KR101309549B1 - 얇은 반도체들에 대한 패널화된 후면 공정 - Google Patents

얇은 반도체들에 대한 패널화된 후면 공정 Download PDF

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KR101309549B1
KR101309549B1 KR1020117029271A KR20117029271A KR101309549B1 KR 101309549 B1 KR101309549 B1 KR 101309549B1 KR 1020117029271 A KR1020117029271 A KR 1020117029271A KR 20117029271 A KR20117029271 A KR 20117029271A KR 101309549 B1 KR101309549 B1 KR 101309549B1
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die
substrate
mold compound
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KR20120018787A (ko
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아빈드 찬드라세카란
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퀄컴 인코포레이티드
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Dicing (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
KR1020117029271A 2009-05-07 2010-05-07 얇은 반도체들에 대한 패널화된 후면 공정 Active KR101309549B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/437,168 US8294280B2 (en) 2009-05-07 2009-05-07 Panelized backside processing for thin semiconductors
US12/437,168 2009-05-07
PCT/US2010/034096 WO2010129903A1 (en) 2009-05-07 2010-05-07 Panelized backside processing for thin semiconductors

Publications (2)

Publication Number Publication Date
KR20120018787A KR20120018787A (ko) 2012-03-05
KR101309549B1 true KR101309549B1 (ko) 2013-09-24

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ES2900265T3 (es) 2022-03-16
TW201118937A (en) 2011-06-01
US20120040497A1 (en) 2012-02-16
JP2012526400A (ja) 2012-10-25
KR20120018787A (ko) 2012-03-05
CN106129000A (zh) 2016-11-16
EP2427909A1 (en) 2012-03-14
US8294280B2 (en) 2012-10-23
CN102422415A (zh) 2012-04-18
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