KR20100102635A - 언더 범프 라우팅 층 방법 및 장치 - Google Patents
언더 범프 라우팅 층 방법 및 장치 Download PDFInfo
- Publication number
- KR20100102635A KR20100102635A KR1020107014910A KR20107014910A KR20100102635A KR 20100102635 A KR20100102635 A KR 20100102635A KR 1020107014910 A KR1020107014910 A KR 1020107014910A KR 20107014910 A KR20107014910 A KR 20107014910A KR 20100102635 A KR20100102635 A KR 20100102635A
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- conductor
- solder
- site
- redistribution layer
- layer
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
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- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
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Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/949,951 US20090032941A1 (en) | 2007-08-01 | 2007-12-04 | Under Bump Routing Layer Method and Apparatus |
| US11/949,951 | 2007-12-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20100102635A true KR20100102635A (ko) | 2010-09-24 |
Family
ID=40592064
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020107014910A Ceased KR20100102635A (ko) | 2007-12-04 | 2008-12-04 | 언더 범프 라우팅 층 방법 및 장치 |
Country Status (6)
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| EP (1) | EP2229694B1 (enExample) |
| JP (2) | JP5567489B2 (enExample) |
| KR (1) | KR20100102635A (enExample) |
| CN (1) | CN101952962A (enExample) |
| WO (1) | WO2009071982A2 (enExample) |
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| US7790501B2 (en) * | 2008-07-02 | 2010-09-07 | Ati Technologies Ulc | Semiconductor chip passivation structures and methods of making the same |
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| TWI541964B (zh) * | 2010-11-23 | 2016-07-11 | 矽品精密工業股份有限公司 | 半導體基板之製法 |
| US20120175772A1 (en) * | 2011-01-07 | 2012-07-12 | Leung Andrew K | Alternative surface finishes for flip-chip ball grid arrays |
| US8647974B2 (en) | 2011-03-25 | 2014-02-11 | Ati Technologies Ulc | Method of fabricating a semiconductor chip with supportive terminal pad |
| US8564030B2 (en) | 2011-06-10 | 2013-10-22 | Advanced Micro Devices | Self-aligned trench contact and local interconnect with replacement gate process |
| US8716124B2 (en) | 2011-11-14 | 2014-05-06 | Advanced Micro Devices | Trench silicide and gate open with local interconnect with replacement gate process |
| US9257276B2 (en) * | 2011-12-31 | 2016-02-09 | Intel Corporation | Organic thin film passivation of metal interconnections |
| WO2013101243A1 (en) | 2011-12-31 | 2013-07-04 | Intel Corporation | High density package interconnects |
| EP2738809A3 (en) * | 2012-11-30 | 2017-05-10 | Enpirion, Inc. | Semiconductor device including gate drivers around a periphery thereof |
| CN103887248B (zh) * | 2012-12-21 | 2017-12-12 | 比亚迪股份有限公司 | 一种igbt结构及其制备方法 |
| GB2520952A (en) | 2013-12-04 | 2015-06-10 | Ibm | Flip-chip electronic device with carrier having heat dissipation elements free of solder mask |
| JP6771308B2 (ja) * | 2016-05-02 | 2020-10-21 | 三菱電機株式会社 | 回路基板および半導体集積回路の実装構造 |
| DE102018105166B4 (de) * | 2017-11-15 | 2024-01-18 | Taiwan Semiconductor Manufacturing Co., Ltd. | Zwei vorrichtungen zu einem halbleiter-package und verfahren zur herstellung eines halbleiter-package |
| WO2019116482A1 (ja) * | 2017-12-14 | 2019-06-20 | 三菱電機株式会社 | 半導体装置 |
| US11462513B2 (en) * | 2020-12-29 | 2022-10-04 | United Microelectronics Corp. | Chip bonding alignment structure, chip bonding structure and methods for fabricating the same |
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-
2007
- 2007-12-04 US US11/949,951 patent/US20090032941A1/en not_active Abandoned
-
2008
- 2008-12-04 JP JP2010536543A patent/JP5567489B2/ja not_active Expired - Fee Related
- 2008-12-04 CN CN2008801260899A patent/CN101952962A/zh active Pending
- 2008-12-04 EP EP08855955.4A patent/EP2229694B1/en active Active
- 2008-12-04 KR KR1020107014910A patent/KR20100102635A/ko not_active Ceased
- 2008-12-04 WO PCT/IB2008/003343 patent/WO2009071982A2/en not_active Ceased
-
2013
- 2013-02-19 JP JP2013030065A patent/JP5654067B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| WO2009071982A2 (en) | 2009-06-11 |
| EP2229694B1 (en) | 2017-01-25 |
| JP2013093630A (ja) | 2013-05-16 |
| CN101952962A (zh) | 2011-01-19 |
| WO2009071982A3 (en) | 2009-07-23 |
| EP2229694A2 (en) | 2010-09-22 |
| JP5654067B2 (ja) | 2015-01-14 |
| JP5567489B2 (ja) | 2014-08-06 |
| JP2011505705A (ja) | 2011-02-24 |
| US20090032941A1 (en) | 2009-02-05 |
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