JP2011522130A - 重合パラキシリレンまたは置換パラキシリレンの薄い層を堆積させるための堆積方法および堆積装置 - Google Patents
重合パラキシリレンまたは置換パラキシリレンの薄い層を堆積させるための堆積方法および堆積装置 Download PDFInfo
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- JP2011522130A JP2011522130A JP2011512105A JP2011512105A JP2011522130A JP 2011522130 A JP2011522130 A JP 2011522130A JP 2011512105 A JP2011512105 A JP 2011512105A JP 2011512105 A JP2011512105 A JP 2011512105A JP 2011522130 A JP2011522130 A JP 2011522130A
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- 238000000151 deposition Methods 0.000 title claims description 52
- 239000007789 gas Substances 0.000 claims abstract description 228
- 238000000034 method Methods 0.000 claims abstract description 82
- 239000000758 substrate Substances 0.000 claims abstract description 70
- 239000012159 carrier gas Substances 0.000 claims abstract description 45
- 238000000354 decomposition reaction Methods 0.000 claims abstract description 36
- 230000008021 deposition Effects 0.000 claims abstract description 33
- 238000002347 injection Methods 0.000 claims abstract description 30
- 239000007924 injection Substances 0.000 claims abstract description 30
- 239000007858 starting material Substances 0.000 claims abstract description 27
- 239000007788 liquid Substances 0.000 claims abstract description 12
- 239000007787 solid Substances 0.000 claims abstract description 9
- 238000001704 evaporation Methods 0.000 claims abstract description 7
- 239000000178 monomer Substances 0.000 claims description 38
- 238000000197 pyrolysis Methods 0.000 claims description 29
- 238000010438 heat treatment Methods 0.000 claims description 21
- 239000000539 dimer Substances 0.000 claims description 20
- 229920000642 polymer Polymers 0.000 claims description 16
- 239000012530 fluid Substances 0.000 claims description 10
- 238000001816 cooling Methods 0.000 claims description 9
- 239000002994 raw material Substances 0.000 claims description 9
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 230000008020 evaporation Effects 0.000 claims description 3
- 229910000831 Steel Inorganic materials 0.000 claims description 2
- 239000010959 steel Substances 0.000 claims description 2
- 239000010409 thin film Substances 0.000 claims description 2
- 238000005336 cracking Methods 0.000 claims 3
- 239000004020 conductor Substances 0.000 claims 1
- 239000011248 coating agent Substances 0.000 description 8
- 238000000576 coating method Methods 0.000 description 8
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- 239000012071 phase Substances 0.000 description 5
- 229920000052 poly(p-xylylene) Polymers 0.000 description 5
- 238000006116 polymerization reaction Methods 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical group [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 229910052786 argon Inorganic materials 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 229910052734 helium Inorganic materials 0.000 description 2
- 239000001307 helium Substances 0.000 description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 2
- 239000007791 liquid phase Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 230000000379 polymerizing effect Effects 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000005979 thermal decomposition reaction Methods 0.000 description 2
- OOLUVSIJOMLOCB-UHFFFAOYSA-N 1633-22-3 Chemical compound C1CC(C=C2)=CC=C2CCC2=CC=C1C=C2 OOLUVSIJOMLOCB-UHFFFAOYSA-N 0.000 description 1
- VRBFTYUMFJWSJY-UHFFFAOYSA-N 28804-46-8 Chemical compound ClC1CC(C=C2)=CC=C2C(Cl)CC2=CC=C1C=C2 VRBFTYUMFJWSJY-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 230000001143 conditioned effect Effects 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000010327 methods by industry Methods 0.000 description 1
- NRNFFDZCBYOZJY-UHFFFAOYSA-N p-quinodimethane Chemical group C=C1C=CC(=C)C=C1 NRNFFDZCBYOZJY-UHFFFAOYSA-N 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/60—Deposition of organic layers from vapour phase
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
- B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Chemical Vapour Deposition (AREA)
- Physical Vapour Deposition (AREA)
- Formation Of Insulating Films (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102008026974A DE102008026974A1 (de) | 2008-06-03 | 2008-06-03 | Verfahren und Vorrichtung zum Abscheiden dünner Schichten aus polymeren Para-Xylylene oder substituiertem Para-Xylylene |
| DE102008026974.3 | 2008-06-03 | ||
| PCT/EP2009/056768 WO2009147156A1 (de) | 2008-06-03 | 2009-06-03 | Verfahren und vorrichtung zum abscheiden dünner schichten aus polymeren para-xylylene oder substituiertem para-xylylene |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2011522130A true JP2011522130A (ja) | 2011-07-28 |
| JP2011522130A5 JP2011522130A5 (enExample) | 2012-07-12 |
Family
ID=41203865
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011512105A Pending JP2011522130A (ja) | 2008-06-03 | 2009-06-03 | 重合パラキシリレンまたは置換パラキシリレンの薄い層を堆積させるための堆積方法および堆積装置 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US20110293832A1 (enExample) |
| EP (1) | EP2293883B1 (enExample) |
| JP (1) | JP2011522130A (enExample) |
| KR (1) | KR101967778B1 (enExample) |
| CN (1) | CN102056679B (enExample) |
| DE (1) | DE102008026974A1 (enExample) |
| RU (1) | RU2481901C2 (enExample) |
| TW (1) | TWI463031B (enExample) |
| WO (1) | WO2009147156A1 (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013519794A (ja) * | 2010-02-17 | 2013-05-30 | アイクストロン、エスイー | コーティング装置及び遮蔽プレートを有するコーティング装置の操作方法 |
| JP2013227176A (ja) * | 2012-04-26 | 2013-11-07 | Asahi Glass Co Ltd | 光学素子の成形装置及び成形方法 |
Families Citing this family (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102010000479A1 (de) | 2010-02-19 | 2011-08-25 | Aixtron Ag, 52134 | Vorrichtung zur Homogenisierung eines verdampften Aerosols sowie Vorrichtung zum Abscheiden einer organischen Schicht auf einem Substrat mit einer derartigen Homogenisierungseinrichtung |
| DE102010000480A1 (de) | 2010-02-19 | 2011-08-25 | Aixtron Ag, 52134 | Vorrichtung zum Abscheiden einer organischen Schicht, insbesondere einer Polymerschicht mit einem Aerosolerzeuger sowie ein hierzu geeigneter Aerosolerzeuger |
| DE102010010819A1 (de) * | 2010-03-10 | 2011-09-15 | Osram Opto Semiconductors Gmbh | Verfahren und Vorrichtung zur Herstellung einer Parylen-Beschichtung |
| RU2461429C2 (ru) * | 2010-09-03 | 2012-09-20 | Российская Федерация, от имени которой выступает Министерство образования и науки РФ (Минобрнаука РФ) | Способ получения пленок полипараксилилена и его производных |
| TWI427839B (zh) * | 2010-12-03 | 2014-02-21 | Ind Tech Res Inst | 薄膜圖案的沉積裝置與方法 |
| KR101638765B1 (ko) * | 2011-04-29 | 2016-07-13 | 어플라이드 머티어리얼스, 인코포레이티드 | 반응성 증착 프로세스를 위한 가스 시스템 |
| DE102011051261A1 (de) * | 2011-06-22 | 2012-12-27 | Aixtron Se | Verfahren und Vorrichtung zum Abscheiden von OLEDs insbesondere Verdampfungsvorrichtung dazu |
| TWI458843B (zh) | 2011-10-06 | 2014-11-01 | Ind Tech Res Inst | 蒸鍍裝置與有機薄膜的形成方法 |
| US11060183B2 (en) * | 2012-03-23 | 2021-07-13 | Hzo, Inc. | Apparatuses, systems and methods for applying protective coatings to electronic device assemblies |
| US9238865B2 (en) * | 2012-02-06 | 2016-01-19 | Asm Ip Holding B.V. | Multiple vapor sources for vapor deposition |
| DE102013101534A1 (de) * | 2013-02-15 | 2014-08-21 | Aixtron Se | Gasverteiler für einen CVD-Reaktor |
| KR102150625B1 (ko) * | 2013-03-15 | 2020-10-27 | 삼성디스플레이 주식회사 | 코팅장치 |
| TW201540772A (zh) * | 2014-04-24 | 2015-11-01 | 美樺興業股份有限公司 | 高分子粒子及其製備方法 |
| DE102014115497A1 (de) * | 2014-10-24 | 2016-05-12 | Aixtron Se | Temperierte Gaszuleitung mit an mehreren Stellen eingespeisten Verdünnungsgasströmen |
| KR101709344B1 (ko) * | 2014-12-11 | 2017-03-08 | 한국과학기술원 | 종이기판 및 그 제조방법과 종이기판을 이용하는 센서 및 그 제조방법 |
| US10743421B2 (en) * | 2016-06-17 | 2020-08-11 | Hzo, Inc. | Mixing dimers for moisture resistant materials |
| CN108355855B (zh) * | 2018-03-23 | 2020-05-29 | 德淮半导体有限公司 | 增粘剂涂布装置 |
| GB201814231D0 (en) * | 2018-08-31 | 2018-10-17 | Univ Surrey | Apparatus for forming a poly(p-xylylene) film on a component |
| WO2020251696A1 (en) | 2019-06-10 | 2020-12-17 | Applied Materials, Inc. | Processing system for forming layers |
| US11788190B2 (en) | 2019-07-05 | 2023-10-17 | Asm Ip Holding B.V. | Liquid vaporizer |
| GB201913140D0 (en) * | 2019-09-12 | 2019-10-30 | Ucl Business Plc | Methods and apparatuses for fabricating polymeric conformal coatings, parts coated with polymeric conformal coatings, and optical apparatus |
| US11946136B2 (en) | 2019-09-20 | 2024-04-02 | Asm Ip Holding B.V. | Semiconductor processing device |
| KR102433553B1 (ko) * | 2020-07-30 | 2022-08-18 | 연세대학교 산학협력단 | 폴리머 증착기 및 폴리머 증착 방법 |
| CN114277359B (zh) * | 2021-12-28 | 2023-11-28 | 新美光(苏州)半导体科技有限公司 | 进气管道、化学气相沉积炉及向其通入前驱体的方法 |
| DE102022122315A1 (de) * | 2022-09-02 | 2024-03-07 | MAX-PLANCK-Gesellschaft zur Förderung der Wissenschaften e.V. | Verfahren und vorrichtung zur herstellung einer tragstruktur, tragstruktur und optisches gerät mit einer tragstruktur |
| CN115572946B (zh) * | 2022-09-16 | 2024-09-24 | 华为数字能源技术有限公司 | 一种钙钛矿的制备方法、制备设备及光电转换器 |
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| JPH03500429A (ja) * | 1988-07-25 | 1991-01-31 | ウルトラファイバー・インコーポレイテッド | 不織絶縁ウェブ |
| JPH10189569A (ja) * | 1996-11-07 | 1998-07-21 | Applied Materials Inc | 低誘電率の多層膜を堆積するための方法及び装置 |
| JP2000260764A (ja) * | 1999-03-08 | 2000-09-22 | Nec Corp | 半導体装置の製造装置 |
| JP2004228564A (ja) * | 2003-01-21 | 2004-08-12 | Ngk Insulators Ltd | 半導体製造装置用部品および半導体製造装置 |
| WO2008012921A1 (en) * | 2006-07-28 | 2008-01-31 | Daisankasei Co., Ltd. | Apparatus for chemical vapor deposition and method of chemical vapor deposition |
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-
2008
- 2008-06-03 DE DE102008026974A patent/DE102008026974A1/de not_active Withdrawn
-
2009
- 2009-06-03 US US12/995,170 patent/US20110293832A1/en not_active Abandoned
- 2009-06-03 RU RU2010154436/05A patent/RU2481901C2/ru not_active IP Right Cessation
- 2009-06-03 EP EP09757537.7A patent/EP2293883B1/de not_active Not-in-force
- 2009-06-03 KR KR1020107029891A patent/KR101967778B1/ko not_active Expired - Fee Related
- 2009-06-03 TW TW098118342A patent/TWI463031B/zh not_active IP Right Cessation
- 2009-06-03 JP JP2011512105A patent/JP2011522130A/ja active Pending
- 2009-06-03 WO PCT/EP2009/056768 patent/WO2009147156A1/de not_active Ceased
- 2009-06-03 CN CN200980120900.7A patent/CN102056679B/zh not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03500429A (ja) * | 1988-07-25 | 1991-01-31 | ウルトラファイバー・インコーポレイテッド | 不織絶縁ウェブ |
| JPH10189569A (ja) * | 1996-11-07 | 1998-07-21 | Applied Materials Inc | 低誘電率の多層膜を堆積するための方法及び装置 |
| JP2000260764A (ja) * | 1999-03-08 | 2000-09-22 | Nec Corp | 半導体装置の製造装置 |
| JP2004228564A (ja) * | 2003-01-21 | 2004-08-12 | Ngk Insulators Ltd | 半導体製造装置用部品および半導体製造装置 |
| WO2008012921A1 (en) * | 2006-07-28 | 2008-01-31 | Daisankasei Co., Ltd. | Apparatus for chemical vapor deposition and method of chemical vapor deposition |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013519794A (ja) * | 2010-02-17 | 2013-05-30 | アイクストロン、エスイー | コーティング装置及び遮蔽プレートを有するコーティング装置の操作方法 |
| JP2013227176A (ja) * | 2012-04-26 | 2013-11-07 | Asahi Glass Co Ltd | 光学素子の成形装置及び成形方法 |
Also Published As
| Publication number | Publication date |
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| KR101967778B1 (ko) | 2019-08-13 |
| EP2293883B1 (de) | 2018-03-21 |
| WO2009147156A1 (de) | 2009-12-10 |
| RU2010154436A (ru) | 2012-07-20 |
| CN102056679B (zh) | 2015-01-14 |
| EP2293883A1 (de) | 2011-03-16 |
| DE102008026974A1 (de) | 2009-12-10 |
| TWI463031B (zh) | 2014-12-01 |
| US20110293832A1 (en) | 2011-12-01 |
| CN102056679A (zh) | 2011-05-11 |
| KR20110015661A (ko) | 2011-02-16 |
| TW201009109A (en) | 2010-03-01 |
| RU2481901C2 (ru) | 2013-05-20 |
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