JP2011526052A5 - - Google Patents

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Publication number
JP2011526052A5
JP2011526052A5 JP2011512492A JP2011512492A JP2011526052A5 JP 2011526052 A5 JP2011526052 A5 JP 2011526052A5 JP 2011512492 A JP2011512492 A JP 2011512492A JP 2011512492 A JP2011512492 A JP 2011512492A JP 2011526052 A5 JP2011526052 A5 JP 2011526052A5
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Japan
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encapsulating composition
adhesive encapsulating
weight
emitting unit
light
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JP2011512492A
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English (en)
Japanese (ja)
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JP2011526052A (ja
JP5270755B2 (ja
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Priority claimed from PCT/US2009/041510 external-priority patent/WO2009148716A2/en
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Publication of JP2011526052A5 publication Critical patent/JP2011526052A5/ja
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JP2011512492A 2008-06-02 2009-04-23 接着剤封入組成物及びそれで作られた電子デバイス Active JP5270755B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US5806708P 2008-06-02 2008-06-02
US61/058,067 2008-06-02
PCT/US2009/041510 WO2009148716A2 (en) 2008-06-02 2009-04-23 Adhesive encapsulating composition and electronic devices made therewith

Publications (3)

Publication Number Publication Date
JP2011526052A JP2011526052A (ja) 2011-09-29
JP2011526052A5 true JP2011526052A5 (cg-RX-API-DMAC7.html) 2012-06-14
JP5270755B2 JP5270755B2 (ja) 2013-08-21

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JP2011512492A Active JP5270755B2 (ja) 2008-06-02 2009-04-23 接着剤封入組成物及びそれで作られた電子デバイス

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US (1) US20110073901A1 (cg-RX-API-DMAC7.html)
EP (1) EP2291479B1 (cg-RX-API-DMAC7.html)
JP (1) JP5270755B2 (cg-RX-API-DMAC7.html)
KR (1) KR20110020862A (cg-RX-API-DMAC7.html)
CN (1) CN102076803B (cg-RX-API-DMAC7.html)
TW (1) TW201005063A (cg-RX-API-DMAC7.html)
WO (1) WO2009148716A2 (cg-RX-API-DMAC7.html)

Families Citing this family (58)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9024455B2 (en) 2010-05-26 2015-05-05 Hitachi Chemical Company, Ltd. Semiconductor encapsulation adhesive composition, semiconductor encapsulation film-like adhesive, method for producing semiconductor device and semiconductor device
WO2009148722A2 (en) * 2008-06-02 2009-12-10 3M Innovative Properties Company Adhesive encapsulating composition and electronic devices made therewith
WO2011057005A2 (en) * 2009-11-04 2011-05-12 Klöckner Pentaplast Of America, Inc. Configuration of multiple thermoformable film layers for rigid packaging requiring moisture and oxygen protection
CN102666714B (zh) 2009-11-19 2015-04-29 3M创新有限公司 包含合成橡胶和与丙烯酸类聚合物结合的官能化合成橡胶的共混物的压敏粘合剂
WO2011062852A1 (en) 2009-11-19 2011-05-26 3M Innovative Properties Company Pressure sensitive adhesive comprising functionalized polyisobutylene hydrogen bonded to acylic polymer
JP2011151388A (ja) * 2009-12-24 2011-08-04 Mitsubishi Plastics Inc 太陽電池封止材及びそれを用いて作製された太陽電池モジュール
US20130102734A1 (en) * 2010-04-22 2013-04-25 Daicel Corporation Photosemiconductor protective material and precursor thereof, and process for producing photosemiconductor protective material
CN104221178B (zh) 2010-11-02 2019-12-03 Lg化学株式会社 粘合膜和使用其包封有机电子装置的方法
JP2014500354A (ja) 2010-11-16 2014-01-09 スリーエム イノベイティブ プロパティズ カンパニー 紫外線硬化性無水物変性ポリ（イソブチレン）
US8663407B2 (en) 2010-11-17 2014-03-04 3M Innovative Properties Company Isobutylene (Co)polymeric adhesive composition
US8629209B2 (en) 2010-12-02 2014-01-14 3M Innovative Properties Company Moisture curable isobutylene adhesive copolymers
TWI552883B (zh) * 2011-07-25 2016-10-11 Lintec Corp Gas barrier film laminates and electronic components
KR101614631B1 (ko) 2011-09-29 2016-04-21 미쓰이 가가쿠 가부시키가이샤 접착성 조성물, 및 이것을 이용한 화상 표시 장치
EP2801476B1 (en) * 2012-01-06 2022-03-02 LG Chem, Ltd. Encapsulation film
US8728568B2 (en) 2012-01-16 2014-05-20 Itron, Inc. Method for encapsulation of electronics received in water meter pits with an improved wax-based encapsulant/moisture barrier
US8481626B1 (en) 2012-01-16 2013-07-09 Itron, Inc. Wax-based encapsulant/moisture barrier for use with electronics received in water meter pits
KR101478429B1 (ko) * 2012-03-12 2014-12-31 주식회사 엘지화학 점착 필름
WO2013146015A1 (ja) * 2012-03-28 2013-10-03 昭和電工株式会社 重合性組成物、重合物、粘着シート、画像表示装置の製造方法、及び画像表示装置
KR101563243B1 (ko) 2012-03-29 2015-10-26 쓰리엠 이노베이티브 프로퍼티즈 컴파니 펜던트형 자유 라디칼 중합성 4차 암모늄 치환체를 포함하는 폴리(아이소부틸렌) 공중합체를 포함하는 접착제
WO2013169317A1 (en) 2012-05-11 2013-11-14 3M Innovative Properties Company Adhesives comprising reaction product of halogenated poly(isobutylene) copolymers and polyamines
TWI569959B (zh) * 2012-05-22 2017-02-11 Sekisui Chemical Co Ltd Sheet seal and laminated sheet seal
CN104488107B (zh) 2012-08-03 2016-10-19 Lg化学株式会社 粘合膜以及使用该粘合膜的有机电子装置的封装方法
US9587150B2 (en) 2012-08-14 2017-03-07 3M Innovative Properties Company Adhesives comprising grafted isobutylene copolymer
US9269623B2 (en) 2012-10-25 2016-02-23 Rohm And Haas Electronic Materials Llc Ephemeral bonding
US9007538B2 (en) 2012-10-31 2015-04-14 Industrial Technology Research Institute Barrier functional film and manufacturing thereof, environmental sensitive electronic device, and display apparatus
JP6244088B2 (ja) * 2012-11-29 2017-12-06 東京応化工業株式会社 接着剤組成物、接着フィルムおよび積層体
JP5914397B2 (ja) 2013-03-19 2016-05-11 富士フイルム株式会社 機能性フィルム
CN103436203B (zh) * 2013-07-08 2015-06-03 北京京东方光电科技有限公司 封框胶及其制备方法和显示装置
KR20150016877A (ko) 2013-08-05 2015-02-13 주식회사 엘지화학 점착제 조성물, 점착 필름 및 이를 이용한 유기전자장치의 봉지방법
US10435596B2 (en) 2013-09-24 2019-10-08 Lg Chem, Ltd. Pressure-sensitive adhesive composition
US9315696B2 (en) * 2013-10-31 2016-04-19 Dow Global Technologies Llc Ephemeral bonding
US20150166789A1 (en) * 2013-12-18 2015-06-18 Sabic Innovative Plastics Ip B.V. Poly(phenylene ether) fiber, method of forming, and articles therefrom
KR20150097359A (ko) * 2014-02-18 2015-08-26 주식회사 엘지화학 봉지 필름 및 이를 포함하는 유기전자장치
KR20170013914A (ko) * 2014-06-27 2017-02-07 후지필름 가부시키가이샤 유기 전자 장치용 밀봉 부재
CN104282728B (zh) * 2014-10-10 2017-03-15 深圳市华星光电技术有限公司 一种白光oled显示器及其封装方法
CN104479574B (zh) * 2014-12-31 2017-03-08 广州鹿山新材料股份有限公司 一种增透的聚烯烃光伏组件封装胶膜及其制备方法
CN107548403B (zh) * 2015-03-25 2019-08-16 理研科技株式会社 热塑性树脂组合物、粘结性涂料以及使用其的层叠体
JP6550275B2 (ja) * 2015-06-15 2019-07-24 東京応化工業株式会社 ナノインプリント用組成物、硬化物、パターン形成方法及びパターンを含む物品
JP2018525807A (ja) * 2015-07-22 2018-09-06 インテル・コーポレーション マルチレイヤパッケージ
DE102015222027A1 (de) 2015-11-09 2017-05-11 Tesa Se Barriereklebemasse mit polymerem Gettermaterial
SG11201806570SA (en) * 2016-02-01 2018-08-30 3M Innovative Properties Co Barrier composites
KR102563022B1 (ko) * 2016-04-04 2023-08-07 덕산네오룩스 주식회사 유기전기발광소자용 봉지 화합물, 조성물 및 이를 포함하는 봉지화된 장치
US10121990B2 (en) * 2016-04-28 2018-11-06 Electronics And Telecommunications Research Institute Organic light emitting devices and methods of fabricating the same
US10896827B2 (en) * 2016-06-28 2021-01-19 Zeon Corporation Support for manufacturing semiconductor packages, use of support for manufacturing semiconductor packages, and method for manufacturing semiconductor packages
CN105938873A (zh) 2016-07-01 2016-09-14 武汉华星光电技术有限公司 一种柔性显示装置及其制造方法
CN107658231B (zh) * 2016-07-26 2019-08-02 中国科学院苏州纳米技术与纳米仿生研究所 电子器件的干法封装方法及电子器件封装结构
EP3491675B1 (en) * 2016-07-29 2022-11-16 trinamiX GmbH Optical sensor and detector for optical detection
JP2019526476A (ja) 2016-08-15 2019-09-19 クロックナー、ペンタプラスト、オブ、アメリカ、インコーポレイテッドＫｌｏｃｋｎｅｒ Ｐｅｎｔａｐｌａｓｔ Ｏｆ Ａｍｅｒｉｃａ， Ｉｎｃ． 熱充填積層体
US20200123419A1 (en) 2017-04-21 2020-04-23 3M Innovative Properties Company Barrier adhesive compositions and articles
KR102505265B1 (ko) 2017-06-23 2023-03-06 삼성디스플레이 주식회사 전자 장치
CN111465669B (zh) 2017-12-06 2022-12-16 3M创新有限公司 阻隔性粘合剂组合物和制品
US11349103B2 (en) * 2018-03-15 2022-05-31 Dell Products L.P. Display assembly apparatus and methods for information handling systems
DE102018112817A1 (de) 2018-05-29 2019-12-05 Klöckner Pentaplast Gmbh Transparente Polymerfolie mit Verfärbungskompensation
JP7388228B2 (ja) * 2020-02-14 2023-11-29 住友ベークライト株式会社 光硬化性接着剤組成物、フィルム、および光学部品
JP2021172812A (ja) * 2020-04-21 2021-11-01 Jsr株式会社 熱可塑性エラストマー組成物及び成形体
US20230322978A1 (en) * 2020-08-28 2023-10-12 Rimtec Corporation Cycloolefin resin cured product having oxygen barrier properties
EP4247881B1 (en) 2020-11-18 2025-01-29 Klöckner Pentaplast of America, Inc. Thermoformed packaging and methods of forming the same
CN117120535A (zh) 2021-04-15 2023-11-24 H.B.富乐公司 用于薄膜光伏模块中的处于膜形式的热熔融组合物

Family Cites Families (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3657159A (en) * 1968-10-14 1972-04-18 Hercules Inc Epoxide polymerization catalysts comprising complex organoaluminate compounds of silicon tin or phosphorus
US3657149A (en) * 1968-10-14 1972-04-18 Hercules Inc Catalyst compositions
EP0192965B1 (en) * 1985-01-30 1990-04-04 Kao Corporation Absorbent article
JPH0329291A (ja) * 1989-06-27 1991-02-07 Sumitomo Bakelite Co Ltd 有機分散型ｅｌランプ用捕水フィルム
EP0414258B1 (en) * 1989-08-25 1995-06-28 Mitsui Petrochemical Industries, Ltd. Information recording medium and adhesive composition therefor
US5238519A (en) * 1990-10-17 1993-08-24 United Solar Systems Corporation Solar cell lamination apparatus
US5252694A (en) * 1992-01-22 1993-10-12 Minnesota Mining And Manufacturing Company Energy-polymerization adhesive, coating, film and process for making the same
JPH05306311A (ja) * 1992-04-30 1993-11-19 Mitsubishi Petrochem Co Ltd グラフト変性共重合体の製造法
US5721289A (en) * 1994-11-04 1998-02-24 Minnesota Mining And Manufacturing Company Stable, low cure-temperature semi-structural pressure sensitive adhesive
US5973085A (en) * 1994-11-17 1999-10-26 Ciba Specialty Chemicals Corporation Monomers and composition which can be crosslinked and crosslinked polymers
JP3222361B2 (ja) * 1995-08-15 2001-10-29 キヤノン株式会社 太陽電池モジュールの製造方法及び太陽電池モジュール
AU731869B2 (en) * 1998-11-12 2001-04-05 Kaneka Corporation Solar cell module
US6226890B1 (en) * 2000-04-07 2001-05-08 Eastman Kodak Company Desiccation of moisture-sensitive electronic devices
WO2002061471A1 (fr) * 2001-01-31 2002-08-08 Zeon Corporation Plaque guide optique et unite d'eclairage
DE10141379A1 (de) * 2001-08-23 2003-04-30 Tesa Ag Oberflächenschutzfolie für lackierte Flächen mit einem Kleber auf Basis von hydrierten Blockcopolymeren
US6946676B2 (en) * 2001-11-05 2005-09-20 3M Innovative Properties Company Organic thin film transistor with polymeric interface
US6835950B2 (en) * 2002-04-12 2004-12-28 Universal Display Corporation Organic electronic devices with pressure sensitive adhesive layer
KR101028603B1 (ko) * 2002-06-17 2011-04-11 세키스이가가쿠 고교가부시키가이샤 유기 전계 발광 소자 밀봉용 접착제 및 그의 응용
US20040253464A1 (en) * 2002-07-30 2004-12-16 Thorsten Krawinkel Surface protection film for painted surfaces with an adhesive based on hydrogenated block copolymers
EP1308084A1 (en) * 2002-10-02 2003-05-07 Ciba SC Holding AG Synergistic UV absorber combination
US6790914B2 (en) * 2002-11-29 2004-09-14 Jsr Corporation Resin film and applications thereof
US6975067B2 (en) * 2002-12-19 2005-12-13 3M Innovative Properties Company Organic electroluminescent device and encapsulation method
US7018713B2 (en) * 2003-04-02 2006-03-28 3M Innovative Properties Company Flexible high-temperature ultrabarrier
US7279777B2 (en) * 2003-05-08 2007-10-09 3M Innovative Properties Company Organic polymers, laminates, and capacitors
US20040238846A1 (en) * 2003-05-30 2004-12-02 Georg Wittmann Organic electronic device
US7535017B2 (en) * 2003-05-30 2009-05-19 Osram Opto Semiconductors Gmbh Flexible multilayer packaging material and electronic devices with the packaging material
US20050090566A1 (en) * 2003-10-01 2005-04-28 Nitzman Alan F. Synthetic resins in casein-stabilized rosin size emulsions
JP4206899B2 (ja) * 2003-10-27 2009-01-14 Ｊｓｒ株式会社 面実装型ｌｅｄ素子
DE10357321A1 (de) * 2003-12-05 2005-07-21 Tesa Ag Hochtackige Klebmasse, Verfahren zu deren Herstellung und deren Verwendung
JP4410055B2 (ja) * 2004-08-02 2010-02-03 日東電工株式会社 位相差粘着剤層、その製造方法、粘着型光学フィルム、その製造方法および画像表示装置
JP2005347204A (ja) * 2004-06-07 2005-12-15 Canon Inc 有機ｅｌ素子及びその製造方法
JP2006008761A (ja) * 2004-06-23 2006-01-12 Tosoh Corp ホットメルト接着剤組成物
US7316756B2 (en) * 2004-07-27 2008-01-08 Eastman Kodak Company Desiccant for top-emitting OLED
US7875686B2 (en) * 2004-08-18 2011-01-25 Promerus Llc Polycycloolefin polymeric compositions for semiconductor applications
US20060063015A1 (en) * 2004-09-23 2006-03-23 3M Innovative Properties Company Protected polymeric film
KR101165487B1 (ko) * 2004-10-29 2012-07-13 쓰리엠 이노베이티브 프로퍼티즈 컴파니 시클릭 올레핀 공중합체를 혼입한 광학 필름
US7329465B2 (en) * 2004-10-29 2008-02-12 3M Innovative Properties Company Optical films incorporating cyclic olefin copolymers
CN101056900B (zh) * 2004-11-09 2011-09-07 出光兴产株式会社 光半导体密封材料
JPWO2006057218A1 (ja) * 2004-11-24 2008-06-05 株式会社カネカ 硬化性組成物およびその硬化性組成物により封止、被覆された半導体装置
WO2006067950A1 (ja) * 2004-12-22 2006-06-29 Jsr Corporation 環状オレフィン系付加共重合体の製造方法、環状オレフィン系付加共重合体およびその用途
JP2006186175A (ja) * 2004-12-28 2006-07-13 Nippon Zeon Co Ltd 電子部品用樹脂膜形成材料及びそれを用いた積層体
US7928174B2 (en) * 2005-01-04 2011-04-19 Dow Corning Corporation Organosilicon functional boron amine catalyst complexes and curable compositions made therefrom
JP2007065575A (ja) * 2005-09-02 2007-03-15 Jsr Corp 光学フィルム、偏光板および液晶表示装置
EP1937779A1 (en) * 2005-10-12 2008-07-02 Ciba Holding Inc. Encapsulated luminescent pigments
JP5213303B2 (ja) * 2006-01-17 2013-06-19 スリーエム イノベイティブ プロパティズ カンパニー 光硬化性吸湿性組成物及び有機ｅｌ素子
JP2007197517A (ja) * 2006-01-24 2007-08-09 Three M Innovative Properties Co 接着性封止組成物、封止フィルム及び有機ｅｌ素子
EP2004746B1 (en) * 2006-03-29 2018-08-01 Henkel AG & Co. KGaA Radiation-curable rubber adhesive/sealant
CN101454388B (zh) * 2006-05-23 2012-04-18 西巴控股有限公司 作为表面改性剂的n-取代的全氟烷基化的吡咯烷
JP5365891B2 (ja) * 2006-10-13 2013-12-11 日本ゼオン株式会社 発光素子用樹脂組成物、発光素子用積層体、発光素子
KR101569220B1 (ko) * 2007-08-16 2015-11-13 후지필름 가부시키가이샤 헤테로시클릭 화합물, 자외선 흡수제, 및 상기 자외선 흡수제를 포함하는 조성물
JP2011508062A (ja) * 2007-12-28 2011-03-10 スリーエム イノベイティブ プロパティズ カンパニー 可撓性封入フィルムシステム
WO2009113177A1 (ja) * 2008-03-14 2009-09-17 株式会社大塚製薬工場 プラスチックアンプルおよび着色プラスチック容器

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