JP2013149972A - 電気相互接続用の吊り下げ型格子 - Google Patents
電気相互接続用の吊り下げ型格子 Download PDFInfo
- Publication number
- JP2013149972A JP2013149972A JP2013002315A JP2013002315A JP2013149972A JP 2013149972 A JP2013149972 A JP 2013149972A JP 2013002315 A JP2013002315 A JP 2013002315A JP 2013002315 A JP2013002315 A JP 2013002315A JP 2013149972 A JP2013149972 A JP 2013149972A
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- Prior art keywords
- electrical connection
- grid
- electrical
- circuit board
- connection point
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09681—Mesh conductors, e.g. as a ground plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/0969—Apertured conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
- Multi-Conductor Connections (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
【解決手段】回路基板と回路基板上の電気的接続点202とを有し、電気的接続点202は導体材料の格子212を含み、この格子212は回路基板内のすき間に隣接するとともに、回路基板に取り付けられたカバーレイ220材料によるアンカーポイントを有している。導電性エポキシ樹脂が導体材料の格子212のうちの少なくとも一部分を閉じ込める。
【選択図】図4
Description
Claims (8)
- 回路基板と、
前記回路基板上の電気的接続点であって、前記電気的接続点は前記回路基板内のすき間に隣接する導体材料の格子を含み、前記格子は前記回路基板に取り付けられたアンカーポイントを有する、電気的接点と、を含む
電気相互接続。 - 導体材料の前記格子を閉じ込める導電性エポキシ樹脂をさらに含む、請求項1に記載の電気相互接続。
- 前記回路基板の前記表面上にある前記電気的接続点に隣接し、前記導電性エポキシ樹脂に接触している第2の電気的接続点をさらに含む、請求項2に記載の電気相互接続。
- 前記アンカーポイントが前記導電性エポキシ樹脂を導体材料の前記格子に限定する、請求項2に記載の電気相互接続。
- 前記回路基板と接触しているカバーレイ材料をさらに含む、請求項1に記載の電気相互接続。
- 前記アンカーポイントが、前記カバーレイ材料内に存在し、かつ前記カバーレイ材料と前記回路基板の両方に接触している、請求項5に記載の電気相互接続。
- 前記格子が円形の穴を含む、請求項1に記載の電気相互接続。
- 前記格子が、四分円状の穴を4個形成する2つの交差する直線部分を含む、請求項1に記載の電気相互接続。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/352,215 | 2012-01-17 | ||
US13/352,215 US9572254B2 (en) | 2012-01-17 | 2012-01-17 | Suspended lattice for electrical interconnects |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2013149972A true JP2013149972A (ja) | 2013-08-01 |
Family
ID=47844048
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013002315A Pending JP2013149972A (ja) | 2012-01-17 | 2013-01-10 | 電気相互接続用の吊り下げ型格子 |
Country Status (5)
Country | Link |
---|---|
US (2) | US9572254B2 (ja) |
EP (1) | EP2618642A3 (ja) |
JP (1) | JP2013149972A (ja) |
KR (1) | KR101887707B1 (ja) |
CN (1) | CN103208478B (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10433421B2 (en) * | 2012-12-26 | 2019-10-01 | Intel Corporation | Reduced capacitance land pad |
US10834818B2 (en) * | 2018-11-05 | 2020-11-10 | Ngk Spark Plug Co., Ltd. | Wiring board |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2003283121A (ja) * | 2002-03-25 | 2003-10-03 | Toppan Forms Co Ltd | 導電接続部同士の接続方法 |
JP2007103631A (ja) * | 2005-10-04 | 2007-04-19 | Fujifilm Corp | フレキシブルプリント配線板 |
JP2007128787A (ja) * | 2005-11-04 | 2007-05-24 | Matsushita Electric Works Ltd | 基板接続用コネクタ |
JP2009176947A (ja) * | 2008-01-24 | 2009-08-06 | Olympus Corp | 3次元モジュール |
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-
2012
- 2012-01-17 US US13/352,215 patent/US9572254B2/en active Active
-
2013
- 2013-01-10 JP JP2013002315A patent/JP2013149972A/ja active Pending
- 2013-01-10 KR KR1020130003031A patent/KR101887707B1/ko active IP Right Grant
- 2013-01-14 EP EP13151202.2A patent/EP2618642A3/en not_active Withdrawn
- 2013-01-16 CN CN201310015295.5A patent/CN103208478B/zh not_active Expired - Fee Related
-
2017
- 2017-01-19 US US15/409,807 patent/US10306775B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003283121A (ja) * | 2002-03-25 | 2003-10-03 | Toppan Forms Co Ltd | 導電接続部同士の接続方法 |
JP2007103631A (ja) * | 2005-10-04 | 2007-04-19 | Fujifilm Corp | フレキシブルプリント配線板 |
JP2007128787A (ja) * | 2005-11-04 | 2007-05-24 | Matsushita Electric Works Ltd | 基板接続用コネクタ |
JP2009176947A (ja) * | 2008-01-24 | 2009-08-06 | Olympus Corp | 3次元モジュール |
Also Published As
Publication number | Publication date |
---|---|
US20130180771A1 (en) | 2013-07-18 |
CN103208478B (zh) | 2017-07-18 |
EP2618642A2 (en) | 2013-07-24 |
US10306775B2 (en) | 2019-05-28 |
US20170135228A1 (en) | 2017-05-11 |
CN103208478A (zh) | 2013-07-17 |
KR20130084614A (ko) | 2013-07-25 |
US9572254B2 (en) | 2017-02-14 |
KR101887707B1 (ko) | 2018-08-10 |
EP2618642A3 (en) | 2014-08-06 |
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