JP2012204548A - 表示装置およびその製造方法 - Google Patents
表示装置およびその製造方法 Download PDFInfo
- Publication number
- JP2012204548A JP2012204548A JP2011066747A JP2011066747A JP2012204548A JP 2012204548 A JP2012204548 A JP 2012204548A JP 2011066747 A JP2011066747 A JP 2011066747A JP 2011066747 A JP2011066747 A JP 2011066747A JP 2012204548 A JP2012204548 A JP 2012204548A
- Authority
- JP
- Japan
- Prior art keywords
- protective film
- layer
- insulating film
- wiring
- display device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/421—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer
- H10D86/423—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer comprising semiconductor materials not belonging to the Group IV, e.g. InGaZnO
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
- H10K59/1213—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
Landscapes
- Thin Film Transistor (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011066747A JP2012204548A (ja) | 2011-03-24 | 2011-03-24 | 表示装置およびその製造方法 |
| US13/403,735 US8673661B2 (en) | 2011-03-24 | 2012-02-23 | Display apparatus and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011066747A JP2012204548A (ja) | 2011-03-24 | 2011-03-24 | 表示装置およびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2012204548A true JP2012204548A (ja) | 2012-10-22 |
| JP2012204548A5 JP2012204548A5 (https=) | 2014-05-01 |
Family
ID=46876574
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011066747A Pending JP2012204548A (ja) | 2011-03-24 | 2011-03-24 | 表示装置およびその製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US8673661B2 (https=) |
| JP (1) | JP2012204548A (https=) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014080826A1 (ja) * | 2012-11-21 | 2014-05-30 | シャープ株式会社 | 表示装置 |
| JP2014207292A (ja) * | 2013-04-11 | 2014-10-30 | 株式会社ジャパンディスプレイ | 薄膜トランジスタ及びそれを用いた表示装置 |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012204548A (ja) * | 2011-03-24 | 2012-10-22 | Sony Corp | 表示装置およびその製造方法 |
| US20160104669A1 (en) * | 2014-10-08 | 2016-04-14 | Infineon Technologies Ag | Semiconductor structure with improved metallization adhesion and method for manufacturing the same |
| CN107293493A (zh) * | 2017-06-06 | 2017-10-24 | 武汉华星光电技术有限公司 | 铟镓锌氧化物薄膜晶体管的制作方法 |
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| JP2006186119A (ja) * | 2004-12-28 | 2006-07-13 | Casio Comput Co Ltd | 薄膜トランジスタおよびその製造方法 |
| JP2007073559A (ja) * | 2005-09-02 | 2007-03-22 | Kochi Prefecture Sangyo Shinko Center | 薄膜トランジスタの製法 |
| JP2007096055A (ja) * | 2005-09-29 | 2007-04-12 | Semiconductor Energy Lab Co Ltd | 半導体装置、及び半導体装置の作製方法 |
| JP2007134687A (ja) * | 2005-10-14 | 2007-05-31 | Semiconductor Energy Lab Co Ltd | 半導体装置及びその作製方法 |
| JP2009260378A (ja) * | 2005-09-29 | 2009-11-05 | Semiconductor Energy Lab Co Ltd | 半導体装置の作製方法 |
| JP2010123913A (ja) * | 2008-11-21 | 2010-06-03 | Korea Electronics Telecommun | 薄膜トランジスタ及びその製造方法 |
| JP2010182818A (ja) * | 2009-02-04 | 2010-08-19 | Sony Corp | 薄膜トランジスタおよび表示装置 |
| JP2011009719A (ja) * | 2009-05-29 | 2011-01-13 | Semiconductor Energy Lab Co Ltd | 半導体装置及びその作製方法 |
| JP2011049548A (ja) * | 2009-07-31 | 2011-03-10 | Semiconductor Energy Lab Co Ltd | 半導体装置およびその作製方法 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6319876A (ja) * | 1986-07-11 | 1988-01-27 | Fuji Xerox Co Ltd | 薄膜トランジスタ装置 |
| JP2771820B2 (ja) * | 1988-07-08 | 1998-07-02 | 株式会社日立製作所 | アクティブマトリクスパネル及びその製造方法 |
| KR970004885B1 (ko) * | 1993-05-12 | 1997-04-08 | 삼성전자 주식회사 | 평판표시장치 및 그 제조방법 |
| JP3344072B2 (ja) * | 1994-03-31 | 2002-11-11 | ソニー株式会社 | 薄膜トランジスタの製造方法 |
| JPH08184853A (ja) * | 1994-12-27 | 1996-07-16 | Sharp Corp | アクティブマトリクス基板の製造方法およびアクティブマトリクス基板 |
| KR100190041B1 (ko) * | 1995-12-28 | 1999-06-01 | 윤종용 | 액정표시장치의 제조방법 |
| JP3433632B2 (ja) * | 1996-12-10 | 2003-08-04 | カシオ計算機株式会社 | 薄膜トランジスタの製造方法 |
| US5998230A (en) * | 1998-10-22 | 1999-12-07 | Frontec Incorporated | Method for making liquid crystal display device with reduced mask steps |
| JP2001119029A (ja) * | 1999-10-18 | 2001-04-27 | Fujitsu Ltd | 薄膜トランジスタ及びその製造方法及びそれを備えた液晶表示装置 |
| JP2002237594A (ja) * | 2001-02-02 | 2002-08-23 | Internatl Business Mach Corp <Ibm> | 薄膜トランジスタ、薄膜トランジスタの製造方法および薄膜トランジスタを含むディスプレイ・デバイス |
| US7592207B2 (en) * | 2003-11-14 | 2009-09-22 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device and method for manufacturing the same |
| KR101353269B1 (ko) * | 2006-12-11 | 2014-01-20 | 삼성디스플레이 주식회사 | 박막 트랜지스터 기판 및 이의 제조 방법 |
| KR101410926B1 (ko) | 2007-02-16 | 2014-06-24 | 삼성전자주식회사 | 박막 트랜지스터 및 그 제조방법 |
| TWI387109B (zh) * | 2008-06-10 | 2013-02-21 | Taiwan Tft Lcd Ass | 薄膜電晶體的製造方法 |
| JP5584960B2 (ja) * | 2008-07-03 | 2014-09-10 | ソニー株式会社 | 薄膜トランジスタおよび表示装置 |
| TWI495108B (zh) * | 2008-07-31 | 2015-08-01 | 半導體能源研究所股份有限公司 | 半導體裝置的製造方法 |
| EP2172977A1 (en) * | 2008-10-03 | 2010-04-07 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
| JP5515281B2 (ja) * | 2008-12-03 | 2014-06-11 | ソニー株式会社 | 薄膜トランジスタ、表示装置、電子機器および薄膜トランジスタの製造方法 |
| JP2010182819A (ja) * | 2009-02-04 | 2010-08-19 | Sony Corp | 薄膜トランジスタおよび表示装置 |
| US8450144B2 (en) * | 2009-03-26 | 2013-05-28 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| TWI511288B (zh) * | 2009-03-27 | 2015-12-01 | Semiconductor Energy Lab | 半導體裝置 |
| TWI476917B (zh) * | 2009-04-16 | 2015-03-11 | 半導體能源研究所股份有限公司 | 半導體裝置和其製造方法 |
| WO2011055474A1 (ja) * | 2009-11-09 | 2011-05-12 | シャープ株式会社 | アクティブマトリクス基板及びそれを備えた液晶表示パネル、並びにアクティブマトリクス基板の製造方法 |
| JP5095865B2 (ja) * | 2009-12-21 | 2012-12-12 | シャープ株式会社 | アクティブマトリクス基板及びそれを備えた表示パネル、並びにアクティブマトリクス基板の製造方法 |
| KR101711870B1 (ko) * | 2009-12-23 | 2017-03-06 | 삼성디스플레이 주식회사 | 박막트랜지스터, 그 제조방법 및 박막트랜지스터를 이용한 표시기판 |
| JP5668917B2 (ja) * | 2010-11-05 | 2015-02-12 | ソニー株式会社 | 薄膜トランジスタおよびその製造方法 |
| JP2012204548A (ja) * | 2011-03-24 | 2012-10-22 | Sony Corp | 表示装置およびその製造方法 |
| TWI455322B (zh) * | 2011-04-22 | 2014-10-01 | Au Optronics Corp | 薄膜電晶體及其製造方法 |
| KR101854197B1 (ko) * | 2011-05-12 | 2018-06-21 | 삼성디스플레이 주식회사 | 표시 기판 및 이의 제조 방법 |
| KR101425064B1 (ko) * | 2011-06-09 | 2014-08-01 | 엘지디스플레이 주식회사 | 산화물 박막 트랜지스터 및 그 제조방법 |
| KR20130021607A (ko) * | 2011-08-23 | 2013-03-06 | 삼성디스플레이 주식회사 | 저저항 배선, 박막 트랜지스터, 및 박막 트랜지스터 표시판과 이들을 제조하는 방법 |
| CN102800709B (zh) * | 2012-09-11 | 2015-07-01 | 深圳市华星光电技术有限公司 | 薄膜晶体管主动装置 |
-
2011
- 2011-03-24 JP JP2011066747A patent/JP2012204548A/ja active Pending
-
2012
- 2012-02-23 US US13/403,735 patent/US8673661B2/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006186119A (ja) * | 2004-12-28 | 2006-07-13 | Casio Comput Co Ltd | 薄膜トランジスタおよびその製造方法 |
| JP2007073559A (ja) * | 2005-09-02 | 2007-03-22 | Kochi Prefecture Sangyo Shinko Center | 薄膜トランジスタの製法 |
| JP2007096055A (ja) * | 2005-09-29 | 2007-04-12 | Semiconductor Energy Lab Co Ltd | 半導体装置、及び半導体装置の作製方法 |
| JP2009260378A (ja) * | 2005-09-29 | 2009-11-05 | Semiconductor Energy Lab Co Ltd | 半導体装置の作製方法 |
| JP2007134687A (ja) * | 2005-10-14 | 2007-05-31 | Semiconductor Energy Lab Co Ltd | 半導体装置及びその作製方法 |
| JP2010123913A (ja) * | 2008-11-21 | 2010-06-03 | Korea Electronics Telecommun | 薄膜トランジスタ及びその製造方法 |
| JP2010182818A (ja) * | 2009-02-04 | 2010-08-19 | Sony Corp | 薄膜トランジスタおよび表示装置 |
| JP2011009719A (ja) * | 2009-05-29 | 2011-01-13 | Semiconductor Energy Lab Co Ltd | 半導体装置及びその作製方法 |
| JP2011049548A (ja) * | 2009-07-31 | 2011-03-10 | Semiconductor Energy Lab Co Ltd | 半導体装置およびその作製方法 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014080826A1 (ja) * | 2012-11-21 | 2014-05-30 | シャープ株式会社 | 表示装置 |
| JPWO2014080826A1 (ja) * | 2012-11-21 | 2017-01-05 | シャープ株式会社 | 表示装置 |
| JP2014207292A (ja) * | 2013-04-11 | 2014-10-30 | 株式会社ジャパンディスプレイ | 薄膜トランジスタ及びそれを用いた表示装置 |
| US10283644B2 (en) | 2013-04-11 | 2019-05-07 | Japan Display Inc. | Thin film transistor having stable threshold voltage and less parasitic capacitance, and display device using the same |
Also Published As
| Publication number | Publication date |
|---|---|
| US8673661B2 (en) | 2014-03-18 |
| US20120241744A1 (en) | 2012-09-27 |
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