JP2017528006A5 - - Google Patents

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Publication number
JP2017528006A5
JP2017528006A5 JP2017527190A JP2017527190A JP2017528006A5 JP 2017528006 A5 JP2017528006 A5 JP 2017528006A5 JP 2017527190 A JP2017527190 A JP 2017527190A JP 2017527190 A JP2017527190 A JP 2017527190A JP 2017528006 A5 JP2017528006 A5 JP 2017528006A5
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JP
Japan
Prior art keywords
discrete component
handle
ultra
substrate
release layer
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JP2017527190A
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English (en)
Japanese (ja)
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JP6480583B2 (ja
JP2017528006A (ja
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Priority claimed from PCT/US2015/043550 external-priority patent/WO2016022528A1/en
Publication of JP2017528006A publication Critical patent/JP2017528006A/ja
Publication of JP2017528006A5 publication Critical patent/JP2017528006A5/ja
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Publication of JP6480583B2 publication Critical patent/JP6480583B2/ja
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JP2017527190A 2014-08-05 2015-08-04 組み立てが容易な超小型または超薄型離散コンポーネントの構成 Active JP6480583B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201462033595P 2014-08-05 2014-08-05
US62/033,595 2014-08-05
US201462060928P 2014-10-07 2014-10-07
US62/060,928 2014-10-07
PCT/US2015/043550 WO2016022528A1 (en) 2014-08-05 2015-08-04 Setting up ultra-small or ultra-thin discrete components for easy assembly

Publications (3)

Publication Number Publication Date
JP2017528006A JP2017528006A (ja) 2017-09-21
JP2017528006A5 true JP2017528006A5 (enExample) 2018-09-13
JP6480583B2 JP6480583B2 (ja) 2019-03-13

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ID=55264414

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017527190A Active JP6480583B2 (ja) 2014-08-05 2015-08-04 組み立てが容易な超小型または超薄型離散コンポーネントの構成

Country Status (6)

Country Link
US (4) US10529614B2 (enExample)
EP (1) EP3177463A4 (enExample)
JP (1) JP6480583B2 (enExample)
KR (3) KR102240810B1 (enExample)
CN (2) CN113715458A (enExample)
WO (1) WO2016022528A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113715458A (zh) 2014-08-05 2021-11-30 库利克和索夫工业公司 用于传送分立元件的方法和装置
JP6483246B2 (ja) 2014-10-17 2019-03-13 インテル・コーポレーション 微小持ち上げ・接合組立法
TWI889995B (zh) * 2016-01-15 2025-07-11 荷蘭商庫力克及索發荷蘭公司 放置超小或超薄之離散組件
CN117393441A (zh) 2016-04-29 2024-01-12 库利克和索夫工业公司 将电子组件连接至基板
KR102160225B1 (ko) 2017-06-12 2020-09-28 유니카르타, 인크. 개별 부품들의 기판 상으로의 병렬적 조립
DE102018009472A1 (de) * 2018-12-03 2020-06-04 Giesecke+Devrient Currency Technology Gmbh Aufbringung und Befestigung einer bestimmten Anzahl von Einzelelementen auf einer Substratbahn
KR20210145141A (ko) 2019-02-15 2021-12-01 쿨리케 & 소파 네덜란드 비.브이. 개별 구성 요소의 조립을 위한 동적 해제 테이프
KR102858957B1 (ko) 2019-06-11 2025-09-12 쿨리케 & 소파 네덜란드 비.브이. 광학 시스템 특성의 조정에 의해 개별 콤포넌트의 어셈블레에서의 위치 오차 보상
EP4078662A4 (en) 2019-12-17 2024-05-29 Kulicke & Soffa Netherlands B.V. Adhesive tapes for receiving discrete components
EP3933902B1 (en) 2020-06-29 2023-05-03 IMEC vzw A method for positioning components on a substrate
TWI859583B (zh) * 2021-11-30 2024-10-21 群創光電股份有限公司 電子裝置的製造方法
GB2633617A (en) * 2023-09-15 2025-03-19 Pragmatic Semiconductor Ltd Methods and apparatus for facilitating manufacture of an integrated circuit
WO2026017271A1 (en) * 2024-07-19 2026-01-22 Nexperia B.V. A method for mounting an electronics component at a particular placement location on a carrier as well as a pick-and-place apparatus for mounting an electronics component at a particular placement location on a carrier.

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3006866B2 (ja) * 1990-10-18 2000-02-07 大日本印刷株式会社 転写箔
JP3197788B2 (ja) * 1995-05-18 2001-08-13 株式会社日立製作所 半導体装置の製造方法
EP1041620A3 (en) * 1999-04-02 2005-01-05 Interuniversitair Microelektronica Centrum Vzw Method of transferring ultrathin substrates and application of the method to the manufacture of a multi-layer thin film device
US6383833B1 (en) * 2000-05-23 2002-05-07 Silverbrook Research Pty Ltd. Method of fabricating devices incorporating microelectromechanical systems using at least one UV curable tape
JP4597323B2 (ja) * 2000-07-07 2010-12-15 リンテック株式会社 紫外線硬化型粘着剤組成物および紫外線硬化性粘着シート
EP1358673A1 (en) * 2001-02-08 2003-11-05 International Business Machines Corporation Chip transfer method and apparatus
FR2823012B1 (fr) * 2001-04-03 2004-05-21 Commissariat Energie Atomique Procede de transfert selectif d'au moins un element d'un support initial sur un support final
KR100853410B1 (ko) * 2001-04-11 2008-08-21 소니 가부시키가이샤 소자의 전사방법 및 이를 이용한 소자의 배열방법,화상표시장치의 제조방법
US7387913B2 (en) * 2001-08-08 2008-06-17 Jsr Corporation 3D optoelectronic micro system
US7535100B2 (en) 2002-07-12 2009-05-19 The United States Of America As Represented By The Secretary Of The Navy Wafer bonding of thinned electronic materials and circuits to high performance substrates
AU2003300040A1 (en) * 2002-12-31 2004-07-29 Massachusetts Institute Of Technology Multi-layer integrated semiconductor structure having an electrical shielding portion
US7091108B2 (en) * 2003-09-11 2006-08-15 Intel Corporation Methods and apparatuses for manufacturing ultra thin device layers for integrated circuit devices
US7101620B1 (en) * 2004-09-07 2006-09-05 National Semiconductor Corporation Thermal release wafer mount tape with B-stage adhesive
EP1869701B1 (de) * 2005-04-08 2017-02-08 Pac Tech - Packaging Technologies GmbH Verfahren und vorrichtung zur übertragung eines chips auf ein kontaktsubstrat
US7300824B2 (en) * 2005-08-18 2007-11-27 James Sheats Method of packaging and interconnection of integrated circuits
JP5129939B2 (ja) * 2006-08-31 2013-01-30 沖電気工業株式会社 半導体装置の製造方法
JP2008258412A (ja) * 2007-04-05 2008-10-23 Shinko Electric Ind Co Ltd シリコンウエハの個片化方法
KR101273871B1 (ko) * 2007-04-19 2013-06-11 세키스이가가쿠 고교가부시키가이샤 다이싱ㆍ다이본딩 테이프 및 반도체칩의 제조 방법
US7802356B1 (en) * 2008-02-21 2010-09-28 Hrl Laboratories, Llc Method of fabricating an ultra thin quartz resonator component
WO2010132552A1 (en) * 2009-05-12 2010-11-18 The Board Of Trustees Of The University Of Illinois Printed assemblies of ultrathin, microscale inorganic light emitting diodes for deformable and semitransparent displays
US8912646B2 (en) * 2009-07-15 2014-12-16 Silanna Semiconductor U.S.A., Inc. Integrated circuit assembly and method of making
US9064686B2 (en) * 2010-04-15 2015-06-23 Suss Microtec Lithography, Gmbh Method and apparatus for temporary bonding of ultra thin wafers
EP2434528A1 (en) * 2010-09-28 2012-03-28 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO An active carrier for carrying a wafer and method for release
RU2582160C2 (ru) * 2011-04-11 2016-04-20 Ндсю Рисёрч Фаундейшн Избирательный лазерно-стимулированный перенос дискретных компонентов
JP5845775B2 (ja) * 2011-09-26 2016-01-20 住友電気工業株式会社 薄膜個片の接合方法
MX375104B (es) * 2012-08-17 2025-03-06 Visual Physics Llc Un procedimiento para la transferencia de microestructuras a un sustrato final.
US9136173B2 (en) * 2012-11-07 2015-09-15 Semiconductor Components Industries, Llc Singulation method for semiconductor die having a layer of material along one major surface
CN113715458A (zh) 2014-08-05 2021-11-30 库利克和索夫工业公司 用于传送分立元件的方法和装置
US9209142B1 (en) * 2014-09-05 2015-12-08 Skorpios Technologies, Inc. Semiconductor bonding with compliant resin and utilizing hydrogen implantation for transfer-wafer removal
US20160133486A1 (en) * 2014-11-07 2016-05-12 International Business Machines Corporation Double Layer Release Temporary Bond and Debond Processes and Systems
US9496165B1 (en) * 2015-07-09 2016-11-15 International Business Machines Corporation Method of forming a flexible semiconductor layer and devices on a flexible carrier

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