KR102240810B1 - 쉬운 조립을 위한 초소형 또는 초박형 개별 컴포넌트의 구성 - Google Patents

쉬운 조립을 위한 초소형 또는 초박형 개별 컴포넌트의 구성 Download PDF

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KR102240810B1
KR102240810B1 KR1020177006045A KR20177006045A KR102240810B1 KR 102240810 B1 KR102240810 B1 KR 102240810B1 KR 1020177006045 A KR1020177006045 A KR 1020177006045A KR 20177006045 A KR20177006045 A KR 20177006045A KR 102240810 B1 KR102240810 B1 KR 102240810B1
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delete delete
layer
substrate
individual components
handle
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KR20170039281A (ko
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발 마리노브
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유니카르타, 인크.
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    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/26—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
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    • B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
  • Adhesive Tapes (AREA)
  • Die Bonding (AREA)
  • Adhesives Or Adhesive Processes (AREA)
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KR20220075241A (ko) 2022-06-07
KR102866272B1 (ko) 2025-10-02
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JP2017528006A (ja) 2017-09-21
US10937680B2 (en) 2021-03-02
KR20210033071A (ko) 2021-03-25
US11728201B2 (en) 2023-08-15
US20210265191A1 (en) 2021-08-26
US12412772B2 (en) 2025-09-09
US20170365499A1 (en) 2017-12-21
KR20170039281A (ko) 2017-04-10
US10529614B2 (en) 2020-01-07
CN113715458A (zh) 2021-11-30
KR102403580B1 (ko) 2022-05-30
US20230377936A1 (en) 2023-11-23
WO2016022528A1 (en) 2016-02-11
US20200135534A1 (en) 2020-04-30
CN107107600B (zh) 2021-07-27
CN107107600A (zh) 2017-08-29
EP3177463A1 (en) 2017-06-14

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