JP2012155820A5 - - Google Patents

Download PDF

Info

Publication number
JP2012155820A5
JP2012155820A5 JP2011016476A JP2011016476A JP2012155820A5 JP 2012155820 A5 JP2012155820 A5 JP 2012155820A5 JP 2011016476 A JP2011016476 A JP 2011016476A JP 2011016476 A JP2011016476 A JP 2011016476A JP 2012155820 A5 JP2012155820 A5 JP 2012155820A5
Authority
JP
Japan
Prior art keywords
stainless steel
patent document
conductive material
increase
conductivity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011016476A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012155820A (ja
JP5587219B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2011016476A priority Critical patent/JP5587219B2/ja
Priority claimed from JP2011016476A external-priority patent/JP5587219B2/ja
Priority to US13/339,911 priority patent/US8920887B2/en
Publication of JP2012155820A publication Critical patent/JP2012155820A/ja
Publication of JP2012155820A5 publication Critical patent/JP2012155820A5/ja
Application granted granted Critical
Publication of JP5587219B2 publication Critical patent/JP5587219B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2011016476A 2011-01-28 2011-01-28 ステンレス鋼への導電材料の接合方法 Active JP5587219B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2011016476A JP5587219B2 (ja) 2011-01-28 2011-01-28 ステンレス鋼への導電材料の接合方法
US13/339,911 US8920887B2 (en) 2011-01-28 2011-12-29 Method of bonding conductive material to stainless steel, and HDD magnetic head suspension

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011016476A JP5587219B2 (ja) 2011-01-28 2011-01-28 ステンレス鋼への導電材料の接合方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2013229425A Division JP5666676B2 (ja) 2013-11-05 2013-11-05 導電接合方法

Publications (3)

Publication Number Publication Date
JP2012155820A JP2012155820A (ja) 2012-08-16
JP2012155820A5 true JP2012155820A5 (enExample) 2013-03-28
JP5587219B2 JP5587219B2 (ja) 2014-09-10

Family

ID=46577607

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011016476A Active JP5587219B2 (ja) 2011-01-28 2011-01-28 ステンレス鋼への導電材料の接合方法

Country Status (2)

Country Link
US (1) US8920887B2 (enExample)
JP (1) JP5587219B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100367301B1 (ko) * 2000-10-09 2003-01-09 (주)이.씨테크날리지 비접촉식 카드모듈의 제조방법 및 그 장치
JP6251032B2 (ja) * 2013-12-27 2017-12-20 日東電工株式会社 回路付サスペンション基板およびヘッドジンバルアッセンブリ
CN105448308B (zh) * 2014-08-27 2019-04-09 祥和科技有限公司 用于形成具有延长高度的硬盘驱动器基板的方法和装置

Family Cites Families (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3562009A (en) * 1967-02-14 1971-02-09 Western Electric Co Method of providing electrically conductive substrate through-holes
JPS54119357A (en) * 1978-03-10 1979-09-17 Hitachi Ltd Solder coating and soldering method for aluminum
JPS611229A (ja) 1984-06-11 1986-01-07 松下電工株式会社 急速充電回路
US4750947A (en) * 1985-02-01 1988-06-14 Nippon Steel Corporation Method for surface-alloying metal with a high-density energy beam and an alloy metal
JPS6237377A (ja) * 1985-08-09 1987-02-18 Nippon Steel Corp 合金鋼の耐食性向上法
US4637862A (en) * 1985-12-16 1987-01-20 General Motors Corporation Wire-glass composite and method of making same
JP2586466B2 (ja) 1986-12-08 1997-02-26 日本エクスラン工業株式会社 金属被覆炭素材料の製造法
US5233152A (en) * 1989-06-21 1993-08-03 Honeywell Inc. Robotic laser soldering apparatus for automated surface assembly of microscopic components
US5314003A (en) * 1991-12-24 1994-05-24 Microelectronics And Computer Technology Corporation Three-dimensional metal fabrication using a laser
JPH06246475A (ja) * 1993-03-03 1994-09-06 Nippon Steel Corp レーザ溶接方法
KR100213603B1 (ko) * 1994-12-28 1999-08-02 가나이 쯔또무 전자회로기판의 배선수정방법 및 그 장치와 전자회로기판
US6350326B1 (en) * 1996-01-15 2002-02-26 The University Of Tennessee Research Corporation Method for practicing a feedback controlled laser induced surface modification
US5736709A (en) * 1996-08-12 1998-04-07 Armco Inc. Descaling metal with a laser having a very short pulse width and high average power
US5821494A (en) * 1996-09-27 1998-10-13 International Business Machines Corporation Method of electrical connection between head transducer and suspension by solder wire bumping at slider level and laser reflow
US6154952A (en) * 1998-04-22 2000-12-05 Hutchinson Technology, Inc. Attachment isolation structures for adjusting head slider static attitude
JP2001216617A (ja) * 2000-01-31 2001-08-10 Sony Corp 磁気ヘッド装置の製造方法及び磁気ヘッド装置
JP4156203B2 (ja) 2000-05-22 2008-09-24 株式会社日立グローバルストレージテクノロジーズ ディスク装置用サスペンション
JP2002042547A (ja) 2000-07-25 2002-02-08 Nisshin Steel Co Ltd 表面接触抵抗及びはんだ接合性に優れたステンレス鋼製電気接点部材
US6870708B1 (en) * 2002-08-28 2005-03-22 Hutchinson Technology Incorporated Weld pads for head suspensions
JP2004139687A (ja) 2002-10-18 2004-05-13 Alps Electric Co Ltd ヘッドジンバルアッセンブリ及びその製造方法
JP2005081406A (ja) * 2003-09-10 2005-03-31 Tdk Corp 半田ボールの接合方法および接合装置
JP2005111531A (ja) * 2003-10-08 2005-04-28 Fuji Electric Holdings Co Ltd レーザはんだ付け方法およびレーザはんだ付け装置
JP2005296960A (ja) * 2004-04-06 2005-10-27 Seiko Epson Corp 金属表面処理剤、金属表面処理方法、はんだ接合剤、はんだペースト及び半導体電子部品の実装方法
US6844522B1 (en) * 2004-05-04 2005-01-18 General Motors Corporation Method of metallurgically bonding articles and article therefor
CN1828726B (zh) * 2005-02-28 2010-04-28 新科实业有限公司 可旋转压电微驱动器及其磁头折片组合和磁盘驱动单元
US7414814B1 (en) * 2005-04-28 2008-08-19 Western Digital Technologies, Inc. Disk drives, head stack, head gimbal and suspension assemblies having a compliant suspension tail design for solder reflow
US8553364B1 (en) * 2005-09-09 2013-10-08 Magnecomp Corporation Low impedance, high bandwidth disk drive suspension circuit
JP4999478B2 (ja) * 2006-09-05 2012-08-15 宣雄 杉野 乾燥花絵飾りの製造方法、乾燥花絵飾りおよび乾燥花絵飾り用防湿袋
US8203807B2 (en) * 2007-02-09 2012-06-19 Suncall Corporation Magnetic head suspension with load beam support point control
EP2281657B1 (en) * 2008-04-21 2012-05-16 Honda Motor Co., Ltd. Joining method for and jointed structure of metal members
US8149545B1 (en) * 2008-10-23 2012-04-03 Magnecomp Corporation Low profile load beam with etched cavity for PZT microactuator
JP2010146653A (ja) * 2008-12-19 2010-07-01 Hitachi Global Storage Technologies Netherlands Bv ヘッド・スタック・アセンブリの製造方法、その相互接続装置及びヘッド・スタック・アセンブリ
US8189301B2 (en) * 2009-04-24 2012-05-29 Magnecomp Corporation Wireless microactuator motor assembly for use in a hard disk drive suspension, and mechanical and electrical connections thereto
JP5285550B2 (ja) * 2009-09-02 2013-09-11 日本発條株式会社 圧電アクチュエータの給電構造、及びヘッドサスペンション
JP5518430B2 (ja) * 2009-10-30 2014-06-11 日本発條株式会社 リフロー接合方法、及びヘッドサスペンションの製造方法
US8980380B2 (en) * 2011-01-13 2015-03-17 The United States Of America, As Represented By The Secretary Of The Navy Fabrication of 3-dimensional micro-assemblies
KR101327889B1 (ko) * 2011-12-01 2013-11-11 서울대학교산학협력단 금속성 미세구조물 및 그의 가공 방법
US20130168370A1 (en) * 2011-12-28 2013-07-04 Iraj Kavosh Laser-beam device, laser-soldering tool and method, for laser-soldering connection pads of a head-stack assembly for a hard-disk drive
US8857021B2 (en) * 2012-06-15 2014-10-14 Xerox Corporation Laser welded bonding pads for piezoelectric print heads

Similar Documents

Publication Publication Date Title
JP5982652B2 (ja) 異材金属接合体
JP2016528044A5 (enExample)
WO2012129033A3 (en) Conductive foils having multiple layers and methods of forming same
JOP20200150A1 (ar) قطع غيار بأوجه مقواه باستخدام عملية التقسية المصلدة والطريقة والتجميع المرافق للتصنيع
JP2014123418A5 (enExample)
MX354517B (es) Capas funcionales que comprenden aleaciones ternarias inclusivas de ni y métodos para hacer las mismas.
WO2010134734A3 (ko) 기판 표면 실장용 도전성 접촉 단자
JP2012155820A5 (enExample)
JP2015518270A5 (enExample)
ATE525493T1 (de) Element
JP2018081061A5 (enExample)
JP2013054814A5 (enExample)
TW201035513A (en) Method for manufacturing heat dissipation interface device and product thereof
JP2013535632A5 (enExample)
JP5587219B2 (ja) ステンレス鋼への導電材料の接合方法
ATE511196T1 (de) Elektrischer kontakt für eine cadmium-tellur- komponente
JP2011246745A5 (enExample)
MY167627A (en) Manufacturing method for magnetic recording medium
RU2011100923A (ru) Способ защиты от коррозии
TW201114114A (en) Electrical connector contact and electroplating method thereof
JP2016191842A5 (enExample)
JP5666676B2 (ja) 導電接合方法
CN203344524U (zh) 镭射水转印结构
JP2013222480A (ja) サスペンション用基板、サスペンション、ヘッド付サスペンション、ヘッド付サスペンションと外部接続基板との組合体およびハードディスクドライブ
JP2012222997A (ja) 融雪リング