JP2011505705A5 - - Google Patents

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Publication number
JP2011505705A5
JP2011505705A5 JP2010536543A JP2010536543A JP2011505705A5 JP 2011505705 A5 JP2011505705 A5 JP 2011505705A5 JP 2010536543 A JP2010536543 A JP 2010536543A JP 2010536543 A JP2010536543 A JP 2010536543A JP 2011505705 A5 JP2011505705 A5 JP 2011505705A5
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JP
Japan
Prior art keywords
site
forming
electrically connected
layer
conductor
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Application number
JP2010536543A
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English (en)
Japanese (ja)
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JP5567489B2 (ja
JP2011505705A (ja
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Priority claimed from US11/949,951 external-priority patent/US20090032941A1/en
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Publication of JP2011505705A publication Critical patent/JP2011505705A/ja
Publication of JP2011505705A5 publication Critical patent/JP2011505705A5/ja
Application granted granted Critical
Publication of JP5567489B2 publication Critical patent/JP5567489B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2010536543A 2007-12-04 2008-12-04 アンダーバンプ配線層の方法および装置 Expired - Fee Related JP5567489B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/949,951 US20090032941A1 (en) 2007-08-01 2007-12-04 Under Bump Routing Layer Method and Apparatus
US11/949,951 2007-12-04
PCT/IB2008/003343 WO2009071982A2 (en) 2007-12-04 2008-12-04 Under bump routing layer method and apparatus

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2013030065A Division JP5654067B2 (ja) 2007-12-04 2013-02-19 アンダーバンプ配線層の方法および装置

Publications (3)

Publication Number Publication Date
JP2011505705A JP2011505705A (ja) 2011-02-24
JP2011505705A5 true JP2011505705A5 (enExample) 2012-02-09
JP5567489B2 JP5567489B2 (ja) 2014-08-06

Family

ID=40592064

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2010536543A Expired - Fee Related JP5567489B2 (ja) 2007-12-04 2008-12-04 アンダーバンプ配線層の方法および装置
JP2013030065A Expired - Fee Related JP5654067B2 (ja) 2007-12-04 2013-02-19 アンダーバンプ配線層の方法および装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2013030065A Expired - Fee Related JP5654067B2 (ja) 2007-12-04 2013-02-19 アンダーバンプ配線層の方法および装置

Country Status (6)

Country Link
US (1) US20090032941A1 (enExample)
EP (1) EP2229694B1 (enExample)
JP (2) JP5567489B2 (enExample)
KR (1) KR20100102635A (enExample)
CN (1) CN101952962A (enExample)
WO (1) WO2009071982A2 (enExample)

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WO2019116482A1 (ja) * 2017-12-14 2019-06-20 三菱電機株式会社 半導体装置
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