JP2011504718A - 冷却部材 - Google Patents
冷却部材 Download PDFInfo
- Publication number
- JP2011504718A JP2011504718A JP2010532085A JP2010532085A JP2011504718A JP 2011504718 A JP2011504718 A JP 2011504718A JP 2010532085 A JP2010532085 A JP 2010532085A JP 2010532085 A JP2010532085 A JP 2010532085A JP 2011504718 A JP2011504718 A JP 2011504718A
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- 238000001816 cooling Methods 0.000 title claims abstract description 75
- 239000012530 fluid Substances 0.000 claims abstract description 40
- 238000001746 injection moulding Methods 0.000 claims abstract description 11
- 230000000694 effects Effects 0.000 claims abstract description 10
- 239000007769 metal material Substances 0.000 claims description 4
- 239000007788 liquid Substances 0.000 description 14
- 239000012809 cooling fluid Substances 0.000 description 11
- 239000003507 refrigerant Substances 0.000 description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 5
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000004378 air conditioning Methods 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000011780 sodium chloride Substances 0.000 description 3
- 238000009423 ventilation Methods 0.000 description 3
- -1 copper Chemical class 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 239000001110 calcium chloride Substances 0.000 description 1
- 229910001628 calcium chloride Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20936—Liquid coolant with phase change
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
【選択図】図6
Description
Claims (20)
- 可変速度駆動装置において、
前記駆動装置の作動中、熱を発生させる前記駆動装置の構成要素と、
前記構成要素を受け入れる形態とされた面を有する基部を備える冷却部材とを備え、該冷却部材は、
前記基部の前記面に形成されたタブと、
前記基部に形成され、貫通する流体を受け入れる形態とされた通路と、を更に備え、
前記通路を通って流れる流体の一部分は、前記タブに向けられ、前記流体は、構成要素に対する冷却効果を提供し、前記基部は、射出成形過程により製造される、可変速度駆動装置。 - 請求項1に記載の可変速度駆動装置において、前記基部の表面に形成され、シールを受け入れて流体の漏出を防止する形態とされた通路を備える、可変速度駆動装置。
- 請求項1に記載の可変速度駆動装置において、入口通路と、出口通路とを備え、流体は該入口通路を通って基部に入り、該出口通路を通って基部から出る、可変速度駆動装置。
- 請求項3に記載の可変速度駆動装置において、タブ入口と、タブ出口とを備え、入口通路内の流体の一部分は、前記タブ入口を通じてタブに向けられ且つ前記タブを横断して流れ、流体は前記タブ出口を通じて前記出口通路に排出される、可変速度駆動装置。
- 請求項1に記載の可変速度駆動装置において、前記通路の断面積は、所定の流体の流れ及び流体の圧力降下の必要量を満足させる寸法とされる、可変速度駆動装置。
- 請求項1に記載の可変速度駆動装置において、前記基部は非金属材料製である、可変速度駆動装置。
- 可変速度駆動装置用の冷却部材において、
構成要素を受け入れる形態とされた面を有する基部を備え、該基部は、
前記基部の前記面に形成されたタブと、
前記基部に形成され、貫通する流体を受け入れる形態とされた通路と、を更に備え、
前記通路を通って流れる流体の一部分は、前記タブに向けられ、前記流体は、構成要素に対する冷却効果を提供し、前記基部は、射出成形過程により製造される、可変速度駆動装置用の冷却部材。 - 請求項7に記載の冷却部材において、前記基部の表面に形成され、シールを受け入れて流体の漏出を防止する形態とされた通路を備える、冷却部材。
- 請求項7に記載の冷却部材において、入口通路と、出口通路とを備え、流体は該入口通路を通って基部に入り、該出口通路を通って基部から出る、冷却部材。
- 請求項9に記載の冷却部材において、タブ入口と、タブ出口とを備え、入口通路内の流体の一部分は、前記タブ入口を通じてタブに向けられ且つ前記タブを横断して流れ、流体は前記タブ出口を通じて前記出口通路に排出される、冷却部材。
- 請求項7に記載の冷却部材において、前記通路の断面積は、所定の流体の流れ及び流体の圧力降下の必要量を満足させる寸法とされる、冷却部材。
- 請求項7に記載の冷却部材において、前記基部は非金属材料製である、冷却部材。
- 可変速度駆動装置において、
前記駆動装置の作動中、熱を発生させる前記駆動装置の少なくとも2つの構成要素と、
前記少なくとも2つの構成要素を受け入れる形態とされた面を有する少なくとも2つの基部とを備え、該少なくとも2つの基部の各々の基部は、
前記基部の前記面に形成されたタブと、
前記基部に形成され、貫通する流体を受け入れる形態とされた通路と、を更に備え、
前記通路を通って流れる流体の一部分は、前記タブに向けられ、前記流体は、構成要素に対する冷却効果を提供し、前記少なくとも2つの基部は、射出成形過程により製造され、
前記少なくとも2つの基部は、貫通する連続した通路を形成するよう接続される、可変速度駆動装置。 - 請求項13に記載の可変速度駆動装置において、前記基部の表面に形成され、シールを受け入れて流体の漏出を防止する形態とされた通路を備える、可変速度駆動装置。
- 請求項13に記載の可変速度駆動装置において、入口通路と、出口通路とを備え、流体は該入口通路を通って基部に入り、該出口通路を通って基部から出る、可変速度駆動装置。
- 請求項15に記載の可変速度駆動装置において、タブ入口と、タブ出口とを備え、入口通路内の流体の一部分は、前記タブ入口を通じてタブに向けられ且つ前記タブを横断して流れ、流体は前記タブ出口を通して前記出口通路に排出される、可変速度駆動装置。
- 請求項13に記載の可変速度駆動装置において、前記通路の断面積は、所定の流体の流れ及び流体の圧力降下の必要量を満足させる寸法とされる、可変速度駆動装置。
- 請求項13に記載の可変速度駆動装置において、前記基部は非金属材料製である、可変速度駆動装置。
- 請求項13に記載の可変速度駆動装置において、前記少なくとも2つの基部の各々の基部は、締結具を受け入れる貫通穴を備え、該締結具は、前記少なくとも2つの基部の間の確実な接続部を提供する、可変速度駆動装置。
- 請求項13に記載の可変速度駆動装置において、前記少なくとも2つの基部の各々の基部は、締結具タブと、隣接する基部の締結具タブを受け入れる形態とされた締結具受容部とを備え、締結具タブが締結具受容部内に固定されたとき、前記隣接する基部との確実な接続部が形成される、可変速度駆動装置。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/932,479 US7876561B2 (en) | 2007-01-22 | 2007-10-31 | Cooling systems for variable speed drives and inductors |
US11/932,479 | 2007-10-31 | ||
US12/057,787 | 2008-03-28 | ||
US12/057,787 US8149579B2 (en) | 2008-03-28 | 2008-03-28 | Cooling member |
PCT/US2008/059112 WO2009058417A1 (en) | 2007-10-31 | 2008-04-02 | Cooling member |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2011504718A true JP2011504718A (ja) | 2011-02-10 |
JP2011504718A5 JP2011504718A5 (ja) | 2011-03-31 |
JP5167364B2 JP5167364B2 (ja) | 2013-03-21 |
Family
ID=39666115
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010532085A Active JP5167364B2 (ja) | 2007-10-31 | 2008-04-02 | 冷却部材 |
Country Status (7)
Country | Link |
---|---|
US (1) | US8149579B2 (ja) |
EP (1) | EP2206422B1 (ja) |
JP (1) | JP5167364B2 (ja) |
KR (1) | KR101460487B1 (ja) |
CN (1) | CN101843184B (ja) |
TW (1) | TWI402665B (ja) |
WO (1) | WO2009058417A1 (ja) |
Families Citing this family (24)
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US8495890B2 (en) * | 2007-01-22 | 2013-07-30 | Johnson Controls Technology Company | Cooling member |
EP2282144B1 (en) * | 2008-04-30 | 2017-04-05 | Mitsubishi Electric Corporation | Air conditioner |
JP5702988B2 (ja) * | 2010-01-29 | 2015-04-15 | 株式会社 日立パワーデバイス | 半導体パワーモジュール及びそれが搭載される電力変換装置並びに半導体パワーモジュール搭載用水路形成体の製造方法 |
JP5327195B2 (ja) * | 2010-02-05 | 2013-10-30 | 株式会社デンソー | 電力変換装置 |
JP5158176B2 (ja) * | 2010-02-05 | 2013-03-06 | 株式会社デンソー | 電力変換装置 |
JP4924750B2 (ja) * | 2010-02-05 | 2012-04-25 | 株式会社デンソー | 電力変換装置 |
JP5423655B2 (ja) * | 2010-02-05 | 2014-02-19 | 株式会社デンソー | 電力変換装置 |
JP5423654B2 (ja) * | 2010-02-05 | 2014-02-19 | 株式会社デンソー | 電力変換装置 |
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EP2206422A1 (en) | 2010-07-14 |
TWI402665B (zh) | 2013-07-21 |
CN101843184B (zh) | 2012-06-27 |
JP5167364B2 (ja) | 2013-03-21 |
WO2009058417A1 (en) | 2009-05-07 |
US8149579B2 (en) | 2012-04-03 |
TW200919164A (en) | 2009-05-01 |
US20090241575A1 (en) | 2009-10-01 |
KR101460487B1 (ko) | 2014-11-12 |
CN101843184A (zh) | 2010-09-22 |
EP2206422B1 (en) | 2016-03-09 |
KR20100081998A (ko) | 2010-07-15 |
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