JP2012039095A5 - - Google Patents

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Publication number
JP2012039095A5
JP2012039095A5 JP2011146293A JP2011146293A JP2012039095A5 JP 2012039095 A5 JP2012039095 A5 JP 2012039095A5 JP 2011146293 A JP2011146293 A JP 2011146293A JP 2011146293 A JP2011146293 A JP 2011146293A JP 2012039095 A5 JP2012039095 A5 JP 2012039095A5
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JP
Japan
Prior art keywords
wafers
wafer
bonding
contacting
series
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JP2011146293A
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English (en)
Japanese (ja)
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JP5419929B2 (ja
JP2012039095A (ja
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Priority claimed from FR1056566A external-priority patent/FR2963848B1/fr
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Publication of JP2012039095A5 publication Critical patent/JP2012039095A5/ja
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Publication of JP5419929B2 publication Critical patent/JP5419929B2/ja
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JP2011146293A 2010-08-11 2011-06-30 低圧での分子接着接合方法 Active JP5419929B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1056566A FR2963848B1 (fr) 2010-08-11 2010-08-11 Procede de collage par adhesion moleculaire a basse pression
FR1056566 2010-08-11

Publications (3)

Publication Number Publication Date
JP2012039095A JP2012039095A (ja) 2012-02-23
JP2012039095A5 true JP2012039095A5 (enExample) 2013-07-25
JP5419929B2 JP5419929B2 (ja) 2014-02-19

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ID=43617963

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011146293A Active JP5419929B2 (ja) 2010-08-11 2011-06-30 低圧での分子接着接合方法

Country Status (7)

Country Link
EP (1) EP2418678B1 (enExample)
JP (1) JP5419929B2 (enExample)
KR (1) KR101238679B1 (enExample)
CN (1) CN102376623B (enExample)
FR (2) FR2963848B1 (enExample)
SG (1) SG178659A1 (enExample)
TW (2) TW201428859A (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2978297A1 (fr) * 2011-07-23 2013-01-25 Soitec Silicon On Insulator Reduction d'interferences mecaniques dans un systeme de collage de substrats a basse pression
FR2992772B1 (fr) 2012-06-28 2014-07-04 Soitec Silicon On Insulator Procede de realisation de structure composite avec collage de type metal/metal
FR2997224B1 (fr) * 2012-10-18 2015-12-04 Soitec Silicon On Insulator Procede de collage par adhesion moleculaire
DE112014007212A5 (de) * 2014-12-23 2017-08-24 Ev Group E. Thallner Gmbh Verfahren und Vorrichtung zur Vorfixierung von Substraten
CN109075037B (zh) 2016-02-16 2023-11-07 Ev 集团 E·索尔纳有限责任公司 用于接合衬底的方法与设备
FR3079532B1 (fr) * 2018-03-28 2022-03-25 Soitec Silicon On Insulator Procede de fabrication d'une couche monocristalline de materiau ain et substrat pour croissance par epitaxie d'une couche monocristalline de materiau ain
CN110767589B (zh) * 2019-10-31 2021-11-19 长春长光圆辰微电子技术有限公司 一种soi硅片对准键合的方法
CN112635362B (zh) * 2020-12-17 2023-12-22 武汉新芯集成电路制造有限公司 晶圆键合方法及晶圆键合系统

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3720515B2 (ja) * 1997-03-13 2005-11-30 キヤノン株式会社 基板処理装置及びその方法並びに基板の製造方法
EP0886306A1 (en) * 1997-06-16 1998-12-23 IMEC vzw Low temperature adhesion bonding method for composite substrates
EP1052687B1 (en) * 1998-02-02 2016-06-29 Nippon Steel & Sumitomo Metal Corporation Method for manufacturing an soi substrate.
US6008113A (en) * 1998-05-19 1999-12-28 Kavlico Corporation Process for wafer bonding in a vacuum
JP2000199883A (ja) * 1998-10-29 2000-07-18 Fujitsu Ltd 反射型プロジェクタ装置
US6958255B2 (en) * 2002-08-08 2005-10-25 The Board Of Trustees Of The Leland Stanford Junior University Micromachined ultrasonic transducers and method of fabrication
WO2006038030A2 (en) * 2004-10-09 2006-04-13 Applied Microengineering Limited Equipment for wafer bonding
JP2009094164A (ja) * 2007-10-04 2009-04-30 Toshiba Corp インバータ装置における電力用半導体素子
JP5354900B2 (ja) * 2007-12-28 2013-11-27 株式会社半導体エネルギー研究所 半導体基板の作製方法
FR2931014B1 (fr) * 2008-05-06 2010-09-03 Soitec Silicon On Insulator Procede d'assemblage de plaques par adhesion moleculaire
JP2010021326A (ja) * 2008-07-10 2010-01-28 Sumco Corp 貼り合わせウェーハの製造方法
FR2935537B1 (fr) * 2008-08-28 2010-10-22 Soitec Silicon On Insulator Procede d'initiation d'adhesion moleculaire
EP2200077B1 (en) * 2008-12-22 2012-12-05 Soitec Method for bonding two substrates
JP5668275B2 (ja) * 2009-04-08 2015-02-12 株式会社Sumco Ｓｏｉウェーハの製造方法及び貼り合わせ装置

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