JP2017528006A5 - - Google Patents

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Publication number
JP2017528006A5
JP2017528006A5 JP2017527190A JP2017527190A JP2017528006A5 JP 2017528006 A5 JP2017528006 A5 JP 2017528006A5 JP 2017527190 A JP2017527190 A JP 2017527190A JP 2017527190 A JP2017527190 A JP 2017527190A JP 2017528006 A5 JP2017528006 A5 JP 2017528006A5
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JP
Japan
Prior art keywords
discrete component
handle
ultra
substrate
release layer
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JP2017527190A
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English (en)
Japanese (ja)
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JP6480583B2 (ja
JP2017528006A (ja
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Priority claimed from PCT/US2015/043550 external-priority patent/WO2016022528A1/en
Publication of JP2017528006A publication Critical patent/JP2017528006A/ja
Publication of JP2017528006A5 publication Critical patent/JP2017528006A5/ja
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Publication of JP6480583B2 publication Critical patent/JP6480583B2/ja
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JP2017527190A 2014-08-05 2015-08-04 組み立てが容易な超小型または超薄型離散コンポーネントの構成 Active JP6480583B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201462033595P 2014-08-05 2014-08-05
US62/033,595 2014-08-05
US201462060928P 2014-10-07 2014-10-07
US62/060,928 2014-10-07
PCT/US2015/043550 WO2016022528A1 (en) 2014-08-05 2015-08-04 Setting up ultra-small or ultra-thin discrete components for easy assembly

Publications (3)

Publication Number Publication Date
JP2017528006A JP2017528006A (ja) 2017-09-21
JP2017528006A5 true JP2017528006A5 (enExample) 2018-09-13
JP6480583B2 JP6480583B2 (ja) 2019-03-13

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ID=55264414

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Application Number Title Priority Date Filing Date
JP2017527190A Active JP6480583B2 (ja) 2014-08-05 2015-08-04 組み立てが容易な超小型または超薄型離散コンポーネントの構成

Country Status (6)

Country Link
US (4) US10529614B2 (enExample)
EP (1) EP3177463A4 (enExample)
JP (1) JP6480583B2 (enExample)
KR (3) KR102866272B1 (enExample)
CN (2) CN113715458A (enExample)
WO (1) WO2016022528A1 (enExample)

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US10242892B2 (en) * 2014-10-17 2019-03-26 Intel Corporation Micro pick and bond assembly
TW202524641A (zh) * 2016-01-15 2025-06-16 荷蘭商庫力克及索發荷蘭公司 放置超小或超薄之離散組件
CN117393441A (zh) 2016-04-29 2024-01-12 库利克和索夫工业公司 将电子组件连接至基板
EP3639297B1 (en) 2017-06-12 2026-03-18 Kulicke & Soffa Netherlands B.V. Parallel assembly of discrete components onto a substrate
DE102018009472A1 (de) * 2018-12-03 2020-06-04 Giesecke+Devrient Currency Technology Gmbh Aufbringung und Befestigung einer bestimmten Anzahl von Einzelelementen auf einer Substratbahn
EP3924999B1 (en) 2019-02-15 2026-03-25 Kulicke & Soffa Netherlands B.V. Dynamic release tapes for assembly of discrete components
KR102858957B1 (ko) 2019-06-11 2025-09-12 쿨리케 & 소파 네덜란드 비.브이. 광학 시스템 특성의 조정에 의해 개별 콤포넌트의 어셈블레에서의 위치 오차 보상
US12266558B2 (en) 2019-12-17 2025-04-01 Kulicke & Soffa Netherlands B.V. Adhesive tapes for receiving discrete components
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TW202501581A (zh) * 2021-11-30 2025-01-01 群創光電股份有限公司 電子裝置的製造方法
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WO2026017271A1 (en) * 2024-07-19 2026-01-22 Nexperia B.V. A method for mounting an electronics component at a particular placement location on a carrier as well as a pick-and-place apparatus for mounting an electronics component at a particular placement location on a carrier.

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