JP2013197246A - 放熱器一体型基板の製造方法および放熱器一体型基板 - Google Patents
放熱器一体型基板の製造方法および放熱器一体型基板 Download PDFInfo
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- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
Abstract
【解決手段】金属回路板15および金属ベース板20とセラミックス基板10とを接合して金属−セラミックス接合基板2を形成し、次いで、放熱器30の一方の面に、ろう材を介して、金属ベース板20を重ねて配置し、放熱器30の他方の面に、凹のR面55を有する治具51を突き合わせて配置し、金属回路板15の他方の面に、金属−セラミックス接合基板2側に突出する凸のR面56を有する治具52を接触させ、放熱器側治具51と金属−セラミックス接合基板側治具52とで加圧しながら金属−セラミックス接合基板2と放熱器30とを加熱接合し、凸のR面56および凹のR面55の曲率半径R(mm)は、6500≦R≦面圧(N/mm2)×2000+12000である。
【選択図】図4
Description
6500≦R≦面圧(N/mm2)×2000+12000
であることを特徴とする、放熱器一体型基板の製造方法を提供する。
6500≦R≦面圧(N/mm2)×2000+12000 (1)
であることが好ましい。曲率半径Rが小さいと、金属回路板15の表面に加圧する面圧については少ない面圧で金属−セラミックス接合基板2の金属回路板15表面の反り量を低減させることができるが、Rが小さすぎると、放熱器一体型基板に割れが発生することがある。また、Rが大きすぎると、R面が平面に近くなるため、本発明の効果が低減する。より好ましい曲率半径Rは、7000≦R≦面圧(N/mm2)×2000+11000である。
2 金属−セラミックス接合基板
10 セラミックス基板
15 金属回路板
20 金属ベース板
30 放熱器
31 間隙部
33 ろう材層
35 仕切り板
38 流路
40 蓋部材
41 蓋部
45a、45b 液循環ポート
51 放熱器側治具
52 金属−セラミックス接合基板側治具
55 凹のR面
56 凸のR面
Claims (10)
- セラミックス基板の一方の面にアルミニウムまたはアルミニウム合金からなる金属回路板の一方の面が接合されるとともに、前記セラミックス基板の他方の面にアルミニウムまたはアルミニウム合金からなる平板状の金属ベース板の一方の面が接合され、前記金属ベース板の他方の面に放熱器が接合された放熱器一体型基板の製造方法であって、
前記金属回路板および前記金属ベース板と前記セラミックス基板とを接合して金属−セラミックス接合基板を形成し、
次いで、前記放熱器の一方の面に、ろう材を介して、前記金属−セラミックス接合基板の金属ベース板を重ねて配置し、
前記放熱器の他方の面に、凹のR面を有する治具を突き合わせて配置し、
前記金属−セラミックス接合基板の金属回路板の他方の面に、前記金属−セラミックス接合基板側に突出する凸のR面を有する治具を接触させ、
前記放熱器側に配置した治具と前記金属−セラミックス接合基板側に配置した治具とで加圧しながら、前記金属−セラミックス接合基板と前記放熱器とを加熱接合し、
前記凸のR面および前記凹のR面の曲率半径R(mm)は、
6500≦R≦面圧(N/mm2)×2000+12000
であることを特徴とする、放熱器一体型基板の製造方法。 - 前記セラミックス基板が矩形であり、その長辺が40mm以上であることを特徴とする、請求項1に記載の放熱器一体型基板の製造方法。
- 前記金属回路板に加圧する面圧が1.0N/mm2以上であることを特徴とする、請求項1または2に記載の放熱器一体型基板の製造方法。
- 前記金属回路板に加圧する面圧が5.0N/mm2以下であることを特徴とする、請求項1〜3のいずれかに記載の放熱器一体型基板の製造方法。
- 前記金属回路板の厚さt1と前記金属ベース板の厚さt2が、t2/t1≧2 を満たし、t1が0.4〜3.0mm、t2が0.8〜6mmであることを特徴とする、請求項1〜4のいずれかに記載の放熱器一体型基板の製造方法。
- 前記放熱器がアルミニウムまたはアルミニウム合金の押出し材であることを特徴とする、請求項1〜5のいずれかに記載の放熱器一体型基板の製造方法。
- 前記セラミックス基板と前記金属回路板との接合、及び前記セラミックス基板と前記金属ベース板との接合を、溶湯接合法によって行うことを特徴とする、請求項1〜6のいずれかに記載の放熱器一体型基板の製造方法。
- 請求項1〜7のいずれかの製造方法で製造したことを特徴とする、放熱器一体型基板。
- 前記金属−セラミックス接合基板と前記放熱器とをろう付け接合した後の前記金属−セラミックス接合基板の金属回路板表面の反り量が2μm/mm以下であることを特徴とする、請求項8に記載の放熱器一体型基板。
- セラミックス基板の一方の面にアルミニウムまたはアルミニウム合金からなる金属回路板の一方の面が接合されるとともに、前記セラミックス基板の他方の面にアルミニウムまたはアルミニウム合金からなる平板状の金属ベース板の一方の面が接合され、前記金属ベース板の他方の面に放熱器がろう材を介して接合された放熱器一体型基板であって、
前記セラミックス基板が矩形であり、その長辺が40mm以上であり、且つ前記金属−セラミックス接合基板の金属回路板表面の反り量が2μm/mm以下であることを特徴とする、放熱器一体型基板。
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JP2012061603A JP6012990B2 (ja) | 2012-03-19 | 2012-03-19 | 放熱器一体型基板の製造方法 |
EP13765162.6A EP2830403B1 (en) | 2012-03-19 | 2013-03-13 | Manufacturing method of radiator-integrated substrate and radiator-integrated substrate |
PCT/JP2013/057025 WO2013141110A1 (ja) | 2012-03-19 | 2013-03-13 | 放熱器一体型基板の製造方法および放熱器一体型基板 |
US14/386,271 US9474146B2 (en) | 2012-03-19 | 2013-03-13 | Manufacturing method of radiator-integrated substrate and radiator-integrated substrate |
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JP2012061603A JP6012990B2 (ja) | 2012-03-19 | 2012-03-19 | 放熱器一体型基板の製造方法 |
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Cited By (10)
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WO2015053316A1 (ja) * | 2013-10-10 | 2015-04-16 | 三菱マテリアル株式会社 | ヒートシンク付パワーモジュール用基板及びその製造方法 |
JP2015076551A (ja) * | 2013-10-10 | 2015-04-20 | 三菱マテリアル株式会社 | ヒートシンク付パワーモジュール用基板及びその製造方法 |
JP2015130429A (ja) * | 2014-01-08 | 2015-07-16 | 三菱マテリアル株式会社 | ヒートシンク付パワーモジュール用基板及びその製造方法 |
JP2015130430A (ja) * | 2014-01-08 | 2015-07-16 | 三菱マテリアル株式会社 | ヒートシンク付パワーモジュール用基板及びその製造方法 |
JP2015153925A (ja) * | 2014-02-17 | 2015-08-24 | 三菱マテリアル株式会社 | ヒートシンク付パワーモジュール用基板の製造方法 |
JP2015170825A (ja) * | 2014-03-10 | 2015-09-28 | 三菱マテリアル株式会社 | 放熱板付パワーモジュール用基板の製造方法 |
JP2015170826A (ja) * | 2014-03-10 | 2015-09-28 | 三菱マテリアル株式会社 | 放熱板付パワーモジュール用基板の製造方法 |
JP2016063145A (ja) * | 2014-09-19 | 2016-04-25 | 三菱マテリアル株式会社 | 放熱板付パワーモジュール用基板の製造装置及び製造方法 |
US11501980B2 (en) | 2019-05-15 | 2022-11-15 | Fuji Electric Co., Ltd. | Semiconductor module, method for manufacturing semiconductor module, and level different jig |
JP7363583B2 (ja) | 2020-03-04 | 2023-10-18 | 三菱マテリアル株式会社 | 絶縁回路基板の製造方法 |
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US9474146B2 (en) | 2016-10-18 |
US20150041187A1 (en) | 2015-02-12 |
EP2830403A4 (en) | 2015-11-11 |
EP2830403A1 (en) | 2015-01-28 |
JP6012990B2 (ja) | 2016-10-25 |
WO2013141110A1 (ja) | 2013-09-26 |
EP2830403B1 (en) | 2019-12-18 |
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