KR101623532B1 - 열 응답을 향상시키기 위한 프로브 카드 조립체의 기계적 결합 해제 - Google Patents

열 응답을 향상시키기 위한 프로브 카드 조립체의 기계적 결합 해제 Download PDF

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Publication number
KR101623532B1
KR101623532B1 KR1020117012892A KR20117012892A KR101623532B1 KR 101623532 B1 KR101623532 B1 KR 101623532B1 KR 1020117012892 A KR1020117012892 A KR 1020117012892A KR 20117012892 A KR20117012892 A KR 20117012892A KR 101623532 B1 KR101623532 B1 KR 101623532B1
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South Korea
Prior art keywords
frame
probe
wiring board
card assembly
stiffener
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Expired - Fee Related
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KR1020117012892A
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Korean (ko)
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KR20110106295A (ko
Inventor
케이쓰 제이. 브라인링거
에릭 디. 홉스
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폼팩터, 인크.
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Priority claimed from US12/327,643 external-priority patent/US7772863B2/en
Application filed by 폼팩터, 인크. filed Critical 폼팩터, 인크.
Publication of KR20110106295A publication Critical patent/KR20110106295A/ko
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
KR1020117012892A 2008-12-03 2009-11-21 열 응답을 향상시키기 위한 프로브 카드 조립체의 기계적 결합 해제 Expired - Fee Related KR101623532B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US12/327,643 2008-12-03
US12/327,643 US7772863B2 (en) 2008-12-03 2008-12-03 Mechanical decoupling of a probe card assembly to improve thermal response
US12/478,117 US7960989B2 (en) 2008-12-03 2009-06-04 Mechanical decoupling of a probe card assembly to improve thermal response
US12/478,117 2009-06-04

Publications (2)

Publication Number Publication Date
KR20110106295A KR20110106295A (ko) 2011-09-28
KR101623532B1 true KR101623532B1 (ko) 2016-06-07

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KR1020117012892A Expired - Fee Related KR101623532B1 (ko) 2008-12-03 2009-11-21 열 응답을 향상시키기 위한 프로브 카드 조립체의 기계적 결합 해제

Country Status (5)

Country Link
US (1) US7960989B2 (enExample)
JP (1) JP5463366B2 (enExample)
KR (1) KR101623532B1 (enExample)
TW (1) TWI476410B (enExample)
WO (1) WO2010065353A2 (enExample)

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JP7138004B2 (ja) * 2018-09-28 2022-09-15 株式会社日本マイクロニクス プローブカード保持具
US11933816B2 (en) * 2019-03-20 2024-03-19 Celadon Systems, Inc. Portable probe card assembly
US11293947B2 (en) * 2019-04-26 2022-04-05 Formfactor, Inc. Probe on carrier architecture for vertical probe arrays
CN115280166A (zh) * 2020-03-13 2022-11-01 日本电产理德股份有限公司 检查治具以及包括所述检查治具的基板检查装置
CN114116570B (zh) 2020-08-28 2024-08-02 中强光电股份有限公司 电子装置控制系统与电子装置控制方法
JP7539843B2 (ja) * 2021-01-19 2024-08-26 株式会社アドバンテスト プローブカード及び電子部品試験装置
EP4314847A4 (en) * 2021-03-23 2025-03-05 Nielson Scientific, LLC CRYOGENIC PROBE CARD
TWI776476B (zh) * 2021-04-20 2022-09-01 旺矽科技股份有限公司 探針卡及其檢測裝置
TWI797004B (zh) * 2022-04-29 2023-03-21 中華精測科技股份有限公司 懸臂式探針卡及其承載座

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Cited By (2)

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Publication number Priority date Publication date Assignee Title
KR20200068002A (ko) * 2017-10-18 2020-06-15 헤르메스 에피텍 코포레이션 웨이퍼 레벨 다중 사이트 테스트 구조
KR102146158B1 (ko) * 2017-10-18 2020-08-20 헤르메스 에피텍 코포레이션 웨이퍼 레벨 다중 사이트 테스트 구조

Also Published As

Publication number Publication date
WO2010065353A3 (en) 2010-08-05
TWI476410B (zh) 2015-03-11
KR20110106295A (ko) 2011-09-28
JP5463366B2 (ja) 2014-04-09
WO2010065353A2 (en) 2010-06-10
US7960989B2 (en) 2011-06-14
US20100134127A1 (en) 2010-06-03
JP2012510633A (ja) 2012-05-10
TW201027078A (en) 2010-07-16

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