TWI463031B - 聚對二甲苯或經取代之對二甲苯薄膜的沉積方法及裝置 - Google Patents
聚對二甲苯或經取代之對二甲苯薄膜的沉積方法及裝置 Download PDFInfo
- Publication number
- TWI463031B TWI463031B TW098118342A TW98118342A TWI463031B TW I463031 B TWI463031 B TW I463031B TW 098118342 A TW098118342 A TW 098118342A TW 98118342 A TW98118342 A TW 98118342A TW I463031 B TWI463031 B TW I463031B
- Authority
- TW
- Taiwan
- Prior art keywords
- gas
- chamber
- substrate
- temperature
- bearing surface
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 26
- 230000008021 deposition Effects 0.000 title claims description 13
- 239000007789 gas Substances 0.000 claims description 161
- 239000000758 substrate Substances 0.000 claims description 111
- 238000006243 chemical reaction Methods 0.000 claims description 46
- 239000012159 carrier gas Substances 0.000 claims description 36
- 238000000354 decomposition reaction Methods 0.000 claims description 31
- 238000000197 pyrolysis Methods 0.000 claims description 30
- 239000000178 monomer Substances 0.000 claims description 29
- 238000010438 heat treatment Methods 0.000 claims description 26
- URLKBWYHVLBVBO-UHFFFAOYSA-N Para-Xylene Chemical group CC1=CC=C(C)C=C1 URLKBWYHVLBVBO-UHFFFAOYSA-N 0.000 claims description 20
- 239000007788 liquid Substances 0.000 claims description 20
- 239000002994 raw material Substances 0.000 claims description 19
- 238000000151 deposition Methods 0.000 claims description 18
- 229920000052 poly(p-xylylene) Polymers 0.000 claims description 13
- 239000000539 dimer Substances 0.000 claims description 12
- 229920000642 polymer Polymers 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 11
- 238000001816 cooling Methods 0.000 claims description 10
- 239000007787 solid Substances 0.000 claims description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 6
- 239000010931 gold Substances 0.000 claims description 6
- 229910052737 gold Inorganic materials 0.000 claims description 6
- 238000006116 polymerization reaction Methods 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 239000007858 starting material Substances 0.000 claims description 4
- 238000001704 evaporation Methods 0.000 claims description 3
- 229910000831 Steel Inorganic materials 0.000 claims description 2
- 239000010959 steel Substances 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims 1
- 239000011344 liquid material Substances 0.000 claims 1
- 239000011343 solid material Substances 0.000 claims 1
- 239000006200 vaporizer Substances 0.000 claims 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 8
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 6
- 238000009826 distribution Methods 0.000 description 5
- 238000000576 coating method Methods 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 239000012071 phase Substances 0.000 description 4
- 239000012495 reaction gas Substances 0.000 description 4
- 229910052786 argon Inorganic materials 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 229920006254 polymer film Polymers 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000001307 helium Substances 0.000 description 2
- 229910052734 helium Inorganic materials 0.000 description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- OOLUVSIJOMLOCB-UHFFFAOYSA-N 1633-22-3 Chemical compound C1CC(C=C2)=CC=C2CCC2=CC=C1C=C2 OOLUVSIJOMLOCB-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000006471 dimerization reaction Methods 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000013022 venting Methods 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/60—Deposition of organic layers from vapour phase
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
- B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Chemical Vapour Deposition (AREA)
- Physical Vapour Deposition (AREA)
- Formation Of Insulating Films (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102008026974A DE102008026974A1 (de) | 2008-06-03 | 2008-06-03 | Verfahren und Vorrichtung zum Abscheiden dünner Schichten aus polymeren Para-Xylylene oder substituiertem Para-Xylylene |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201009109A TW201009109A (en) | 2010-03-01 |
| TWI463031B true TWI463031B (zh) | 2014-12-01 |
Family
ID=41203865
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW098118342A TWI463031B (zh) | 2008-06-03 | 2009-06-03 | 聚對二甲苯或經取代之對二甲苯薄膜的沉積方法及裝置 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US20110293832A1 (enExample) |
| EP (1) | EP2293883B1 (enExample) |
| JP (1) | JP2011522130A (enExample) |
| KR (1) | KR101967778B1 (enExample) |
| CN (1) | CN102056679B (enExample) |
| DE (1) | DE102008026974A1 (enExample) |
| RU (1) | RU2481901C2 (enExample) |
| TW (1) | TWI463031B (enExample) |
| WO (1) | WO2009147156A1 (enExample) |
Families Citing this family (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102010000447A1 (de) | 2010-02-17 | 2011-08-18 | Aixtron Ag, 52134 | Beschichtungsvorrichtung sowie Verfahren zum Betrieb einer Beschichtungsvorrichtung mit einer Schirmplatte |
| DE102010000479A1 (de) | 2010-02-19 | 2011-08-25 | Aixtron Ag, 52134 | Vorrichtung zur Homogenisierung eines verdampften Aerosols sowie Vorrichtung zum Abscheiden einer organischen Schicht auf einem Substrat mit einer derartigen Homogenisierungseinrichtung |
| DE102010000480A1 (de) | 2010-02-19 | 2011-08-25 | Aixtron Ag, 52134 | Vorrichtung zum Abscheiden einer organischen Schicht, insbesondere einer Polymerschicht mit einem Aerosolerzeuger sowie ein hierzu geeigneter Aerosolerzeuger |
| DE102010010819A1 (de) * | 2010-03-10 | 2011-09-15 | Osram Opto Semiconductors Gmbh | Verfahren und Vorrichtung zur Herstellung einer Parylen-Beschichtung |
| RU2461429C2 (ru) * | 2010-09-03 | 2012-09-20 | Российская Федерация, от имени которой выступает Министерство образования и науки РФ (Минобрнаука РФ) | Способ получения пленок полипараксилилена и его производных |
| TWI427839B (zh) * | 2010-12-03 | 2014-02-21 | Ind Tech Res Inst | 薄膜圖案的沉積裝置與方法 |
| KR101638765B1 (ko) * | 2011-04-29 | 2016-07-13 | 어플라이드 머티어리얼스, 인코포레이티드 | 반응성 증착 프로세스를 위한 가스 시스템 |
| DE102011051261A1 (de) * | 2011-06-22 | 2012-12-27 | Aixtron Se | Verfahren und Vorrichtung zum Abscheiden von OLEDs insbesondere Verdampfungsvorrichtung dazu |
| TWI458843B (zh) | 2011-10-06 | 2014-11-01 | Ind Tech Res Inst | 蒸鍍裝置與有機薄膜的形成方法 |
| US11060183B2 (en) * | 2012-03-23 | 2021-07-13 | Hzo, Inc. | Apparatuses, systems and methods for applying protective coatings to electronic device assemblies |
| US9238865B2 (en) * | 2012-02-06 | 2016-01-19 | Asm Ip Holding B.V. | Multiple vapor sources for vapor deposition |
| JP5953906B2 (ja) * | 2012-04-26 | 2016-07-20 | 旭硝子株式会社 | 光学素子の成形装置及び成形方法 |
| DE102013101534A1 (de) * | 2013-02-15 | 2014-08-21 | Aixtron Se | Gasverteiler für einen CVD-Reaktor |
| KR102150625B1 (ko) * | 2013-03-15 | 2020-10-27 | 삼성디스플레이 주식회사 | 코팅장치 |
| TW201540772A (zh) * | 2014-04-24 | 2015-11-01 | 美樺興業股份有限公司 | 高分子粒子及其製備方法 |
| DE102014115497A1 (de) * | 2014-10-24 | 2016-05-12 | Aixtron Se | Temperierte Gaszuleitung mit an mehreren Stellen eingespeisten Verdünnungsgasströmen |
| KR101709344B1 (ko) * | 2014-12-11 | 2017-03-08 | 한국과학기술원 | 종이기판 및 그 제조방법과 종이기판을 이용하는 센서 및 그 제조방법 |
| US10743421B2 (en) * | 2016-06-17 | 2020-08-11 | Hzo, Inc. | Mixing dimers for moisture resistant materials |
| CN108355855B (zh) * | 2018-03-23 | 2020-05-29 | 德淮半导体有限公司 | 增粘剂涂布装置 |
| GB201814231D0 (en) * | 2018-08-31 | 2018-10-17 | Univ Surrey | Apparatus for forming a poly(p-xylylene) film on a component |
| WO2020251696A1 (en) | 2019-06-10 | 2020-12-17 | Applied Materials, Inc. | Processing system for forming layers |
| US11788190B2 (en) | 2019-07-05 | 2023-10-17 | Asm Ip Holding B.V. | Liquid vaporizer |
| GB201913140D0 (en) * | 2019-09-12 | 2019-10-30 | Ucl Business Plc | Methods and apparatuses for fabricating polymeric conformal coatings, parts coated with polymeric conformal coatings, and optical apparatus |
| US11946136B2 (en) | 2019-09-20 | 2024-04-02 | Asm Ip Holding B.V. | Semiconductor processing device |
| KR102433553B1 (ko) * | 2020-07-30 | 2022-08-18 | 연세대학교 산학협력단 | 폴리머 증착기 및 폴리머 증착 방법 |
| CN114277359B (zh) * | 2021-12-28 | 2023-11-28 | 新美光(苏州)半导体科技有限公司 | 进气管道、化学气相沉积炉及向其通入前驱体的方法 |
| DE102022122315A1 (de) * | 2022-09-02 | 2024-03-07 | MAX-PLANCK-Gesellschaft zur Förderung der Wissenschaften e.V. | Verfahren und vorrichtung zur herstellung einer tragstruktur, tragstruktur und optisches gerät mit einer tragstruktur |
| CN115572946B (zh) * | 2022-09-16 | 2024-09-24 | 华为数字能源技术有限公司 | 一种钙钛矿的制备方法、制备设备及光电转换器 |
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| US5958510A (en) * | 1996-01-08 | 1999-09-28 | Applied Materials, Inc. | Method and apparatus for forming a thin polymer layer on an integrated circuit structure |
| US5986874A (en) * | 1997-06-03 | 1999-11-16 | Watkins-Johnson Company | Electrostatic support assembly having an integral ion focus ring |
| US6033732A (en) * | 1994-12-28 | 2000-03-07 | Mitsushita Denki Kabushiki Kaisha | Apparatus for and method of forming thin film by chemical vapor deposition |
| US20030054099A1 (en) * | 2000-02-16 | 2003-03-20 | Holger Jurgensen | Condensation coating process |
| US20050260833A1 (en) * | 2004-05-22 | 2005-11-24 | Mcfeely Fenton R | Constant emissivity deposition member |
| US20050282987A1 (en) * | 2004-05-28 | 2005-12-22 | Nec Corporation | Copolymerized high polymer film and method of manufacturing the same |
| US20090260571A1 (en) * | 2008-04-16 | 2009-10-22 | Novellus Systems, Inc. | Showerhead for chemical vapor deposition |
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| US3288728A (en) | 1966-02-18 | 1966-11-29 | Union Carbide Corp | Para-xylylene copolymers |
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| SU1840423A1 (ru) * | 1982-04-15 | 2007-03-20 | НПО "Астрофизика", Институт неорганической химии СО АН СССР | Способ получения покрытий из металлов |
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| JP3247270B2 (ja) * | 1994-08-25 | 2002-01-15 | 東京エレクトロン株式会社 | 処理装置及びドライクリーニング方法 |
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-
2008
- 2008-06-03 DE DE102008026974A patent/DE102008026974A1/de not_active Withdrawn
-
2009
- 2009-06-03 US US12/995,170 patent/US20110293832A1/en not_active Abandoned
- 2009-06-03 RU RU2010154436/05A patent/RU2481901C2/ru not_active IP Right Cessation
- 2009-06-03 EP EP09757537.7A patent/EP2293883B1/de not_active Not-in-force
- 2009-06-03 KR KR1020107029891A patent/KR101967778B1/ko not_active Expired - Fee Related
- 2009-06-03 TW TW098118342A patent/TWI463031B/zh not_active IP Right Cessation
- 2009-06-03 JP JP2011512105A patent/JP2011522130A/ja active Pending
- 2009-06-03 WO PCT/EP2009/056768 patent/WO2009147156A1/de not_active Ceased
- 2009-06-03 CN CN200980120900.7A patent/CN102056679B/zh not_active Expired - Fee Related
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6033732A (en) * | 1994-12-28 | 2000-03-07 | Mitsushita Denki Kabushiki Kaisha | Apparatus for and method of forming thin film by chemical vapor deposition |
| US5958510A (en) * | 1996-01-08 | 1999-09-28 | Applied Materials, Inc. | Method and apparatus for forming a thin polymer layer on an integrated circuit structure |
| US5986874A (en) * | 1997-06-03 | 1999-11-16 | Watkins-Johnson Company | Electrostatic support assembly having an integral ion focus ring |
| US20030054099A1 (en) * | 2000-02-16 | 2003-03-20 | Holger Jurgensen | Condensation coating process |
| US20050260833A1 (en) * | 2004-05-22 | 2005-11-24 | Mcfeely Fenton R | Constant emissivity deposition member |
| US20050282987A1 (en) * | 2004-05-28 | 2005-12-22 | Nec Corporation | Copolymerized high polymer film and method of manufacturing the same |
| US20090260571A1 (en) * | 2008-04-16 | 2009-10-22 | Novellus Systems, Inc. | Showerhead for chemical vapor deposition |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101967778B1 (ko) | 2019-08-13 |
| EP2293883B1 (de) | 2018-03-21 |
| WO2009147156A1 (de) | 2009-12-10 |
| RU2010154436A (ru) | 2012-07-20 |
| CN102056679B (zh) | 2015-01-14 |
| EP2293883A1 (de) | 2011-03-16 |
| DE102008026974A1 (de) | 2009-12-10 |
| JP2011522130A (ja) | 2011-07-28 |
| US20110293832A1 (en) | 2011-12-01 |
| CN102056679A (zh) | 2011-05-11 |
| KR20110015661A (ko) | 2011-02-16 |
| TW201009109A (en) | 2010-03-01 |
| RU2481901C2 (ru) | 2013-05-20 |
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