JP2012526400A5 - - Google Patents

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Publication number
JP2012526400A5
JP2012526400A5 JP2012510021A JP2012510021A JP2012526400A5 JP 2012526400 A5 JP2012526400 A5 JP 2012526400A5 JP 2012510021 A JP2012510021 A JP 2012510021A JP 2012510021 A JP2012510021 A JP 2012510021A JP 2012526400 A5 JP2012526400 A5 JP 2012526400A5
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JP
Japan
Prior art keywords
die
substrate
layer
mold compound
applying
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JP2012510021A
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English (en)
Japanese (ja)
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JP5605958B2 (ja
JP2012526400A (ja
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Priority claimed from US12/437,168 external-priority patent/US8294280B2/en
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Publication of JP2012526400A publication Critical patent/JP2012526400A/ja
Publication of JP2012526400A5 publication Critical patent/JP2012526400A5/ja
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Publication of JP5605958B2 publication Critical patent/JP5605958B2/ja
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JP2012510021A 2009-05-07 2010-05-07 薄い半導体のためのパネル化裏面処理を用いた半導体製造方法及び半導体デバイス Active JP5605958B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/437,168 US8294280B2 (en) 2009-05-07 2009-05-07 Panelized backside processing for thin semiconductors
US12/437,168 2009-05-07
PCT/US2010/034096 WO2010129903A1 (en) 2009-05-07 2010-05-07 Panelized backside processing for thin semiconductors

Publications (3)

Publication Number Publication Date
JP2012526400A JP2012526400A (ja) 2012-10-25
JP2012526400A5 true JP2012526400A5 (enExample) 2013-08-08
JP5605958B2 JP5605958B2 (ja) 2014-10-15

Family

ID=42340979

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012510021A Active JP5605958B2 (ja) 2009-05-07 2010-05-07 薄い半導体のためのパネル化裏面処理を用いた半導体製造方法及び半導体デバイス

Country Status (8)

Country Link
US (2) US8294280B2 (enExample)
EP (1) EP2427909B1 (enExample)
JP (1) JP5605958B2 (enExample)
KR (1) KR101309549B1 (enExample)
CN (2) CN106129000A (enExample)
ES (1) ES2900265T3 (enExample)
TW (1) TW201118937A (enExample)
WO (1) WO2010129903A1 (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8294280B2 (en) 2009-05-07 2012-10-23 Qualcomm Incorporated Panelized backside processing for thin semiconductors
US8541886B2 (en) * 2010-03-09 2013-09-24 Stats Chippac Ltd. Integrated circuit packaging system with via and method of manufacture thereof
US9230894B2 (en) * 2012-05-02 2016-01-05 Infineon Technologies Ag Methods for manufacturing a chip package
US8964888B2 (en) * 2012-08-29 2015-02-24 Qualcomm Incorporated System and method of generating a pre-emphasis pulse
US20150008566A1 (en) * 2013-07-02 2015-01-08 Texas Instruments Incorporated Method and structure of panelized packaging of semiconductor devices
US9257341B2 (en) 2013-07-02 2016-02-09 Texas Instruments Incorporated Method and structure of packaging semiconductor devices
US11239199B2 (en) 2015-12-26 2022-02-01 Intel Corporation Package stacking using chip to wafer bonding
DE102016108000B3 (de) * 2016-04-29 2016-12-15 Danfoss Silicon Power Gmbh Verfahren zum stoffschlüssigen Verbinden einer ersten Komponente eines Leistungshalbleitermoduls mit einer zweiten Komponente eines Leistungshalbleitermoduls
US10566267B2 (en) 2017-10-05 2020-02-18 Texas Instruments Incorporated Die attach surface copper layer with protective layer for microelectronic devices
US10879144B2 (en) 2018-08-14 2020-12-29 Texas Instruments Incorporated Semiconductor package with multilayer mold
US10643957B2 (en) 2018-08-27 2020-05-05 Nxp B.V. Conformal dummy die
US11114410B2 (en) 2019-11-27 2021-09-07 International Business Machines Corporation Multi-chip package structures formed by joining chips to pre-positioned chip interconnect bridge devices
US11342246B2 (en) * 2020-07-21 2022-05-24 Qualcomm Incorporated Multi-terminal integrated passive devices embedded on die and a method for fabricating the multi-terminal integrated passive devices
CN111739840B (zh) * 2020-07-24 2023-04-11 联合微电子中心有限责任公司 一种硅转接板的制备方法及硅转接板的封装结构

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US6010392A (en) * 1998-02-17 2000-01-04 International Business Machines Corporation Die thinning apparatus
JP3339838B2 (ja) * 1999-06-07 2002-10-28 ローム株式会社 半導体装置およびその製造方法
JP2001144218A (ja) * 1999-11-17 2001-05-25 Sony Corp 半導体装置及び半導体装置の製造方法
US6444576B1 (en) * 2000-06-16 2002-09-03 Chartered Semiconductor Manufacturing, Ltd. Three dimensional IC package module
JP3530149B2 (ja) * 2001-05-21 2004-05-24 新光電気工業株式会社 配線基板の製造方法及び半導体装置
KR100394808B1 (ko) * 2001-07-19 2003-08-14 삼성전자주식회사 웨이퍼 레벨 적층 칩 패키지 및 그 제조 방법
US6867501B2 (en) 2001-11-01 2005-03-15 Rohm Co., Ltd. Semiconductor device and method for manufacturing same
JP3893268B2 (ja) * 2001-11-02 2007-03-14 ローム株式会社 半導体装置の製造方法
JP2006502596A (ja) * 2002-10-08 2006-01-19 チップパック，インク． 裏返しにされた第二のパッケージを有する積み重ねられた半導体マルチパッケージモジュール
JP4056854B2 (ja) * 2002-11-05 2008-03-05 新光電気工業株式会社 半導体装置の製造方法
JP4441328B2 (ja) * 2004-05-25 2010-03-31 株式会社ルネサステクノロジ 半導体装置及びその製造方法
JP5052130B2 (ja) 2004-06-04 2012-10-17 カミヤチョウ アイピー ホールディングス 三次元積層構造を持つ半導体装置及びその製造方法
JP4434977B2 (ja) * 2005-02-02 2010-03-17 株式会社東芝 半導体装置及びその製造方法
JP2007180529A (ja) * 2005-12-02 2007-07-12 Nec Electronics Corp 半導体装置およびその製造方法
US20070126085A1 (en) 2005-12-02 2007-06-07 Nec Electronics Corporation Semiconductor device and method of manufacturing the same
JP2007317822A (ja) * 2006-05-25 2007-12-06 Sony Corp 基板処理方法及び半導体装置の製造方法
US7901989B2 (en) * 2006-10-10 2011-03-08 Tessera, Inc. Reconstituted wafer level stacking
US8035207B2 (en) * 2006-12-30 2011-10-11 Stats Chippac Ltd. Stackable integrated circuit package system with recess
KR20080068334A (ko) 2007-01-19 2008-07-23 오태성 주석 비아 또는 솔더 비아와 이의 접속부를 구비한 칩 스택패키지 및 그 제조방법
JP2008177504A (ja) * 2007-01-22 2008-07-31 Toyobo Co Ltd 半導体パッケージ
US8367471B2 (en) * 2007-06-15 2013-02-05 Micron Technology, Inc. Semiconductor assemblies, stacked semiconductor devices, and methods of manufacturing semiconductor assemblies and stacked semiconductor devices
SG149726A1 (en) * 2007-07-24 2009-02-27 Micron Technology Inc Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods
US20100109169A1 (en) * 2008-04-29 2010-05-06 United Test And Assembly Center Ltd Semiconductor package and method of making the same
US8294280B2 (en) 2009-05-07 2012-10-23 Qualcomm Incorporated Panelized backside processing for thin semiconductors

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