CN113715458A - 用于传送分立元件的方法和装置 - Google Patents

用于传送分立元件的方法和装置 Download PDF

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Publication number
CN113715458A
CN113715458A CN202110824519.1A CN202110824519A CN113715458A CN 113715458 A CN113715458 A CN 113715458A CN 202110824519 A CN202110824519 A CN 202110824519A CN 113715458 A CN113715458 A CN 113715458A
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China
Prior art keywords
substrate
layer
discrete
microns
release layer
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Pending
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CN202110824519.1A
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English (en)
Chinese (zh)
Inventor
V·马里诺夫
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Kulicke and Soffa Industries Inc
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Kulicke and Soffa Industries Inc
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Publication of CN113715458A publication Critical patent/CN113715458A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/26—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
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    • B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H01L2224/83874—Ultraviolet [UV] curing

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
  • Adhesive Tapes (AREA)
  • Die Bonding (AREA)
  • Adhesives Or Adhesive Processes (AREA)
CN202110824519.1A 2014-08-05 2015-08-04 用于传送分立元件的方法和装置 Pending CN113715458A (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201462033595P 2014-08-05 2014-08-05
US62/033,595 2014-08-05
US201462060928P 2014-10-07 2014-10-07
US62/060,928 2014-10-07
CN201580053887.3A CN107107600B (zh) 2014-08-05 2015-08-04 设置便于组装的超小或超薄分立元件

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