JP2013157496A - 発光素子およびその製造方法、並びに発光装置 - Google Patents

発光素子およびその製造方法、並びに発光装置 Download PDF

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Publication number
JP2013157496A
JP2013157496A JP2012017660A JP2012017660A JP2013157496A JP 2013157496 A JP2013157496 A JP 2013157496A JP 2012017660 A JP2012017660 A JP 2012017660A JP 2012017660 A JP2012017660 A JP 2012017660A JP 2013157496 A JP2013157496 A JP 2013157496A
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Prior art keywords
light emitting
layer
light
semiconductor layer
electrode
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Pending
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JP2012017660A
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English (en)
Japanese (ja)
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JP2013157496A5 (enExample
Inventor
Hidekazu Aoyanagi
秀和 青柳
Takahiko Kawasaki
孝彦 河崎
Harunori Shiomi
治典 塩見
Katsutoshi Ito
勝利 伊藤
Makoto Nakajima
真 中島
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Sony Corp
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Sony Corp
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Priority to JP2012017660A priority Critical patent/JP2013157496A/ja
Priority to US13/743,275 priority patent/US8987763B2/en
Priority to CN2013100260358A priority patent/CN103227260A/zh
Publication of JP2013157496A publication Critical patent/JP2013157496A/ja
Publication of JP2013157496A5 publication Critical patent/JP2013157496A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H10H20/831—Electrodes characterised by their shape
    • H10H20/8314—Electrodes characterised by their shape extending at least partially onto an outer side surface of the bodies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings

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JP2012017660A 2012-01-31 2012-01-31 発光素子およびその製造方法、並びに発光装置 Pending JP2013157496A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2012017660A JP2013157496A (ja) 2012-01-31 2012-01-31 発光素子およびその製造方法、並びに発光装置
US13/743,275 US8987763B2 (en) 2012-01-31 2013-01-16 Light emitting device and method of manufacturing the same, and light emitting unit
CN2013100260358A CN103227260A (zh) 2012-01-31 2013-01-23 发光元件、发光元件制造方法和发光装置

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Application Number Priority Date Filing Date Title
JP2012017660A JP2013157496A (ja) 2012-01-31 2012-01-31 発光素子およびその製造方法、並びに発光装置

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JP2013157496A true JP2013157496A (ja) 2013-08-15
JP2013157496A5 JP2013157496A5 (enExample) 2015-02-19

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US (1) US8987763B2 (enExample)
JP (1) JP2013157496A (enExample)
CN (1) CN103227260A (enExample)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016056750A1 (en) * 2014-10-07 2016-04-14 Lg Electronics Inc. Semiconductor device and method of manufacturing the same
JP2017512380A (ja) * 2014-02-18 2017-05-18 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングＯｓｒａｍ Ｏｐｔｏ Ｓｅｍｉｃｏｎｄｕｃｔｏｒｓ ＧｍｂＨ 半導体構成素子を製造する方法、及び、半導体構成素子
JPWO2016079929A1 (ja) * 2014-11-21 2017-06-15 信越半導体株式会社 発光素子及び発光素子の製造方法
KR20170133746A (ko) * 2016-05-26 2017-12-06 엘지이노텍 주식회사 발광 소자
KR20170133758A (ko) * 2016-05-26 2017-12-06 엘지이노텍 주식회사 발광 소자
KR20180106163A (ko) * 2017-03-17 2018-10-01 엘지이노텍 주식회사 반도체 소자 및 반도체 소자 제조 방법
WO2020044991A1 (ja) * 2018-08-28 2020-03-05 ソニーセミコンダクタソリューションズ株式会社 発光素子及び電子機器
JP2020134921A (ja) * 2019-02-20 2020-08-31 日亜化学工業株式会社 表示装置及びその製造方法
KR20210102739A (ko) * 2020-02-12 2021-08-20 삼성전자주식회사 Led 소자 및 그 제조방법과, led 소자를 포함하는 디스플레이 장치
US11362246B2 (en) 2019-02-20 2022-06-14 Nichia Corporation Method of manufacturing display device with lateral wiring
US11410975B2 (en) 2019-02-20 2022-08-09 Nichia Corporation Display device and method of manufacturing display device
US12446382B2 (en) 2020-09-17 2025-10-14 Ams-Osram International Gmbh Optoelectronic semiconductor component and production method

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CN105449064B (zh) * 2014-09-02 2018-02-23 展晶科技(深圳)有限公司 发光二极管及其制造方法
KR102309092B1 (ko) * 2014-12-29 2021-10-06 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광 소자 및 이를 포함하는 발광 소자 어레이
CN110379896B (zh) * 2015-01-21 2021-09-21 晶元光电股份有限公司 半导体发光元件
US11024773B2 (en) 2016-11-07 2021-06-01 Goertek. Inc Micro-LED with vertical structure, display device, electronics apparatus and manufacturing method
CN109698264B (zh) * 2017-10-20 2020-08-18 展晶科技(深圳)有限公司 发光二极管及其制造方法
CN110600596A (zh) * 2018-06-13 2019-12-20 相丰科技股份有限公司 垂直型发光二极管结构及其制造方法
KR102805792B1 (ko) * 2019-11-26 2025-05-12 삼성전자주식회사 Led 소자 및 그 제조방법과, led 소자를 포함하는 디스플레이 장치

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JPH0983015A (ja) * 1995-09-20 1997-03-28 Oki Electric Ind Co Ltd モノリシック発光ダイオードアレイの製造方法
JP2002335013A (ja) * 2001-05-08 2002-11-22 Hitachi Cable Ltd 高密度発光ダイオードアレイ
JP2006173197A (ja) * 2004-12-13 2006-06-29 Citizen Electronics Co Ltd 光半導体素子及び光半導体装置並びに光半導体素子の製造方法
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JP4066654B2 (ja) * 2001-12-19 2008-03-26 富士ゼロックス株式会社 面発光型半導体レーザ装置及びその製造方法
JP3928621B2 (ja) 2004-01-19 2007-06-13 日亜化学工業株式会社 発光素子用ウエハー
WO2009004980A1 (ja) * 2007-06-29 2009-01-08 Showa Denko K.K. 発光ダイオードの製造方法
CN101222014A (zh) * 2008-01-31 2008-07-16 金芃 垂直结构的半导体芯片
US20130015461A1 (en) * 2011-07-13 2013-01-17 Kun Hsin Technology Inc. Light-emitting Device Capable of Producing White Light And Light Mixing Method For Producing White Light With Same
US8410508B1 (en) * 2011-09-12 2013-04-02 SemiLEDs Optoelectronics Co., Ltd. Light emitting diode (LED) package having wavelength conversion member and wafer level fabrication method

Patent Citations (4)

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JPH0983015A (ja) * 1995-09-20 1997-03-28 Oki Electric Ind Co Ltd モノリシック発光ダイオードアレイの製造方法
JP2002335013A (ja) * 2001-05-08 2002-11-22 Hitachi Cable Ltd 高密度発光ダイオードアレイ
JP2006173197A (ja) * 2004-12-13 2006-06-29 Citizen Electronics Co Ltd 光半導体素子及び光半導体装置並びに光半導体素子の製造方法
JP2011176145A (ja) * 2010-02-24 2011-09-08 Toshiba Corp 半導体発光装置及びその製造方法

Cited By (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10074766B2 (en) 2014-02-18 2018-09-11 Osram Opto Semiconductors Gmbh Method for producing semiconductor components and semiconductor component
JP2017512380A (ja) * 2014-02-18 2017-05-18 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングＯｓｒａｍ Ｏｐｔｏ Ｓｅｍｉｃｏｎｄｕｃｔｏｒｓ ＧｍｂＨ 半導体構成素子を製造する方法、及び、半導体構成素子
KR20160041417A (ko) * 2014-10-07 2016-04-18 엘지전자 주식회사 반도체 소자 및 이의 제조 방법
KR101649657B1 (ko) * 2014-10-07 2016-08-30 엘지전자 주식회사 반도체 소자 및 이의 제조 방법
US9620681B2 (en) 2014-10-07 2017-04-11 Lg Electronics Inc. Semiconductor device and method of manufacturing the same
WO2016056750A1 (en) * 2014-10-07 2016-04-14 Lg Electronics Inc. Semiconductor device and method of manufacturing the same
JPWO2016079929A1 (ja) * 2014-11-21 2017-06-15 信越半導体株式会社 発光素子及び発光素子の製造方法
KR20170133746A (ko) * 2016-05-26 2017-12-06 엘지이노텍 주식회사 발광 소자
KR20170133758A (ko) * 2016-05-26 2017-12-06 엘지이노텍 주식회사 발광 소자
KR102504334B1 (ko) * 2016-05-26 2023-02-28 엘지이노텍 주식회사 발광 소자
KR102477250B1 (ko) * 2016-05-26 2022-12-13 엘지이노텍 주식회사 발광 소자
KR20180106163A (ko) * 2017-03-17 2018-10-01 엘지이노텍 주식회사 반도체 소자 및 반도체 소자 제조 방법
KR102261951B1 (ko) 2017-03-17 2021-06-08 엘지이노텍 주식회사 반도체 소자 및 반도체 소자 제조 방법
KR20210044789A (ko) 2018-08-28 2021-04-23 소니 세미컨덕터 솔루션즈 가부시키가이샤 발광 소자 및 전자 기기
KR102740658B1 (ko) * 2018-08-28 2024-12-11 소니 세미컨덕터 솔루션즈 가부시키가이샤 발광 소자 및 전자 기기
JPWO2020044991A1 (ja) * 2018-08-28 2021-08-12 ソニーセミコンダクタソリューションズ株式会社 発光素子及び電子機器
US11923479B2 (en) 2018-08-28 2024-03-05 Sony Semiconductor Solutions Corporation Light-emitting element and electronic apparatus
JP7307077B2 (ja) 2018-08-28 2023-07-11 ソニーセミコンダクタソリューションズ株式会社 発光素子及び電子機器
WO2020044991A1 (ja) * 2018-08-28 2020-03-05 ソニーセミコンダクタソリューションズ株式会社 発光素子及び電子機器
JP2020134921A (ja) * 2019-02-20 2020-08-31 日亜化学工業株式会社 表示装置及びその製造方法
US11410975B2 (en) 2019-02-20 2022-08-09 Nichia Corporation Display device and method of manufacturing display device
US11362246B2 (en) 2019-02-20 2022-06-14 Nichia Corporation Method of manufacturing display device with lateral wiring
JP7029624B2 (ja) 2019-02-20 2022-03-04 日亜化学工業株式会社 表示装置及びその製造方法
KR20210102739A (ko) * 2020-02-12 2021-08-20 삼성전자주식회사 Led 소자 및 그 제조방법과, led 소자를 포함하는 디스플레이 장치
KR102806089B1 (ko) * 2020-02-12 2025-05-12 삼성전자주식회사 Led 소자 및 그 제조방법과, led 소자를 포함하는 디스플레이 장치
US12501742B2 (en) 2020-02-12 2025-12-16 Samsung Electronics Co., Ltd. LED device, method of manufacturing the LED device, and display apparatus including the LED device
US12446382B2 (en) 2020-09-17 2025-10-14 Ams-Osram International Gmbh Optoelectronic semiconductor component and production method

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US8987763B2 (en) 2015-03-24
CN103227260A (zh) 2013-07-31
US20130181249A1 (en) 2013-07-18

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