JP2017528006A5 - - Google Patents

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Publication number
JP2017528006A5
JP2017528006A5 JP2017527190A JP2017527190A JP2017528006A5 JP 2017528006 A5 JP2017528006 A5 JP 2017528006A5 JP 2017527190 A JP2017527190 A JP 2017527190A JP 2017527190 A JP2017527190 A JP 2017527190A JP 2017528006 A5 JP2017528006 A5 JP 2017528006A5
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JP
Japan
Prior art keywords
discrete component
handle
ultra
substrate
release layer
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JP2017527190A
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English (en)
Japanese (ja)
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JP2017528006A (ja
JP6480583B2 (ja
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Priority claimed from PCT/US2015/043550 external-priority patent/WO2016022528A1/en
Publication of JP2017528006A publication Critical patent/JP2017528006A/ja
Publication of JP2017528006A5 publication Critical patent/JP2017528006A5/ja
Application granted granted Critical
Publication of JP6480583B2 publication Critical patent/JP6480583B2/ja
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JP2017527190A 2014-08-05 2015-08-04 組み立てが容易な超小型または超薄型離散コンポーネントの構成 Active JP6480583B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201462033595P 2014-08-05 2014-08-05
US62/033,595 2014-08-05
US201462060928P 2014-10-07 2014-10-07
US62/060,928 2014-10-07
PCT/US2015/043550 WO2016022528A1 (en) 2014-08-05 2015-08-04 Setting up ultra-small or ultra-thin discrete components for easy assembly

Publications (3)

Publication Number Publication Date
JP2017528006A JP2017528006A (ja) 2017-09-21
JP2017528006A5 true JP2017528006A5 (enExample) 2018-09-13
JP6480583B2 JP6480583B2 (ja) 2019-03-13

Family

ID=55264414

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017527190A Active JP6480583B2 (ja) 2014-08-05 2015-08-04 組み立てが容易な超小型または超薄型離散コンポーネントの構成

Country Status (6)

Country Link
US (4) US10529614B2 (enExample)
EP (1) EP3177463A4 (enExample)
JP (1) JP6480583B2 (enExample)
KR (3) KR102240810B1 (enExample)
CN (2) CN113715458A (enExample)
WO (1) WO2016022528A1 (enExample)

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EP3207563A4 (en) * 2014-10-17 2018-05-30 Intel Corporation Micro pick and bond assembly
TWI783910B (zh) * 2016-01-15 2022-11-21 荷蘭商庫力克及索發荷蘭公司 放置超小或超薄之離散組件
US12094811B2 (en) 2016-04-29 2024-09-17 Kulicke And Soffa Industries, Inc. Connecting electronic components to substrates
KR102160225B1 (ko) 2017-06-12 2020-09-28 유니카르타, 인크. 개별 부품들의 기판 상으로의 병렬적 조립
DE102018009472A1 (de) * 2018-12-03 2020-06-04 Giesecke+Devrient Currency Technology Gmbh Aufbringung und Befestigung einer bestimmten Anzahl von Einzelelementen auf einer Substratbahn
WO2020168174A1 (en) 2019-02-15 2020-08-20 Uniqarta, Inc Dynamic release tapes for assembly of discrete components
CN121510896A (zh) 2019-06-11 2026-02-10 库力索法荷兰有限公司 方法和系统
WO2021126580A1 (en) * 2019-12-17 2021-06-24 Uniqarta, Inc. Adhesive tapes for receiving discrete components
EP3933902B1 (en) 2020-06-29 2023-05-03 IMEC vzw A method for positioning components on a substrate
TWI859583B (zh) * 2021-11-30 2024-10-21 群創光電股份有限公司 電子裝置的製造方法
GB2633617A (en) * 2023-09-15 2025-03-19 Pragmatic Semiconductor Ltd Methods and apparatus for facilitating manufacture of an integrated circuit
WO2026017271A1 (en) * 2024-07-19 2026-01-22 Nexperia B.V. A method for mounting an electronics component at a particular placement location on a carrier as well as a pick-and-place apparatus for mounting an electronics component at a particular placement location on a carrier.

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