JP2012523091A5 - - Google Patents
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- JP2012523091A5 JP2012523091A5 JP2012503646A JP2012503646A JP2012523091A5 JP 2012523091 A5 JP2012523091 A5 JP 2012523091A5 JP 2012503646 A JP2012503646 A JP 2012503646A JP 2012503646 A JP2012503646 A JP 2012503646A JP 2012523091 A5 JP2012523091 A5 JP 2012523091A5
- Authority
- JP
- Japan
- Prior art keywords
- metal
- composition
- melting point
- low melting
- particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000203 mixture Substances 0.000 claims 39
- 229910052751 metal Inorganic materials 0.000 claims 27
- 239000002184 metal Substances 0.000 claims 27
- 238000002844 melting Methods 0.000 claims 23
- 230000008018 melting Effects 0.000 claims 23
- 239000002923 metal particle Substances 0.000 claims 22
- 229910052718 tin Inorganic materials 0.000 claims 13
- 229910000765 intermetallic Inorganic materials 0.000 claims 8
- 229910052802 copper Inorganic materials 0.000 claims 6
- 238000000034 method Methods 0.000 claims 6
- 239000003870 refractory metal Substances 0.000 claims 6
- 229910052709 silver Inorganic materials 0.000 claims 6
- 239000002245 particle Substances 0.000 claims 5
- 229910052787 antimony Inorganic materials 0.000 claims 4
- 229910052797 bismuth Inorganic materials 0.000 claims 4
- 229910052737 gold Inorganic materials 0.000 claims 4
- 229910052738 indium Inorganic materials 0.000 claims 4
- 239000011230 binding agent Substances 0.000 claims 3
- 229910052759 nickel Inorganic materials 0.000 claims 3
- 229910045601 alloy Inorganic materials 0.000 claims 2
- 239000000956 alloy Substances 0.000 claims 2
- 229910052782 aluminium Inorganic materials 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 2
- 229910052745 lead Inorganic materials 0.000 claims 2
- 229920000642 polymer Polymers 0.000 claims 2
- 229910052790 beryllium Inorganic materials 0.000 claims 1
- 239000000919 ceramic Substances 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 239000000945 filler Substances 0.000 claims 1
- 229910052733 gallium Inorganic materials 0.000 claims 1
- 239000011521 glass Substances 0.000 claims 1
- 229910052742 iron Inorganic materials 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000000155 melt Substances 0.000 claims 1
- 229910001092 metal group alloy Inorganic materials 0.000 claims 1
- 150000002739 metals Chemical class 0.000 claims 1
- 229910052750 molybdenum Inorganic materials 0.000 claims 1
- 239000000178 monomer Substances 0.000 claims 1
- 229910052763 palladium Inorganic materials 0.000 claims 1
- 229910052697 platinum Inorganic materials 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 229910052703 rhodium Inorganic materials 0.000 claims 1
- 239000002904 solvent Substances 0.000 claims 1
- 229910052716 thallium Inorganic materials 0.000 claims 1
- 229910052725 zinc Inorganic materials 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US16601509P | 2009-04-02 | 2009-04-02 | |
| US61/166,015 | 2009-04-02 | ||
| PCT/US2010/029330 WO2010114874A2 (en) | 2009-04-02 | 2010-03-31 | Conductive compositions containing blended alloy fillers |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014059793A Division JP2014167915A (ja) | 2009-04-02 | 2014-03-24 | 混合された合金フィラーを含む伝導性組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2012523091A JP2012523091A (ja) | 2012-09-27 |
| JP2012523091A5 true JP2012523091A5 (enExample) | 2012-11-08 |
Family
ID=42825368
Family Applications (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012503646A Pending JP2012523091A (ja) | 2009-04-02 | 2010-03-31 | 混合された合金フィラーを含む伝導性組成物 |
| JP2014059793A Pending JP2014167915A (ja) | 2009-04-02 | 2014-03-24 | 混合された合金フィラーを含む伝導性組成物 |
| JP2016158377A Active JP6976028B2 (ja) | 2009-04-02 | 2016-08-12 | 混合された合金フィラーを含む伝導性組成物 |
| JP2021126418A Pending JP2021178366A (ja) | 2009-04-02 | 2021-08-02 | 混合された合金フィラーを含む伝導性組成物 |
Family Applications After (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014059793A Pending JP2014167915A (ja) | 2009-04-02 | 2014-03-24 | 混合された合金フィラーを含む伝導性組成物 |
| JP2016158377A Active JP6976028B2 (ja) | 2009-04-02 | 2016-08-12 | 混合された合金フィラーを含む伝導性組成物 |
| JP2021126418A Pending JP2021178366A (ja) | 2009-04-02 | 2021-08-02 | 混合された合金フィラーを含む伝導性組成物 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US8221518B2 (enExample) |
| JP (4) | JP2012523091A (enExample) |
| KR (2) | KR20120032463A (enExample) |
| TW (1) | TWI555032B (enExample) |
| WO (1) | WO2010114874A2 (enExample) |
Families Citing this family (57)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010114874A2 (en) | 2009-04-02 | 2010-10-07 | Ormet Circuits Inc. | Conductive compositions containing blended alloy fillers |
| KR20120096928A (ko) * | 2009-11-05 | 2012-08-31 | 오르멧 서키츠 인코퍼레이티드 | 야금 망상 조성물의 제조 및 그것의 사용 방법 |
| US9636784B2 (en) * | 2010-05-03 | 2017-05-02 | Indium Corporation | Mixed alloy solder paste |
| US9017446B2 (en) | 2010-05-03 | 2015-04-28 | Indium Corporation | Mixed alloy solder paste |
| DE102011102555A1 (de) * | 2011-05-26 | 2012-11-29 | Forschungszentrum Jülich GmbH | Lotmaterial, Verwendung des Lotmaterials in einer Lotpaste sowie Verfahren zur Herstellung einer Lötverbindung mit Hilfe des Lotmaterials |
| CN102935511B (zh) * | 2011-08-15 | 2015-05-20 | 上海核威实业有限公司 | 一种提高铜铅合金粉末烧结的铜铅合金金相组织的方法 |
| JPWO2013038816A1 (ja) * | 2011-09-16 | 2015-03-26 | 株式会社村田製作所 | 導電性材料、それを用いた接続方法、および接続構造 |
| TW201332122A (zh) * | 2011-12-13 | 2013-08-01 | Dow Corning | 光伏打電池及其形成方法 |
| US8551367B2 (en) | 2012-01-19 | 2013-10-08 | E I Du Pont De Nemours And Company | Polymer thick film solder alloy conductor composition |
| US8557146B1 (en) | 2012-03-26 | 2013-10-15 | E I Du Pont De Nemours And Company | Polymer thick film solder alloy/metal conductor compositions |
| US9583453B2 (en) | 2012-05-30 | 2017-02-28 | Ormet Circuits, Inc. | Semiconductor packaging containing sintering die-attach material |
| JP2013256584A (ja) * | 2012-06-12 | 2013-12-26 | Panasonic Corp | 熱硬化性樹脂組成物およびフラックス組成物とそれを用いた半導体装置 |
| US20140120356A1 (en) * | 2012-06-18 | 2014-05-01 | Ormet Circuits, Inc. | Conductive film adhesive |
| US12053934B2 (en) * | 2012-06-18 | 2024-08-06 | Ormet Circuits, Inc. | Conductive film adhesive |
| US9005330B2 (en) | 2012-08-09 | 2015-04-14 | Ormet Circuits, Inc. | Electrically conductive compositions comprising non-eutectic solder alloys |
| US9034417B2 (en) * | 2012-08-20 | 2015-05-19 | E I Du Pont De Nemours And Company | Photonic sintering of polymer thick film conductor compositions |
| JP5599497B2 (ja) | 2012-08-29 | 2014-10-01 | 有限会社 ナプラ | 機能性材料 |
| US8986579B2 (en) | 2012-10-10 | 2015-03-24 | E I Du Pont De Nemours And Company | Lamination of polymer thick film conductor compositions |
| US8696860B1 (en) | 2012-10-10 | 2014-04-15 | E I Du Pont De Nemours And Company | Lamination of polymer thick film conductor compositions |
| US11440142B2 (en) | 2012-11-16 | 2022-09-13 | Ormet Circuits, Inc. | Alternative compositions for high temperature soldering applications |
| GB201222620D0 (en) * | 2012-12-14 | 2013-01-30 | Conpart As | Method of applying a conductive adhesive |
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| JP6153076B2 (ja) * | 2013-05-22 | 2017-06-28 | 株式会社豊田中央研究所 | 金属ナノ粒子ペースト、それを含有する接合材料、及びそれを用いた半導体装置 |
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| WO2015118790A1 (ja) | 2014-02-10 | 2015-08-13 | 三菱電機株式会社 | 接合材、接合方法、および電力用半導体装置 |
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| US9731384B2 (en) | 2014-11-18 | 2017-08-15 | Baker Hughes Incorporated | Methods and compositions for brazing |
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| KR101913994B1 (ko) * | 2015-03-10 | 2018-12-28 | 인듐 코포레이션 | 혼합 합금 땜납 페이스트 |
| US9831201B2 (en) | 2015-03-11 | 2017-11-28 | Guy F. Burgess | Methods for forming pillar bumps on semiconductor wafers |
| US10563292B2 (en) | 2015-04-09 | 2020-02-18 | Electronics And Telecommunications Research Institute | Metal material for 3-dimensional printing, method for manufacturing the same, and method for 3-dimensional printing using the same |
| KR101873491B1 (ko) * | 2015-04-09 | 2018-08-03 | 한국전자통신연구원 | 3d 프린팅용 금속 소재, 그 제조 방법, 및 그를 이용하는 3d 프린터 |
| WO2016174584A1 (en) * | 2015-04-28 | 2016-11-03 | Ormet Circuits, Inc. | Sintering pastes with high metal loading for semiconductor die attach applications |
| US9780067B2 (en) * | 2015-06-04 | 2017-10-03 | Advanced Micro Devices, Inc. | Semiconductor chip metal alloy thermal interface material |
| US10376997B2 (en) * | 2016-06-23 | 2019-08-13 | Purdue Research Foundation | Transient liquid phase bonding process and assemblies formed thereby |
| US20200063008A1 (en) * | 2016-12-09 | 2020-02-27 | Hitachi Chemical Company, Ltd. | Composition, adhesive, sintered body, joined body, and method of producing joined body |
| WO2018105126A1 (ja) * | 2016-12-09 | 2018-06-14 | 日立化成株式会社 | 組成物、接着剤、焼結体、接合体及び接合体の製造方法 |
| WO2018105125A1 (ja) * | 2016-12-09 | 2018-06-14 | 日立化成株式会社 | 組成物、接着剤、焼結体、接合体及び接合体の製造方法 |
| WO2019055680A1 (en) * | 2017-09-13 | 2019-03-21 | Carnegie Mellon University | LIQUID METAL FUSION WITH INKS AND CONDUCTIVE PASTES |
| CN107739873B (zh) * | 2017-09-30 | 2019-02-12 | 重庆鸽牌电线电缆有限公司 | 调相机用含银铜排坯料配方 |
| US11028303B2 (en) * | 2017-11-20 | 2021-06-08 | Terrapower, Llc | Sodium-tin and sodium-tin-lead coolants |
| EP3720647B1 (en) * | 2017-12-07 | 2024-09-11 | Ormet Circuits, Inc. | Metallurgical compositions with thermally stable microstructures for assembly in electronic packaging |
| CN108766614B (zh) * | 2018-06-29 | 2019-09-24 | 北京梦之墨科技有限公司 | 一种导电连接剂及其使用方法 |
| KR102061203B1 (ko) | 2018-11-08 | 2019-12-31 | 덕산하이메탈 주식회사 | 저융점 고 내열성 특성 솔더 페이스트 및 포일 |
| JP7406069B2 (ja) * | 2019-09-26 | 2023-12-27 | ダイキン工業株式会社 | 熱交換器 |
| JP2021063262A (ja) * | 2019-10-11 | 2021-04-22 | 昭和電工マテリアルズ株式会社 | 接合用金属ペースト、接合体の製造方法、及び接合体 |
| JP7500943B2 (ja) * | 2019-10-11 | 2024-06-18 | 株式会社レゾナック | 接合用金属ペースト、接合体の製造方法、及び接合体 |
| US11819953B2 (en) * | 2020-10-18 | 2023-11-21 | Mesoglue, Inc | Method of using amalgamation preform |
| JP7656862B2 (ja) * | 2021-06-18 | 2025-04-04 | パナソニックIpマネジメント株式会社 | 導電性ペーストおよびそれを用いて形成される導電膜 |
| WO2023097174A1 (en) * | 2021-11-23 | 2023-06-01 | Ormet Circuits, Inc. | Conductive compositions for low temperature assembly of electronic components |
| TW202334367A (zh) * | 2022-02-21 | 2023-09-01 | 日商拓自達電線股份有限公司 | 導電性糊及多層基板 |
| CN114833494B (zh) * | 2022-05-17 | 2023-04-14 | 南京恒电电子有限公司 | 实现低温焊接高温服役的过程反应性焊料及接头制备方法 |
| CN115555757B (zh) * | 2022-06-07 | 2024-07-26 | 苏州优诺电子材料科技有限公司 | 一种中温焊接的高可靠性焊锡膏及其应用 |
| CN119421760A (zh) * | 2022-07-05 | 2025-02-11 | 松下知识产权经营株式会社 | 接合材料和接合结构体 |
| JP7267522B1 (ja) * | 2022-09-29 | 2023-05-01 | 三菱電機株式会社 | 接合部材および半導体装置 |
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| JPS53133799A (en) | 1977-04-27 | 1978-11-21 | Idearisaachi Yuugen | Electroconductive paint |
| US5043102A (en) * | 1989-11-29 | 1991-08-27 | Advanced Products, Inc. | Conductive adhesive useful for bonding a semiconductor die to a conductive support base |
| JPH03187373A (ja) | 1989-12-13 | 1991-08-15 | Masao Saito | 薬酒 |
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| US5853622A (en) * | 1990-02-09 | 1998-12-29 | Ormet Corporation | Transient liquid phase sintering conductive adhesives |
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| US5376403A (en) * | 1990-02-09 | 1994-12-27 | Capote; Miguel A. | Electrically conductive compositions and methods for the preparation and use thereof |
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| WO2010114874A2 (en) | 2009-04-02 | 2010-10-07 | Ormet Circuits Inc. | Conductive compositions containing blended alloy fillers |
| KR20120096928A (ko) | 2009-11-05 | 2012-08-31 | 오르멧 서키츠 인코퍼레이티드 | 야금 망상 조성물의 제조 및 그것의 사용 방법 |
-
2010
- 2010-03-31 WO PCT/US2010/029330 patent/WO2010114874A2/en not_active Ceased
- 2010-03-31 KR KR1020117024999A patent/KR20120032463A/ko not_active Ceased
- 2010-03-31 JP JP2012503646A patent/JP2012523091A/ja active Pending
- 2010-03-31 US US12/751,030 patent/US8221518B2/en active Active
- 2010-03-31 KR KR1020177013835A patent/KR102089843B1/ko active Active
- 2010-04-02 TW TW099110429A patent/TWI555032B/zh active
-
2014
- 2014-03-24 JP JP2014059793A patent/JP2014167915A/ja active Pending
-
2016
- 2016-08-12 JP JP2016158377A patent/JP6976028B2/ja active Active
-
2021
- 2021-08-02 JP JP2021126418A patent/JP2021178366A/ja active Pending
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