JP5463366B2 - 熱応答を改善するためのプローブカードアセンブリの機械的分離 - Google Patents

熱応答を改善するためのプローブカードアセンブリの機械的分離 Download PDF

Info

Publication number
JP5463366B2
JP5463366B2 JP2011539587A JP2011539587A JP5463366B2 JP 5463366 B2 JP5463366 B2 JP 5463366B2 JP 2011539587 A JP2011539587 A JP 2011539587A JP 2011539587 A JP2011539587 A JP 2011539587A JP 5463366 B2 JP5463366 B2 JP 5463366B2
Authority
JP
Japan
Prior art keywords
frame
probe
wiring board
card assembly
probe card
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2011539587A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012510633A5 (enExample
JP2012510633A (ja
Inventor
ブレインリンガー，キース，ジェイ．
ホッブス，エリック，ディー．
Original Assignee
フォームファクター， インコーポレイテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US12/327,643 external-priority patent/US7772863B2/en
Application filed by フォームファクター， インコーポレイテッド filed Critical フォームファクター， インコーポレイテッド
Publication of JP2012510633A publication Critical patent/JP2012510633A/ja
Publication of JP2012510633A5 publication Critical patent/JP2012510633A5/ja
Application granted granted Critical
Publication of JP5463366B2 publication Critical patent/JP5463366B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
JP2011539587A 2008-12-03 2009-11-21 熱応答を改善するためのプローブカードアセンブリの機械的分離 Expired - Fee Related JP5463366B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US12/327,643 2008-12-03
US12/327,643 US7772863B2 (en) 2008-12-03 2008-12-03 Mechanical decoupling of a probe card assembly to improve thermal response
US12/478,117 US7960989B2 (en) 2008-12-03 2009-06-04 Mechanical decoupling of a probe card assembly to improve thermal response
US12/478,117 2009-06-04
PCT/US2009/065426 WO2010065353A2 (en) 2008-12-03 2009-11-21 Mechanical decoupling of a probe card assembly to improve thermal response

Publications (3)

Publication Number Publication Date
JP2012510633A JP2012510633A (ja) 2012-05-10
JP2012510633A5 JP2012510633A5 (enExample) 2013-01-17
JP5463366B2 true JP5463366B2 (ja) 2014-04-09

Family

ID=42222225

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011539587A Expired - Fee Related JP5463366B2 (ja) 2008-12-03 2009-11-21 熱応答を改善するためのプローブカードアセンブリの機械的分離

Country Status (5)

Country Link
US (1) US7960989B2 (enExample)
JP (1) JP5463366B2 (enExample)
KR (1) KR101623532B1 (enExample)
TW (1) TWI476410B (enExample)
WO (1) WO2010065353A2 (enExample)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6256882B1 (en) * 1998-07-14 2001-07-10 Cascade Microtech, Inc. Membrane probing system
WO2012099572A1 (en) * 2011-01-18 2012-07-26 Touchdown Technologies, Inc. Stiffener plate for a probecard and method
US10006938B2 (en) 2012-01-04 2018-06-26 Formfactor, Inc. Probes with programmable motion
JP5941713B2 (ja) * 2012-03-14 2016-06-29 東京エレクトロン株式会社 ウエハ検査用インターフェース及びウエハ検査装置
SG11201510024VA (en) 2013-05-06 2016-01-28 Formfactor Inc A probe card assembly for testing electronic devices
WO2015132747A1 (en) * 2014-03-06 2015-09-11 Technoprobe S.P.A. High-planarity probe card for a testing apparatus for electronic devices
US10365323B2 (en) 2015-11-25 2019-07-30 Formfactor Beaverton, Inc. Probe systems and methods for automatically maintaining alignment between a probe and a device under test during a temperature change
JP6621716B2 (ja) 2016-08-02 2019-12-18 日立オートモティブシステムズ株式会社 ステレオカメラ
TWI623753B (zh) * 2017-08-15 2018-05-11 旺矽科技股份有限公司 同軸探針卡裝置
WO2018089659A1 (en) * 2016-11-10 2018-05-17 Translarity, Inc. Probe card assembly having die-level and pin-level compliance, and associated systems and methods
DE102017104516B4 (de) * 2017-03-03 2021-06-10 Turbodynamics Gmbh Plattenförmiges Verbindungssystem zum Verbinden von zwei Testeinheiten sowie Verbindungseinheit und Testsystem mit jeweils einem solchen plattenförmigen Verbindungssystem
TWI639205B (zh) * 2017-10-18 2018-10-21 Hermes-Epitek Corp. 晶圓級多點測試結構
JP7138004B2 (ja) * 2018-09-28 2022-09-15 株式会社日本マイクロニクス プローブカード保持具
US11933816B2 (en) * 2019-03-20 2024-03-19 Celadon Systems, Inc. Portable probe card assembly
US11293947B2 (en) * 2019-04-26 2022-04-05 Formfactor, Inc. Probe on carrier architecture for vertical probe arrays
CN115280166A (zh) * 2020-03-13 2022-11-01 日本电产理德股份有限公司 检查治具以及包括所述检查治具的基板检查装置
CN114116570B (zh) 2020-08-28 2024-08-02 中强光电股份有限公司 电子装置控制系统与电子装置控制方法
JP7539843B2 (ja) * 2021-01-19 2024-08-26 株式会社アドバンテスト プローブカード及び電子部品試験装置
EP4314847A4 (en) * 2021-03-23 2025-03-05 Nielson Scientific, LLC CRYOGENIC PROBE CARD
TWI776476B (zh) * 2021-04-20 2022-09-01 旺矽科技股份有限公司 探針卡及其檢測裝置
TWI797004B (zh) * 2022-04-29 2023-03-21 中華精測科技股份有限公司 懸臂式探針卡及其承載座

Family Cites Families (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3691506A (en) * 1971-04-05 1972-09-12 Cts Corp Resistors and stacked plurality thereof
US4330163A (en) * 1979-12-05 1982-05-18 E. I. Du Pont De Nemours And Company Zero insertion force connector for LSI circuit package
US4715682A (en) * 1986-07-11 1987-12-29 Eastman Kodak Company Mount for imaging lens array on optical print head
US4779463A (en) * 1987-01-13 1988-10-25 Systron Donner Corporation Servo accelerometer
US5422574A (en) * 1993-01-14 1995-06-06 Probe Technology Corporation Large scale protrusion membrane for semiconductor devices under test with very high pin counts
US7064566B2 (en) * 1993-11-16 2006-06-20 Formfactor, Inc. Probe card assembly and kit
US5772451A (en) * 1993-11-16 1998-06-30 Form Factor, Inc. Sockets for electronic components and methods of connecting to electronic components
US5806181A (en) * 1993-11-16 1998-09-15 Formfactor, Inc. Contact carriers (tiles) for populating larger substrates with spring contacts
US6429029B1 (en) * 1997-01-15 2002-08-06 Formfactor, Inc. Concurrent design and subsequent partitioning of product and test die
US6690185B1 (en) * 1997-01-15 2004-02-10 Formfactor, Inc. Large contactor with multiple, aligned contactor units
US6201629B1 (en) * 1997-08-27 2001-03-13 Microoptical Corporation Torsional micro-mechanical mirror system
US6359452B1 (en) * 1998-07-22 2002-03-19 Nortel Networks Limited Method and apparatus for testing an electronic assembly
US6887723B1 (en) * 1998-12-04 2005-05-03 Formfactor, Inc. Method for processing an integrated circuit including placing dice into a carrier and testing
US7349223B2 (en) * 2000-05-23 2008-03-25 Nanonexus, Inc. Enhanced compliant probe card systems having improved planarity
US7215131B1 (en) * 1999-06-07 2007-05-08 Formfactor, Inc. Segmented contactor
US7262611B2 (en) * 2000-03-17 2007-08-28 Formfactor, Inc. Apparatuses and methods for planarizing a semiconductor contactor
US6509751B1 (en) * 2000-03-17 2003-01-21 Formfactor, Inc. Planarizer for a semiconductor contactor
JP4152083B2 (ja) * 2001-02-22 2008-09-17 日本圧着端子製造株式会社 電気コネクタ
JP4022518B2 (ja) * 2001-06-18 2007-12-19 株式会社アドバンテスト 平面調整機構を有するプローブコンタクトシステム
US7071714B2 (en) * 2001-11-02 2006-07-04 Formfactor, Inc. Method and system for compensating for thermally induced motion of probe cards
US6972578B2 (en) * 2001-11-02 2005-12-06 Formfactor, Inc. Method and system for compensating thermally induced motion of probe cards
WO2003062970A1 (en) 2001-12-24 2003-07-31 Lg Electronics Inc. Hinge assembly for flat panel display appliance
JP3936596B2 (ja) * 2002-02-04 2007-06-27 矢崎総業株式会社 基板用コネクタ
US6683787B1 (en) * 2002-02-14 2004-01-27 Mercury Computer Systems, Inc. Circuit board assembly with integrated air plenum chamber using self-aligning heat sinks
US6911835B2 (en) * 2002-05-08 2005-06-28 Formfactor, Inc. High performance probe system
JP3621938B2 (ja) * 2002-08-09 2005-02-23 日本電子材料株式会社 プローブカード
US6999317B2 (en) * 2003-08-12 2006-02-14 Delphi Technologies, Inc. Thermally enhanced electronic module with self-aligning heat sink
JP4425005B2 (ja) * 2004-01-19 2010-03-03 帝国通信工業株式会社 基板への電子部品取付構造
US20050157791A1 (en) * 2004-01-20 2005-07-21 Eastman Kodak Company System and method for video tone scale reduction
US7230437B2 (en) * 2004-06-15 2007-06-12 Formfactor, Inc. Mechanically reconfigurable vertical tester interface for IC probing
US7180321B2 (en) * 2004-10-01 2007-02-20 Teradyne, Inc. Tester interface module
US7129730B2 (en) * 2004-12-15 2006-10-31 Chipmos Technologies (Bermuda) Ltd. Probe card assembly
US7285968B2 (en) * 2005-04-19 2007-10-23 Formfactor, Inc. Apparatus and method for managing thermally induced motion of a probe card assembly
US7471094B2 (en) * 2005-06-24 2008-12-30 Formfactor, Inc. Method and apparatus for adjusting a multi-substrate probe structure
US20070057685A1 (en) * 2005-09-14 2007-03-15 Touchdown Technologies, Inc. Lateral interposer contact design and probe card assembly
US7671614B2 (en) * 2005-12-02 2010-03-02 Formfactor, Inc. Apparatus and method for adjusting an orientation of probes
US7622935B2 (en) * 2005-12-02 2009-11-24 Formfactor, Inc. Probe card assembly with a mechanically decoupled wiring substrate
US7365553B2 (en) * 2005-12-22 2008-04-29 Touchdown Technologies, Inc. Probe card assembly
KR20080009996A (ko) 2006-07-25 2008-01-30 삼성전자주식회사 표시패널모듈용 검사 장치
US7368930B2 (en) * 2006-08-04 2008-05-06 Formfactor, Inc. Adjustment mechanism
US7746089B2 (en) * 2006-09-29 2010-06-29 Formfactor, Inc. Method and apparatus for indirect planarization
US7884627B2 (en) 2006-12-29 2011-02-08 Formfactor, Inc. Stiffener assembly for use with testing devices
US7471078B2 (en) * 2006-12-29 2008-12-30 Formfactor, Inc. Stiffener assembly for use with testing devices
US7419313B2 (en) * 2007-01-16 2008-09-02 Stratos International, Inc. Optoelectronic device in combination with a push-in cage
US20080231258A1 (en) * 2007-03-23 2008-09-25 Formfactor, Inc. Stiffening connector and probe card assembly incorporating same
KR20080099996A (ko) * 2007-05-11 2008-11-14 주식회사 세지 열변형 방지용 프로브카드
US7688063B2 (en) * 2008-02-19 2010-03-30 Formfactor, Inc. Apparatus and method for adjusting thermally induced movement of electro-mechanical assemblies
US20100039133A1 (en) * 2008-08-13 2010-02-18 Formfactor, Inc. Probe head controlling mechanism for probe card assemblies
US7772863B2 (en) * 2008-12-03 2010-08-10 Formfactor, Inc. Mechanical decoupling of a probe card assembly to improve thermal response
US8760187B2 (en) 2008-12-03 2014-06-24 L-3 Communications Corp. Thermocentric alignment of elements on parts of an apparatus
TWM369456U (en) * 2009-05-08 2009-11-21 Premtek Int Inc Modular probe card device

Also Published As

Publication number Publication date
WO2010065353A3 (en) 2010-08-05
KR101623532B1 (ko) 2016-06-07
TWI476410B (zh) 2015-03-11
KR20110106295A (ko) 2011-09-28
WO2010065353A2 (en) 2010-06-10
US7960989B2 (en) 2011-06-14
US20100134127A1 (en) 2010-06-03
JP2012510633A (ja) 2012-05-10
TW201027078A (en) 2010-07-16

Similar Documents

Publication Publication Date Title
JP5463366B2 (ja) 熱応答を改善するためのプローブカードアセンブリの機械的分離
US7772863B2 (en) Mechanical decoupling of a probe card assembly to improve thermal response
JP5592069B2 (ja) プローブカードアセンブリの熱により誘起される運動に対処するための装置
US10509056B2 (en) Probe card for a testing apparatus of electronic devices, particularly for extreme temperature applications
US8760187B2 (en) Thermocentric alignment of elements on parts of an apparatus
US7688063B2 (en) Apparatus and method for adjusting thermally induced movement of electro-mechanical assemblies
JP5466018B2 (ja) デバイステストに使用する補強アセンブリ
US8736294B2 (en) Probe card stiffener with decoupling
US8278956B2 (en) Probecard system and method
JP2010540908A (ja) 検査装置と共に使用するスティフナアセンブリ
US20100039133A1 (en) Probe head controlling mechanism for probe card assemblies
CN101512354A (zh) 用于管理探针卡组件的热感应移动的装置和方法
US9128122B2 (en) Stiffener plate for a probecard and method
KR20090014755A (ko) 프로브 카드 및 이를 갖는 웨이퍼 검사 장치
KR20090014763A (ko) 프로브 카드
JP2011075342A (ja) プローブカードアセンブリ用プローブヘッド制御機構
KR20090014760A (ko) 프로브 카드

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20121120

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20121120

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20130815

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20130819

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20131107

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20131122

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20131220

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20140106

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20140120

R150 Certificate of patent or registration of utility model

Ref document number: 5463366

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees