JP2012155820A - ステンレス鋼への導電材料の接合方法、及びhdd用磁気ヘッドサスペンション - Google Patents
ステンレス鋼への導電材料の接合方法、及びhdd用磁気ヘッドサスペンション Download PDFInfo
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- JP2012155820A JP2012155820A JP2011016476A JP2011016476A JP2012155820A JP 2012155820 A JP2012155820 A JP 2012155820A JP 2011016476 A JP2011016476 A JP 2011016476A JP 2011016476 A JP2011016476 A JP 2011016476A JP 2012155820 A JP2012155820 A JP 2012155820A
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- 229910001220 stainless steel Inorganic materials 0.000 title claims abstract description 87
- 239000010935 stainless steel Substances 0.000 title claims abstract description 87
- 239000004020 conductor Substances 0.000 title claims abstract description 71
- 238000000034 method Methods 0.000 title claims abstract description 32
- 239000000725 suspension Substances 0.000 title claims description 20
- 239000000463 material Substances 0.000 claims abstract description 26
- 239000002184 metal Substances 0.000 claims description 26
- 229910052751 metal Inorganic materials 0.000 claims description 26
- 239000007788 liquid Substances 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 238000007711 solidification Methods 0.000 description 4
- 230000008023 solidification Effects 0.000 description 4
- 229920006332 epoxy adhesive Polymers 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 229910000963 austenitic stainless steel Inorganic materials 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- -1 for example Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1612—Process or apparatus coating on selected surface areas by direct patterning through irradiation means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/21—Bonding by welding
- B23K26/22—Spot welding
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B9/00—General processes of refining or remelting of metals; Apparatus for electroslag or arc remelting of metals
- C22B9/16—Remelting metals
- C22B9/22—Remelting metals with heating by wave energy or particle radiation
- C22B9/221—Remelting metals with heating by wave energy or particle radiation by electromagnetic waves, e.g. by gas discharge lamps
- C22B9/223—Remelting metals with heating by wave energy or particle radiation by electromagnetic waves, e.g. by gas discharge lamps by laser beams
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/14—Decomposition by irradiation, e.g. photolysis, particle radiation or by mixed irradiation sources
- C23C18/143—Radiation by light, e.g. photolysis or pyrolysis
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/70—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using melts
- C23C22/72—Treatment of iron or alloys based thereon
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
- G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
- G11B5/4826—Mounting, aligning or attachment of the transducer head relative to the arm assembly, e.g. slider holding members, gimbals, adhesive
- G11B5/483—Piezoelectric devices between head and arm, e.g. for fine adjustment
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
- G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
- G11B5/486—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives with provision for mounting or arranging electrical conducting means or circuits on or along the arm assembly
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/38—Conductors
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Optics & Photonics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Plasma & Fusion (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Supporting Of Heads In Record-Carrier Devices (AREA)
Abstract
【解決手段】ステンレス鋼からなるベースプレート2の表面に導電性ペースト12を付与する第1のステップと、ベースプレート2の表面の導電性ペースト12で覆われた領域において、ベースプレート2のステンレス鋼の母材が空気と接触しない状態でステンレス鋼の表面の不動態皮膜を除去する第2のステップを経て行われる。不動態皮膜の除去は、例えばレーザ光30の照射により行われる。
【選択図】図6
Description
2 ベースプレート(ステンレス鋼からなる金属部品)
3 ロードビーム
4 フレクシャ
5 ヘッド
6 圧電素子
11 絶縁性接着剤
12 導電性ペースト(導電材料)
12a 貫通孔
12b 被覆部
12c (新たな)導電性ペースト
20 不動態皮膜
30 レーザ光
40 空間
50 治具
Claims (5)
- 空気雰囲気下でステンレス鋼の表面に導電材料を接合するための方法であって、
ステンレス鋼の表面にペースト状又は液状の導電材料を付与する第1のステップと、
ステンレス鋼の表面の導電材料で覆われた領域において、ステンレス鋼の母材が空気と接触しない状態でステンレス鋼の表面の不動態皮膜を除去する第2のステップとを有するステンレス鋼への導電材料の接合方法。 - 前記第2のステップが、ステンレス鋼の表面に付与した導電材料にレーザ光を照射することにより、ステンレス鋼の表面の不導態皮膜を除去すると同時に、不導体皮膜が除去された部分のステンレス鋼の表面を溶融した導電材料で覆うものである請求項1のステンレス鋼への導電材料の接合方法。
- 不動態皮膜が除去された部分のステンレス鋼の表面を覆う導電材料と、その周囲の導電材料とを、新たな導電材料で接続する第3のステップを有する請求項2のステンレス鋼への導電材料の接合方法。
- 前記第2のステップが、ステンレス鋼の表面に付与した導電材料が固化する前に治具を突き刺し、この治具の先端でステンレス鋼の表面の不動態皮膜を除去するものである請求項1のステンレス鋼への導電材料の接合方法。
- ステンレス鋼からなる金属部品と、金属部品に取り付けられた圧電素子と、金属部品及び圧電素子の表面に接合され、金属部品と圧電素子とを通電可能に接続する導電材料とを備えたHDD用磁気ヘッドサスペンションであって、
金属部品の表面のうち、導電材料で覆われた領域の一部における不動態皮膜が除去されたHDD用磁気ヘッドサスペンション。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011016476A JP5587219B2 (ja) | 2011-01-28 | 2011-01-28 | ステンレス鋼への導電材料の接合方法 |
US13/339,911 US8920887B2 (en) | 2011-01-28 | 2011-12-29 | Method of bonding conductive material to stainless steel, and HDD magnetic head suspension |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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JP2011016476A JP5587219B2 (ja) | 2011-01-28 | 2011-01-28 | ステンレス鋼への導電材料の接合方法 |
Related Child Applications (1)
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JP2013229425A Division JP5666676B2 (ja) | 2013-11-05 | 2013-11-05 | 導電接合方法 |
Publications (3)
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JP2012155820A true JP2012155820A (ja) | 2012-08-16 |
JP2012155820A5 JP2012155820A5 (ja) | 2013-03-28 |
JP5587219B2 JP5587219B2 (ja) | 2014-09-10 |
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JP2011016476A Active JP5587219B2 (ja) | 2011-01-28 | 2011-01-28 | ステンレス鋼への導電材料の接合方法 |
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US (1) | US8920887B2 (ja) |
JP (1) | JP5587219B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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KR100367301B1 (ko) * | 2000-10-09 | 2003-01-09 | (주)이.씨테크날리지 | 비접촉식 카드모듈의 제조방법 및 그 장치 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP6251032B2 (ja) * | 2013-12-27 | 2017-12-20 | 日東電工株式会社 | 回路付サスペンション基板およびヘッドジンバルアッセンブリ |
CN105448308B (zh) | 2014-08-27 | 2019-04-09 | 祥和科技有限公司 | 用于形成具有延长高度的硬盘驱动器基板的方法和装置 |
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JP2005296960A (ja) * | 2004-04-06 | 2005-10-27 | Seiko Epson Corp | 金属表面処理剤、金属表面処理方法、はんだ接合剤、はんだペースト及び半導体電子部品の実装方法 |
JP2008087456A (ja) * | 2006-09-05 | 2008-04-17 | Yoshio Sugino | 乾燥花絵飾りの製造方法、乾燥花絵飾りおよび乾燥花絵飾り用防湿袋 |
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KR100367301B1 (ko) * | 2000-10-09 | 2003-01-09 | (주)이.씨테크날리지 | 비접촉식 카드모듈의 제조방법 및 그 장치 |
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