HK1244833B - 樹脂浸滲物、複合材料和覆銅層疊體的製造方法 - Google Patents

樹脂浸滲物、複合材料和覆銅層疊體的製造方法

Info

Publication number
HK1244833B
HK1244833B HK18104326.7A HK18104326A HK1244833B HK 1244833 B HK1244833 B HK 1244833B HK 18104326 A HK18104326 A HK 18104326A HK 1244833 B HK1244833 B HK 1244833B
Authority
HK
Hong Kong
Prior art keywords
copper
clad laminate
resin impregnated
manufacturing resin
composite material
Prior art date
Application number
HK18104326.7A
Other languages
English (en)
Inventor
蘆賀原治之
梅田裕明
宮本真憲
Original Assignee
拓自達電線株式會社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 拓自達電線株式會社 filed Critical 拓自達電線株式會社
Publication of HK1244833B publication Critical patent/HK1244833B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/12—Unsaturated polyimide precursors
    • C08G73/121—Preparatory processes from unsaturated precursors and polyamines
    • C08G73/122—Preparatory processes from unsaturated precursors and polyamines containing chain terminating or branching agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/085—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B32B27/322—Layered products comprising a layer of synthetic resin comprising polyolefins comprising halogenated polyolefins, e.g. PTFE
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/18—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer of foamed material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/246—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using polymer based synthetic fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08L79/085—Unsaturated polyimide precursors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/07—Parts immersed or impregnated in a matrix
    • B32B2305/076—Prepregs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2379/00—Other polymers having nitrogen, with or without oxygen or carbon only, in the main chain
    • B32B2379/08—Polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/12—Photovoltaic modules
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/085—Copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)
  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
HK18104326.7A 2015-03-23 2018-03-29 樹脂浸滲物、複合材料和覆銅層疊體的製造方法 HK1244833B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015059770 2015-03-23
PCT/JP2016/001652 WO2016152149A1 (ja) 2015-03-23 2016-03-22 樹脂含浸物、複合材及び銅張積層体の製造方法

Publications (1)

Publication Number Publication Date
HK1244833B true HK1244833B (zh) 2019-11-29

Family

ID=56978129

Family Applications (1)

Application Number Title Priority Date Filing Date
HK18104326.7A HK1244833B (zh) 2015-03-23 2018-03-29 樹脂浸滲物、複合材料和覆銅層疊體的製造方法

Country Status (8)

Country Link
US (1) US10059083B2 (zh)
EP (1) EP3275922A4 (zh)
JP (1) JP6017750B1 (zh)
KR (1) KR101841899B1 (zh)
CN (1) CN107406606B (zh)
HK (1) HK1244833B (zh)
TW (1) TW201700611A (zh)
WO (1) WO2016152149A1 (zh)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10059083B2 (en) 2015-03-23 2018-08-28 Tatsuta Electric Wire & Cable Co., Ltd. Method of manufacturing resin impregnated material, composite material and copper-clad laminate
JP7442255B2 (ja) * 2016-12-06 2024-03-04 三菱瓦斯化学株式会社 電子材料用樹脂組成物
WO2018155418A1 (ja) * 2017-02-22 2018-08-30 ナミックス株式会社 多層配線基板および半導体装置
TWI636885B (zh) * 2017-05-24 2018-10-01 台燿科技股份有限公司 金屬箔積層板的製造方法及其應用
CN111836857A (zh) * 2018-03-28 2020-10-27 积水化学工业株式会社 树脂材料、叠层结构体及多层印刷布线板
WO2019217503A1 (en) * 2018-05-08 2019-11-14 W.L. Gore & Associates, Inc. Flexible and durable printed circuits on stretchable and non-stretchable substrates
WO2019225000A1 (ja) * 2018-05-25 2019-11-28 日立化成株式会社 回路基板の製造方法及び防湿材料
KR102220141B1 (ko) * 2018-07-27 2021-02-25 도레이첨단소재 주식회사 열경화성 접착제 조성물, 그의 경화물을 포함하는 적층필름, 및 상기 적층필름을 채용한 프린트 배선판
US11167375B2 (en) 2018-08-10 2021-11-09 The Research Foundation For The State University Of New York Additive manufacturing processes and additively manufactured products
TWI701982B (zh) 2019-05-14 2020-08-11 欣興電子股份有限公司 電路板結構及其製造方法
US11639398B2 (en) * 2019-12-30 2023-05-02 Rohm And Haas Electronic Materials Llc Photosensitive bismaleimide composition
CN115243892B (zh) * 2020-03-30 2024-05-24 东洋纺株式会社 双轴拉伸聚酰胺膜
JP7194313B2 (ja) * 2020-09-23 2022-12-21 積水化学工業株式会社 硬化性樹脂組成物、仮固定材、及び、電子部品の製造方法
JP7467014B2 (ja) 2021-03-25 2024-04-15 信越化学工業株式会社 フレキシブルプリント配線板（ｆｐｃ）用接着剤組成物、並びに該組成物を含む熱硬化性樹脂フィルム、プリプレグ、及びｆｐｃ基板
TW202237697A (zh) * 2021-03-25 2022-10-01 日商日本化藥股份有限公司 樹脂組成物、硬化物、樹脂片材、預浸體、覆金屬箔積層板、多層印刷配線板、密封用材料、纖維加強複合材料、接著劑及半導體裝置
WO2022255468A1 (ja) * 2021-06-03 2022-12-08 パナソニックＩｐマネジメント株式会社 銅張積層板
TW202323439A (zh) * 2021-11-01 2023-06-16 日商信越化學工業股份有限公司 熱固性馬來醯亞胺樹脂組合物、膜、預浸料、層壓板和印刷電路板
TWI824668B (zh) * 2021-11-05 2023-12-01 財團法人工業技術研究院 寡聚物與組成物
CN114015046B (zh) * 2021-12-07 2023-11-10 苏州生益科技有限公司 一种改性双马来酰亚胺预聚物及使用其制备的组合物、半固化片及其层压板
CN114231230B (zh) * 2021-12-30 2023-10-20 黑龙江省科学院石油化学研究院 降低应力并提高耐温性的胶粘剂及制备方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0220857Y2 (zh) * 1985-11-06 1990-06-06
US4784901A (en) * 1987-04-13 1988-11-15 Japan Gore-Tex, Inc. Flexible printed circuit board base material
JP2559236B2 (ja) * 1987-09-10 1996-12-04 ジャパンゴアテックス株式会社 シート材
JP2762544B2 (ja) 1989-04-11 1998-06-04 三菱瓦斯化学株式会社 低誘電率プリント配線板材料
JP4394266B2 (ja) 2000-09-18 2010-01-06 カシオ計算機株式会社 半導体装置および半導体装置の製造方法
KR101179815B1 (ko) * 2003-05-05 2012-09-04 디자이너 몰레큘스 인코퍼레이티드 이미드-연결된 말레이미드 및 폴리말레이미드 화합물
JP4661196B2 (ja) 2004-07-27 2011-03-30 日立化成工業株式会社 低誘電率絶縁性樹脂組成物
JP4827460B2 (ja) 2005-08-24 2011-11-30 三井・デュポンフロロケミカル株式会社 含フッ素樹脂積層体
JP5181221B2 (ja) * 2008-01-15 2013-04-10 日立化成株式会社 低熱膨張性低誘電損失プリプレグ及びその応用品
TWI532756B (zh) 2009-03-31 2016-05-11 Taiyo Holdings Co Ltd Hardened resin composition and printed circuit board
US8415812B2 (en) 2009-09-03 2013-04-09 Designer Molecules, Inc. Materials and methods for stress reduction in semiconductor wafer passivation layers
US20110209812A1 (en) * 2010-03-01 2011-09-01 General Electric Company Method of manufacturing composite article
JP5672788B2 (ja) 2010-06-16 2015-02-18 日立化成株式会社 ポリアゾメチンを有するビスマレイミド誘導体とその製造方法、並びに熱硬化性樹脂組成物、プリプレグ及び積層板
JP2014001289A (ja) 2012-06-18 2014-01-09 Nippon Steel & Sumikin Chemical Co Ltd 半導体封止用樹脂組成物
CN102850726A (zh) * 2012-09-07 2013-01-02 广东生益科技股份有限公司 复合材料、用其制作的高频电路基板及其制作方法
US10059083B2 (en) 2015-03-23 2018-08-28 Tatsuta Electric Wire & Cable Co., Ltd. Method of manufacturing resin impregnated material, composite material and copper-clad laminate

Also Published As

Publication number Publication date
EP3275922A1 (en) 2018-01-31
KR20170106488A (ko) 2017-09-20
WO2016152149A1 (ja) 2016-09-29
CN107406606B (zh) 2019-03-19
CN107406606A (zh) 2017-11-28
TW201700611A (zh) 2017-01-01
US20180086025A1 (en) 2018-03-29
JPWO2016152149A1 (ja) 2017-04-27
EP3275922A4 (en) 2018-07-11
US10059083B2 (en) 2018-08-28
JP6017750B1 (ja) 2016-11-02
KR101841899B1 (ko) 2018-03-23

Similar Documents

Publication Publication Date Title
HK1244833B (zh) 樹脂浸滲物、複合材料和覆銅層疊體的製造方法
EP3321055A4 (en) Method for manufacturing fiber-reinforced composite material, and fiber-reinforced composite material
EP3533575A4 (en) PRE-IMPREGNATED LAMINATE, FIBER REINFORCED COMPOSITE MATERIAL, AND METHOD FOR PRODUCING FIBER REINFORCED COMPOSITE MATERIAL
EP3210716A4 (en) Composite material and composite material manufacturing method
EP3390506A4 (en) PREPREG, LAMINATE BODY, FIBER-REINFORCED COMPOSITE MATERIAL AND MANUFACTURING METHOD FOR FIBER-REINFORCED COMPOSITE MATERIAL
EP3521002C0 (en) COMPOSITE STRUCTURE AND METHOD FOR PRODUCING A COMPOSITE STRUCTURE
GB201712740D0 (en) Method for the manufacture of a polymer foam composite, polymer foam composites prepared thereby and articles prepared therefrom
EP3109025A4 (en) Fiber-reinforced composite material molding and manufacturing method therefor
EP3279394A4 (en) Composite material production method and composite material
GB201612854D0 (en) Laminated composite material and method for manufacturing laminated composite material
EP3508518A4 (en) LAMINATE AND METHOD FOR PRODUCING A FIBER-REINFORCED RESIN COMPOSITE
GB201614040D0 (en) Composite material, components comprising same and method of using same
EP3412713A4 (en) RESIN COMPOSITE AND PROCESS FOR PRODUCING RESIN COMPOSITE
EP2955015A4 (en) RESIN COMPOSITE, AND METHOD FOR MANUFACTURING THE COMPOSITE
EP3141581A4 (en) Resin composite material and method for manufacturing resin composite material
GB2529571B (en) Laminated composite material and method for manufacturing laminated composite material
SG11201803341QA (en) Composite structure and associated production method
HUE055760T2 (hu) Nem összefüggõ szálakkal erõsített kompozitanyag
GB2539795B (en) Composite having fibre reinforced plastic and metal layers
EP3309213A4 (en) Pvc foaming material and manufacturing method therefor, and pvc composite board
PT3380316T (pt) Processo para o fabrico de um material compósito e material compósito
EP3287206A4 (en) Composite material and method for producing same
ZA201900685B (en) Manufacturing fibre-reinforced composite structures
EP3321404A4 (en) Fiber laminate, method for manufacturing fiber laminate, and fiber reinforced composite material
EP3321056A4 (en) Composite material molding method, and composite material