JP2012160718A5 - Semiconductor device - Google Patents
Semiconductor device Download PDFInfo
- Publication number
- JP2012160718A5 JP2012160718A5 JP2012001751A JP2012001751A JP2012160718A5 JP 2012160718 A5 JP2012160718 A5 JP 2012160718A5 JP 2012001751 A JP2012001751 A JP 2012001751A JP 2012001751 A JP2012001751 A JP 2012001751A JP 2012160718 A5 JP2012160718 A5 JP 2012160718A5
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- Prior art keywords
- capacitor
- transistor
- semiconductor device
- wiring
- memory cell
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004065 semiconductor Substances 0.000 title claims 12
- 239000003990 capacitor Substances 0.000 claims 9
- 230000015572 biosynthetic process Effects 0.000 claims 2
- 238000005755 formation reaction Methods 0.000 claims 2
- 239000000463 material Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Claims (8)
前記駆動回路上方の配線層と、A wiring layer above the drive circuit;
前記配線層上方のメモリセルと、を有し、A memory cell above the wiring layer,
前記配線層は、第1の配線を有し、The wiring layer has a first wiring,
前記駆動回路は、前記第1の配線を介して前記メモリセルと電気的に接続され、The drive circuit is electrically connected to the memory cell through the first wiring,
前記メモリセルは、トランジスタと、前記トランジスタのゲート電極上方の絶縁層と、前記絶縁層上方のキャパシタと、を有し、The memory cell includes a transistor, an insulating layer above the gate electrode of the transistor, and a capacitor above the insulating layer,
前記トランジスタは、酸化物半導体層にチャネル形成領域を有し、The transistor includes a channel formation region in an oxide semiconductor layer;
前記トランジスタのソース又はドレインの一方は、前記キャパシタの第1の電極と電気的に接続されることを特徴とする半導体装置。One of the source and the drain of the transistor is electrically connected to the first electrode of the capacitor.
前記駆動回路上方の配線層と、A wiring layer above the drive circuit;
前記配線層上方のメモリセルと、を有し、A memory cell above the wiring layer,
前記配線層は、第1の配線を有し、The wiring layer has a first wiring,
前記駆動回路は、前記第1の配線を介して前記メモリセルと電気的に接続され、The drive circuit is electrically connected to the memory cell through the first wiring,
前記メモリセルは、トランジスタと、キャパシタと、を有し、The memory cell includes a transistor and a capacitor,
前記トランジスタは、酸化物半導体層にチャネル形成領域を有し、The transistor includes a channel formation region in an oxide semiconductor layer;
前記トランジスタのソース又はドレインの一方は、前記キャパシタの第1の電極と電気的に接続されることを特徴とする半導体装置。One of the source and the drain of the transistor is electrically connected to the first electrode of the capacitor.
前記キャパシタは、溝部に設けられていることを特徴とする半導体装置。2. The semiconductor device according to claim 1, wherein the capacitor is provided in the groove.
前記キャパシタの第1の電極は、前記キャパシタの第2の電極の下面と対向する領域と、前記キャパシタの第2の電極の側面と対向する領域と、を有することを特徴とする半導体装置。The semiconductor device according to claim 1, wherein the first electrode of the capacitor includes a region facing a lower surface of the second electrode of the capacitor and a region facing a side surface of the second electrode of the capacitor.
前記キャパシタの誘電体は、凹形を有することを特徴とする半導体装置。The semiconductor device according to claim 1, wherein the dielectric of the capacitor has a concave shape.
前記酸化物半導体層は、高純度化されていることを特徴とする半導体装置。The semiconductor device, wherein the oxide semiconductor layer is highly purified.
前記酸化物半導体層は、i型化又は実質的にi型化されていることを特徴とする半導体装置。The semiconductor device is characterized in that the oxide semiconductor layer is i-type or substantially i-type.
前記駆動回路は、単結晶半導体材料を含む基板に形成されていることを特徴とする半導体装置。The semiconductor device is characterized in that the driver circuit is formed on a substrate containing a single crystal semiconductor material.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012001751A JP6017138B2 (en) | 2011-01-14 | 2012-01-10 | Method for manufacturing semiconductor device |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011005401 | 2011-01-14 | ||
JP2011005401 | 2011-01-14 | ||
JP2012001751A JP6017138B2 (en) | 2011-01-14 | 2012-01-10 | Method for manufacturing semiconductor device |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016189450A Division JP2017011299A (en) | 2011-01-14 | 2016-09-28 | Semiconductor storage device |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2012160718A JP2012160718A (en) | 2012-08-23 |
JP2012160718A5 true JP2012160718A5 (en) | 2015-08-27 |
JP6017138B2 JP6017138B2 (en) | 2016-10-26 |
Family
ID=46490645
Family Applications (6)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012001751A Expired - Fee Related JP6017138B2 (en) | 2011-01-14 | 2012-01-10 | Method for manufacturing semiconductor device |
JP2016189450A Withdrawn JP2017011299A (en) | 2011-01-14 | 2016-09-28 | Semiconductor storage device |
JP2018050654A Withdrawn JP2018110267A (en) | 2011-01-14 | 2018-03-19 | Semiconductor storage device |
JP2019229167A Withdrawn JP2020053705A (en) | 2011-01-14 | 2019-12-19 | Semiconductor device |
JP2022054811A Withdrawn JP2022082650A (en) | 2011-01-14 | 2022-03-30 | Semiconductor device |
JP2023184875A Pending JP2023178501A (en) | 2011-01-14 | 2023-10-27 | Semiconductor device |
Family Applications After (5)
Application Number | Title | Priority Date | Filing Date |
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JP2016189450A Withdrawn JP2017011299A (en) | 2011-01-14 | 2016-09-28 | Semiconductor storage device |
JP2018050654A Withdrawn JP2018110267A (en) | 2011-01-14 | 2018-03-19 | Semiconductor storage device |
JP2019229167A Withdrawn JP2020053705A (en) | 2011-01-14 | 2019-12-19 | Semiconductor device |
JP2022054811A Withdrawn JP2022082650A (en) | 2011-01-14 | 2022-03-30 | Semiconductor device |
JP2023184875A Pending JP2023178501A (en) | 2011-01-14 | 2023-10-27 | Semiconductor device |
Country Status (4)
Country | Link |
---|---|
US (8) | US8811064B2 (en) |
JP (6) | JP6017138B2 (en) |
KR (2) | KR20120090787A (en) |
TW (4) | TWI492368B (en) |
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