JP2013071335A - マザー基板の分断方法 - Google Patents

マザー基板の分断方法 Download PDF

Info

Publication number
JP2013071335A
JP2013071335A JP2011212633A JP2011212633A JP2013071335A JP 2013071335 A JP2013071335 A JP 2013071335A JP 2011212633 A JP2011212633 A JP 2011212633A JP 2011212633 A JP2011212633 A JP 2011212633A JP 2013071335 A JP2013071335 A JP 2013071335A
Authority
JP
Japan
Prior art keywords
substrate
scribe line
scribe
edge
mother substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011212633A
Other languages
English (en)
Japanese (ja)
Inventor
Kenji Fukuhara
健司 福原
Koji Yamamoto
山本　　幸司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Priority to JP2011212633A priority Critical patent/JP2013071335A/ja
Priority to TW101119277A priority patent/TW201315557A/zh
Priority to KR1020120070617A priority patent/KR101434348B1/ko
Priority to CN201210293007.8A priority patent/CN103030263B/zh
Publication of JP2013071335A publication Critical patent/JP2013071335A/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/10—Aluminium or alloys thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/52—Ceramics
JP2011212633A 2011-09-28 2011-09-28 マザー基板の分断方法 Pending JP2013071335A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2011212633A JP2013071335A (ja) 2011-09-28 2011-09-28 マザー基板の分断方法
TW101119277A TW201315557A (zh) 2011-09-28 2012-05-30 母基板之分斷方法
KR1020120070617A KR101434348B1 (ko) 2011-09-28 2012-06-29 마더 기판의 분단 방법
CN201210293007.8A CN103030263B (zh) 2011-09-28 2012-08-15 母基板的分断方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011212633A JP2013071335A (ja) 2011-09-28 2011-09-28 マザー基板の分断方法

Publications (1)

Publication Number Publication Date
JP2013071335A true JP2013071335A (ja) 2013-04-22

Family

ID=48017720

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011212633A Pending JP2013071335A (ja) 2011-09-28 2011-09-28 マザー基板の分断方法

Country Status (4)

Country Link
JP (1) JP2013071335A (zh)
KR (1) KR101434348B1 (zh)
CN (1) CN103030263B (zh)
TW (1) TW201315557A (zh)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150037481A (ko) 2013-09-30 2015-04-08 미쓰보시 다이야몬도 고교 가부시키가이샤 취성 재료 기판의 브레이크 방법 그리고 브레이크 장치
KR20150037482A (ko) 2013-09-30 2015-04-08 미쓰보시 다이야몬도 고교 가부시키가이샤 취성 재료 기판의 브레이크 방법 그리고 브레이크 장치
CN105382945A (zh) * 2014-08-20 2016-03-09 三星钻石工业股份有限公司 脆性材料基板的分断方法、基板保持构件及框体
JP2016040134A (ja) * 2015-12-24 2016-03-24 三星ダイヤモンド工業株式会社 脆性材料基板用のブレイクバー
CN106142369A (zh) * 2014-08-26 2016-11-23 三星钻石工业股份有限公司 切断装置
CN107009524A (zh) * 2015-09-29 2017-08-04 三星钻石工业股份有限公司 脆性基板的截断方法
KR20190064466A (ko) 2017-11-30 2019-06-10 미쓰보시 다이야몬도 고교 가부시키가이샤 기판정렬장치
US11105985B2 (en) 2020-01-31 2021-08-31 Corning Research & Development Corporation Lens-based connector assemblies having precision alignment features and methods for fabricating the same
US11249257B2 (en) 2020-01-31 2022-02-15 Corning Research & Development Corporation Ferrule assemblies having a lens array

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6524803B2 (ja) * 2015-06-02 2019-06-05 三星ダイヤモンド工業株式会社 ブレイクシステム
TW202039193A (zh) * 2016-02-26 2020-11-01 日商三星鑽石工業股份有限公司 脆性基板之分斷方法
KR101980606B1 (ko) * 2017-08-29 2019-05-21 한국미쯔보시다이아몬드공업(주) 취성 재료 기판의 경사 타입 분단 장치 및 분단 방법

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06275924A (ja) * 1993-03-22 1994-09-30 Ngk Spark Plug Co Ltd セラミック基板
JP2003236828A (ja) * 2002-02-13 2003-08-26 Murata Mfg Co Ltd 基板分割方法
JP2006001773A (ja) * 2004-06-16 2006-01-05 Sony Corp 基板分断方法及び基板分断装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100626983B1 (ko) * 1999-06-18 2006-09-22 미쓰보시 다이야몬도 고교 가부시키가이샤 레이저를 이용한 스크라이브 방법
ATE524285T1 (de) * 2003-01-10 2011-09-15 Mitsuboshi Diamond Ind Co Ltd Vorrichtung und verfahren zum ritzen von trägern aus sprödem material sowie automatische analyselinie
EP1862280A1 (en) * 2004-12-28 2007-12-05 Mitsuboshi Diamond Industrial Co., Ltd. Method for cutting brittle material substrate and substrate cutting system
JP2008162824A (ja) 2006-12-27 2008-07-17 Epson Imaging Devices Corp ガラス基板の切断方法及びガラス基板から表示パネルを製造する方法
JP2009116276A (ja) * 2007-11-09 2009-05-28 Sony Corp 表示パネルの製造方法、表示パネル、および、基板切断方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06275924A (ja) * 1993-03-22 1994-09-30 Ngk Spark Plug Co Ltd セラミック基板
JP2003236828A (ja) * 2002-02-13 2003-08-26 Murata Mfg Co Ltd 基板分割方法
JP2006001773A (ja) * 2004-06-16 2006-01-05 Sony Corp 基板分断方法及び基板分断装置

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150037481A (ko) 2013-09-30 2015-04-08 미쓰보시 다이야몬도 고교 가부시키가이샤 취성 재료 기판의 브레이크 방법 그리고 브레이크 장치
KR20150037482A (ko) 2013-09-30 2015-04-08 미쓰보시 다이야몬도 고교 가부시키가이샤 취성 재료 기판의 브레이크 방법 그리고 브레이크 장치
JP2015066831A (ja) * 2013-09-30 2015-04-13 三星ダイヤモンド工業株式会社 脆性材料基板のブレイク方法並びにブレイク装置
JP2015066832A (ja) * 2013-09-30 2015-04-13 三星ダイヤモンド工業株式会社 脆性材料基板のブレイク方法並びにブレイク装置
CN105382945A (zh) * 2014-08-20 2016-03-09 三星钻石工业股份有限公司 脆性材料基板的分断方法、基板保持构件及框体
CN106142369A (zh) * 2014-08-26 2016-11-23 三星钻石工业股份有限公司 切断装置
CN107009524A (zh) * 2015-09-29 2017-08-04 三星钻石工业股份有限公司 脆性基板的截断方法
JP2016040134A (ja) * 2015-12-24 2016-03-24 三星ダイヤモンド工業株式会社 脆性材料基板用のブレイクバー
KR20190064466A (ko) 2017-11-30 2019-06-10 미쓰보시 다이야몬도 고교 가부시키가이샤 기판정렬장치
US11105985B2 (en) 2020-01-31 2021-08-31 Corning Research & Development Corporation Lens-based connector assemblies having precision alignment features and methods for fabricating the same
US11249257B2 (en) 2020-01-31 2022-02-15 Corning Research & Development Corporation Ferrule assemblies having a lens array
US11808992B2 (en) 2020-01-31 2023-11-07 Corning Research & Development Corporation Lens-based connector assemblies having precision alignment features and methods for fabricating the same

Also Published As

Publication number Publication date
KR20130034575A (ko) 2013-04-05
KR101434348B1 (ko) 2014-08-27
TW201315557A (zh) 2013-04-16
CN103030263A (zh) 2013-04-10
CN103030263B (zh) 2016-01-27

Similar Documents

Publication Publication Date Title
JP2013071335A (ja) マザー基板の分断方法
KR100949152B1 (ko) 유리 기판 레이저 절단 장치
JP5173885B2 (ja) スクライブ装置及びスクライブ方法
KR101223470B1 (ko) 취성 재료 기판의 가공 방법
KR101165982B1 (ko) 취성 재료 기판의 가공 방법
US20090050610A1 (en) Method and apparatus for scribing brittle material board and system for breaking brittle material board
TWI462885B (zh) Method of breaking the substrate
KR101467157B1 (ko) 취성 재료 기판의 스크라이브 방법
JP5210409B2 (ja) ブレイク装置
JP2006199553A (ja) 基板分断装置及び基板分断方法
JP2013144635A (ja) 倣い制御を備えた硬質脆性板のスクライブライン形成装置及びその形成方法
JP6364789B2 (ja) スクライブ装置
JP2015209357A (ja) ブレイク方法並びにブレイク装置
KR20150145711A (ko) 취성 재료 기판의 스크라이브 방법 및 스크라이브 장치
JP2008307747A (ja) 脆性材料の割断方法
JP6507600B2 (ja) 脆性材料基板の分断方法及び加工装置
JP5536713B2 (ja) 脆性材料基板の加工方法
JP2018015903A (ja) スクライブ方法並びにスクライブ装置
JP2017014032A (ja) スクライブ方法並びにスクライブ装置
JP5444158B2 (ja) 脆性材料基板の割断方法
JP5993684B2 (ja) 脆性材料基板の分断方法及びスクライブ装置
JP2015085599A (ja) レーザブレイク装置
JP2011162395A (ja) 基板加工装置
JP2008156180A (ja) ガラス板スクライブ方法およびガラス板スクライブ装置
JP2021053827A (ja) スクライブ方法および分断方法

Legal Events

Date Code Title Description
A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20130716

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20131126