JP2017528006A5 - - Google Patents

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Publication number
JP2017528006A5
JP2017528006A5 JP2017527190A JP2017527190A JP2017528006A5 JP 2017528006 A5 JP2017528006 A5 JP 2017528006A5 JP 2017527190 A JP2017527190 A JP 2017527190A JP 2017527190 A JP2017527190 A JP 2017527190A JP 2017528006 A5 JP2017528006 A5 JP 2017528006A5
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JP
Japan
Prior art keywords
discrete component
handle
ultra
substrate
release layer
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JP2017527190A
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English (en)
Japanese (ja)
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JP6480583B2 (ja
JP2017528006A (ja
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Priority claimed from PCT/US2015/043550 external-priority patent/WO2016022528A1/en
Publication of JP2017528006A publication Critical patent/JP2017528006A/ja
Publication of JP2017528006A5 publication Critical patent/JP2017528006A5/ja
Application granted granted Critical
Publication of JP6480583B2 publication Critical patent/JP6480583B2/ja
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JP2017527190A 2014-08-05 2015-08-04 組み立てが容易な超小型または超薄型離散コンポーネントの構成 Active JP6480583B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201462033595P 2014-08-05 2014-08-05
US62/033,595 2014-08-05
US201462060928P 2014-10-07 2014-10-07
US62/060,928 2014-10-07
PCT/US2015/043550 WO2016022528A1 (en) 2014-08-05 2015-08-04 Setting up ultra-small or ultra-thin discrete components for easy assembly

Publications (3)

Publication Number Publication Date
JP2017528006A JP2017528006A (ja) 2017-09-21
JP2017528006A5 true JP2017528006A5 (enExample) 2018-09-13
JP6480583B2 JP6480583B2 (ja) 2019-03-13

Family

ID=55264414

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Application Number Title Priority Date Filing Date
JP2017527190A Active JP6480583B2 (ja) 2014-08-05 2015-08-04 組み立てが容易な超小型または超薄型離散コンポーネントの構成

Country Status (6)

Country Link
US (4) US10529614B2 (enExample)
EP (1) EP3177463A4 (enExample)
JP (1) JP6480583B2 (enExample)
KR (3) KR102403580B1 (enExample)
CN (2) CN107107600B (enExample)
WO (1) WO2016022528A1 (enExample)

Families Citing this family (12)

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CN107107600B (zh) * 2014-08-05 2021-07-27 尤尼卡尔塔股份有限公司 设置便于组装的超小或超薄分立元件
JP6483246B2 (ja) 2014-10-17 2019-03-13 インテル・コーポレーション 微小持ち上げ・接合組立法
TWI889995B (zh) * 2016-01-15 2025-07-11 荷蘭商庫力克及索發荷蘭公司 放置超小或超薄之離散組件
CN109478516B (zh) 2016-04-29 2023-06-13 库利克和索夫工业公司 将电子组件连接至基板
CN118538834A (zh) 2017-06-12 2024-08-23 库力索法荷兰有限公司 分立组件向基板上的并行组装
DE102018009472A1 (de) * 2018-12-03 2020-06-04 Giesecke+Devrient Currency Technology Gmbh Aufbringung und Befestigung einer bestimmten Anzahl von Einzelelementen auf einer Substratbahn
EP3924999A4 (en) 2019-02-15 2022-11-02 Kulicke & Soffa Netherlands B.V. DYNAMIC SEPARATOR TAPES FOR MOUNTING DISCRETE COMPONENTS
US12046504B2 (en) 2019-06-11 2024-07-23 Kulicke & Soffa Netherlands B.V. Positional error compensation in assembly of discrete components by adjustment of optical system characteristics
US12266558B2 (en) 2019-12-17 2025-04-01 Kulicke & Soffa Netherlands B.V. Adhesive tapes for receiving discrete components
EP3933902B1 (en) 2020-06-29 2023-05-03 IMEC vzw A method for positioning components on a substrate
TW202501581A (zh) * 2021-11-30 2025-01-01 群創光電股份有限公司 電子裝置的製造方法
GB2633617A (en) * 2023-09-15 2025-03-19 Pragmatic Semiconductor Ltd Methods and apparatus for facilitating manufacture of an integrated circuit

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EP1041620A3 (en) 1999-04-02 2005-01-05 Interuniversitair Microelektronica Centrum Vzw Method of transferring ultrathin substrates and application of the method to the manufacture of a multi-layer thin film device
US6383833B1 (en) * 2000-05-23 2002-05-07 Silverbrook Research Pty Ltd. Method of fabricating devices incorporating microelectromechanical systems using at least one UV curable tape
JP4597323B2 (ja) * 2000-07-07 2010-12-15 リンテック株式会社 紫外線硬化型粘着剤組成物および紫外線硬化性粘着シート
CN1491436A (zh) * 2001-02-08 2004-04-21 �Ҵ���˾ 芯片转移方法及装置
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