 2009-11-05 2009-11-05
US61/258,365 2009-11-05

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020187013019A Division KR101988188B1 (ko) 2009-11-05 2010-11-05 야금 망상 조성물의 제조 및 그것의 사용 방법

Publications (1)

Publication Number Publication Date
KR20120096928A true KR20120096928A (ko) 2012-08-31

Family

ID=44196381

Family Applications (3)

Application Number Title Priority Date Filing Date
KR1020127014423A Ceased KR20120096928A (ko) 2009-11-05 2010-11-05 야금 망상 조성물의 제조 및 그것의 사용 방법
KR1020197015899A Active KR102108773B1 (ko) 2009-11-05 2010-11-05 야금 망상 조성물의 제조 및 그것의 사용 방법
KR1020187013019A Active KR101988188B1 (ko) 2009-11-05 2010-11-05 야금 망상 조성물의 제조 및 그것의 사용 방법

Family Applications After (2)

Application Number Title Priority Date Filing Date
KR1020197015899A Active KR102108773B1 (ko) 2009-11-05 2010-11-05 야금 망상 조성물의 제조 및 그것의 사용 방법
KR1020187013019A Active KR101988188B1 (ko) 2009-11-05 2010-11-05 야금 망상 조성물의 제조 및 그것의 사용 방법

Country Status (5)

Country Link
US (1) US8840700B2 (enExample)
JP (2) JP6203493B2 (enExample)
KR (3) KR20120096928A (enExample)
TW (1) TWI481728B (enExample)
WO (1) WO2011078918A2 (enExample)

Families Citing this family (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010114874A2 (en) 2009-04-02 2010-10-07 Ormet Circuits Inc. Conductive compositions containing blended alloy fillers
KR20120096928A (ko) 2009-11-05 2012-08-31 오르멧 서키츠 인코퍼레이티드 야금 망상 조성물의 제조 및 그것의 사용 방법
US8557146B1 (en) 2012-03-26 2013-10-15 E I Du Pont De Nemours And Company Polymer thick film solder alloy/metal conductor compositions
US9583453B2 (en) 2012-05-30 2017-02-28 Ormet Circuits, Inc. Semiconductor packaging containing sintering die-attach material
JP2013256584A (ja) * 2012-06-12 2013-12-26 Panasonic Corp 熱硬化性樹脂組成物およびフラックス組成物とそれを用いた半導体装置
US20140120356A1 (en) * 2012-06-18 2014-05-01 Ormet Circuits, Inc. Conductive film adhesive
US12053934B2 (en) 2012-06-18 2024-08-06 Ormet Circuits, Inc. Conductive film adhesive
US9005330B2 (en) 2012-08-09 2015-04-14 Ormet Circuits, Inc. Electrically conductive compositions comprising non-eutectic solder alloys
US8986579B2 (en) * 2012-10-10 2015-03-24 E I Du Pont De Nemours And Company Lamination of polymer thick film conductor compositions
US11440142B2 (en) 2012-11-16 2022-09-13 Ormet Circuits, Inc. Alternative compositions for high temperature soldering applications
US9605162B2 (en) 2013-03-15 2017-03-28 Honda Motor Co., Ltd. Corrosion inhibiting compositions and methods of making and using
US9816189B2 (en) 2013-03-15 2017-11-14 Honda Motor Co., Ltd. Corrosion inhibiting compositions and coatings including the same
JP6184731B2 (ja) 2013-04-25 2017-08-23 Dowaエレクトロニクス株式会社 銀−ビスマス粉末、導電性ペースト及び導電膜
JP6486369B2 (ja) * 2013-09-05 2019-03-20 ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング 金属焼結フィルム組成物
US20160012931A1 (en) * 2014-07-11 2016-01-14 Tyco Electronics Corporation Conductive Particle
US20160108204A1 (en) * 2014-10-17 2016-04-21 Toyota Motor Engineering & Manufacturing North America, Inc. Transient Liquid Phase Compositions Having Multi-Layer Particles
US9731384B2 (en) 2014-11-18 2017-08-15 Baker Hughes Incorporated Methods and compositions for brazing
US9687940B2 (en) * 2014-11-18 2017-06-27 Baker Hughes Incorporated Methods and compositions for brazing, and earth-boring tools formed from such methods and compositions
KR20160076393A (ko) * 2014-12-22 2016-06-30 엘지전자 주식회사 태양 전지 모듈
US9831201B2 (en) 2015-03-11 2017-11-28 Guy F. Burgess Methods for forming pillar bumps on semiconductor wafers
US10612112B2 (en) 2015-04-09 2020-04-07 Electronics And Telecommunications Research Institute Noble metal material for 3-dimensional printing, method for manufacturing the same, and method for 3-dimensional printing using the same
KR101839876B1 (ko) * 2015-04-09 2018-03-20 한국전자통신연구원 3d 프린팅용 귀금속 소재, 그 제조 방법, 및 그 소재를 이용한 3d 프린팅 방법
WO2016174584A1 (en) * 2015-04-28 2016-11-03 Ormet Circuits, Inc. Sintering pastes with high metal loading for semiconductor die attach applications
KR101658733B1 (ko) * 2015-07-08 2016-09-21 엘지전자 주식회사 태양 전지 모듈
JP6042577B1 (ja) * 2016-07-05 2016-12-14 有限会社 ナプラ 多層プリフォームシート
WO2018105125A1 (ja) * 2016-12-09 2018-06-14 日立化成株式会社 組成物、接着剤、焼結体、接合体及び接合体の製造方法
WO2018105127A1 (ja) * 2016-12-09 2018-06-14 日立化成株式会社 接合体の製造方法、遷移的液相焼結用組成物、焼結体及び接合体
WO2018105126A1 (ja) * 2016-12-09 2018-06-14 日立化成株式会社 組成物、接着剤、焼結体、接合体及び接合体の製造方法
US20200063008A1 (en) * 2016-12-09 2020-02-27 Hitachi Chemical Company, Ltd. Composition, adhesive, sintered body, joined body, and method of producing joined body
EP3373310A1 (en) * 2017-03-06 2018-09-12 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Printed temperature sensor
WO2018231612A2 (en) 2017-06-12 2018-12-20 Ormet Circuits, Inc. Metallic adhesive compositions having good work lives and thermal conductivity, methods of making same and uses thereof
CN107649676A (zh) * 2017-09-06 2018-02-02 王明江 一种3d打印用铝合金粉体材料
EP3720647B1 (en) * 2017-12-07 2024-09-11 Ormet Circuits, Inc. Metallurgical compositions with thermally stable microstructures for assembly in electronic packaging
JP2019141908A (ja) * 2018-02-19 2019-08-29 有限会社 ナプラ はんだ材、金属粒子、ペースト、金属材、複合材、半導体装置、電子部品、電気機器、光学機器および照明器具
WO2020012226A1 (en) 2018-07-10 2020-01-16 Bosch Car Multimedia Portugal, S.A. Additivated solder paste and process for applying a reactive additive element for selective control of soldering temperature on the reflow soldering method
WO2020017050A1 (ja) * 2018-07-20 2020-01-23 日立化成株式会社 組成物、接合材料、焼結体、接合体及び接合体の製造方法
JP6811798B2 (ja) * 2018-09-28 2021-01-13 株式会社タムラ製作所 成形はんだ及び成形はんだの製造方法
WO2020179874A1 (ja) * 2019-03-06 2020-09-10 日立化成株式会社 電子部品装置を製造する方法
WO2021060525A1 (ja) * 2019-09-27 2021-04-01 昭和電工マテリアルズ株式会社 電磁波シールド用組成物、電磁波シールド用シート、電磁波シールド用焼結体及び電子部品装置
JP2021063262A (ja) * 2019-10-11 2021-04-22 昭和電工マテリアルズ株式会社 接合用金属ペースト、接合体の製造方法、及び接合体
JP7500943B2 (ja) * 2019-10-11 2024-06-18 株式会社レゾナック 接合用金属ペースト、接合体の製造方法、及び接合体
JP7559330B2 (ja) * 2020-03-02 2024-10-02 株式会社レゾナック 電磁波シールド用組成物、電磁波シールド用シート、電磁波シールド用焼結体及び電子部品装置
JP2021182600A (ja) * 2020-05-20 2021-11-25 昭和電工マテリアルズ株式会社 電子部品装置を製造する方法
JP2022002254A (ja) * 2020-06-19 2022-01-06 昭和電工マテリアルズ株式会社 電磁波シールド用焼結体付き物品の製造方法
JP2022001663A (ja) * 2020-06-22 2022-01-06 昭和電工マテリアルズ株式会社 接合構造及び半導体パッケージ
JP2022044463A (ja) * 2020-09-07 2022-03-17 昭和電工マテリアルズ株式会社 電磁波シールド用焼結体付き樹脂構造体
WO2023097174A1 (en) * 2021-11-23 2023-06-01 Ormet Circuits, Inc. Conductive compositions for low temperature assembly of electronic components
CN114864134A (zh) * 2022-05-31 2022-08-05 深圳市百柔新材料技术有限公司 一种纳米合金复合低温浆料、制备方法及其应用
CN114974656A (zh) * 2022-05-31 2022-08-30 深圳市百柔新材料技术有限公司 一种纳米复合低温浆料、制备方法及其应用

Family Cites Families (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53133799A (en) 1977-04-27 1978-11-21 Idearisaachi Yuugen Electroconductive paint
US5043102A (en) 1989-11-29 1991-08-27 Advanced Products, Inc. Conductive adhesive useful for bonding a semiconductor die to a conductive support base
JPH03187373A (ja) 1989-12-13 1991-08-15 Masao Saito 薬酒
US5853622A (en) 1990-02-09 1998-12-29 Ormet Corporation Transient liquid phase sintering conductive adhesives
US5716663A (en) 1990-02-09 1998-02-10 Toranaga Technologies Multilayer printed circuit
US5376403A (en) 1990-02-09 1994-12-27 Capote; Miguel A. Electrically conductive compositions and methods for the preparation and use thereof
US5538789A (en) 1990-02-09 1996-07-23 Toranaga Technologies, Inc. Composite substrates for preparation of printed circuits
US5948533A (en) 1990-02-09 1999-09-07 Ormet Corporation Vertically interconnected electronic assemblies and compositions useful therefor
US5088189A (en) 1990-08-31 1992-02-18 Federated Fry Metals Electronic manufacturing process
US5463190A (en) 1994-04-04 1995-10-31 Motorola, Inc. Electrically conductive adhesive
FR2726001B1 (fr) 1994-10-19 1996-11-29 Solaic Sa Encre conductrice comprenant des grains metalliques ayant des points de fusion differents
US7022266B1 (en) 1996-08-16 2006-04-04 Dow Corning Corporation Printable compositions, and their application to dielectric surfaces used in the manufacture of printed circuit boards
US6143116A (en) 1996-09-26 2000-11-07 Kyocera Corporation Process for producing a multi-layer wiring board
US5985043A (en) 1997-07-21 1999-11-16 Miguel Albert Capote Polymerizable fluxing agents and fluxing adhesive compositions therefrom
US5922397A (en) 1997-03-03 1999-07-13 Ormet Corporation Metal-plating of cured and sintered transient liquid phase sintering pastes
US6297559B1 (en) 1997-07-10 2001-10-02 International Business Machines Corporation Structure, materials, and applications of ball grid array interconnections
US6114413A (en) 1997-07-10 2000-09-05 International Business Machines Corporation Thermally conducting materials and applications for microelectronic packaging
US6337522B1 (en) 1997-07-10 2002-01-08 International Business Machines Corporation Structure employing electrically conductive adhesives
US5980785A (en) 1997-10-02 1999-11-09 Ormet Corporation Metal-containing compositions and uses thereof, including preparation of resistor and thermistor elements
US6068782A (en) 1998-02-11 2000-05-30 Ormet Corporation Individual embedded capacitors for laminated printed circuit boards
US6139777A (en) 1998-05-08 2000-10-31 Matsushita Electric Industrial Co., Ltd. Conductive paste for filling via-hole, double-sided and multilayer printed circuit boards using the same, and method for producing the same
US6127619A (en) 1998-06-08 2000-10-03 Ormet Corporation Process for producing high performance thermoelectric modules
US6085415A (en) 1998-07-27 2000-07-11 Ormet Corporation Methods to produce insulated conductive through-features in core materials for electric packaging
US6207259B1 (en) 1998-11-02 2001-03-27 Kyocera Corporation Wiring board
US6054761A (en) 1998-12-01 2000-04-25 Fujitsu Limited Multi-layer circuit substrates and electrical assemblies having conductive composition connectors
WO2000059645A1 (en) * 1999-04-01 2000-10-12 Ormet Corporation Methods to produce robust multilayer circuitry for electronic packaging
WO2000074946A1 (en) 1999-06-04 2000-12-14 Dj Orthopedics, Llc Orthopedic knee braces having sublimated graphics
US6370013B1 (en) 1999-11-30 2002-04-09 Kyocera Corporation Electric element incorporating wiring board
US6267559B1 (en) * 1999-12-21 2001-07-31 Alaris Medical Systems, Inc. Apparatus and method for reducing power consumption in a peristaltic pump mechanism
US6517602B2 (en) 2000-03-14 2003-02-11 Hitachi Metals, Ltd Solder ball and method for producing same
JP3414388B2 (ja) * 2000-06-12 2003-06-09 株式会社日立製作所 電子機器
US6896172B2 (en) * 2000-08-22 2005-05-24 Senju Metal Industry Co., Ltd. Lead-free solder paste for reflow soldering
JP3736452B2 (ja) * 2000-12-21 2006-01-18 株式会社日立製作所 はんだ箔
JP2003211289A (ja) * 2002-01-21 2003-07-29 Fujitsu Ltd 導電性接合材料、それを用いた接合方法及び電子機器
US6716036B2 (en) 2002-05-15 2004-04-06 Ormet Circuits, Inc. Method of attaching circuitry to a modular jack connector using electrically conductive paste
KR100757163B1 (ko) 2002-05-31 2007-09-07 다츠다 덴센 가부시키가이샤 도전성 페이스트, 이를 이용한 다층기판과 그 제조방법
US7147927B2 (en) 2002-06-26 2006-12-12 Eastman Chemical Company Biaxially oriented polyester film and laminates thereof with copper
US7888411B2 (en) 2003-04-01 2011-02-15 Creative Electron, Inc. Thermally conductive adhesive composition and process for device attachment
JP4639607B2 (ja) * 2004-03-04 2011-02-23 日立金属株式会社 鉛フリー半田材料およびPbフリー半田材料の製造方法
US20080023665A1 (en) 2006-07-25 2008-01-31 Weiser Martin W Thermal interconnect and interface materials, methods of production and uses thereof
CN101506906A (zh) * 2006-08-28 2009-08-12 株式会社村田制作所 导电性接合材料及电子装置
US8277677B2 (en) * 2008-06-23 2012-10-02 Northwestern University Mechanical strength and thermoelectric performance in metal chalcogenide MQ (M=Ge,Sn,Pb and Q=S, Se, Te) based compositions
WO2010114874A2 (en) * 2009-04-02 2010-10-07 Ormet Circuits Inc. Conductive compositions containing blended alloy fillers
KR101276147B1 (ko) * 2009-09-03 2013-06-18 가부시키가이샤 무라타 세이사쿠쇼 솔더 페이스트, 그것을 사용한 접합 방법, 및 접합 구조
KR20120096928A (ko) 2009-11-05 2012-08-31 오르멧 서키츠 인코퍼레이티드 야금 망상 조성물의 제조 및 그것의 사용 방법

Also Published As

Publication number Publication date
US8840700B2 (en) 2014-09-23
JP6203493B2 (ja) 2017-09-27
JP6976029B2 (ja) 2021-12-01
KR102108773B1 (ko) 2020-05-11
JP2017222930A (ja) 2017-12-21
JP2013510240A (ja) 2013-03-21
KR20190065473A (ko) 2019-06-11
US20110171372A1 (en) 2011-07-14
TWI481728B (zh) 2015-04-21
TW201124542A (en) 2011-07-16
WO2011078918A3 (en) 2011-10-27
WO2011078918A2 (en) 2011-06-30
KR20180054887A (ko) 2018-05-24
KR101988188B1 (ko) 2019-06-11

Similar Documents

Publication Publication Date Title
KR102108773B1 (ko) 야금 망상 조성물의 제조 및 그것의 사용 방법
JP6976028B2 (ja) 混合された合金フィラーを含む伝導性組成物
JP6975708B2 (ja) 半導体ダイ接着用途のための高金属負荷量の焼結ペースト
US11440142B2 (en) Alternative compositions for high temperature soldering applications
US9005330B2 (en) Electrically conductive compositions comprising non-eutectic solder alloys
KR102747812B1 (ko) 전자 패키징에서의 조립을 위한 열안정성 미세구조를 갖는 야금 조성물
US20210118836A1 (en) Metallic adhesive compositions having good work lives and thermal conductivity, methods of making same and uses thereof

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20120604

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20151105

Comment text: Request for Examination of Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20170124

Patent event code: PE09021S01D

E601 Decision to refuse application
PE0601 Decision on rejection of patent

Patent event date: 20171129

Comment text: Decision to Refuse Application

Patent event code: PE06012S01D

Patent event date: 20170124

Comment text: Notification of reason for refusal

Patent event code: PE06011S01I

E801 Decision on dismissal of amendment
PE0801 Dismissal of amendment

Patent event code: PE08012E01D

Comment text: Decision on Dismissal of Amendment

Patent event date: 20180410

Patent event code: PE08011R01I

Comment text: Amendment to Specification, etc.

Patent event date: 20180223

Patent event code: PE08011R01I

Comment text: Amendment to Specification, etc.

Patent event date: 20170626

Patent event code: PE08011R01I

Comment text: Amendment to Specification, etc.

Patent event date: 20151105

E601 Decision to refuse application
PE0601 Decision on rejection of patent

Patent event date: 20180417

Comment text: Decision to Refuse Application

Patent event code: PE06012S01D

Patent event date: 20170124

Comment text: Notification of reason for refusal

Patent event code: PE06011S01I

PA0104 Divisional application for international application

Comment text: Divisional Application for International Patent

Patent event code: PA01041R01D

Patent event date: 20180508