JP2012160718A5 - Semiconductor device - Google Patents

Semiconductor device Download PDF

Info

Publication number
JP2012160718A5
JP2012160718A5 JP2012001751A JP2012001751A JP2012160718A5 JP 2012160718 A5 JP2012160718 A5 JP 2012160718A5 JP 2012001751 A JP2012001751 A JP 2012001751A JP 2012001751 A JP2012001751 A JP 2012001751A JP 2012160718 A5 JP2012160718 A5 JP 2012160718A5
Authority
JP
Japan
Prior art keywords
capacitor
transistor
semiconductor device
wiring
memory cell
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012001751A
Other languages
Japanese (ja)
Other versions
JP2012160718A (en
JP6017138B2 (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2012001751A priority Critical patent/JP6017138B2/en
Priority claimed from JP2012001751A external-priority patent/JP6017138B2/en
Publication of JP2012160718A publication Critical patent/JP2012160718A/en
Publication of JP2012160718A5 publication Critical patent/JP2012160718A5/en
Application granted granted Critical
Publication of JP6017138B2 publication Critical patent/JP6017138B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Claims (8)

駆動回路と、A drive circuit;
前記駆動回路上方の配線層と、A wiring layer above the drive circuit;
前記配線層上方のメモリセルと、を有し、A memory cell above the wiring layer,
前記配線層は、第1の配線を有し、The wiring layer has a first wiring,
前記駆動回路は、前記第1の配線を介して前記メモリセルと電気的に接続され、The drive circuit is electrically connected to the memory cell through the first wiring,
前記メモリセルは、トランジスタと、前記トランジスタのゲート電極上方の絶縁層と、前記絶縁層上方のキャパシタと、を有し、The memory cell includes a transistor, an insulating layer above the gate electrode of the transistor, and a capacitor above the insulating layer,
前記トランジスタは、酸化物半導体層にチャネル形成領域を有し、The transistor includes a channel formation region in an oxide semiconductor layer;
前記トランジスタのソース又はドレインの一方は、前記キャパシタの第1の電極と電気的に接続されることを特徴とする半導体装置。One of the source and the drain of the transistor is electrically connected to the first electrode of the capacitor.
駆動回路と、A drive circuit;
前記駆動回路上方の配線層と、A wiring layer above the drive circuit;
前記配線層上方のメモリセルと、を有し、A memory cell above the wiring layer,
前記配線層は、第1の配線を有し、The wiring layer has a first wiring,
前記駆動回路は、前記第1の配線を介して前記メモリセルと電気的に接続され、The drive circuit is electrically connected to the memory cell through the first wiring,
前記メモリセルは、トランジスタと、キャパシタと、を有し、The memory cell includes a transistor and a capacitor,
前記トランジスタは、酸化物半導体層にチャネル形成領域を有し、The transistor includes a channel formation region in an oxide semiconductor layer;
前記トランジスタのソース又はドレインの一方は、前記キャパシタの第1の電極と電気的に接続されることを特徴とする半導体装置。One of the source and the drain of the transistor is electrically connected to the first electrode of the capacitor.
請求項1又は請求項2において、In claim 1 or claim 2,
前記キャパシタは、溝部に設けられていることを特徴とする半導体装置。2. The semiconductor device according to claim 1, wherein the capacitor is provided in the groove.
請求項1又は請求項2において、In claim 1 or claim 2,
前記キャパシタの第1の電極は、前記キャパシタの第2の電極の下面と対向する領域と、前記キャパシタの第2の電極の側面と対向する領域と、を有することを特徴とする半導体装置。The semiconductor device according to claim 1, wherein the first electrode of the capacitor includes a region facing a lower surface of the second electrode of the capacitor and a region facing a side surface of the second electrode of the capacitor.
請求項1又は請求項2において、In claim 1 or claim 2,
前記キャパシタの誘電体は、凹形を有することを特徴とする半導体装置。The semiconductor device according to claim 1, wherein the dielectric of the capacitor has a concave shape.
請求項1乃至請求項5のいずれか一項において、In any one of Claims 1 thru | or 5,
前記酸化物半導体層は、高純度化されていることを特徴とする半導体装置。The semiconductor device, wherein the oxide semiconductor layer is highly purified.
請求項1乃至請求項6のいずれか一項において、In any one of Claims 1 thru | or 6,
前記酸化物半導体層は、i型化又は実質的にi型化されていることを特徴とする半導体装置。The semiconductor device is characterized in that the oxide semiconductor layer is i-type or substantially i-type.
請求項1乃至請求項7のいずれか一項において、In any one of Claims 1 thru | or 7,
前記駆動回路は、単結晶半導体材料を含む基板に形成されていることを特徴とする半導体装置。The semiconductor device is characterized in that the driver circuit is formed on a substrate containing a single crystal semiconductor material.
JP2012001751A 2011-01-14 2012-01-10 Method for manufacturing semiconductor device Expired - Fee Related JP6017138B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012001751A JP6017138B2 (en) 2011-01-14 2012-01-10 Method for manufacturing semiconductor device

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011005401 2011-01-14
JP2011005401 2011-01-14
JP2012001751A JP6017138B2 (en) 2011-01-14 2012-01-10 Method for manufacturing semiconductor device

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2016189450A Division JP2017011299A (en) 2011-01-14 2016-09-28 Semiconductor storage device

Publications (3)

Publication Number Publication Date
JP2012160718A JP2012160718A (en) 2012-08-23
JP2012160718A5 true JP2012160718A5 (en) 2015-08-27
JP6017138B2 JP6017138B2 (en) 2016-10-26

Family

ID=46490645

Family Applications (6)

Application Number Title Priority Date Filing Date
JP2012001751A Expired - Fee Related JP6017138B2 (en) 2011-01-14 2012-01-10 Method for manufacturing semiconductor device
JP2016189450A Withdrawn JP2017011299A (en) 2011-01-14 2016-09-28 Semiconductor storage device
JP2018050654A Withdrawn JP2018110267A (en) 2011-01-14 2018-03-19 Semiconductor storage device
JP2019229167A Withdrawn JP2020053705A (en) 2011-01-14 2019-12-19 Semiconductor device
JP2022054811A Withdrawn JP2022082650A (en) 2011-01-14 2022-03-30 Semiconductor device
JP2023184875A Pending JP2023178501A (en) 2011-01-14 2023-10-27 Semiconductor device

Family Applications After (5)

Application Number Title Priority Date Filing Date
JP2016189450A Withdrawn JP2017011299A (en) 2011-01-14 2016-09-28 Semiconductor storage device
JP2018050654A Withdrawn JP2018110267A (en) 2011-01-14 2018-03-19 Semiconductor storage device
JP2019229167A Withdrawn JP2020053705A (en) 2011-01-14 2019-12-19 Semiconductor device
JP2022054811A Withdrawn JP2022082650A (en) 2011-01-14 2022-03-30 Semiconductor device
JP2023184875A Pending JP2023178501A (en) 2011-01-14 2023-10-27 Semiconductor device

Country Status (4)

Country Link
US (8) US8811064B2 (en)
JP (6) JP6017138B2 (en)
KR (2) KR20120090787A (en)
TW (4) TWI492368B (en)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI574259B (en) 2010-09-29 2017-03-11 半導體能源研究所股份有限公司 Semiconductor memory device and method for driving the same
TWI492368B (en) 2011-01-14 2015-07-11 Semiconductor Energy Lab Semiconductor memory device
TWI614747B (en) 2011-01-26 2018-02-11 半導體能源研究所股份有限公司 Memory device and semiconductor device
US8780614B2 (en) 2011-02-02 2014-07-15 Semiconductor Energy Laboratory Co., Ltd. Semiconductor memory device
TWI520273B (en) 2011-02-02 2016-02-01 半導體能源研究所股份有限公司 Semiconductor memory device
JP5886496B2 (en) 2011-05-20 2016-03-16 株式会社半導体エネルギー研究所 Semiconductor device
TWI616873B (en) 2011-05-20 2018-03-01 半導體能源研究所股份有限公司 Memory device and signal processing circuit
JP6082189B2 (en) 2011-05-20 2017-02-15 株式会社半導体エネルギー研究所 Storage device and signal processing circuit
CN103022012B (en) 2011-09-21 2017-03-01 株式会社半导体能源研究所 Semiconductor storage
JP6081171B2 (en) 2011-12-09 2017-02-15 株式会社半導体エネルギー研究所 Storage device
US8916424B2 (en) 2012-02-07 2014-12-23 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
KR101947813B1 (en) * 2012-12-17 2019-02-14 한국전자통신연구원 Electronic chip and method of fabricating the same
US9607991B2 (en) 2013-09-05 2017-03-28 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US10916430B2 (en) 2016-07-25 2021-02-09 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
WO2018092003A1 (en) * 2016-11-17 2018-05-24 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing semiconductor device
WO2018182729A1 (en) * 2017-03-31 2018-10-04 Intel Corporation Co-integration of on chip memory technologies
KR102637403B1 (en) 2017-07-26 2024-02-15 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor devices and methods of manufacturing semiconductor devices
US10431357B2 (en) * 2017-11-13 2019-10-01 Texas Instruments Incorporated Vertically-constructed, temperature-sensing resistors and methods of making the same
US11417662B2 (en) * 2020-08-25 2022-08-16 Nanya Technology Corporation Memory device and method of forming the same
US20230397437A1 (en) * 2020-10-21 2023-12-07 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and electronic device

Family Cites Families (182)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60198861A (en) 1984-03-23 1985-10-08 Fujitsu Ltd Thin film transistor
JPH0244256B2 (en) 1987-01-28 1990-10-03 Kagaku Gijutsucho Mukizaishitsu Kenkyushocho INGAZN2O5DESHIMESARERUROTSUHOSHOKEINOSOJOKOZOOJUSURUKAGOBUTSUOYOBISONOSEIZOHO
JPS63210023A (en) 1987-02-24 1988-08-31 Natl Inst For Res In Inorg Mater Compound having laminar structure of hexagonal crystal system expressed by ingazn4o7 and its production
JPH0244260B2 (en) 1987-02-24 1990-10-03 Kagaku Gijutsucho Mukizaishitsu Kenkyushocho INGAZN5O8DESHIMESARERUROTSUHOSHOKEINOSOJOKOZOOJUSURUKAGOBUTSUOYOBISONOSEIZOHO
JPH0244258B2 (en) 1987-02-24 1990-10-03 Kagaku Gijutsucho Mukizaishitsu Kenkyushocho INGAZN3O6DESHIMESARERUROTSUHOSHOKEINOSOJOKOZOOJUSURUKAGOBUTSUOYOBISONOSEIZOHO
JPH0244262B2 (en) 1987-02-27 1990-10-03 Kagaku Gijutsucho Mukizaishitsu Kenkyushocho INGAZN6O9DESHIMESARERUROTSUHOSHOKEINOSOJOKOZOOJUSURUKAGOBUTSUOYOBISONOSEIZOHO
JPH0244263B2 (en) 1987-04-22 1990-10-03 Kagaku Gijutsucho Mukizaishitsu Kenkyushocho INGAZN7O10DESHIMESARERUROTSUHOSHOKEINOSOJOKOZOOJUSURUKAGOBUTSUOYOBISONOSEIZOHO
JPH03112151A (en) 1989-09-26 1991-05-13 Nec Corp Active layer stacked element
JP3003188B2 (en) 1990-09-10 2000-01-24 ソニー株式会社 Semiconductor memory and manufacturing method thereof
JP3128829B2 (en) 1990-12-26 2001-01-29 ソニー株式会社 Semiconductor memory device
JPH05251705A (en) 1992-03-04 1993-09-28 Fuji Xerox Co Ltd Thin-film transistor
JP3479375B2 (en) 1995-03-27 2003-12-15 科学技術振興事業団 Metal oxide semiconductor device in which a pn junction is formed with a thin film transistor made of a metal oxide semiconductor such as cuprous oxide, and methods for manufacturing the same
KR100394896B1 (en) 1995-08-03 2003-11-28 코닌클리케 필립스 일렉트로닉스 엔.브이. A semiconductor device including a transparent switching element
JPH0982918A (en) 1995-09-19 1997-03-28 Toshiba Corp Semiconductor storage device and its manufacture
JP3625598B2 (en) 1995-12-30 2005-03-02 三星電子株式会社 Manufacturing method of liquid crystal display device
JP4103968B2 (en) 1996-09-18 2008-06-18 株式会社半導体エネルギー研究所 Insulated gate type semiconductor device
JP4401448B2 (en) 1997-02-24 2010-01-20 株式会社半導体エネルギー研究所 Method for manufacturing semiconductor device
JPH1131795A (en) * 1997-05-12 1999-02-02 Sony Corp Semiconductor device and method for manufacturing it
JP3161408B2 (en) 1998-03-03 2001-04-25 日本電気株式会社 Semiconductor device and manufacturing method thereof
JP4170454B2 (en) 1998-07-24 2008-10-22 Hoya株式会社 Article having transparent conductive oxide thin film and method for producing the same
JP2000150861A (en) 1998-11-16 2000-05-30 Tdk Corp Oxide thin film
JP3276930B2 (en) 1998-11-17 2002-04-22 科学技術振興事業団 Transistor and semiconductor device
JP2000183313A (en) * 1998-12-21 2000-06-30 Hitachi Ltd Semiconductor integrated circuit device and manufacture of the same
JP3296324B2 (en) 1999-04-07 2002-06-24 日本電気株式会社 Method for manufacturing semiconductor memory device
TW460731B (en) 1999-09-03 2001-10-21 Ind Tech Res Inst Electrode structure and production method of wide viewing angle LCD
KR100360592B1 (en) 1999-12-08 2002-11-13 동부전자 주식회사 Semiconductor devic and method for fabricating it
JP2001223344A (en) * 2000-02-09 2001-08-17 Hitachi Ltd Semiconductor device and its manufacturing method
JP4089858B2 (en) 2000-09-01 2008-05-28 国立大学法人東北大学 Semiconductor device
KR20020038482A (en) 2000-11-15 2002-05-23 모리시타 요이찌 Thin film transistor array, method for producing the same, and display panel using the same
DE10103991C1 (en) 2001-01-30 2002-06-06 Infineon Technologies Ag Temperature detection method for semiconductor component uses evaluation of replacement voltage of memory cell transistor
JP3997731B2 (en) 2001-03-19 2007-10-24 富士ゼロックス株式会社 Method for forming a crystalline semiconductor thin film on a substrate
JP2002289859A (en) 2001-03-23 2002-10-04 Minolta Co Ltd Thin-film transistor
JP4090716B2 (en) 2001-09-10 2008-05-28 雅司 川崎 Thin film transistor and matrix display device
JP3925839B2 (en) 2001-09-10 2007-06-06 シャープ株式会社 Semiconductor memory device and test method thereof
JP4164562B2 (en) 2002-09-11 2008-10-15 独立行政法人科学技術振興機構 Transparent thin film field effect transistor using homologous thin film as active layer
EP1443130B1 (en) 2001-11-05 2011-09-28 Japan Science and Technology Agency Natural superlattice homologous single crystal thin film, method for preparation thereof, and device using said single crystal thin film
JP2003163265A (en) 2001-11-27 2003-06-06 Nec Corp Wiring structure and its manufacturing method
US7126214B2 (en) 2001-12-05 2006-10-24 Arbor Company Llp Reconfigurable processor module comprising hybrid stacked integrated circuit die elements
JP4083486B2 (en) 2002-02-21 2008-04-30 独立行政法人科学技術振興機構 Method for producing LnCuO (S, Se, Te) single crystal thin film
US7049190B2 (en) 2002-03-15 2006-05-23 Sanyo Electric Co., Ltd. Method for forming ZnO film, method for forming ZnO semiconductor layer, method for fabricating semiconductor device, and semiconductor device
JP3933591B2 (en) 2002-03-26 2007-06-20 淳二 城戸 Organic electroluminescent device
JP4212299B2 (en) 2002-05-09 2009-01-21 株式会社東芝 Nonvolatile semiconductor memory device
US7339187B2 (en) 2002-05-21 2008-03-04 State Of Oregon Acting By And Through The Oregon State Board Of Higher Education On Behalf Of Oregon State University Transistor structures
JP2004022625A (en) 2002-06-13 2004-01-22 Murata Mfg Co Ltd Manufacturing method of semiconductor device and its manufacturing method
US7105868B2 (en) 2002-06-24 2006-09-12 Cermet, Inc. High-electron mobility transistor with zinc oxide
JP2004128395A (en) * 2002-10-07 2004-04-22 Renesas Technology Corp Semiconductor device and method of manufacturing semiconductor device
US7067843B2 (en) 2002-10-11 2006-06-27 E. I. Du Pont De Nemours And Company Transparent oxide semiconductor thin film transistors
JP4175877B2 (en) 2002-11-29 2008-11-05 株式会社半導体エネルギー研究所 Semiconductor device and manufacturing method thereof
JP4489345B2 (en) 2002-12-13 2010-06-23 株式会社ルネサステクノロジ Manufacturing method of semiconductor device
JP4166105B2 (en) 2003-03-06 2008-10-15 シャープ株式会社 Semiconductor device and manufacturing method thereof
JP2004273732A (en) 2003-03-07 2004-09-30 Sharp Corp Active matrix substrate and its producing process
US7200050B2 (en) * 2003-05-26 2007-04-03 Semiconductor Energy Laboratory Co., Ltd. Memory unit and semiconductor device
JP4108633B2 (en) 2003-06-20 2008-06-25 シャープ株式会社 THIN FILM TRANSISTOR, MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE
US7262463B2 (en) 2003-07-25 2007-08-28 Hewlett-Packard Development Company, L.P. Transistor including a deposited channel region having a doped portion
US7423343B2 (en) 2003-08-05 2008-09-09 Semiconductor Energy Laboratory Co., Ltd. Wiring board, manufacturing method thereof, semiconductor device and manufacturing method thereof
JP4606006B2 (en) * 2003-09-11 2011-01-05 ルネサスエレクトロニクス株式会社 Manufacturing method of semiconductor device
KR100591154B1 (en) 2003-12-31 2006-06-19 동부일렉트로닉스 주식회사 Method for fabricating metal pattern to reduce contact resistivity with interconnection contact
US7145174B2 (en) 2004-03-12 2006-12-05 Hewlett-Packard Development Company, Lp. Semiconductor device
US7297977B2 (en) 2004-03-12 2007-11-20 Hewlett-Packard Development Company, L.P. Semiconductor device
EP1737044B1 (en) 2004-03-12 2014-12-10 Japan Science and Technology Agency Amorphous oxide and thin film transistor
US7282782B2 (en) 2004-03-12 2007-10-16 Hewlett-Packard Development Company, L.P. Combined binary oxide semiconductor device
US7211825B2 (en) 2004-06-14 2007-05-01 Yi-Chi Shih Indium oxide-based thin film transistors and circuits
US7378702B2 (en) * 2004-06-21 2008-05-27 Sang-Yun Lee Vertical memory device structures
JP2006100760A (en) 2004-09-02 2006-04-13 Casio Comput Co Ltd Thin-film transistor and its manufacturing method
US7285501B2 (en) 2004-09-17 2007-10-23 Hewlett-Packard Development Company, L.P. Method of forming a solution processed device
US7298084B2 (en) 2004-11-02 2007-11-20 3M Innovative Properties Company Methods and displays utilizing integrated zinc oxide row and column drivers in conjunction with organic light emitting diodes
EP1812969B1 (en) 2004-11-10 2015-05-06 Canon Kabushiki Kaisha Field effect transistor comprising an amorphous oxide
US7453065B2 (en) 2004-11-10 2008-11-18 Canon Kabushiki Kaisha Sensor and image pickup device
US7863611B2 (en) 2004-11-10 2011-01-04 Canon Kabushiki Kaisha Integrated circuits utilizing amorphous oxides
US7868326B2 (en) 2004-11-10 2011-01-11 Canon Kabushiki Kaisha Field effect transistor
US7829444B2 (en) 2004-11-10 2010-11-09 Canon Kabushiki Kaisha Field effect transistor manufacturing method
CN101057333B (en) 2004-11-10 2011-11-16 佳能株式会社 Light emitting device
US7791072B2 (en) 2004-11-10 2010-09-07 Canon Kabushiki Kaisha Display
KR100629364B1 (en) 2004-12-28 2006-09-29 삼성전자주식회사 Semiconductor integrated circuit devices including SRAM cells and flash memory cells and methods of fabricating the same
US7579224B2 (en) 2005-01-21 2009-08-25 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing a thin film semiconductor device
US7608531B2 (en) 2005-01-28 2009-10-27 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, electronic device, and method of manufacturing semiconductor device
TWI562380B (en) 2005-01-28 2016-12-11 Semiconductor Energy Lab Co Ltd Semiconductor device, electronic device, and method of manufacturing semiconductor device
US7858451B2 (en) 2005-02-03 2010-12-28 Semiconductor Energy Laboratory Co., Ltd. Electronic device, semiconductor device and manufacturing method thereof
US7948171B2 (en) 2005-02-18 2011-05-24 Semiconductor Energy Laboratory Co., Ltd. Light emitting device
US20060197092A1 (en) 2005-03-03 2006-09-07 Randy Hoffman System and method for forming conductive material on a substrate
JP4466853B2 (en) * 2005-03-15 2010-05-26 セイコーエプソン株式会社 Organic ferroelectric memory and manufacturing method thereof
US8681077B2 (en) 2005-03-18 2014-03-25 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, and display device, driving method and electronic apparatus thereof
WO2006105077A2 (en) 2005-03-28 2006-10-05 Massachusetts Institute Of Technology Low voltage thin film transistor with high-k dielectric material
US7645478B2 (en) 2005-03-31 2010-01-12 3M Innovative Properties Company Methods of making displays
US8300031B2 (en) 2005-04-20 2012-10-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device comprising transistor having gate and drain connected through a current-voltage conversion element
JP2006344849A (en) 2005-06-10 2006-12-21 Casio Comput Co Ltd Thin film transistor
US7402506B2 (en) 2005-06-16 2008-07-22 Eastman Kodak Company Methods of making thin film transistors comprising zinc-oxide-based semiconductor materials and transistors made thereby
US7691666B2 (en) 2005-06-16 2010-04-06 Eastman Kodak Company Methods of making thin film transistors comprising zinc-oxide-based semiconductor materials and transistors made thereby
KR100688554B1 (en) 2005-06-23 2007-03-02 삼성전자주식회사 Semiconductor memory device having power decoupling capacitor
US7999299B2 (en) 2005-06-23 2011-08-16 Samsung Electronics Co., Ltd. Semiconductor memory device having capacitor for peripheral circuit
US7507618B2 (en) 2005-06-27 2009-03-24 3M Innovative Properties Company Method for making electronic devices using metal oxide nanoparticles
KR100711890B1 (en) 2005-07-28 2007-04-25 삼성에스디아이 주식회사 Organic Light Emitting Display and Fabrication Method for the same
JP2007059128A (en) 2005-08-23 2007-03-08 Canon Inc Organic electroluminescent display device and manufacturing method thereof
JP2007073705A (en) 2005-09-06 2007-03-22 Canon Inc Oxide-semiconductor channel film transistor and its method of manufacturing same
JP5116225B2 (en) 2005-09-06 2013-01-09 キヤノン株式会社 Manufacturing method of oxide semiconductor device
JP4280736B2 (en) 2005-09-06 2009-06-17 キヤノン株式会社 Semiconductor element
JP4850457B2 (en) 2005-09-06 2012-01-11 キヤノン株式会社 Thin film transistor and thin film diode
JP5006598B2 (en) * 2005-09-16 2012-08-22 キヤノン株式会社 Field effect transistor
JP5078246B2 (en) 2005-09-29 2012-11-21 株式会社半導体エネルギー研究所 Semiconductor device and manufacturing method of semiconductor device
EP3614442A3 (en) 2005-09-29 2020-03-25 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device having oxide semiconductor layer and manufactoring method thereof
JP5064747B2 (en) 2005-09-29 2012-10-31 株式会社半導体エネルギー研究所 Semiconductor device, electrophoretic display device, display module, electronic device, and method for manufacturing semiconductor device
JP5037808B2 (en) 2005-10-20 2012-10-03 キヤノン株式会社 Field effect transistor using amorphous oxide, and display device using the transistor
JP4304516B2 (en) * 2005-10-31 2009-07-29 セイコーエプソン株式会社 Method for producing conductive complex oxide layer, method for producing laminate having ferroelectric layer
KR101117948B1 (en) 2005-11-15 2012-02-15 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Method of Manufacturing a Liquid Crystal Display Device
TWI292281B (en) 2005-12-29 2008-01-01 Ind Tech Res Inst Pixel structure of active organic light emitting diode and method of fabricating the same
US7867636B2 (en) 2006-01-11 2011-01-11 Murata Manufacturing Co., Ltd. Transparent conductive film and method for manufacturing the same
JP4977478B2 (en) 2006-01-21 2012-07-18 三星電子株式会社 ZnO film and method of manufacturing TFT using the same
US7576394B2 (en) 2006-02-02 2009-08-18 Kochi Industrial Promotion Center Thin film transistor including low resistance conductive thin films and manufacturing method thereof
US7977169B2 (en) 2006-02-15 2011-07-12 Kochi Industrial Promotion Center Semiconductor device including active layer made of zinc oxide with controlled orientations and manufacturing method thereof
JP5015473B2 (en) * 2006-02-15 2012-08-29 財団法人高知県産業振興センター Thin film transistor array and manufacturing method thereof
JP5063912B2 (en) * 2006-03-31 2012-10-31 パナソニック株式会社 Semiconductor memory device
KR20070101595A (en) 2006-04-11 2007-10-17 삼성전자주식회사 Zno thin film transistor
US20070252928A1 (en) 2006-04-28 2007-11-01 Toppan Printing Co., Ltd. Structure, transmission type liquid crystal display, reflection type display and manufacturing method thereof
JP5028033B2 (en) 2006-06-13 2012-09-19 キヤノン株式会社 Oxide semiconductor film dry etching method
JP4609797B2 (en) 2006-08-09 2011-01-12 Nec液晶テクノロジー株式会社 Thin film device and manufacturing method thereof
JP4999400B2 (en) 2006-08-09 2012-08-15 キヤノン株式会社 Oxide semiconductor film dry etching method
JP2007013196A (en) * 2006-08-23 2007-01-18 Renesas Technology Corp Semiconductor device
KR100832104B1 (en) * 2006-09-07 2008-05-27 삼성전자주식회사 Semiconductor memory device and method for forming the same
JP4332545B2 (en) 2006-09-15 2009-09-16 キヤノン株式会社 Field effect transistor and manufacturing method thereof
JP5164357B2 (en) 2006-09-27 2013-03-21 キヤノン株式会社 Semiconductor device and manufacturing method of semiconductor device
JP4274219B2 (en) 2006-09-27 2009-06-03 セイコーエプソン株式会社 Electronic devices, organic electroluminescence devices, organic thin film semiconductor devices
US7622371B2 (en) 2006-10-10 2009-11-24 Hewlett-Packard Development Company, L.P. Fused nanocrystal thin film semiconductor and method
US7772021B2 (en) 2006-11-29 2010-08-10 Samsung Electronics Co., Ltd. Flat panel displays comprising a thin-film transistor having a semiconductive oxide in its channel and methods of fabricating the same for use in flat panel displays
JP2008140684A (en) 2006-12-04 2008-06-19 Toppan Printing Co Ltd Color el display, and its manufacturing method
KR101303578B1 (en) 2007-01-05 2013-09-09 삼성전자주식회사 Etching method of thin film
US8207063B2 (en) 2007-01-26 2012-06-26 Eastman Kodak Company Process for atomic layer deposition
KR100851215B1 (en) 2007-03-14 2008-08-07 삼성에스디아이 주식회사 Thin film transistor and organic light-emitting dislplay device having the thin film transistor
US7795613B2 (en) 2007-04-17 2010-09-14 Toppan Printing Co., Ltd. Structure with transistor
KR101325053B1 (en) 2007-04-18 2013-11-05 삼성디스플레이 주식회사 Thin film transistor substrate and manufacturing method thereof
KR20080094300A (en) 2007-04-19 2008-10-23 삼성전자주식회사 Thin film transistor and method of manufacturing the same and flat panel display comprising the same
KR101334181B1 (en) 2007-04-20 2013-11-28 삼성전자주식회사 Thin Film Transistor having selectively crystallized channel layer and method of manufacturing the same
US8274078B2 (en) 2007-04-25 2012-09-25 Canon Kabushiki Kaisha Metal oxynitride semiconductor containing zinc
KR100886429B1 (en) 2007-05-14 2009-03-02 삼성전자주식회사 Semiconductor device and method for manufacturing the same
KR101345376B1 (en) 2007-05-29 2013-12-24 삼성전자주식회사 Fabrication method of ZnO family Thin film transistor
JP5352077B2 (en) * 2007-11-12 2013-11-27 ルネサスエレクトロニクス株式会社 Semiconductor integrated circuit
JP5215158B2 (en) * 2007-12-17 2013-06-19 富士フイルム株式会社 Inorganic crystalline alignment film, method for manufacturing the same, and semiconductor device
JP2009152235A (en) * 2007-12-18 2009-07-09 Panasonic Corp Ferroelectric stacked-layer structure and fabrication method thereof, field effect transistor and fabrication method thereof, and ferroelectric capacitor and fabrication method thereof
KR20090072399A (en) 2007-12-28 2009-07-02 삼성전자주식회사 Tree dimentional memory device
JP2009206508A (en) * 2008-01-31 2009-09-10 Canon Inc Thin film transistor and display
EP2146379B1 (en) 2008-07-14 2015-01-28 Samsung Electronics Co., Ltd. Transistor comprising ZnO based channel layer
JP2010056227A (en) 2008-08-27 2010-03-11 Toshiba Corp Semiconductor device and method of manufacturing the same
US8230375B2 (en) * 2008-09-14 2012-07-24 Raminda Udaya Madurawe Automated metal pattern generation for integrated circuits
JP4623179B2 (en) 2008-09-18 2011-02-02 ソニー株式会社 Thin film transistor and manufacturing method thereof
JP5451280B2 (en) 2008-10-09 2014-03-26 キヤノン株式会社 Wurtzite crystal growth substrate, manufacturing method thereof, and semiconductor device
JP2010118407A (en) * 2008-11-11 2010-05-27 Idemitsu Kosan Co Ltd Thin-film transistor having etching resistance, and production method thereof
WO2010058541A1 (en) * 2008-11-18 2010-05-27 パナソニック株式会社 Flexible semiconductor device and method for manufacturing same
JP4905442B2 (en) * 2008-12-05 2012-03-28 ソニー株式会社 Semiconductor device and manufacturing method thereof
JP2010140919A (en) 2008-12-09 2010-06-24 Hitachi Ltd Oxide semiconductor device, manufacturing method thereof, and active matrix substrate
JP5538797B2 (en) * 2008-12-12 2014-07-02 キヤノン株式会社 Field effect transistor and display device
JP5781720B2 (en) * 2008-12-15 2015-09-24 ルネサスエレクトロニクス株式会社 Semiconductor device and manufacturing method of semiconductor device
TWI540647B (en) 2008-12-26 2016-07-01 半導體能源研究所股份有限公司 Semiconductor device and manufacturing method thereof
US8492756B2 (en) * 2009-01-23 2013-07-23 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
JP4752927B2 (en) 2009-02-09 2011-08-17 ソニー株式会社 Thin film transistor and display device
JP2010205987A (en) 2009-03-04 2010-09-16 Sony Corp Thin film transistor, method for manufacturing the same, and display
JP5724157B2 (en) * 2009-04-13 2015-05-27 日立金属株式会社 Oxide semiconductor target and method of manufacturing oxide semiconductor device using the same
KR101076888B1 (en) * 2009-06-29 2011-10-25 주식회사 하이닉스반도체 Interconnection wire of semiconductor device and manufacturing method therefor
JP2011060825A (en) * 2009-09-07 2011-03-24 Elpida Memory Inc Semiconductor device and method of manufacturing the same
KR102246529B1 (en) 2009-09-16 2021-04-30 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
WO2011043194A1 (en) 2009-10-09 2011-04-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
KR20190006091A (en) 2009-10-29 2019-01-16 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
CN102612749B (en) 2009-11-06 2015-04-01 株式会社半导体能源研究所 Semiconductor device
CN102668077B (en) 2009-11-20 2015-05-13 株式会社半导体能源研究所 Nonvolatile latch circuit and logic circuit, and semiconductor device using the same
KR101928723B1 (en) 2009-11-20 2018-12-13 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
KR101662359B1 (en) 2009-11-24 2016-10-04 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device including memory cell
KR101911382B1 (en) 2009-11-27 2018-10-24 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
KR101802406B1 (en) 2009-11-27 2017-11-28 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and method for manufacturing the same
CN104658598B (en) 2009-12-11 2017-08-11 株式会社半导体能源研究所 Semiconductor devices, logic circuit and CPU
KR101913111B1 (en) 2009-12-18 2018-10-31 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
KR101781336B1 (en) 2009-12-25 2017-09-25 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
KR101866734B1 (en) 2009-12-25 2018-06-15 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
CN105702631B (en) 2009-12-28 2019-05-28 株式会社半导体能源研究所 Semiconductor devices
KR102063214B1 (en) 2009-12-28 2020-01-07 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Memory device and semiconductor device
KR101842413B1 (en) 2009-12-28 2018-03-26 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
JP4628485B2 (en) 2010-02-17 2011-02-09 株式会社半導体エネルギー研究所 Method for manufacturing thin film transistor
WO2012029638A1 (en) 2010-09-03 2012-03-08 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP2012256821A (en) 2010-09-13 2012-12-27 Semiconductor Energy Lab Co Ltd Memory device
TWI539453B (en) 2010-09-14 2016-06-21 半導體能源研究所股份有限公司 Memory device and semiconductor device
JP5587716B2 (en) * 2010-09-27 2014-09-10 マイクロンメモリジャパン株式会社 Semiconductor device, manufacturing method thereof, and adsorption site blocking atomic layer deposition method
TWI574259B (en) 2010-09-29 2017-03-11 半導體能源研究所股份有限公司 Semiconductor memory device and method for driving the same
TWI620176B (en) 2010-10-05 2018-04-01 半導體能源研究所股份有限公司 Semiconductor memory device and driving method thereof
KR101973212B1 (en) 2010-11-05 2019-04-26 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
TWI492368B (en) * 2011-01-14 2015-07-11 Semiconductor Energy Lab Semiconductor memory device

Similar Documents

Publication Publication Date Title
JP2012160718A5 (en) Semiconductor device
JP2011119675A5 (en)
JP2013149961A5 (en) Semiconductor device
JP2011151383A5 (en)
JP2011151377A5 (en)
JP2013239713A5 (en)
JP2016195267A5 (en)
JP2013190804A5 (en)
JP2012134520A5 (en) Display device
JP2013214729A5 (en)
JP2011204347A5 (en) Semiconductor memory device
JP2012015498A5 (en)
JP2012256063A5 (en) Display device
JP2014199402A5 (en)
JP2012138590A5 (en) Display device
JP2012015500A5 (en)
JP2014063179A5 (en)
JP2013102140A5 (en) Semiconductor device
JP2013165132A5 (en)
JP2011151384A5 (en)
JP2010251732A5 (en) Transistor and display device
JP2011155255A5 (en) Semiconductor device
JP2013211537A5 (en)
JP2011071503A5 (en) Semiconductor device
JP2011054949A5 (en) Semiconductor device