JP5419929B2 - 低圧での分子接着接合方法 - Google Patents

低圧での分子接着接合方法 Download PDF

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Publication number
JP5419929B2
JP5419929B2 JP2011146293A JP2011146293A JP5419929B2 JP 5419929 B2 JP5419929 B2 JP 5419929B2 JP 2011146293 A JP2011146293 A JP 2011146293A JP 2011146293 A JP2011146293 A JP 2011146293A JP 5419929 B2 JP5419929 B2 JP 5419929B2
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Japan
Prior art keywords
wafer
wafers
bonding
microcomponents
substrate
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JP2011146293A
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English (en)
Japanese (ja)
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JP2012039095A5 (enExample
JP2012039095A (ja
Inventor
ブロッカール マルセル
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Soitec SA
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Soitec SA
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Publication of JP2012039095A5 publication Critical patent/JP2012039095A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
    • H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/185—Joining of semiconductor bodies for junction formation
    • H01L21/187—Joining of semiconductor bodies for junction formation by direct bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
    • H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
    • H01L21/76256—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques using silicon etch back techniques, e.g. BESOI, ELTRAN

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Micromachines (AREA)
  • Pressure Sensors (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2011146293A 2010-08-11 2011-06-30 低圧での分子接着接合方法 Active JP5419929B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1056566A FR2963848B1 (fr) 2010-08-11 2010-08-11 Procede de collage par adhesion moleculaire a basse pression
FR1056566 2010-08-11

Publications (3)

Publication Number Publication Date
JP2012039095A JP2012039095A (ja) 2012-02-23
JP2012039095A5 JP2012039095A5 (enExample) 2013-07-25
JP5419929B2 true JP5419929B2 (ja) 2014-02-19

Family

ID=43617963

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011146293A Active JP5419929B2 (ja) 2010-08-11 2011-06-30 低圧での分子接着接合方法

Country Status (7)

Country Link
EP (1) EP2418678B1 (enExample)
JP (1) JP5419929B2 (enExample)
KR (1) KR101238679B1 (enExample)
CN (1) CN102376623B (enExample)
FR (2) FR2963848B1 (enExample)
SG (1) SG178659A1 (enExample)
TW (2) TW201428859A (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2978297A1 (fr) * 2011-07-23 2013-01-25 Soitec Silicon On Insulator Reduction d'interferences mecaniques dans un systeme de collage de substrats a basse pression
FR2992772B1 (fr) 2012-06-28 2014-07-04 Soitec Silicon On Insulator Procede de realisation de structure composite avec collage de type metal/metal
FR2997224B1 (fr) * 2012-10-18 2015-12-04 Soitec Silicon On Insulator Procede de collage par adhesion moleculaire
DE112014007212A5 (de) * 2014-12-23 2017-08-24 Ev Group E. Thallner Gmbh Verfahren und Vorrichtung zur Vorfixierung von Substraten
CN109075037B (zh) 2016-02-16 2023-11-07 Ev 集团 E·索尔纳有限责任公司 用于接合衬底的方法与设备
FR3079532B1 (fr) * 2018-03-28 2022-03-25 Soitec Silicon On Insulator Procede de fabrication d'une couche monocristalline de materiau ain et substrat pour croissance par epitaxie d'une couche monocristalline de materiau ain
CN110767589B (zh) * 2019-10-31 2021-11-19 长春长光圆辰微电子技术有限公司 一种soi硅片对准键合的方法
CN112635362B (zh) * 2020-12-17 2023-12-22 武汉新芯集成电路制造有限公司 晶圆键合方法及晶圆键合系统

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3720515B2 (ja) * 1997-03-13 2005-11-30 キヤノン株式会社 基板処理装置及びその方法並びに基板の製造方法
EP0886306A1 (en) * 1997-06-16 1998-12-23 IMEC vzw Low temperature adhesion bonding method for composite substrates
EP1052687B1 (en) * 1998-02-02 2016-06-29 Nippon Steel & Sumitomo Metal Corporation Method for manufacturing an soi substrate.
US6008113A (en) * 1998-05-19 1999-12-28 Kavlico Corporation Process for wafer bonding in a vacuum
JP2000199883A (ja) * 1998-10-29 2000-07-18 Fujitsu Ltd 反射型プロジェクタ装置
US6958255B2 (en) * 2002-08-08 2005-10-25 The Board Of Trustees Of The Leland Stanford Junior University Micromachined ultrasonic transducers and method of fabrication
WO2006038030A2 (en) * 2004-10-09 2006-04-13 Applied Microengineering Limited Equipment for wafer bonding
JP2009094164A (ja) * 2007-10-04 2009-04-30 Toshiba Corp インバータ装置における電力用半導体素子
JP5354900B2 (ja) * 2007-12-28 2013-11-27 株式会社半導体エネルギー研究所 半導体基板の作製方法
FR2931014B1 (fr) * 2008-05-06 2010-09-03 Soitec Silicon On Insulator Procede d'assemblage de plaques par adhesion moleculaire
JP2010021326A (ja) * 2008-07-10 2010-01-28 Sumco Corp 貼り合わせウェーハの製造方法
FR2935537B1 (fr) * 2008-08-28 2010-10-22 Soitec Silicon On Insulator Procede d'initiation d'adhesion moleculaire
EP2200077B1 (en) * 2008-12-22 2012-12-05 Soitec Method for bonding two substrates
JP5668275B2 (ja) * 2009-04-08 2015-02-12 株式会社Sumco Ｓｏｉウェーハの製造方法及び貼り合わせ装置

Also Published As

Publication number Publication date
TW201214583A (en) 2012-04-01
EP2418678A2 (en) 2012-02-15
TW201428859A (zh) 2014-07-16
KR101238679B1 (ko) 2013-03-04
CN102376623A (zh) 2012-03-14
EP2418678A3 (en) 2012-02-29
TWI527131B (zh) 2016-03-21
FR2963848A1 (fr) 2012-02-17
EP2418678B1 (en) 2014-10-15
CN102376623B (zh) 2014-07-02
KR20120015266A (ko) 2012-02-21
FR2963848B1 (fr) 2012-08-31
JP2012039095A (ja) 2012-02-23
FR2969378A1 (fr) 2012-06-22
SG178659A1 (en) 2012-03-29

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