JP2011506259A5 - - Google Patents

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Publication number
JP2011506259A5
JP2011506259A5 JP2010538600A JP2010538600A JP2011506259A5 JP 2011506259 A5 JP2011506259 A5 JP 2011506259A5 JP 2010538600 A JP2010538600 A JP 2010538600A JP 2010538600 A JP2010538600 A JP 2010538600A JP 2011506259 A5 JP2011506259 A5 JP 2011506259A5
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JP
Japan
Prior art keywords
units
silica
group
unit
relative proportion
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JP2010538600A
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English (en)
Japanese (ja)
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JP5394390B2 (ja
JP2011506259A (ja
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Priority claimed from DE102007055879A external-priority patent/DE102007055879A1/de
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Publication of JP2011506259A publication Critical patent/JP2011506259A/ja
Publication of JP2011506259A5 publication Critical patent/JP2011506259A5/ja
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Publication of JP5394390B2 publication Critical patent/JP5394390B2/ja
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JP2010538600A 2007-12-19 2008-12-12 酸化条件下でのシリカの疎水化法 Active JP5394390B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102007055879A DE102007055879A1 (de) 2007-12-19 2007-12-19 Hydrophobierung von Kieselsäuren und oxidierenden Bedingungen
DE102007055879.3 2007-12-19
PCT/EP2008/067377 WO2009077437A1 (de) 2007-12-19 2008-12-12 Hydrophobierung von kieselsäuren unter oxidierenden bedingungen

Publications (3)

Publication Number Publication Date
JP2011506259A JP2011506259A (ja) 2011-03-03
JP2011506259A5 true JP2011506259A5 (enExample) 2013-10-10
JP5394390B2 JP5394390B2 (ja) 2014-01-22

Family

ID=40512911

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010538600A Active JP5394390B2 (ja) 2007-12-19 2008-12-12 酸化条件下でのシリカの疎水化法

Country Status (7)

Country Link
US (1) US8470443B2 (enExample)
EP (1) EP2220172B1 (enExample)
JP (1) JP5394390B2 (enExample)
KR (1) KR101259244B1 (enExample)
CN (1) CN101903472B (enExample)
DE (1) DE102007055879A1 (enExample)
WO (1) WO2009077437A1 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9581922B2 (en) 2012-03-26 2017-02-28 Cabot Corporation Treated fumed silica
EP2781558B1 (de) 2013-03-19 2016-12-14 Evonik Degussa GmbH Modifizierte kieselsäure enthaltende zusammensetzung und diese zusammensetzung enthaltender silikonkautschuk
DE102013224206A1 (de) 2013-11-27 2015-05-28 Wacker Chemie Ag Oberflächenmodifizierte partikuläre Metalloxide
US10058918B2 (en) * 2014-05-09 2018-08-28 United Technologies Corporation Surface treatment of powers
CN106794996B (zh) 2014-10-03 2026-06-16 亚斯朋空气凝胶公司 改良的疏水性气凝胶材料
DE102015216505A1 (de) 2015-08-28 2017-03-02 Wacker Chemie Ag Silica Formkörper mit geringer thermischer Leitfähigkeit
KR101698525B1 (ko) * 2015-09-03 2017-02-06 (주)티엠에스 전자파 차폐용 점착 조성물 및 이를 사용하여 제조된 전자파 차폐용 점착 시트
CN108780253A (zh) * 2016-03-31 2018-11-09 陶氏环球技术有限责任公司 用钝化薄膜晶体管组件
CN106978103A (zh) * 2017-04-07 2017-07-25 德山化工(浙江)有限公司 硅油处理热解法二氧化硅、其制备方法及应用
EP3929155A4 (en) * 2019-02-21 2022-04-06 Mitsubishi Chemical Corporation SILICA PARTICLES AND METHOD OF MANUFACTURE THEREOF, SILICA SOL, POLISHING COMPOSITION, POLISHING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR WAFER AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES
BR112022013832A2 (pt) * 2020-01-14 2022-09-13 Evonik Operations Gmbh Sílica pirogenada com atividade de superfície modificada
CN116529308B (zh) * 2020-12-16 2026-03-17 住友电气工业株式会社 树脂组合物、光纤的次级被覆材料、光纤以及光纤的制造方法

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3408306A (en) 1959-07-20 1968-10-29 Hercules Inc Method of controlling foaming
US3924029A (en) * 1962-03-30 1975-12-02 Degussa Method of modifying the surface properties of finely divided metal oxides
DE1163784C2 (de) 1962-03-30 1973-05-03 Degussa Verfahren zur Oberflaechenbehandlung von hochdispersen Oxyden
US3207698A (en) 1963-02-13 1965-09-21 Nopco Chem Co Composition and method for defoaming aqueous systems
DE2513608C2 (de) 1975-03-27 1982-08-05 Degussa Ag, 6000 Frankfurt Verfahren zur Hydrophobierung von Kieselsäuren und Silikaten mit Organosilanen
US4208316A (en) 1978-06-29 1980-06-17 Deutsche Gold- Und Silber-Scheideanstalt Vormals Roessler Hydrophobic precipitated silicic acid and compositions containing same
DE2929587C2 (de) 1979-07-21 1981-08-27 Degussa Ag, 6000 Frankfurt Hydrophobe Füllstoff-Mischung, Verfahren zu deren Herstellung und deren Verwendung
DE4419234A1 (de) 1994-06-01 1995-12-07 Wacker Chemie Gmbh Verfahren zur Silylierung von anorganischen Oxiden
US6316050B1 (en) * 1997-12-22 2001-11-13 Degussa Method of producing hydrophobic pyrogenically produced oxides
DE19757210A1 (de) 1997-12-22 1999-07-01 Degussa Hydrophobierte, pyrogen hergestellte Oxide
US6239243B1 (en) 1999-06-10 2001-05-29 Dow Corning Corporation Method for preparing hydrophilic silica gels with high pore volume
WO2001048094A1 (en) 1999-12-24 2001-07-05 Nippon Aerosil Co., Ltd. Surface-modified inorganic oxide powder, process for producing the same, and use thereof
JP2003238574A (ja) * 2001-12-12 2003-08-27 Mitsubishi Chemicals Corp 有機基担持シリカゲル
JP3877608B2 (ja) * 2002-02-12 2007-02-07 三井化学株式会社 シリル化された多孔質シリカの製造方法
DE10239423A1 (de) 2002-08-28 2004-03-11 Degussa Ag Kieselsäure
JP4803630B2 (ja) * 2003-05-21 2011-10-26 扶桑化学工業株式会社 高純度疎水性有機溶媒分散シリカゾルの製造方法
DE102004010756A1 (de) 2004-03-05 2005-09-22 Degussa Ag Silanisierte Kieselsäuren
JP4847050B2 (ja) * 2004-06-07 2011-12-28 扶桑化学工業株式会社 膜形成用組成物及び膜の形成方法
WO2006010764A1 (de) * 2004-07-28 2006-02-02 Ge Bayer Silicones Gmbh & Co. Kg Verfahren zur herstellung eines oberflaechenbehandelten oxidischen füllstoffes
JP4615952B2 (ja) * 2004-09-30 2011-01-19 株式会社トクヤマ 改質疎水化シリカ及びその製造方法
US9308520B2 (en) 2005-12-16 2016-04-12 Akzo Nobel N.V. Silica based material
US8202502B2 (en) * 2006-09-15 2012-06-19 Cabot Corporation Method of preparing hydrophobic silica
DE102006061057A1 (de) 2006-12-22 2008-06-26 Wacker Chemie Ag Organofunktionelle Silikonharzschichten auf Metalloxiden
DE102006061584A1 (de) * 2006-12-27 2008-07-03 Wacker Chemie Ag Organosiliciumverbindungen und deren Verwendung in vernetzbaren Massen

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