JP2013211408A - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
- Publication number
- JP2013211408A JP2013211408A JP2012080586A JP2012080586A JP2013211408A JP 2013211408 A JP2013211408 A JP 2013211408A JP 2012080586 A JP2012080586 A JP 2012080586A JP 2012080586 A JP2012080586 A JP 2012080586A JP 2013211408 A JP2013211408 A JP 2013211408A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- algaas layer
- algaas
- type
- gaas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 51
- 229910000980 Aluminium gallium arsenide Inorganic materials 0.000 claims abstract description 111
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims abstract description 50
- 239000000203 mixture Substances 0.000 claims abstract description 19
- 239000000758 substrate Substances 0.000 claims abstract description 8
- 238000009792 diffusion process Methods 0.000 abstract description 17
- 238000012360 testing method Methods 0.000 description 10
- 229910000530 Gallium indium arsenide Inorganic materials 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 230000007423 decrease Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 229910000807 Ga alloy Inorganic materials 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 238000001312 dry etching Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 229910000927 Ge alloy Inorganic materials 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 229910003902 SiCl 4 Inorganic materials 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66446—Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET]
- H01L29/66462—Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET] with a heterojunction interface channel or gate, e.g. HFET, HIGFET, SISFET, HJFET, HEMT
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
- H01L29/7782—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with confinement of carriers by at least two heterojunctions, e.g. DHHEMT, quantum well HEMT, DHMODFET
- H01L29/7783—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with confinement of carriers by at least two heterojunctions, e.g. DHHEMT, quantum well HEMT, DHMODFET using III-V semiconductor material
- H01L29/7785—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with confinement of carriers by at least two heterojunctions, e.g. DHHEMT, quantum well HEMT, DHMODFET using III-V semiconductor material with more than one donor layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/20—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
- H01L29/201—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds including two or more compounds, e.g. alloys
- H01L29/205—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds including two or more compounds, e.g. alloys in different semiconductor regions, e.g. heterojunctions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/45—Ohmic electrodes
- H01L29/452—Ohmic electrodes on AIII-BV compounds
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Junction Field-Effect Transistors (AREA)
- Electrodes Of Semiconductors (AREA)
Abstract
【解決手段】基板10上に設けられたGaAs系半導体からなる動作層20と、前記動作層上に設けられた第1AlGaAs層24、26と、前記第1AlGaAs層上に設けられたゲート電極34と、前記ゲート領域を挟む領域の前記第1AlGaAs層上に選択的に設けられ、前記第1AlGaAs層よりAl組成比が大きく、Al組成比が0.3以上かつ0.5以下であるn型の第2AlGaAs層28と、前記第2AlGaAs層上に選択的に設けられたn型GaAs層30と、前記n型GaAs層上に前記ゲート電極を挟んで設けられた、Auを含むソース電極36およびドレイン電極38と、を具備する半導体装置。
【選択図】図5
Description
20 アンドープInGaAs層
24 n型AlGaAs層
26 アンドープAlGaAs層
28 n型AlGaAs層
30 n型GaAs層
32 半導体層
34 ゲート電極
36 ソース電極
38 ドレイン電極
Claims (4)
- 基板上に設けられたGaAs系半導体からなる動作層と、
前記動作層上に設けられた第1AlGaAs層と、
前記第1AlGaAs層上に設けられたゲート電極と、
前記ゲート領域を挟む領域の前記第1AlGaAs層上に選択的に設けられ、前記第1AlGaAs層よりAl組成比が大きく、Al組成比が0.3以上かつ0.5以下であるn型の第2AlGaAs層と、
前記第2AlGaAs層上に選択的に設けられたn型GaAs層と、
前記n型GaAs層上に前記ゲート電極を挟んで設けられた、Auを含むソース電極およびドレイン電極と、
を具備することを特徴とする半導体装置。 - 前記第2AlGaAs層は、前記第1AlGaAs層上に直接設けられていることを特徴とする請求項1記載の半導体装置。
- 前記第2AlGaAs層と前記第1AlGaAs層との間にリセスを有するGaAs層が設けられ、前記ゲート電極は前記リセス内に設けられてなることを特徴とする請求項1記載の半導体装置。
- 前記第2AlGaAs層の膜厚は5nm以上かつ7.5nm以下であることを特徴とする請求項1から3のいずれか一項記載の半導体装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012080586A JP5857390B2 (ja) | 2012-03-30 | 2012-03-30 | 半導体装置 |
US13/853,748 US9018679B2 (en) | 2012-03-30 | 2013-03-29 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012080586A JP5857390B2 (ja) | 2012-03-30 | 2012-03-30 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013211408A true JP2013211408A (ja) | 2013-10-10 |
JP5857390B2 JP5857390B2 (ja) | 2016-02-10 |
Family
ID=49233724
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012080586A Active JP5857390B2 (ja) | 2012-03-30 | 2012-03-30 | 半導体装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US9018679B2 (ja) |
JP (1) | JP5857390B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015220362A (ja) * | 2014-05-19 | 2015-12-07 | 富士通株式会社 | 半導体装置 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07273317A (ja) * | 1994-03-30 | 1995-10-20 | Nec Corp | 電界効果トランジスタの製造方法 |
JPH10270467A (ja) * | 1997-03-25 | 1998-10-09 | Toshiba Corp | 半導体装置 |
JPH11283995A (ja) * | 1998-03-30 | 1999-10-15 | Hitachi Ltd | 半導体装置およびその製造方法 |
JP2000012563A (ja) * | 1998-06-24 | 2000-01-14 | Sanyo Electric Co Ltd | 電界効果型半導体装置 |
JP2000307101A (ja) * | 1999-04-21 | 2000-11-02 | Ricoh Co Ltd | 半導体装置およびその製造方法 |
JP2000353789A (ja) * | 1999-06-09 | 2000-12-19 | Nec Corp | 化合物半導体装置およびその製造方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05211177A (ja) | 1991-11-29 | 1993-08-20 | Nec Corp | 電界効果トランジスタ |
JP3123940B2 (ja) * | 1997-03-27 | 2001-01-15 | 日本電気株式会社 | 電界効果トランジスタおよびその製造方法 |
JP3107031B2 (ja) * | 1998-03-06 | 2000-11-06 | 日本電気株式会社 | 電界効果トランジスタ |
JP2004103656A (ja) * | 2002-09-05 | 2004-04-02 | Sony Corp | 半導体装置及び半導体装置の製造方法 |
JP2009081177A (ja) * | 2007-09-25 | 2009-04-16 | Nec Electronics Corp | 電界効果トランジスタ、半導体チップ及び半導体装置 |
JP2010016089A (ja) * | 2008-07-02 | 2010-01-21 | Nec Electronics Corp | 電界効果トランジスタ、その製造方法、及び半導体装置 |
JP2010135590A (ja) * | 2008-12-05 | 2010-06-17 | Renesas Electronics Corp | 電界効果トランジスタ |
CN102369594A (zh) * | 2009-04-06 | 2012-03-07 | 住友化学株式会社 | 半导体基板、半导体基板的制造方法、半导体基板的判定方法以及电子器件 |
JP2011146512A (ja) * | 2010-01-14 | 2011-07-28 | Renesas Electronics Corp | 半導体装置 |
US8860120B2 (en) * | 2010-09-22 | 2014-10-14 | Nxp, B.V. | Field modulating plate and circuit |
JP5749918B2 (ja) * | 2010-11-18 | 2015-07-15 | ルネサスエレクトロニクス株式会社 | 半導体装置、及び半導体装置の製造方法 |
WO2013066466A2 (en) * | 2011-08-12 | 2013-05-10 | Bae Systems Integration And Electronic Systems Integration Inc. | Low voltage high efficiency gallium arsenide power amplifier |
-
2012
- 2012-03-30 JP JP2012080586A patent/JP5857390B2/ja active Active
-
2013
- 2013-03-29 US US13/853,748 patent/US9018679B2/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07273317A (ja) * | 1994-03-30 | 1995-10-20 | Nec Corp | 電界効果トランジスタの製造方法 |
JPH10270467A (ja) * | 1997-03-25 | 1998-10-09 | Toshiba Corp | 半導体装置 |
JPH11283995A (ja) * | 1998-03-30 | 1999-10-15 | Hitachi Ltd | 半導体装置およびその製造方法 |
JP2000012563A (ja) * | 1998-06-24 | 2000-01-14 | Sanyo Electric Co Ltd | 電界効果型半導体装置 |
JP2000307101A (ja) * | 1999-04-21 | 2000-11-02 | Ricoh Co Ltd | 半導体装置およびその製造方法 |
JP2000353789A (ja) * | 1999-06-09 | 2000-12-19 | Nec Corp | 化合物半導体装置およびその製造方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015220362A (ja) * | 2014-05-19 | 2015-12-07 | 富士通株式会社 | 半導体装置 |
Also Published As
Publication number | Publication date |
---|---|
US9018679B2 (en) | 2015-04-28 |
JP5857390B2 (ja) | 2016-02-10 |
US20130256752A1 (en) | 2013-10-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6174874B2 (ja) | 半導体装置 | |
US7557389B2 (en) | Field-effect transistor | |
US9299823B2 (en) | Semiconductor device and method of making including cap layer and nitride semiconductor layer | |
US20090194791A1 (en) | Compound semiconductor device and manufacturing method thereof | |
JP7348842B2 (ja) | GaNスペーサ厚の均一性改善のために選択及び非選択エッチング層を用いたエンハンスメントモードGaNトランジスタ | |
US8759878B2 (en) | Nitride semiconductor device and method for manufacturing same | |
US11769825B2 (en) | Nitride semiconductor device and nitride semiconductor package | |
JP2015026629A (ja) | 窒化物半導体装置の構造及び製造方法 | |
TWI470792B (zh) | 異質結構場效電晶體改良結構及其製程方法 | |
JP2009212472A (ja) | 窒化物半導体素子 | |
JP7025853B2 (ja) | 窒化物半導体デバイスおよび窒化物半導体パッケージ | |
JP6242678B2 (ja) | 窒化物半導体素子及びその製造方法 | |
JP2010016089A (ja) | 電界効果トランジスタ、その製造方法、及び半導体装置 | |
JP2007005406A (ja) | ヘテロ接合バイポーラトランジスタ及び製造方法 | |
JP5857390B2 (ja) | 半導体装置 | |
JP2005005646A (ja) | 半導体装置 | |
JP5920043B2 (ja) | 半導体レーザ及びその製造方法 | |
JP5431756B2 (ja) | Iii族窒化物半導体からなる半導体装置 | |
JP2017168583A (ja) | 半導体装置 | |
JP4546051B2 (ja) | 半導体装置の製造方法 | |
JP2015230972A (ja) | ヘテロ接合電界効果型トランジスタおよびその製造方法 | |
TWI746854B (zh) | 高電子移動率電晶體及其形成方法 | |
JP5194399B2 (ja) | 保護素子及びその製造方法、並びに化合物半導体装置 | |
JP4048524B2 (ja) | 半導体装置の製造方法 | |
JP6123195B2 (ja) | 電界効果トランジスタ及びその製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20150323 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20150824 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20150901 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20151027 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20151117 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20151127 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5857390 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |