JP2013140971A - 薄型基板による電子素子のパッケージ方法 - Google Patents
薄型基板による電子素子のパッケージ方法 Download PDFInfo
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- JP2013140971A JP2013140971A JP2012283084A JP2012283084A JP2013140971A JP 2013140971 A JP2013140971 A JP 2013140971A JP 2012283084 A JP2012283084 A JP 2012283084A JP 2012283084 A JP2012283084 A JP 2012283084A JP 2013140971 A JP2013140971 A JP 2013140971A
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- thin substrate
- package
- chip
- package unit
- ball grid
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- 239000010949 copper Substances 0.000 description 15
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 15
- 239000010931 gold Substances 0.000 description 15
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- Engineering & Computer Science (AREA)
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
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Abstract
【解決手段】キャリアを提供するS101工程と、少なくとも1つのパッケージユニットを含み、薄い多層基板を製造するために、少なくとも1つの金属層及び少なくとも1つの誘電層をキャリアに形成するS102工程と、少なくとも1つのパッド層を薄型基板の表面に形成するS103工程と、薄型基板をキャリアから分離するS104工程と、薄型基板を検査して、欠陥があるパッケージユニットを取り除き、チップと接続するためのパッケージユニットを選択するS105工程と、各選択されたパッケージユニットをフリップチップボンディングによりチップと接続するS106工程とを含む。
【選択図】図4
Description
メモリチップに対してボンディング(bonding)を行う。
全体のウェーハに対してウェーハモールディング(wafer molding)を行う。
ウェーハを除去する。
中間層(Feed-Through Interposer:FTI)により、システムオンチップ(System-On-a-Chip:SoC)またはロジックチップ(Logic Chip)をに対してボンディングを行う。全体のパッケージした製品(パッケージしたメモリチップ及びシステムオンチップやロジックチップ)は、ボールグリッドアレイによって外部のシステム回路基板(PCB)と接続する。
100、200 キャリア
102、106、202、206 金属層
104、204 誘電層
108、210 パッド層
112 パッケージ
114 ボールマウンティング
150 チップ
208 ビア金属
300、301、302 クランプシステム
310 外周部
311、314 下保持板
312、315 上保持板
313 吸引孔
320 クランプ部
330 調整スプリング
340、341 固定ネジ
Claims (23)
- 薄型基板による電子素子のパッケージ方法であって、
キャリアを提供する工程と、
前記薄型基板は少なくとも1つのチップと接続するための少なくとも1つのパッケージユニットを含み、前記薄い多層基板を製造するために、少なくとも1つの金属層及び少なくとも1つの誘電層を前記キャリアに形成する工程と、
少なくとも1つのパッド層を前記薄型基板の表面に形成する工程と、
前記薄型基板を前記キャリアから分離する工程と、
前記薄型基板を検査して、欠陥があるパッケージユニットを取り除き、前記チップと接続するための前記パッケージユニットを選択する工程と、
各選択された前記パッケージユニットをフリップチップボンディングにより前記チップと接続する工程と、
前記薄型基板の上に接合されている前記チップに対して完全なモールディングを行って、前記電子素子を構築する工程とを含むことを特徴とするパッケージ方法。 - 前記薄型基板を検査する工程において、クランプシステムにより前記薄型基板をクランプし、前記薄型基板の上表面及び底面に前記パッド層を露出させる工程をさらに含むことを特徴とする請求項1に記載のパッケージ方法。
- 前記薄型基板をクランプする工程において、前記薄型基板への張力及び前記薄型基板の接触抵抗を所定の数値に制御する工程をさらに含むことを特徴とする請求項2に記載のパッケージ方法。
- 前記パッケージユニットはフリップチップボンディングにより前記パッド層で前記チップと接続されることを特徴とする請求項1に記載のパッケージ方法。
- 前記完全なモールディングを行う工程の後に、複数の半田ボールを前記パッケージユニットと接続してボールグリッドアレイを形成し、前記電子素子を得ることを特徴とする請求項1に記載のパッケージ方法。
- 前記ボールグリッドアレイを形成する工程の後に、前記パッケージユニットのサイズに応じて前記電子素子を切り離す工程をさらに含むことを特徴とする請求項5に記載のパッケージ方法。
- 前記完全なモールディングを行う工程の前に、前記パッケージユニットをフリップチップボンディングにより前記チップと接続する表面に、各前記パッケージユニットをボールグリッドアレイ素子と接続する工程をさらに含むことを特徴とする請求項1に記載のパッケージ方法。
- 各前記パッケージユニットを前記ボールグリッドアレイ素子と接続する工程の前に、前記パッケージユニットにソルダペースト或いは半田付剤を印刷する工程をさらに含むことを特徴とする請求項7に記載のパッケージ方法。
- 前記各選択された前記パッケージユニットをフリップチップボンディングにより前記チップと接続する工程の前に、各前記パッケージユニットをボールグリッドアレイ素子と接続する工程をさらに含むことを特徴とする請求項1に記載のパッケージ方法。
- 各前記パッケージユニットを前記ボールグリッドアレイ素子と接続する工程は、前記パッケージユニットをフリップチップボンディングにより前記チップと接続する表面に実行されることを特徴とする請求項9に記載のパッケージ方法。
- 各選択された前記パッケージユニットをフリップチップボンディングにより前記チップと接続する工程において、各前記パッケージユニットをボールグリッドアレイ素子と接続する工程をさらに含み、前記ボールグリッドアレイ素子と接続する工程は前記パッケージユニットをフリップチップボンディングにより前記チップと接続する表面に実行されることを特徴とする請求項1に記載のパッケージ方法。
- 薄型基板による電子素子のパッケージ方法であって、
キャリアを提供する工程と、
前記薄型基板は少なくとも1つのチップと接続するための少なくとも1つのパッケージユニットを含み、前記薄い多層基板を製造するために、少なくとも1つの金属層及び少なくとも1つの誘電層を前記キャリアに形成する工程と、
少なくとも1つのパッド層を前記薄型基板の表面に形成する工程と、
前記薄型基板を前記キャリアから分離する工程と、
前記薄型基板を検査して、欠陥があるパッケージユニットを取り除き、前記チップと接続するための前記パッケージユニットを選択する工程と、
選択された前記パッケージユニットをフリップチップボンディングにより前記チップと接続する工程と、
モールディングパネルのサイズに応じて 前記薄型基板を切り離す工程と、
フリップチップボンディングにより前記モールディングパネルの上に接合されている前記チップに対してモールディングを行って、前記電子素子を構築する工程とを含むことを特徴とするパッケージ方法。 - 前記薄型基板を検査する工程において、クランプシステムにより前記薄型基板をクランプし、前記薄型基板の上表面及び底面に前記パッド層を露出させる工程をさらに含むことを特徴とする請求項12に記載のパッケージ方法。
- 前記薄型基板をクランプする工程において、前記薄型基板への張力及び前記薄型基板の接触抵抗を所定の数値に制御する工程をさらに含むことを特徴とする請求項13に記載のパッケージ方法。
- 前記パッケージユニットはフリップチップボンディングにより前記パッド層で前記チップと接続されることを特徴とする請求項1に記載のパッケージ方法。
- 前記モールディングは移転モールディングであることを特徴とする請求項12に記載のパッケージ方法。
- 前記完全なモールディングを行う工程の後に、複数の半田ボールを前記パッケージユニットと接続してボールグリッドアレイを形成し、前記電子素子を得ることを特徴とする請求項12に記載のパッケージ方法。
- 前記ボールグリッドアレイを形成する工程の後に、前記パッケージユニットのサイズに応じて前記電子素子を切り離す工程をさらに含むことを特徴とする請求項17に記載のパッケージ方法。
- 前記モールディングを行う工程の前に、前記パッケージユニットをフリップチップボンディングにより前記チップと接続する表面に、各前記パッケージユニットをボールグリッドアレイ素子と接続する工程をさらに含むことを特徴とする請求項12に記載のパッケージ方法。
- 各前記パッケージユニットを前記ボールグリッドアレイ素子と接続する工程の前に、前記パッケージユニットにソルダペースト或いは半田付剤を印刷する工程をさらに含むことを特徴とする請求項19に記載のパッケージ方法。
- 前記選択されたパッケージユニットをフリップチップボンディングにより前記チップと接続する工程の前に、各前記パッケージユニットをボールグリッドアレイ素子と接続する工程をさらに含むことを特徴とする請求項12に記載のパッケージ方法。
- 各前記パッケージユニットを前記ボールグリッドアレイ素子と接続する工程は、前記パッケージユニットをフリップチップボンディングにより前記チップと接続する表面に実行されることを特徴とする請求項21に記載のパッケージ方法。
- 各選択された前記パッケージユニットをフリップチップボンディングにより前記チップと接続する工程において、各前記パッケージユニットをボールグリッドアレイ素子と接続する工程をさらに含み、前記ボールグリッドアレイ素子と接続する工程は前記パッケージユニットをフリップチップボンディングにより前記チップと接続する表面に実行されることを特徴とする請求項12に記載のパッケージ方法。
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EP2851942A3 (en) | 2015-04-15 |
EP2610903A2 (en) | 2013-07-03 |
EP2610903B1 (en) | 2019-04-03 |
KR101418279B1 (ko) | 2014-08-06 |
TWI440412B (zh) | 2014-06-01 |
US20140162382A1 (en) | 2014-06-12 |
KR20130076716A (ko) | 2013-07-08 |
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