JP2012510633A5 - - Google Patents

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Publication number
JP2012510633A5
JP2012510633A5 JP2011539587A JP2011539587A JP2012510633A5 JP 2012510633 A5 JP2012510633 A5 JP 2012510633A5 JP 2011539587 A JP2011539587 A JP 2011539587A JP 2011539587 A JP2011539587 A JP 2011539587A JP 2012510633 A5 JP2012510633 A5 JP 2012510633A5
Authority
JP
Japan
Prior art keywords
probe
card assembly
probe card
frame
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011539587A
Other languages
English (en)
Japanese (ja)
Other versions
JP5463366B2 (ja
JP2012510633A (ja
Filing date
Publication date
Priority claimed from US12/327,643 external-priority patent/US7772863B2/en
Priority claimed from US12/478,117 external-priority patent/US7960989B2/en
Application filed filed Critical
Publication of JP2012510633A publication Critical patent/JP2012510633A/ja
Publication of JP2012510633A5 publication Critical patent/JP2012510633A5/ja
Application granted granted Critical
Publication of JP5463366B2 publication Critical patent/JP5463366B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2011539587A 2008-12-03 2009-11-21 熱応答を改善するためのプローブカードアセンブリの機械的分離 Expired - Fee Related JP5463366B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US12/327,643 2008-12-03
US12/327,643 US7772863B2 (en) 2008-12-03 2008-12-03 Mechanical decoupling of a probe card assembly to improve thermal response
US12/478,117 US7960989B2 (en) 2008-12-03 2009-06-04 Mechanical decoupling of a probe card assembly to improve thermal response
US12/478,117 2009-06-04
PCT/US2009/065426 WO2010065353A2 (en) 2008-12-03 2009-11-21 Mechanical decoupling of a probe card assembly to improve thermal response

Publications (3)

Publication Number Publication Date
JP2012510633A JP2012510633A (ja) 2012-05-10
JP2012510633A5 true JP2012510633A5 (enExample) 2013-01-17
JP5463366B2 JP5463366B2 (ja) 2014-04-09

Family

ID=42222225

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011539587A Expired - Fee Related JP5463366B2 (ja) 2008-12-03 2009-11-21 熱応答を改善するためのプローブカードアセンブリの機械的分離

Country Status (5)

Country Link
US (1) US7960989B2 (enExample)
JP (1) JP5463366B2 (enExample)
KR (1) KR101623532B1 (enExample)
TW (1) TWI476410B (enExample)
WO (1) WO2010065353A2 (enExample)

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US11933816B2 (en) * 2019-03-20 2024-03-19 Celadon Systems, Inc. Portable probe card assembly
US11293947B2 (en) * 2019-04-26 2022-04-05 Formfactor, Inc. Probe on carrier architecture for vertical probe arrays
CN115280166A (zh) * 2020-03-13 2022-11-01 日本电产理德股份有限公司 检查治具以及包括所述检查治具的基板检查装置
CN114116570B (zh) 2020-08-28 2024-08-02 中强光电股份有限公司 电子装置控制系统与电子装置控制方法
JP7539843B2 (ja) * 2021-01-19 2024-08-26 株式会社アドバンテスト プローブカード及び電子部品試験装置
EP4314847A4 (en) * 2021-03-23 2025-03-05 Nielson Scientific, LLC CRYOGENIC PROBE CARD
TWI776476B (zh) * 2021-04-20 2022-09-01 旺矽科技股份有限公司 探針卡及其檢測裝置
TWI797004B (zh) * 2022-04-29 2023-03-21 中華精測科技股份有限公司 懸臂式探針卡及其承載座

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