JP4074574B2 - 有機物気相蒸着装置 - Google Patents
有機物気相蒸着装置 Download PDFInfo
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- JP4074574B2 JP4074574B2 JP2003336534A JP2003336534A JP4074574B2 JP 4074574 B2 JP4074574 B2 JP 4074574B2 JP 2003336534 A JP2003336534 A JP 2003336534A JP 2003336534 A JP2003336534 A JP 2003336534A JP 4074574 B2 JP4074574 B2 JP 4074574B2
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- 238000007740 vapor deposition Methods 0.000 title claims description 32
- 238000006243 chemical reaction Methods 0.000 claims description 71
- 239000000758 substrate Substances 0.000 claims description 66
- 239000012071 phase Substances 0.000 claims description 44
- 238000010438 heat treatment Methods 0.000 claims description 26
- 239000011368 organic material Substances 0.000 claims description 26
- 239000012808 vapor phase Substances 0.000 claims description 23
- 238000010790 dilution Methods 0.000 claims description 18
- 239000012895 dilution Substances 0.000 claims description 18
- 238000001704 evaporation Methods 0.000 claims description 8
- 239000006185 dispersion Substances 0.000 claims description 6
- 238000001947 vapour-phase growth Methods 0.000 claims description 5
- 239000012530 fluid Substances 0.000 claims description 2
- 239000007789 gas Substances 0.000 description 132
- 239000010409 thin film Substances 0.000 description 41
- 238000000034 method Methods 0.000 description 19
- 239000000463 material Substances 0.000 description 11
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- 238000010926 purge Methods 0.000 description 10
- 238000000151 deposition Methods 0.000 description 9
- 238000001771 vacuum deposition Methods 0.000 description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 239000012495 reaction gas Substances 0.000 description 6
- 238000002207 thermal evaporation Methods 0.000 description 6
- 230000008021 deposition Effects 0.000 description 5
- 230000008020 evaporation Effects 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- 239000010408 film Substances 0.000 description 4
- 239000005416 organic matter Substances 0.000 description 4
- 238000000427 thin-film deposition Methods 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 239000006227 byproduct Substances 0.000 description 3
- 238000005137 deposition process Methods 0.000 description 3
- 239000011261 inert gas Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000003085 diluting agent Substances 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000001307 helium Substances 0.000 description 2
- 229910052734 helium Inorganic materials 0.000 description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 229910052743 krypton Inorganic materials 0.000 description 2
- DNNSSWSSYDEUBZ-UHFFFAOYSA-N krypton atom Chemical compound [Kr] DNNSSWSSYDEUBZ-UHFFFAOYSA-N 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910052754 neon Inorganic materials 0.000 description 2
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000032258 transport Effects 0.000 description 2
- 230000008016 vaporization Effects 0.000 description 2
- 229910052724 xenon Inorganic materials 0.000 description 2
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
- 238000010574 gas phase reaction Methods 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/228—Gas flow assisted PVD deposition
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
Description
図1によれば、真空チャンバ10内に有機物材料を置ける容器としてるつぼ60を導入し、るつぼ60に蒸着させる物質の適当量を予測して載せた後、真空チャンバ10の内部の圧力を約10−6Torr程度に下げる。その後、るつぼ加熱装置50を利用してるつぼ60の温度を調節して蒸着物質の融点の近くまで温度を上げる。以後に、再び温度を調節しつつ蒸着物質が気化するまでるつぼ60の温度を上げる。
しかしながら、本発明の実施例は種々の他の形態に変形でき、本発明の範囲が後述する実施例によって限定して解釈されてはならない。本発明の実施例は、当業者に本発明をさらに完全に説明するために提供されるものである。したがって、図面での要素の形状はさらに明確な説明を強調するために誇張されたと理解することが望ましい。図面上で同じ符号で表示された構成要素は同一の構成要素を意味している。
図3は、図2のソースチャンバ部を説明するための構成図である。
図2に示した本発明の有機物気相蒸着装置は、有機物薄膜の蒸着過程が行われる反応チャンバ100を備える。反応チャンバ100にいかなる一定の水準の真空を形成・維持するための真空ポンプ200が連結される。真空ポンプ200としては、例えば、一般的な回転ポンプを使用でき、チャンバ100に約0.001乃至100 Torrの圧力を提供する。また、このような真空ポンプ200は、反応チャンバ100の真空度をさらに提高するためにターボポンプをさらに使用できる。
110 シャワーヘッド
120 シャワーカーテン
130 基板支持部
135 リフトピン
150 温度調節部
160 支持軸
200 真空ポンプ
201 真空排出路
203 トラップ
205 絞り弁
208 反応チャンバ用クイックスイッチング弁
300,300' ソースチャンバ
340 パージガス移送路
350 ソース気相移送路
351,351' 反応チャンバ・ガス・クイック・スイッチング弁
355,355' ソース・アウト・クイック・スイッチング弁
357,357' ソース・イン・クイック・スイッチング弁
359,359' ソース・パージ・クイック・スイッチング弁
370 バイパス路
410 移送ガス供給源
411 移送ガス供給用レギュラ弁
413,413',453 流量調節計
417 移送ガス移送路
419,419' 移送ガス分配用クイックスイッチング弁
450 希釈ガス供給源
451 レギュラ弁
455 ソース・チャンバ・ガス・クイック・スイッチング弁
457 希釈ガス移送路
459 クイックスイッチング弁
500 ソース加熱部
Claims (7)
- 反応チャンバと、
該反応チャンバ内に設置されて導入される基板を支持する基板支持部と、
該基板支持部に設置されて前記基板の温度を調節する基板温度調節部と、
前記基板支持部に対向するように、前記反応チャンバ内に設置されて蒸着反応に参加する有機物ソース気相を、前記基板上に均一に分配するシャワーヘッドを有する蒸着部と、
前記シャワーヘッドに提供される前記有機物ソース気相を有機物材料から発生させるソースチャンバと、
前記有機物ソース気相を前記反応チャンバに移送するための移送ガスを提供する移送ガス供給源と、
前記ソースチャンバを覆い包んで前記ソースチャンバで前記有機物ソース気相を前記有機物材料から気化させるソース加熱部を有するソース部と、
前記移送ガス供給源から前記ソースチャンバ内に延び、前記ソースチャンバの内部に延びた部位に、前記移送ガスを前記ソースチャンバに引込む移送ガス引込口を有する移送ガス移送路と、
前記シャワーヘッドから前記ソースチャンバ内に延び、前記移送ガスによって運搬される前記有機物ソース気相を、前記ソースチャンバから引出す通路である有機物ソース気相引出し口を有する有機物ソース気相移送路とを備え、
前記ソースチャンバは、前記ソースチャンバ内に設置されて前記移送ガス引込口から引込まれる前記移送ガスを分散させる移送ガス分散部を備え、
前記移送ガス分散部は、頂点が前記移送ガス引込口の方向に整列された円錐ブロックまたは円錐状の板であることを特徴とする有機物気相蒸着装置。 - 前記シャワーヘッドと前記基板支持部間に導入されるシャワーカーテンを備えたことを特徴とする請求項1に記載の有機物気相蒸着装置。
- 前記ソース加熱部は、前記有機物ソース気相移送路を覆い包むように拡張されることを特徴とする請求項1に記載の有機物気相蒸着装置。
- 前記反応チャンバに、前記有機物ソース気相と共に提供される希釈ガスのための希釈ガス供給源を備えたことを特徴とする請求項1に記載の有機物気相蒸着装置。
- 前記反応チャンバに流入される流体の流量及び速度を調節するための流量制御部を備えたことを特徴とする請求項1に記載の有機物気相蒸着装置。
- 前記ソースチャンバは、相異なる成分の有機物ソース気相を生成するために多数が設置され、
それぞれの前記ソースチャンバから前記相異なる有機物ソース気相を順次に前記反応チャンバに時分割して流入させるか、またはバイパスさせるために設置された移送路と、
前記移送路に前記時分割のために設置された多数の弁部と
を備えたことを特徴とする請求項1に記載の有機物気相蒸着装置。 - 前記移送路及び前記弁部を加熱するように前記ソース加熱部は拡張されることを特徴とする請求項1に記載の有機物気相蒸着装置。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2002-0059133A KR100473806B1 (ko) | 2002-09-28 | 2002-09-28 | 유기물 박막 및 유기물 소자를 위한 대면적 유기물 기상증착 장치 및 제조 방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2004115916A JP2004115916A (ja) | 2004-04-15 |
JP4074574B2 true JP4074574B2 (ja) | 2008-04-09 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2003336534A Expired - Lifetime JP4074574B2 (ja) | 2002-09-28 | 2003-09-26 | 有機物気相蒸着装置 |
Country Status (3)
Country | Link |
---|---|
US (2) | US20040062862A1 (ja) |
JP (1) | JP4074574B2 (ja) |
KR (1) | KR100473806B1 (ja) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
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GB2435629A (en) * | 2005-02-18 | 2007-09-05 | Uvasol Ltd | Moulding of polymers |
KR100682742B1 (ko) * | 2005-03-22 | 2007-02-15 | 주식회사 아이피에스 | 박막증착장치 |
JP4911555B2 (ja) * | 2005-04-07 | 2012-04-04 | 国立大学法人東北大学 | 成膜装置および成膜方法 |
JP5568729B2 (ja) * | 2005-09-06 | 2014-08-13 | 国立大学法人東北大学 | 成膜装置および成膜方法 |
US7799377B2 (en) * | 2006-12-07 | 2010-09-21 | Electronics And Telecommunications Research Institute | Organic/inorganic thin film deposition method |
KR101441737B1 (ko) * | 2009-05-01 | 2014-09-17 | 카티바, 인크. | 유기 증기 인쇄용 장치 및 방법 |
CN102471884A (zh) * | 2009-08-13 | 2012-05-23 | 金南珍 | 用于形成层的设备 |
KR101279606B1 (ko) * | 2009-12-11 | 2013-07-05 | 한국전자통신연구원 | 그래핀 박막의 증착방법 |
US9238865B2 (en) | 2012-02-06 | 2016-01-19 | Asm Ip Holding B.V. | Multiple vapor sources for vapor deposition |
KR101389011B1 (ko) * | 2012-03-28 | 2014-04-24 | 주식회사 유니텍스 | 소스 컨테이너 및 기상 증착용 반응로 |
KR101376956B1 (ko) * | 2012-05-16 | 2014-03-21 | 주식회사 유니텍스 | 기상 증착용 반응로 및 유기 박막의 제조 방법 |
KR101338931B1 (ko) * | 2012-05-21 | 2013-12-09 | 주식회사 유니텍스 | 유기 기상 증착 장치 |
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JP2015195312A (ja) * | 2014-03-31 | 2015-11-05 | 株式会社ニューフレアテクノロジー | 気相成長装置および気相成長方法 |
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CN107058973A (zh) * | 2017-03-10 | 2017-08-18 | 常州大学 | 大面积钙钛矿薄膜的制备设备 |
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2002
- 2002-09-28 KR KR10-2002-0059133A patent/KR100473806B1/ko active IP Right Grant
-
2003
- 2003-09-26 US US10/672,013 patent/US20040062862A1/en not_active Abandoned
- 2003-09-26 JP JP2003336534A patent/JP4074574B2/ja not_active Expired - Lifetime
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2005
- 2005-08-23 US US11/211,111 patent/US20050287299A1/en not_active Abandoned
Also Published As
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US20050287299A1 (en) | 2005-12-29 |
JP2004115916A (ja) | 2004-04-15 |
KR100473806B1 (ko) | 2005-03-10 |
US20040062862A1 (en) | 2004-04-01 |
KR20040028048A (ko) | 2004-04-03 |
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