JP2013062296A - 配線基板、及び半導体パッケージ - Google Patents

配線基板、及び半導体パッケージ Download PDF

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Publication number
JP2013062296A
JP2013062296A JP2011198280A JP2011198280A JP2013062296A JP 2013062296 A JP2013062296 A JP 2013062296A JP 2011198280 A JP2011198280 A JP 2011198280A JP 2011198280 A JP2011198280 A JP 2011198280A JP 2013062296 A JP2013062296 A JP 2013062296A
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JP
Japan
Prior art keywords
electrode
substrate body
wiring board
power supply
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011198280A
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English (en)
Japanese (ja)
Other versions
JP2013062296A5 (enExample
Inventor
Tomoji Fujii
朋治 藤井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2011198280A priority Critical patent/JP2013062296A/ja
Priority to US13/593,752 priority patent/US8786099B2/en
Publication of JP2013062296A publication Critical patent/JP2013062296A/ja
Publication of JP2013062296A5 publication Critical patent/JP2013062296A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H05K1/0222—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09609—Via grid, i.e. two-dimensional array of vias or holes in a single plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Structure Of Printed Boards (AREA)
JP2011198280A 2011-09-12 2011-09-12 配線基板、及び半導体パッケージ Pending JP2013062296A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2011198280A JP2013062296A (ja) 2011-09-12 2011-09-12 配線基板、及び半導体パッケージ
US13/593,752 US8786099B2 (en) 2011-09-12 2012-08-24 Wiring substrate and semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011198280A JP2013062296A (ja) 2011-09-12 2011-09-12 配線基板、及び半導体パッケージ

Publications (2)

Publication Number Publication Date
JP2013062296A true JP2013062296A (ja) 2013-04-04
JP2013062296A5 JP2013062296A5 (enExample) 2014-08-14

Family

ID=47829108

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011198280A Pending JP2013062296A (ja) 2011-09-12 2011-09-12 配線基板、及び半導体パッケージ

Country Status (2)

Country Link
US (1) US8786099B2 (enExample)
JP (1) JP2013062296A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015207677A (ja) * 2014-04-22 2015-11-19 京セラサーキットソリューションズ株式会社 配線基板
JP6163671B1 (ja) * 2016-05-24 2017-07-19 株式会社野田スクリーン 中間接続体、中間接続体を備えた半導体装置、および中間接続体の製造方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6398902B2 (ja) 2014-08-19 2018-10-03 信越化学工業株式会社 インプリント・リソグラフィ用角形基板及びその製造方法
CN107960004A (zh) * 2016-10-14 2018-04-24 鹏鼎控股(深圳)股份有限公司 可伸缩电路板及其制作方法
JP2023043038A (ja) 2021-09-15 2023-03-28 キオクシア株式会社 半導体装置

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0541463A (ja) * 1991-08-05 1993-02-19 Ngk Spark Plug Co Ltd 集積回路用パツケージ
JPH09213832A (ja) * 1996-01-30 1997-08-15 Sumitomo Kinzoku Electro Device:Kk セラミック基板及びその製造方法
JP2002353365A (ja) * 2001-05-30 2002-12-06 Hitachi Ltd 半導体装置
JP2004152812A (ja) * 2002-10-28 2004-05-27 Sharp Corp 半導体装置及び積層型半導体装置
JP2005019765A (ja) * 2003-06-27 2005-01-20 Hitachi Ltd 半導体装置
JP2006253669A (ja) * 2005-02-09 2006-09-21 Ngk Spark Plug Co Ltd 配線基板
JP2008004853A (ja) * 2006-06-26 2008-01-10 Hitachi Ltd 積層半導体装置およびモジュール
US7405473B1 (en) * 2005-11-23 2008-07-29 Altera Corporation Techniques for optimizing electrical performance and layout efficiency in connectors with via placement and routing
WO2011033601A1 (ja) * 2009-09-21 2011-03-24 株式会社 東芝 ３次元集積回路製造方法、及び装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4041253B2 (ja) 1999-11-19 2008-01-30 京セラ株式会社 集積回路素子搭載用基板および集積回路装置
JP4795677B2 (ja) * 2004-12-02 2011-10-19 ルネサスエレクトロニクス株式会社 半導体装置およびそれを用いた半導体モジュール、ならびに半導体装置の製造方法
US8242608B2 (en) * 2008-09-30 2012-08-14 Altera Corporation Universal bump array structure

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0541463A (ja) * 1991-08-05 1993-02-19 Ngk Spark Plug Co Ltd 集積回路用パツケージ
JPH09213832A (ja) * 1996-01-30 1997-08-15 Sumitomo Kinzoku Electro Device:Kk セラミック基板及びその製造方法
JP2002353365A (ja) * 2001-05-30 2002-12-06 Hitachi Ltd 半導体装置
JP2004152812A (ja) * 2002-10-28 2004-05-27 Sharp Corp 半導体装置及び積層型半導体装置
JP2005019765A (ja) * 2003-06-27 2005-01-20 Hitachi Ltd 半導体装置
JP2006253669A (ja) * 2005-02-09 2006-09-21 Ngk Spark Plug Co Ltd 配線基板
US7405473B1 (en) * 2005-11-23 2008-07-29 Altera Corporation Techniques for optimizing electrical performance and layout efficiency in connectors with via placement and routing
JP2008004853A (ja) * 2006-06-26 2008-01-10 Hitachi Ltd 積層半導体装置およびモジュール
WO2011033601A1 (ja) * 2009-09-21 2011-03-24 株式会社 東芝 ３次元集積回路製造方法、及び装置

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015207677A (ja) * 2014-04-22 2015-11-19 京セラサーキットソリューションズ株式会社 配線基板
JP6163671B1 (ja) * 2016-05-24 2017-07-19 株式会社野田スクリーン 中間接続体、中間接続体を備えた半導体装置、および中間接続体の製造方法
WO2017203607A1 (ja) * 2016-05-24 2017-11-30 株式会社野田スクリーン 中間接続体、中間接続体を備えた半導体装置、および中間接続体の製造方法
KR101947774B1 (ko) 2016-05-24 2019-02-14 가부시키가이샤 노다스크린 중간 접속체, 중간 접속체를 구비한 반도체 장치, 및 중간 접속체의 제조 방법
US10483182B2 (en) 2016-05-24 2019-11-19 Noda Screen Co., Ltd. Intermediate connector, semiconductor device including intermediate connector, and method of manufacturing intermediate connector
TWI712343B (zh) * 2016-05-24 2020-12-01 日商野田士克林股份有限公司 中間連接體、具備中間連接體之半導體裝置、及中間連接體之製造方法

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US8786099B2 (en) 2014-07-22
US20130062754A1 (en) 2013-03-14

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