JP2013131755A - 埋込形フィールド・プレート(buriedfieldplate)を有する化合物半導体デバイス - Google Patents
埋込形フィールド・プレート(buriedfieldplate)を有する化合物半導体デバイス Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 222
- 150000001875 compounds Chemical class 0.000 title claims abstract description 127
- 239000000463 material Substances 0.000 claims abstract description 152
- 230000005533 two-dimensional electron gas Effects 0.000 claims abstract description 9
- 239000002019 doping agent Substances 0.000 claims description 35
- 238000000034 method Methods 0.000 claims description 28
- 239000000758 substrate Substances 0.000 claims description 17
- 229910002704 AlGaN Inorganic materials 0.000 claims description 14
- 238000005530 etching Methods 0.000 claims description 10
- 238000001465 metallisation Methods 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 4
- 239000004047 hole gas Substances 0.000 claims description 3
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- 238000000137 annealing Methods 0.000 claims 3
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- 239000002184 metal Substances 0.000 description 6
- 230000015556 catabolic process Effects 0.000 description 5
- 230000005669 field effect Effects 0.000 description 3
- 238000013459 approach Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
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- 101150006217 lex1 gene Proteins 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
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- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
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Abstract
【解決手段】半導体デバイスは、第1の化合物半導体材料120と、この第1の化合物半導体材料上の第2の化合物半導体材料130とを含む。第2の化合物半導体材料130は、第1の化合物半導体材料120が2次元電子ガス(2DEG)を有するように、第1の化合物半導体材料120と異なる材料を含む。この半導体デバイスはさらに、第1の化合物半導体材料120内に配置され、半導体デバイスの端子に電気的に接続された埋込形フィールド・プレート140を含む。2DEGは、埋込形フィールド・プレート140と第2の化合物半導体材料130との間に挿入される。
【選択図】図1
Description
Claims (27)
- 第1の化合物半導体材料と、
前記第1の化合物半導体材料上の第2の化合物半導体材料であって、前記第1の化合物半導体材料が2次元電子ガス(2DEG)を有するように、前記第1の化合物半導体材料と異なる材料を含む第2の化合物半導体材料と、
前記第1の化合物半導体材料内に配置され、半導体デバイスの端子に電気的に接続された埋込形フィールド・プレートであって、前記2DEGが前記埋込形フィールド・プレートと前記第2の化合物半導体材料の間に挿入される、埋込形フィールド・プレートと
を含む、半導体デバイス。 - 前記埋込形フィールド・プレートが、前記第2の化合物半導体材料と同じ材料を含む、請求項1に記載の半導体デバイス。
- 前記埋込形フィールド・プレートおよび前記第2の化合物半導体材料がそれぞれ、AlGaNを含む、請求項2に記載の半導体デバイス。
- 前記埋込形フィールド・プレートがInGaNを含む、請求項1に記載の半導体デバイス。
- 前記埋込形フィールド・プレートが、前記第1の化合物半導体材料のより低濃度のドープ領域によって囲まれた、前記第1の化合物半導体材料のより高濃度のドープ領域を含む、請求項1に記載の半導体デバイス。
- 前記2DEG上のゲート領域と、
前記第2の化合物半導体材料を通って前記第1の化合物半導体材料まで延在し、前記埋込形フィールド・プレートに接触しているソース領域と、
前記第2の化合物半導体材料を通って前記第1の化合物半導体材料まで延在し、前記ソース領域および前記埋込形フィールド・プレートから離れて配置されているドレイン領域と
をさらに含む、請求項1に記載の半導体デバイス。 - 前記埋込形フィールド・プレートと前記2DEGの間の距離が、前記ゲート領域と前記2DEGの間の距離よりも長い、請求項6に記載の半導体デバイス。
- 前記埋込形フィールド・プレートが、前記ソース領域から、前記ゲート領域よりもさらに前記ドレイン領域へと横方向に延在する、請求項6に記載の半導体デバイス。
- 前記埋込形フィールド・プレートおよび前記ソース領域が、同じドーピング・タイプのドープ領域を含む、請求項6に記載の半導体デバイス。
- 前記2DEGの下の前記第1の化合物半導体材料内に配置され、前記ソース領域に接触している、少なくとも1つの追加の埋込形フィールド・プレートをさらに含み、前記埋込形フィールド・プレートのうちの隣接するプレートが、前記第1の化合物半導体材料の一領域によって互いに離れて配置される、請求項6に記載の半導体デバイス。
- 前記ソース領域が、前記ドレイン領域よりも、前記第1の化合物半導体材料内に深く延在する、請求項10に記載の半導体デバイス。
- 前記埋込形フィールド・プレートのうちの第2のプレートが、前記埋込形フィールド・プレートのうちの第1のプレートよりも、前記第2の化合物半導体材料からさらに離れて配置され、前記ソース領域から前記ドレイン領域へと、前記埋込形フィールド・プレートのうちの前記第1のプレートよりもさらに横方向へ延在する、請求項10に記載の半導体デバイス。
- 前記埋込形フィールド・プレートと前記2DEGの間の距離が、前記ソース領域から前記ドレイン領域まで横へ延在する方向に増大する、請求項6に記載の半導体デバイス。
- 前記第1の化合物半導体材料内に、前記第1の2DEGよりも前記第2の化合物半導体材料からさらに離れて配置される第2の2DEGをさらに含み、前記埋込形フィールド・プレートが前記第1の2DEGと第2の2DEGの間に挿入される、請求項1に記載の半導体デバイス。
- 前記第1の2DEGが、前記半導体デバイスのソース領域から前記半導体デバイスのドレイン領域に横方向へ延在し、前記半導体デバイスのチャネルを形成し、前記第2の2DEGが、前記ソース領域から前記ドレイン領域に向けて横方向へ延在し、前記ドレイン領域に達する前に終端する、請求項14に記載の半導体デバイス。
- 前記第1の化合物半導体材料内に、前記2DEGよりも前記第2の化合物半導体材料からさらに離れて配置される2次元正孔ガス(2DHG)をさらに含み、前記埋込形フィールド・プレートが前記2DEGと前記2DHGの間に挿入される、請求項1に記載の半導体デバイス。
- 第1のIII−V族半導体材料と、
前記第1のIII−V族半導体材料上の第2のIII−V族半導体材料であって、前記第1のIII−V族半導体材料が2次元電子ガス(2DEG)を有するように、前記第1のIII−V族半導体材料と異なる材料を含む第2のIII−V族半導体材料と、
前記第2のIII−V族半導体材料が前記2DEGと前記ゲート領域の間に挿入された状態の、前記第2のIII−V族半導体材料上のゲート領域と、
前記第2のIII−V族半導体材料を通って前記第1のIII−V族半導体材料まで延在するソース領域と、
前記第2のIII−V族半導体材料を通って前記第1のIII−V族半導体材料まで延在し、前記ソース領域から離れて配置されるドレイン領域と、
前記第2のIII−V族半導体材料から向きがそれている前記第1のIII−V族半導体材料の片側にあるメタライゼーションであって、前記第1のIII−V族半導体材料の厚さが、前記ソース領域から前記ドレイン領域まで横へ延在する方向に増大するメタライゼーションと
を含む、半導体デバイス。 - 前記第1のIII−V族半導体材料の厚さが、前記ソース領域から前記ドレイン領域まで横へ延在する方向に階段状に増大する、請求項17に記載の半導体デバイス。
- 第1の化合物半導体材料を半導体基板上に形成するステップと、
前記第1の化合物半導体材料上の第2の化合物半導体材料であって、前記第1の化合物半導体材料が2次元電子ガス(2DEG)を有するように、前記第1の化合物半導体材料と異なる材料を含む第2の化合物半導体材料を形成するステップと、
前記2DEGが、埋込形フィールド・プレートと前記第2の化合物半導体材料との間に挿入されるように、前記第1の化合物半導体材料内に前記埋込形フィールド・プレートを形成するステップと、
前記埋込形フィールド・プレートを前記半導体デバイスの端子に電気的に接続するステップと
を含む、半導体デバイスを製造する方法。 - 前記第1の化合物半導体材料内に前記埋込形フィールド・プレートを形成するステップが、
前記第1の化合物半導体材料の一部分が露出するように、前記第2の化合物半導体材料を形成する前に前記第1の化合物半導体材料上にマスクを形成するステップと、
前記第1の化合物半導体材料にドーパント種を埋め込んで、前記第1の化合物半導体材料内のある一定の深さで前記ドーパント種の集中部分を形成するステップと、
前記ドーパント種を埋め込んだ後、前記第2の化合物半導体材料を前記第1の化合物半導体材料上に形成するステップであって、前記2DEGが、ドーパント種の前記集中部分と前記第2の化合物半導体材料との間に挿入されるステップと、
前記半導体デバイスをアニール処理して、ドーパント種を活性化させ、前記埋込形フィールド・プレートを形成するステップと
を含む、請求項19に記載の方法。 - 前記第1の化合物半導体材料内に前記埋込形フィールド・プレートを形成するステップが、
前記第2の化合物半導体材料の一部分が前記マスクによって露出するように、前記第2の化合物半導体材料上にマスクを形成するステップと、
前記第2の化合物半導体材料の露出部分を通して前記第1の化合物半導体材料内にドーパント種を埋め込んで、前記第1の化合物半導体材料内のある一定の深さで前記ドーパント種の集中部分を形成するステップであって、前記2DEGが、ドーパント種の前記集中部分と前記第2の化合物半導体材料との間に挿入されるステップと、
前記半導体デバイスをアニール処理して、前記ドーパント種を活性化させ、前記埋込形フィールド・プレートを形成するステップと
を含む、請求項19に記載の方法。 - 前記第2の化合物半導体材料と同じ材料の前記埋込形フィールド・プレートを形成し、その結果、前記第1の化合物半導体材料内に、前記第1の2DEGよりも前記第2の化合物半導体材料からさらに離れて配置される第2の2DEGが生じるステップを含み、前記埋込形フィールド・プレートが前記第1の2DEGと第2の2DEGの間に挿入される、請求項19に記載の方法。
- 前記第1および第2の化合物半導体材料と異なる化合物半導体材料の前記埋込形フィールド・プレートを形成し、その結果、前記第1の化合物半導体材料内に、前記2DEGよりも前記第2の化合物半導体材料からさらに離れて配置される2次元正孔ガス(2DHG)が生じるステップを含み、前記埋込形フィールド・プレートが前記2DEGと前記2DHGの間に挿入される、請求項19に記載の方法。
- 前記第1の化合物半導体材料内に前記埋込形フィールド・プレートを形成するステップが、
前記第2の化合物半導体材料から向きがそれている前記第1の化合物半導体材料の側部を通してドーパント種を埋め込んで、前記第1の化合物半導体材料内のある一定の深さで前記ドーパント種の集中部分を形成するステップと、
前記半導体デバイスをアニール処理して、ドーパント種を活性化させ、前記埋込形フィールド・プレートを形成するステップと
を含む、請求項19に記載の方法。 - 前記2DEGの下の前記第1の化合物半導体材料内にあり、前記半導体デバイスの前記端子に接触している、少なくとも1つの追加の埋込形フィールド・プレートを形成するステップをさらに含み、前記埋込形フィールド・プレートのうちの隣接するプレートが、前記第1の化合物半導体材料の一領域によって互いに離れて配置される、請求項19に記載の方法。
- 前記埋込形フィールド・プレートに電気的に接続された前記端子が、
前記半導体デバイスの一領域内の前記第2の化合物半導体の少なくとも一部分を取り除くステップと、
前記第2の化合物半導体の少なくとも一部分が取り除かれた領域において、前記第1の化合物半導体材料内にドーパント種を埋め込むステップと、
前記半導体デバイスをアニール処理して、前記ドーパント種を活性化させ、前記端子を形成するステップと
によって形成される、請求項19に記載の方法。 - 前記埋込形フィールド・プレートに電気的に接続された前記端子が、
前記第2の化合物半導体材料を通して前記第1の化合物半導体材料に至るくぼみをエッチングするステップと、
前記埋込形フィールド・プレートの側部が導電性材料に接触するように、前記導電性材料で前記くぼみを満たすステップと
によって形成される、請求項19に記載の方法。
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