JP2012117070A5 - - Google Patents
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- JP2012117070A5 JP2012117070A5 JP2012000044A JP2012000044A JP2012117070A5 JP 2012117070 A5 JP2012117070 A5 JP 2012117070A5 JP 2012000044 A JP2012000044 A JP 2012000044A JP 2012000044 A JP2012000044 A JP 2012000044A JP 2012117070 A5 JP2012117070 A5 JP 2012117070A5
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- JP
- Japan
- Prior art keywords
- group
- substituted
- polymer
- unsubstituted
- hydrocarbon moiety
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229920000642 polymer Polymers 0.000 claims 23
- -1 siloxane moiety Chemical group 0.000 claims 14
- 239000000853 adhesive Substances 0.000 claims 7
- 230000001070 adhesive effect Effects 0.000 claims 7
- 125000002029 aromatic hydrocarbon group Chemical group 0.000 claims 5
- 125000004432 carbon atom Chemical group C* 0.000 claims 4
- 150000002430 hydrocarbons Chemical group 0.000 claims 4
- 229920001296 polysiloxane Polymers 0.000 claims 4
- 239000000758 substrate Substances 0.000 claims 3
- RINCXYDBBGOEEQ-UHFFFAOYSA-N succinic anhydride Chemical group O=C1CCC(=O)O1 RINCXYDBBGOEEQ-UHFFFAOYSA-N 0.000 claims 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims 2
- 125000001931 aliphatic group Chemical group 0.000 claims 2
- 125000000217 alkyl group Chemical group 0.000 claims 2
- 125000004104 aryloxy group Chemical group 0.000 claims 2
- 125000001072 heteroaryl group Chemical group 0.000 claims 2
- 125000000623 heterocyclic group Chemical group 0.000 claims 2
- 125000000472 sulfonyl group Chemical group *S(*)(=O)=O 0.000 claims 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims 1
- 239000005062 Polybutadiene Substances 0.000 claims 1
- 239000004698 Polyethylene Substances 0.000 claims 1
- 239000004743 Polypropylene Substances 0.000 claims 1
- 125000002252 acyl group Chemical group 0.000 claims 1
- 125000002723 alicyclic group Chemical group 0.000 claims 1
- 125000003342 alkenyl group Chemical group 0.000 claims 1
- 125000003545 alkoxy group Chemical group 0.000 claims 1
- 125000000304 alkynyl group Chemical group 0.000 claims 1
- 125000003368 amide group Chemical group 0.000 claims 1
- 125000003277 amino group Chemical group 0.000 claims 1
- 125000003118 aryl group Chemical group 0.000 claims 1
- 238000003763 carbonization Methods 0.000 claims 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims 1
- 229920001577 copolymer Polymers 0.000 claims 1
- 125000004093 cyano group Chemical group *C#N 0.000 claims 1
- 125000000753 cycloalkyl group Chemical group 0.000 claims 1
- 125000001188 haloalkyl group Chemical group 0.000 claims 1
- 229910052736 halogen Inorganic materials 0.000 claims 1
- 150000002367 halogens Chemical class 0.000 claims 1
- 229910052739 hydrogen Inorganic materials 0.000 claims 1
- 239000001257 hydrogen Substances 0.000 claims 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- SQDFHQJTAWCFIB-UHFFFAOYSA-N n-methylidenehydroxylamine Chemical group ON=C SQDFHQJTAWCFIB-UHFFFAOYSA-N 0.000 claims 1
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 claims 1
- 125000004043 oxo group Chemical group O=* 0.000 claims 1
- 125000005254 oxyacyl group Chemical group 0.000 claims 1
- 229920002857 polybutadiene Polymers 0.000 claims 1
- 229920000573 polyethylene Polymers 0.000 claims 1
- 229920001155 polypropylene Polymers 0.000 claims 1
- 125000001424 substituent group Chemical group 0.000 claims 1
- 125000003107 substituted aryl group Chemical group 0.000 claims 1
- 125000005346 substituted cycloalkyl group Chemical group 0.000 claims 1
- 125000005420 sulfonamido group Chemical group S(=O)(=O)(N*)* 0.000 claims 1
- 125000003396 thiol group Chemical group [H]S* 0.000 claims 1
- 239000004711 α-olefin Substances 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US46803703P | 2003-05-05 | 2003-05-05 | |
| US60/468,037 | 2003-05-05 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006513422A Division JP5328006B2 (ja) | 2003-05-05 | 2004-04-30 | イミド−リンクしたマレインイミドおよびポリマレインイミド化合物 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014083344A Division JP2014194021A (ja) | 2003-05-05 | 2014-04-15 | イミド−リンクしたマレインイミドおよびポリマレインイミド化合物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012117070A JP2012117070A (ja) | 2012-06-21 |
| JP2012117070A5 true JP2012117070A5 (enExample) | 2013-10-03 |
| JP5562360B2 JP5562360B2 (ja) | 2014-07-30 |
Family
ID=33435159
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006513422A Expired - Lifetime JP5328006B2 (ja) | 2003-05-05 | 2004-04-30 | イミド−リンクしたマレインイミドおよびポリマレインイミド化合物 |
| JP2012000044A Expired - Lifetime JP5562360B2 (ja) | 2003-05-05 | 2012-01-04 | イミド−リンクしたマレインイミドおよびポリマレインイミド化合物 |
| JP2014083344A Pending JP2014194021A (ja) | 2003-05-05 | 2014-04-15 | イミド−リンクしたマレインイミドおよびポリマレインイミド化合物 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006513422A Expired - Lifetime JP5328006B2 (ja) | 2003-05-05 | 2004-04-30 | イミド−リンクしたマレインイミドおよびポリマレインイミド化合物 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014083344A Pending JP2014194021A (ja) | 2003-05-05 | 2014-04-15 | イミド−リンクしたマレインイミドおよびポリマレインイミド化合物 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US7208566B2 (enExample) |
| EP (1) | EP1620495A4 (enExample) |
| JP (3) | JP5328006B2 (enExample) |
| KR (2) | KR101179815B1 (enExample) |
| CN (1) | CN1784457B (enExample) |
| MX (1) | MXPA05012039A (enExample) |
| TW (1) | TW200508284A (enExample) |
| WO (1) | WO2004099331A2 (enExample) |
Families Citing this family (93)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7884174B2 (en) | 2003-05-05 | 2011-02-08 | Designer Molecules, Inc. | Imide-linked maleimide and polymaleimide compounds |
| US8513375B2 (en) * | 2003-05-05 | 2013-08-20 | Designer Molecules, Inc. | Imide-linked maleimide and polymaleimide compounds |
| US7875688B2 (en) * | 2004-06-04 | 2011-01-25 | Designer Molecules, Inc. | Free-radical curable polyesters and methods for use thereof |
| US7265182B2 (en) * | 2004-07-09 | 2007-09-04 | E. I. Du Pont De Nemours And Company | Polyamic acid cross-linked polymer and formable composition therefrom |
| US7795362B2 (en) * | 2004-07-16 | 2010-09-14 | Designer Molecules, Inc. | Olefin oligomers containing pendant maleimide groups |
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| US8378017B2 (en) * | 2005-12-29 | 2013-02-19 | Designer Molecules, Inc. | Thermosetting adhesive compositions |
| JP2007308676A (ja) * | 2006-04-18 | 2007-11-29 | Mitsubishi Gas Chem Co Inc | 熱硬化性ポリイミド樹脂組成物及びその硬化物 |
| US8530573B2 (en) | 2006-05-10 | 2013-09-10 | Designer Molecules, Inc. | Modified calcium carbonate-filled adhesive compositions and methods for use thereof |
| US7691475B2 (en) * | 2006-07-21 | 2010-04-06 | 3M Innovative Properties Company | Anisotropic conductive adhesives |
| US8287686B2 (en) * | 2006-07-24 | 2012-10-16 | Designer Molecules, Inc. | Derivatives of poly(styrene-co-allyl alcohol) and methods for use thereof |
| KR20080036771A (ko) * | 2006-10-24 | 2008-04-29 | 삼성전자주식회사 | 유기층 패턴 형성방법, 그에 의해 형성된 유기층 및 그를포함하는 유기 메모리 소자 |
| US8344076B2 (en) * | 2006-12-19 | 2013-01-01 | Designer Molecules, Inc. | Hydrolytically resistant thermoset monomers |
| US7825188B2 (en) * | 2006-12-19 | 2010-11-02 | Designer Molecules, Inc. | Thermoplastic elastomer with acyloxyphenyl hard block segment |
| US20080262191A1 (en) * | 2007-01-26 | 2008-10-23 | Mizori Farhad G | Methods for the preparation of imides, maleimides and maleimide-terminated polyimide compounds |
| WO2008124797A1 (en) * | 2007-04-09 | 2008-10-16 | Designer Molecules, Inc. | Curatives for epoxy compositions |
| US8431655B2 (en) * | 2007-04-09 | 2013-04-30 | Designer Molecules, Inc. | Curatives for epoxy compositions |
| US8039663B2 (en) | 2007-04-09 | 2011-10-18 | Designer Molecules, Inc. | Monomers derived from pentacyclopentadecane dimethanol |
| US7868113B2 (en) | 2007-04-11 | 2011-01-11 | Designer Molecules, Inc. | Low shrinkage polyester thermosetting resins |
| US20100056671A1 (en) * | 2007-04-12 | 2010-03-04 | Designer Molecules, Inc. | Polyfunctional epoxy oligomers |
| WO2008130894A1 (en) * | 2007-04-16 | 2008-10-30 | Designer Molecules, Inc. | Low temperature curing acrylate and maleimide based formulations and methods for use thereof |
| US7928153B2 (en) | 2007-08-14 | 2011-04-19 | Designer Molecules, Inc. | Thermosetting polyether oligomers, compositions and methods for use thereof |
| KR20100075906A (ko) * | 2007-09-13 | 2010-07-05 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 저온 접합 전자부품용 접착 |
| US8398898B2 (en) * | 2008-02-23 | 2013-03-19 | Designer Molecules, Inc. | Soluble metal salts for use as conductivity promoters |
| US8541531B2 (en) | 2008-03-21 | 2013-09-24 | Designer Molecules, Inc. | Anti-bleed compounds, compositions and methods for use thereof |
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| US8637611B2 (en) | 2008-08-13 | 2014-01-28 | Designer Molecules, Inc. | Amide-extended crosslinking compounds and methods for use thereof |
| US8013104B2 (en) * | 2008-08-13 | 2011-09-06 | Designer Molecules, Inc. | Thermosetting hyperbranched compositions and methods for use thereof |
| US8158748B2 (en) | 2008-08-13 | 2012-04-17 | Designer Molecules, Inc. | Hetero-functional compounds and methods for use thereof |
| US8217120B2 (en) * | 2008-08-13 | 2012-07-10 | Designer Molecules, Inc. | Functionalized styrene oligomers and polymers |
| US8008419B2 (en) * | 2008-08-13 | 2011-08-30 | Designer Molecules, Inc. | Siloxane monomers and methods for use thereof |
| US8288591B2 (en) * | 2008-11-20 | 2012-10-16 | Designer Molecules, Inc. | Curing agents for epoxy resins |
| US8841406B2 (en) * | 2008-12-22 | 2014-09-23 | The United States Of America As Represented By The Administrator Of National Aeronautics And Space Administration | Branched rod-coil polyimide—poly( alkylene oxide) copolymers and electrolyte compositions |
| KR20110122153A (ko) | 2009-02-02 | 2011-11-09 | 로오드 코포레이션 | 말레이미드 말단 폴리이미드를 함유하는 구조 접착제 |
| US20090200013A1 (en) * | 2009-04-23 | 2009-08-13 | Bernadette Craster | Well tubular, coating system and method for oilfield applications |
| EP2449254B1 (en) * | 2009-06-30 | 2013-04-24 | Vestas Wind Systems A/S | Method of manufacturing a wind turbine blade comprising two members being joined by adhesion |
| CN101997125B (zh) * | 2009-08-14 | 2013-07-10 | 财团法人工业技术研究院 | 改性超支化聚合物、应用其所制成的质子交换膜及其制法 |
| US8710682B2 (en) * | 2009-09-03 | 2014-04-29 | Designer Molecules Inc, Inc. | Materials and methods for stress reduction in semiconductor wafer passivation layers |
| US8415812B2 (en) * | 2009-09-03 | 2013-04-09 | Designer Molecules, Inc. | Materials and methods for stress reduction in semiconductor wafer passivation layers |
| US8623253B2 (en) * | 2010-02-26 | 2014-01-07 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Low-melt poly(amic acids) and polyimides and their uses |
| CN102344567B (zh) * | 2010-07-29 | 2013-05-08 | 财团法人工业技术研究院 | 改性双马来酰亚胺树脂、制备方法及包含该树脂的组合物 |
| US8686162B2 (en) | 2010-08-25 | 2014-04-01 | Designer Molecules Inc, Inc. | Maleimide-functional monomers in amorphous form |
| US8816021B2 (en) | 2010-09-10 | 2014-08-26 | Designer Molecules, Inc. | Curable composition with rubber-like properties |
| JP2013083958A (ja) * | 2011-09-26 | 2013-05-09 | Nippon Steel & Sumikin Chemical Co Ltd | 感光性樹脂組成物、それを用いた硬化物及び半導体素子 |
| CN102964598B (zh) * | 2012-11-05 | 2014-09-10 | 中科院广州化学有限公司 | 一种聚马来酰亚胺聚合物及其制备方法与应用 |
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| CN104163923A (zh) * | 2013-05-17 | 2014-11-26 | 联茂电子股份有限公司 | 含马来酸酐的聚酰亚胺树脂及其制造方法 |
| CN103304813B (zh) * | 2013-06-06 | 2015-09-23 | 北京京东方光电科技有限公司 | 一种固化树脂、间隔物剂、滤光片及它们的制备方法、显示器件 |
| US9771456B2 (en) | 2013-07-01 | 2017-09-26 | Iteq Corporation | Polyimide resins containing polymaleic anhydride and method for manufacturing the same |
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| US10189951B2 (en) | 2014-04-25 | 2019-01-29 | Polyone Corporation | Aliphatic polyimides from a 1:2 molar ration of diamine and unsaturated monoanhydride or unsaturated diacid |
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| SG11201704918VA (en) * | 2015-04-16 | 2017-07-28 | Furukawa Electric Co Ltd | Electrically conductive adhesive film and dicing die bonding film |
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| KR20180003422A (ko) * | 2016-06-30 | 2018-01-09 | 제이엔씨 주식회사 | 광 배향용 액정 배향막을 형성하기 위한 액정 배향제, 액정 배향막 및 이것을 사용한 액정 표시 소자 |
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| TWI821171B (zh) | 2017-01-27 | 2023-11-11 | 日商積水化學工業股份有限公司 | 硬化性樹脂組成物、接著劑、醯亞胺寡聚物、醯亞胺寡聚物組成物、及硬化劑 |
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| MY205735A (en) * | 2018-01-22 | 2024-11-08 | Merck Patent Gmbh | Dielectric materials |
| JP7024548B2 (ja) * | 2018-03-28 | 2022-02-24 | 昭和電工マテリアルズ株式会社 | マレイミド樹脂の製造方法 |
| WO2019188436A1 (ja) | 2018-03-28 | 2019-10-03 | 積水化学工業株式会社 | 硬化性樹脂組成物、接着剤、接着フィルム、回路基板、層間絶縁材料、及び、プリント配線板 |
| WO2019189467A1 (ja) * | 2018-03-28 | 2019-10-03 | 積水化学工業株式会社 | 樹脂材料、積層構造体及び多層プリント配線板 |
| JP6555792B1 (ja) | 2018-05-10 | 2019-08-07 | ユニチカ株式会社 | マレイミドの製造方法 |
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| TWI841750B (zh) * | 2019-07-19 | 2024-05-11 | 日商信越化學工業股份有限公司 | 芳香族雙馬來醯亞胺化合物及其製造方法、以及含有該化合物的熱硬化性環狀醯亞胺樹脂組合物 |
| JP7188309B2 (ja) * | 2019-07-26 | 2022-12-13 | 信越化学工業株式会社 | 熱硬化性マレイミド樹脂組成物及び半導体装置 |
| WO2021117762A1 (ja) | 2019-12-11 | 2021-06-17 | 三菱瓦斯化学株式会社 | 樹脂組成物、樹脂シート、多層プリント配線板、及び半導体装置 |
| US20230095931A1 (en) * | 2020-01-27 | 2023-03-30 | Designer Molecules, Inc. | Uv-curable resin compositions suitable for redistribution layers |
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| WO2022117715A1 (en) | 2020-12-04 | 2022-06-09 | Merck Patent Gmbh | Dielectric materials based on bismaleimides containing cardo/spiro moieties |
| PH12023551943A1 (en) | 2021-03-04 | 2024-03-04 | Merck Patent Gmbh | Dielectric materials based on amide-imide-extended bismaleimides |
| JP7451058B2 (ja) | 2021-03-23 | 2024-03-18 | 信越化学工業株式会社 | 熱硬化性シトラコンイミド樹脂組成物 |
| JP2024515360A (ja) | 2021-04-22 | 2024-04-09 | メルク パテント ゲゼルシャフト ミット ベシュレンクテル ハフツング | オリゴアミド―延長ビスマレイミドに基づく誘電材料 |
| KR20240113579A (ko) | 2021-12-02 | 2024-07-22 | 메르크 파텐트 게엠베하 | 헤테로방향족-확장 비스말레이미드 기반 유전체 재료들 |
| JP2024075095A (ja) * | 2022-11-22 | 2024-06-03 | 信越化学工業株式会社 | ビスマレイミド化合物、樹脂ワニス及びその製造方法 |
| WO2025063226A1 (ja) * | 2023-09-19 | 2025-03-27 | 積水化学工業株式会社 | イミド樹脂材料、硬化性樹脂組成物、接着性フィルム、仮固定材、及び、イミド樹脂材料の製造方法 |
| WO2025070339A1 (ja) * | 2023-09-26 | 2025-04-03 | ユニチカ株式会社 | ビスマレイミド |
Family Cites Families (35)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5512676A (en) * | 1987-09-03 | 1996-04-30 | The Boeing Company | Extended amideimide hub for multidimensional oligomers |
| US4675379A (en) * | 1983-08-12 | 1987-06-23 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Fire and heat resistant laminating resins based on maleimido and citraconimido substituted 1-(diorganooxyphosphonyl)-methyl)-2,4-and-2,6-diaminobenzenes |
| US4775740A (en) * | 1983-08-12 | 1988-10-04 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Fire and heat resistant laminating resin based on maleimido and citraconimido substituted 1-[diorganooxyphosphonyl)-methyl]-2,4- and -2,6-diaminobenzenes |
| JPS62212390A (ja) * | 1986-03-11 | 1987-09-18 | Mitsubishi Petrochem Co Ltd | 新規なポリイミド |
| JPH01135765A (ja) * | 1987-11-21 | 1989-05-29 | New Japan Chem Co Ltd | 新規なイミド化合物並びにその製造方法 |
| US4925915A (en) * | 1987-11-24 | 1990-05-15 | Hoechst Celanese Corp. | Polymers prepared from 4,4'-bis(2-(amino(halo) phenoxyphenyl) hexafluoroisopropyl) diphenyl ether |
| US4931540A (en) * | 1987-11-24 | 1990-06-05 | Hoechst Celanese Corporation | Polymers prepared from 4,4'-bis[2-(3,4-(dicarboxyphenyl)hexafluoroisopropyl] diphenyl ether dianhydride |
| US4983690A (en) * | 1988-02-22 | 1991-01-08 | Lockheed Corporation | Conductive polymer-maleimide blends and method of producing same |
| JPH03502941A (ja) * | 1988-09-28 | 1991-07-04 | アメリカ合衆国 | 強靭な高性能付加型熱可塑性ポリマー |
| JP2651219B2 (ja) * | 1988-11-04 | 1997-09-10 | 日立化成工業株式会社 | イミド環を含む硬化性樹脂の製造法 |
| JP2597181B2 (ja) * | 1989-04-18 | 1997-04-02 | 宇部興産株式会社 | 熱硬化性樹脂組成物およびドライフィルム |
| CA2055919A1 (en) * | 1990-11-26 | 1992-05-27 | Philip Manos | Chemically etchable adhesives |
| US5239049A (en) * | 1991-12-16 | 1993-08-24 | Olin Corporation | Selected poly(dianhydrides) compounds, selected poly(amic acid) compounds, and selected poly(imide) compounds |
| JPH05239137A (ja) * | 1992-02-28 | 1993-09-17 | Dai Ichi Kogyo Seiyaku Co Ltd | アミノ基を含有する共重合体及びその製造方法 |
| US5393887A (en) * | 1993-10-04 | 1995-02-28 | Monsanto Company | Bisimide compositions |
| US6034194A (en) | 1994-09-02 | 2000-03-07 | Quantum Materials/Dexter Corporation | Bismaleimide-divinyl adhesive compositions and uses therefor |
| US6852814B2 (en) | 1994-09-02 | 2005-02-08 | Henkel Corporation | Thermosetting resin compositions containing maleimide and/or vinyl compounds |
| ATE271577T1 (de) * | 1994-09-02 | 2004-08-15 | Henkel Corp | Wärmehärtbare harze aus maleinimiden und/oder vinylderivaten |
| US5789757A (en) * | 1996-09-10 | 1998-08-04 | The Dexter Corporation | Malemide containing formulations and uses therefor |
| AUPM910994A0 (en) * | 1994-10-28 | 1994-11-24 | Commonwealth Scientific And Industrial Research Organisation | Bisallyloxyimides |
| CN1156773A (zh) * | 1996-02-05 | 1997-08-13 | 汉拓商品广告印刷股份有限公司 | 变色镭射转印纸的制造方法 |
| CN1073587C (zh) * | 1997-01-09 | 2001-10-24 | 四川联合大学 | 含硅双马来酰亚胺电荷转移基体树脂及其制备方法 |
| US5973166A (en) * | 1998-03-02 | 1999-10-26 | The Dexter Corporation | Method for the preparation of maleimides |
| US6048930A (en) * | 1998-05-06 | 2000-04-11 | Bridgestone Corporation | Grafted maleimide-styrene-g-polypropylene copolymers used in rubber compounds for increasing hysteresis |
| US6355750B1 (en) | 1998-07-02 | 2002-03-12 | National Starch And Chemical Investment Holding Corporation | Dye attach adhesives for use in microelectronic devices |
| US6316566B1 (en) | 1998-07-02 | 2001-11-13 | National Starch And Chemical Investment Holding Corporation | Package encapsulant compositions for use in electronic devices |
| US6281314B1 (en) | 1998-07-02 | 2001-08-28 | National Starch And Chemical Investment Holding Corporation | Compositions for use in the fabrication of circuit components and printed wire boards |
| US6063828A (en) | 1998-07-02 | 2000-05-16 | National Starch And Chemical Investment Holding Corporation | Underfill encapsulant compositions for use in electronic devices |
| US6265530B1 (en) | 1998-07-02 | 2001-07-24 | National Starch And Chemical Investment Holding Corporation | Die attach adhesives for use in microelectronic devices |
| KR100310092B1 (ko) * | 1998-11-18 | 2001-11-07 | 윤종용 | 광통신용 폴리이미드, 그 제조방법 및 그것을 이용한 다층 폴리이미드막의 형성방법 |
| US6255750B1 (en) * | 1999-04-21 | 2001-07-03 | Seagate Technology Llc | Apparatus and method for reducing disc flutter and disc vibration effects in a disc drive |
| JP2001100215A (ja) * | 1999-09-30 | 2001-04-13 | Hitachi Chemical Dupont Microsystems Ltd | 光配向液晶配向膜用組成物、光配向液晶配向膜、液晶挟持基板及び液晶表示装置 |
| DE60109356T2 (de) | 2000-05-18 | 2005-07-28 | National Starch And Chemical Investment Holding Corp., Wilmington | Vinylether und Karbamat oder Harnstofffunktionalität enthaltende Haftklebemittel für Halbleiterplatten |
| JP2001323066A (ja) | 2000-05-19 | 2001-11-20 | Mitsui Chemicals Inc | 架橋基含有ポリイミド前駆体、架橋基含有ポリイミド、及び、耐熱性接着剤 |
| US6831132B2 (en) * | 2002-03-28 | 2004-12-14 | Henkel Corporation | Film adhesives containing maleimide compounds and methods for use thereof |
-
2004
- 2004-04-30 WO PCT/US2004/013204 patent/WO2004099331A2/en not_active Ceased
- 2004-04-30 EP EP04750876A patent/EP1620495A4/en not_active Withdrawn
- 2004-04-30 MX MXPA05012039A patent/MXPA05012039A/es active IP Right Grant
- 2004-04-30 JP JP2006513422A patent/JP5328006B2/ja not_active Expired - Lifetime
- 2004-04-30 CN CN2004800119195A patent/CN1784457B/zh not_active Expired - Lifetime
- 2004-04-30 KR KR1020057021073A patent/KR101179815B1/ko not_active Expired - Lifetime
- 2004-04-30 KR KR1020127010369A patent/KR20120064711A/ko not_active Ceased
- 2004-04-30 US US10/835,911 patent/US7208566B2/en not_active Expired - Lifetime
- 2004-05-05 TW TW093112687A patent/TW200508284A/zh unknown
-
2012
- 2012-01-04 JP JP2012000044A patent/JP5562360B2/ja not_active Expired - Lifetime
-
2014
- 2014-04-15 JP JP2014083344A patent/JP2014194021A/ja active Pending
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