JP2012162707A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2012162707A5 JP2012162707A5 JP2012000218A JP2012000218A JP2012162707A5 JP 2012162707 A5 JP2012162707 A5 JP 2012162707A5 JP 2012000218 A JP2012000218 A JP 2012000218A JP 2012000218 A JP2012000218 A JP 2012000218A JP 2012162707 A5 JP2012162707 A5 JP 2012162707A5
- Authority
- JP
- Japan
- Prior art keywords
- photoresist composition
- organic group
- unit
- layer
- photoresist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000178 monomer Substances 0.000 claims description 10
- 229920000642 polymer Polymers 0.000 claims description 9
- 229910052799 carbon Inorganic materials 0.000 claims description 6
- 239000002253 acid Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- 150000002148 esters Chemical class 0.000 claims description 3
- 150000002596 lactones Chemical group 0.000 claims description 3
- 229920002120 photoresistant polymer Polymers 0.000 claims 14
- 125000000962 organic group Chemical group 0.000 claims 8
- 239000000758 substrate Substances 0.000 claims 5
- 125000004432 carbon atom Chemical group C* 0.000 claims 4
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims 3
- 229910052739 hydrogen Inorganic materials 0.000 claims 3
- 239000001257 hydrogen Substances 0.000 claims 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims 2
- 125000000217 alkyl group Chemical group 0.000 claims 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims 1
- 125000003545 alkoxy group Chemical group 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 238000000206 photolithography Methods 0.000 claims 1
- 230000005855 radiation Effects 0.000 claims 1
- -1 5-oxo-4-oxa-tricyclo [4.2.1.03,7] non-2-yloxycarbonylmethyl ester Chemical class 0.000 description 4
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- JNIUFMXERFGMTC-UHFFFAOYSA-N oxolan-3-yl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1CCOC1 JNIUFMXERFGMTC-UHFFFAOYSA-N 0.000 description 2
- QSUJHKWXLIQKEY-UHFFFAOYSA-N (2-oxooxolan-3-yl) 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1CCOC1=O QSUJHKWXLIQKEY-UHFFFAOYSA-N 0.000 description 1
- OOIBFPKQHULHSQ-UHFFFAOYSA-N (3-hydroxy-1-adamantyl) 2-methylprop-2-enoate Chemical compound C1C(C2)CC3CC2(O)CC1(OC(=O)C(=C)C)C3 OOIBFPKQHULHSQ-UHFFFAOYSA-N 0.000 description 1
- CVOFUHUIXVFPCH-UHFFFAOYSA-N (3-oxo-4,10-dioxatricyclo[5.2.1.02,6]decan-8-yl) 2-methylprop-2-enoate Chemical compound C12COC(=O)C2C2CC(OC(=O)C(=C)C)C1O2 CVOFUHUIXVFPCH-UHFFFAOYSA-N 0.000 description 1
- CUONHNINZJRNLP-UHFFFAOYSA-N (3-oxo-4-oxatricyclo[5.2.1.02,6]decan-8-yl) 2-methylprop-2-enoate Chemical compound C12COC(=O)C2C2CC(OC(=O)C(=C)C)C1C2 CUONHNINZJRNLP-UHFFFAOYSA-N 0.000 description 1
- JJMQLQLMPJLIPZ-UHFFFAOYSA-N (5-oxo-4-oxatricyclo[4.2.1.03,7]nonan-2-yl) 2-methylprop-2-enoate Chemical group O1C(=O)C2CC3C(OC(=O)C(=C)C)C1C2C3 JJMQLQLMPJLIPZ-UHFFFAOYSA-N 0.000 description 1
- ZROFAXCQYPKWCY-UHFFFAOYSA-N (5-oxooxolan-3-yl) 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1COC(=O)C1 ZROFAXCQYPKWCY-UHFFFAOYSA-N 0.000 description 1
- 0 *COC(*)(*)C(*)(C(*OC(C(*)=C)=O)C1(*)OC(*)(*)OC1=*)OC* Chemical compound *COC(*)(*)C(*)(C(*OC(C(*)=C)=O)C1(*)OC(*)(*)OC1=*)OC* 0.000 description 1
- WGPZTLIWMRFXSI-UHFFFAOYSA-N 2-(1-ethoxyethoxy)ethyl 2-methylprop-2-enoate Chemical compound CCOC(C)OCCOC(=O)C(C)=C WGPZTLIWMRFXSI-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIQLOLNJWXWZHX-UHFFFAOYSA-N 2-(5-bicyclo[2.2.1]hept-2-enylmethyl)-1,1,1,3,3,3-hexafluoropropan-2-ol Chemical compound C1C2C(CC(O)(C(F)(F)F)C(F)(F)F)CC1C=C2 NIQLOLNJWXWZHX-UHFFFAOYSA-N 0.000 description 1
- LNUJGAPHYUEEIB-UHFFFAOYSA-N 2-(ethoxymethoxy)ethyl 2-methylprop-2-enoate Chemical compound CCOCOCCOC(=O)C(C)=C LNUJGAPHYUEEIB-UHFFFAOYSA-N 0.000 description 1
- PDTDJRYFNGKLHD-UHFFFAOYSA-N 2-(methoxymethoxy)ethyl 2-methylprop-2-enoate Chemical compound COCOCCOC(=O)C(C)=C PDTDJRYFNGKLHD-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- XNECRJLMCBHYOM-UHFFFAOYSA-N 2-ethenyl-6-(1-ethoxyethoxy)naphthalene Chemical compound C1=C(C=C)C=CC2=CC(OC(C)OCC)=CC=C21 XNECRJLMCBHYOM-UHFFFAOYSA-N 0.000 description 1
- GPRXTZUZMOYERY-UHFFFAOYSA-N 2-ethenyl-6-(ethoxymethoxy)naphthalene Chemical compound C1=C(C=C)C=CC2=CC(OCOCC)=CC=C21 GPRXTZUZMOYERY-UHFFFAOYSA-N 0.000 description 1
- AEXWRSPXHREQHM-UHFFFAOYSA-N 2-ethenyl-6-(methoxymethoxy)naphthalene Chemical compound C1=C(C=C)C=CC2=CC(OCOC)=CC=C21 AEXWRSPXHREQHM-UHFFFAOYSA-N 0.000 description 1
- XVZWMPLMWUJTCE-UHFFFAOYSA-N 6-ethenylnaphthalen-2-ol Chemical compound C1=C(C=C)C=CC2=CC(O)=CC=C21 XVZWMPLMWUJTCE-UHFFFAOYSA-N 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000005907 alkyl ester group Chemical group 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 125000004185 ester group Chemical group 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201061429101P | 2010-12-31 | 2010-12-31 | |
| US61/429,101 | 2010-12-31 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012162707A JP2012162707A (ja) | 2012-08-30 |
| JP2012162707A5 true JP2012162707A5 (enExample) | 2016-12-28 |
| JP6080358B2 JP6080358B2 (ja) | 2017-02-15 |
Family
ID=45491284
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012000218A Expired - Fee Related JP6080358B2 (ja) | 2010-12-31 | 2012-01-04 | モノマー、ポリマー、フォトレジスト組成物、およびフォトリソグラフィパターンを形成する方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US8771917B2 (enExample) |
| EP (1) | EP2472324A1 (enExample) |
| JP (1) | JP6080358B2 (enExample) |
| KR (1) | KR101809567B1 (enExample) |
| CN (1) | CN102603701B (enExample) |
| TW (1) | TWI428356B (enExample) |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5947028B2 (ja) * | 2010-12-02 | 2016-07-06 | ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ | ポリマー、フォトレジスト組成物、およびフォトリソグラフィパターンを形成する方法 |
| EP2472326A1 (en) * | 2010-12-31 | 2012-07-04 | Rohm and Haas Electronic Materials LLC | Polymers, photoresist compositions and methods of forming photolithographic patterns |
| EP2492749A1 (en) * | 2011-02-28 | 2012-08-29 | Rohm and Haas Electronic Materials LLC | Photoresist compositions and methods of forming photolithographic patterns |
| EP2698388B1 (en) * | 2011-04-15 | 2015-12-09 | Zeon Corporation | Polymerizable compound, polymerizable composition, polymer, and optically anisotropic body |
| JP2013225094A (ja) * | 2011-10-07 | 2013-10-31 | Jsr Corp | フォトレジスト組成物及びレジストパターン形成方法 |
| JP5923423B2 (ja) * | 2011-10-13 | 2016-05-24 | 住友化学株式会社 | 化合物、樹脂、レジスト組成物及びレジストパターンの製造方法 |
| JP5682542B2 (ja) * | 2011-11-17 | 2015-03-11 | 信越化学工業株式会社 | ネガ型パターン形成方法 |
| JP6213016B2 (ja) * | 2012-08-01 | 2017-10-18 | 住友化学株式会社 | レジスト組成物及びレジストパターンの製造方法 |
| JP6063264B2 (ja) * | 2012-09-13 | 2017-01-18 | 東京エレクトロン株式会社 | 被処理基体を処理する方法、及びプラズマ処理装置 |
| JP6327036B2 (ja) * | 2013-07-24 | 2018-05-23 | Jsr株式会社 | 感放射線性樹脂組成物、レジストパターン形成方法、重合体、化合物及び化合物の製造方法 |
| CN103400750A (zh) * | 2013-08-19 | 2013-11-20 | 中国科学院高能物理研究所 | 一种在硅衬底表面涂覆光刻胶的方法 |
| JP5963730B2 (ja) * | 2013-10-17 | 2016-08-03 | シャープ株式会社 | 通信システム及び通信装置 |
| JP6252154B2 (ja) * | 2013-12-13 | 2017-12-27 | 住友化学株式会社 | レジスト組成物及びレジストパターンの製造方法 |
| US9229321B2 (en) * | 2013-12-13 | 2016-01-05 | Sumitomo Chemical Company, Limited | Salt and photoresist composition comprising the same |
| US9581901B2 (en) | 2013-12-19 | 2017-02-28 | Rohm And Haas Electronic Materials Llc | Photoacid-generating copolymer and associated photoresist composition, coated substrate, and method of forming an electronic device |
| US9229319B2 (en) | 2013-12-19 | 2016-01-05 | Rohm And Haas Electronic Materials Llc | Photoacid-generating copolymer and associated photoresist composition, coated substrate, and method of forming an electronic device |
| US10685846B2 (en) * | 2014-05-16 | 2020-06-16 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor integrated circuit fabrication with pattern-reversing process |
| JP6319001B2 (ja) * | 2014-09-08 | 2018-05-09 | Jsr株式会社 | 感放射線性樹脂組成物及びレジストパターン形成方法 |
| EP3067381A1 (en) * | 2015-03-12 | 2016-09-14 | Basf Se | Coated silicon surfaces, their manufacture and application |
| KR101697336B1 (ko) * | 2016-03-03 | 2017-01-17 | 주식회사 엘지화학 | 액정 배향막의 제조방법 |
| CN105566552B (zh) * | 2016-03-04 | 2019-05-17 | 江南大学 | 一种丙烯酸酯共聚物及其制成的248nm光刻胶组合物 |
| US11480878B2 (en) * | 2016-08-31 | 2022-10-25 | Rohm And Haas Electronic Materials Korea Ltd. | Monomers, polymers and photoresist compositions |
| US11574805B2 (en) * | 2019-09-12 | 2023-02-07 | Brewer Science, Inc. | Selective liquiphobic surface modification of substrates |
| CN110724216B (zh) * | 2019-11-05 | 2021-12-31 | 浙江展宇新材料有限公司 | 一种阻隔红外节能的pmma板材及其制备方法 |
| TWI887523B (zh) * | 2021-03-02 | 2025-06-21 | 日商Ｊｓｒ股份有限公司 | 感放射線性樹脂組成物、抗蝕劑圖案的形成方法、聚合物及化合物 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5865411A (ja) * | 1981-10-15 | 1983-04-19 | Toyo Contact Lens Co Ltd | コンタクトレンズの製造法 |
| AU550604B2 (en) * | 1981-05-01 | 1986-03-27 | Menicon Co., Ltd | Water absorptive contact lens |
| JPS57181524A (en) * | 1981-05-01 | 1982-11-09 | Toyo Contact Lens Co Ltd | Contact lens and its manufacture |
| JPS58176618A (ja) * | 1982-04-10 | 1983-10-17 | Toyo Contact Lens Co Ltd | 含水性コンタクトレンズおよびその製造法 |
| JPS61190507A (ja) * | 1985-02-19 | 1986-08-25 | Toyo Contact Lens Co Ltd | 医用材料 |
| CA2028112A1 (en) * | 1989-03-28 | 1990-09-29 | Norbert Klaus | Hydrogels based on sugar alcohol monomers |
| US5275909A (en) * | 1992-06-01 | 1994-01-04 | Ocg Microelectronic Materials, Inc. | Positive-working radiation sensitive mixtures and articles containing alkali-soluble binder, o-quinonediazide photoactive compound and BLANKOPHOR FBW acting dye |
| JP2715881B2 (ja) | 1993-12-28 | 1998-02-18 | 日本電気株式会社 | 感光性樹脂組成物およびパターン形成方法 |
| JPH0950126A (ja) | 1995-08-08 | 1997-02-18 | Fujitsu Ltd | レジスト組成物及びレジストパターン形成方法 |
| WO1997033198A1 (en) | 1996-03-07 | 1997-09-12 | The B.F. Goodrich Company | Photoresist compositions comprising polycyclic polymers with acid labile pendant groups |
| TWI234567B (en) * | 1998-11-27 | 2005-06-21 | Hyundai Electronics Ind | Cross-linker for photoresist, and photoresist composition comprising the same |
| TWI291953B (enExample) * | 2001-10-23 | 2008-01-01 | Mitsubishi Rayon Co | |
| DE10308504A1 (de) | 2003-02-26 | 2004-09-09 | Basf Ag | Enzymatische Herstellung von (Meth)acrylsäureestern |
| KR20060066932A (ko) | 2004-12-14 | 2006-06-19 | 주식회사 하이닉스반도체 | 포토레지스트 중합체 및 이를 함유하는 포토레지스트 조성물 |
| US8034547B2 (en) | 2007-04-13 | 2011-10-11 | Fujifilm Corporation | Pattern forming method, resist composition to be used in the pattern forming method, negative developing solution to be used in the pattern forming method and rinsing solution for negative development to be used in the pattern forming method |
| KR20090059650A (ko) | 2007-12-07 | 2009-06-11 | 삼성전자주식회사 | 이머전 리소그래피용 포토레지스트 조성물 및 이를 이용한포토레지스트 패턴의 형성 방법 |
| JP5775701B2 (ja) | 2010-02-26 | 2015-09-09 | 富士フイルム株式会社 | パターン形成方法及びレジスト組成物 |
-
2011
- 2011-12-23 EP EP11195165A patent/EP2472324A1/en not_active Withdrawn
- 2011-12-29 TW TW100149506A patent/TWI428356B/zh not_active IP Right Cessation
- 2011-12-31 US US13/341,931 patent/US8771917B2/en not_active Expired - Fee Related
- 2011-12-31 CN CN201110463333.4A patent/CN102603701B/zh not_active Expired - Fee Related
-
2012
- 2012-01-02 KR KR1020120000213A patent/KR101809567B1/ko not_active Expired - Fee Related
- 2012-01-04 JP JP2012000218A patent/JP6080358B2/ja not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2012162707A5 (enExample) | ||
| JP2012149252A5 (enExample) | ||
| JP2012149253A5 (enExample) | ||
| JP2012103679A5 (enExample) | ||
| JP2009265642A5 (enExample) | ||
| TWI448819B (zh) | 氟化氬浸潤式曝光用化學增幅正型光阻材料及圖案形成方法 | |
| TWI593666B (zh) | 內酯光酸產生劑及含該光酸產生劑之樹脂及光阻劑 | |
| KR101591545B1 (ko) | 함불소 단량체, 고분자 화합물, 레지스트 재료 및 패턴 형성 방법 | |
| JP5692229B2 (ja) | 感放射線性樹脂組成物、重合体及び化合物 | |
| KR101611634B1 (ko) | 불소 알코올 화합물, 불소 함유 단량체, 고분자 화합물, 레지스트 재료 및 패턴 형성 방법 | |
| JP2013137513A5 (enExample) | ||
| TW201202327A (en) | Photoacid generators and photoresists comprising same | |
| TWI540395B (zh) | The manufacturing method of the monomer | |
| JP2014071424A5 (enExample) | ||
| KR20140109856A (ko) | 감방사선성 수지 조성물, 중합체, 화합물 및 화합물의 제조 방법 | |
| KR20130038169A (ko) | 포토레지스트 조성물 및 레지스트 패턴 형성 방법 | |
| JP2014122356A (ja) | 含フッ素エステル型高分子化合物 | |
| TW201527372A (zh) | 化學增幅型正型感光性樹脂組成物及使用其之阻劑圖型之製造方法 | |
| JP2009258585A5 (enExample) | ||
| JP2010244062A5 (enExample) | ||
| JP2016157451A5 (enExample) | ||
| JP5935910B2 (ja) | 重合体 | |
| JP2009280538A (ja) | 脂環構造含有化合物、（メタ）アクリル酸エステル類、（メタ）アクリル系重合体並びにそれを含むポジ型レジスト組成物 | |
| TWI225971B (en) | Process for the production of photomasks for structuring semiconductor substrates by optical lithography | |
| JP5311089B2 (ja) | レジスト溶剤溶液の評価方法及び感放射線性樹脂組成物 |