WO2019018681A1

WO2019018681A1 - Electronics cooling system

Info

Publication number: WO2019018681A1
Application number: PCT/US2018/042945
Authority: WO
Inventors: Koman Balakrishna Nambiar; Bryan Rene HORNER; Andrew Charles BAILEY; Paul Andrew YUSKEVICH
Original assignee: Johnson Controls Technology Company
Priority date: 2017-07-19
Filing date: 2018-07-19
Publication date: 2019-01-24
Also published as: JP2022177184A; JP7412064B2; CN116261308A; CN111096091A; TWI826384B; JP2020528217A; EP3656190A1; KR102435795B1; TW201909720A; KR20200024932A

Abstract

An electronics cooling system (42) with an electronics enclosure (40) that is hermetically sealed. The system (42) includes a heat exchanger (116) that exchanges heat between a first cooling fluid (108) within the electronics enclosure (40) and a second cooling fluid (118) of a vapor compression system (14). A fan (124) circulates the first cooling fluid (108) within the electronics enclosure (40). The electronics cooling system (42) may also include a baffle system (126) within the electronics enclosure (40) that directs the first cooling fluid (108) over one or more electronic components (114) disposed within the electronics enclosure (40) to cool the one or more electronic components (114).

Description

ELECTRONICS COOLING SYSTEM

CROSS REFERENCE TO RELATED APPLICATIONS

[0001] This application claims priority from and the benefit of U.S. Provisional Application Serial No. 62/534,627, entitled "ELECTRONICS COOLING SYSTEM", filed July 19, 2017, which is hereby incorporated by reference in its entirety for all purposes.

BACKGROUND

[0002] This application relates generally to a system for cooling enclosures that contain electronics.

[0003] Refrigeration systems are used in a variety of settings such as for residential, commercial, and industrial air conditioning systems. These systems may include various components such as motors, compressors, valves, etc. Some or all of these components may be controlled with electronics. Electronics control the flow of electrical energy and signals using electronic components such as resistors, transistors, digital signal processors, programmable logic controllers, analog to digital converters, inductors, transformers, IGBTs, diodes, and integrated circuits.

Unfortunately, the operation and lifespan of these electronic components may be negatively affected by heat, moisture, industrial fumes/gases and/or dirt.

SUMMARY

[0004] In one general aspect, an electronics cooling system with an electronics enclosure that is hermetically sealed. The system includes a heat exchanger that exchanges heat between a first cooling fluid within the electronics enclosure and a second cooling fluid of a vapor compression system. A fan circulates the first cooling fluid within the electronics enclosure. The electronics cooling system may also include a baffle system within the electronics enclosure that directs the first cooling fluid in a controlled manner over one or more electronic components disposed within the electronics enclosure to cool the one or more electronic components. [0005] In another aspect, a system with an electronics cooling system. The electronics cooling system includes an electronics enclosure that is hermetically sealed. The system includes a heat exchanger that exchanges heat between a first cooling fluid within the electronics enclosure and a second cooling fluid of a vapor compression system. A fan circulates the first cooling fluid within the electronics enclosure. The electronics cooling system may also include a baffle system within the electronics enclosure that directs the first cooling fluid over one or more electronic components disposed within the electronics enclosure to cool the one or more electronic components. The system includes a vapor compression system that generates a second cooling fluid. The heat exchanger exchanges heat between the first cooling fluid and the second cooling fluid. In some embodiments, the second cooling fluid is augmented by a third cooling fluid.

[0006] In another aspect, an electronics cooling system that includes an electronics enclosure that stores one or more electronic components used to control a vapor compression system (e.g., an electric motor). The electronics enclosure is hermetically sealed. The electronics cooling system includes a baffle system within the electronics enclosure. The baffle system directs a first cooling fluid over the one or more electronic components to cool the one or more electronic components.

DRAWINGS

[0007] FIG. 1 is a perspective view of a building that may utilize a heating, ventilation, air conditioning, and refrigeration (HVAC&R) system, in accordance with an aspect of the present disclosure;

[0008] FIG. 2 is a perspective view of a vapor compression system coupled to an electronics cooling system, in accordance with an aspect of the present disclosure;

[0009] FIG. 3 is a schematic view of a vapor compression system coupled to an electronics cooling system, in accordance with an aspect of the present disclosure;

[0010] FIG. 4 is a schematic view of a vapor compression system coupled to an electronics cooling system, in accordance with an aspect of the present disclosure; [0011] FIG. 5 is a cross-sectional view of an electronics cooling system, in accordance with an aspect of the present disclosure;

[0012] FIG. 6 is a cross-sectional view of an electronics cooling system, in accordance with an aspect of the present disclosure;

[0013] FIG. 7 is a partial cross-sectional view of an electronics cooling system within line 7-7 of FIG. 6, in accordance with an aspect of the present disclosure;

[0014] FIG. 8 is a partial cross-sectional view of an electronics cooling system within line 7-7 of FIG. 6, in accordance with an aspect of the present disclosure;

[0015] FIG. 9 is a cross-sectional view of an electronics cooling system, in accordance with an aspect of the present disclosure;

[0016] FIG. 10 is a cross-sectional view of an electronics cooling system, in accordance with an aspect of the present disclosure;

[0017] FIG. 11 is a front view of a baffle system of the electronics cooling system, in accordance with an aspect of the present disclosure; and

[0018] FIG. 12 is a front view of a baffle system of the electronics cooling system, in accordance with an aspect of the present disclosure.

DETAILED DESCRIPTION

[0019] Embodiments of the present disclosure include an electronics cooling system that cools electronics as well as protects them from moisture, industrial gases/fumes and dirt. The electronics cooling system includes an electronics enclosure that is hermetically sealed (or near hermetically sealed) to seal in a first cooling fluid, circulating within the electronics enclosure, from interacting with fluids surrounding the enclosure. For example, the first cooling fluid may be air, and the electronics enclosure seals in this air and eliminates or reduces interaction of the air inside of the electronics enclosure from interacting with humid or dirty air outside of the electronics enclosure. As the first cooling fluid circulates within the electronics enclosure, the first cooling fluid cools the electronics by removing heat by forced convection. The first cooling fluid releases this energy in a heat exchanger to a second cooling fluid (e.g., water, refrigerant). The second cooling fluid may come from a vapor compression system, such as a chiller that forms part of a heating, ventilation, air conditioning, and refrigeration (HVAC&R) system. Because the electronics cooling system is hermetically sealed, the electronics cooling system will cool and protect electronics without direct exposure to the outside air in a variety of environments (e.g., industrial, marine, desert, tropical, coastal areas, etc.).

[0020] The second cooling fluid may be driven through the heat exchanger by a pressure differential and/or it may be driven by a pump. For example, the pressure difference may be created by fluidly coupling the electronics cooling system between opposite ends of an evaporator tube bundle. In this way, a small portion of the higher pressure second cooling fluid flowing through the evaporator is diverted to the electronics cooling system. The second cooling fluid then flows through the electronics cooling system heat exchanger to cool the first cooling fluid before being drawn out of the electronics cooling system by the lower pressure second cooling fluid exiting the evaporator tube bundle. In some embodiments, the supply and return lines of the electronics cooling system may couple to other locations in the HVAC&R system to create a pressure differential that drives the second cooling fluid through the electronics cooling system without a pump. The electronics cooling system may therefore not use a pump to drive the second cooling fluid through the heat exchanger, thus reducing potential manufacturing and/or operating costs while simultaneously increasing reliability of the electronics cooling system. However, in some embodiments, the second cooling fluid may be driven through the electronics cooling system with a pump. In still other embodiments, the pump may be assisted by a pressure differential in the HVAC&R system.

[0021] Turning now to the drawings, FIG. 1 is a perspective view of an embodiment of an environment for a heating, ventilation, air conditioning, and refrigeration (HVAC&R) system 10 in a building 12. A similar arrangement may also be applicable to oceangoing vessels. The HVAC&R system 10 may include a vapor compression system 14 (e.g., chiller) that supplies a chilled liquid, which may be used to cool the building 12. The HVAC&R system 10 may also include a boiler 16 to supply warm liquid to heat the building 12 and an air distribution system 18 which circulates air through the building 12. The air distribution system 18 can also include an air return duct 20, an air supply duct 22, and/or an air handler 24. In some embodiments, the air handler 24 may include a heat exchanger that is connected to the boiler 16 and the vapor compression system 14 by conduits 26. The heat exchanger in the air handler 24 may receive either heated liquid from the boiler 16 or chilled liquid from the vapor compression system 14, depending on the mode of operation of the HVAC&R system 10. The HVAC&R system 10 is shown with a separate air handler 24 on each floor 28 of the building 12, but in other embodiments, the HVAC&R system 10 may include air handlers 24 and/or other components that may be shared between or among floors 28.

[0022] FIGS. 2 and 3 illustrate embodiments of the vapor compression system 14 that can be used in the HVAC&R system 10. Specifically, FIG. 2 is a perspective view of the vapor compression system 14, and FIG. 3 is a schematic view of the vapor compression system 14. The vapor compression system 14 may circulate a refrigerant through a circuit starting with a compressor 32. The circuit may also include a condenser 34, an expansion valve(s) or device(s) 36, and an evaporator 38. The vapor compression system 14 may further include an electronics enclosure 40 that stores various electronics to operate the vapor compression system 14. Some of the electronics that may be stored in the electronics enclosure 40 include a digital (A/D) converter(s), a microprocessor(s), a non-volatile memory/memories, interface board(s), etc. As will be explained in more detail below, the electronics enclosure 40 forms part of an electronics cooling system 42 that cools the electronics discussed above. In some embodiments, the electronics enclosure 40 is a hermetically sealed container that reduces and/or blocks exposure of the electronics to a humid and dirty environment. In some embodiments, electronics enclosure 40 may be the same as the enclosure that contains the motor variable speed drive (VSD) 52 or the enclosure which contains the components which control the motor magnetic bearing.

[0023] Some examples of fluids that may be used as refrigerants in the vapor compression system 14 are hydrofluorocarbon (HFC) based refrigerants, for example, R-410A, R-407, R-134a, hydrofluoro olefin (HFO), R1233zd, R1234ze, "natural" refrigerants like ammonia (NH3) R-717, carbon dioxide (CO2), R-744, or hydrocarbon based refrigerants, water vapor, or any other suitable refrigerant. In some

embodiments, the vapor compression system 14 may be configured to efficiently utilize refrigerants having a normal boiling point of about 19 degrees Celsius (86 degrees Fahrenheit) at one atmosphere of pressure, also referred to as low pressure refrigerants, versus a medium pressure refrigerant, such as R-134a. As used herein, "normal boiling point" may refer to a boiling point temperature measured at one atmosphere of pressure.

[0024] In some embodiments, the vapor compression system 14 may use one or more of the following components: a variable speed drive(s) 52, a motor 50, the compressor 32, the condenser 34, the expansion valve or device 36, and/or the evaporator 38. The motor 50 drives the compressor 32 and may be powered by a variable speed drive (VSD) 52. The VSD 52 receives alternating current (AC) power having a particular fixed line voltage and fixed line frequency from an AC power source and provides power having a variable voltage and frequency to the motor 50. In other

embodiments, the motor 50 may be powered directly from an AC or direct current (DC) power source. The motor 50 may include any type of electric motor that can be powered by a VSD 52 or directly from an AC or DC power source, such as a switched reluctance motor, an induction motor, an electronically commutated permanent magnet motor, or another suitable motor. In some embodiments, the compressor 32 and/or motor 50 may use magnetic bearings 54 to reduce friction and/or noise during operation and increase the compressor/motor reliability. The magnetic bearings 54 may be controlled with electronics that are housed within the electronics enclosure 40. As explained above, the electronics enclosure 40 may protect the electronics from dirt and moisture, while the electronics cooling system 42 cools the electronics using a cooling fluid (e.g., water, refrigerant) supplied by the vapor compression system 14.

[0025] The compressor may be a positive displacement device 32 which compresses a refrigerant vapor and delivers the vapor to the condenser 34 through a discharge passage. In some embodiments, the compressor 32 may be a centrifugal compressor. The refrigerant vapor delivered by the compressor 32 to the condenser 34 may transfer heat to a cooling fluid (e.g., water or air) in the condenser 34. The refrigerant vapor may condense to a refrigerant liquid in the condenser 34 as a result of thermal heat transfer with the cooling fluid. The liquid refrigerant from the condenser 34 may flow through the expansion device 36 to the evaporator 38. In the illustrated embodiment of FIG. 3, the condenser 34 is water cooled and includes a tube bundle 55 connected to a cooling tower 56 (or water body surrounding a vessel), which supplies the cooling fluid to the condenser 34.

[0026] The liquid refrigerant delivered to the evaporator 38 may absorb heat from another cooling fluid, which may or may not be the same cooling fluid used in the condenser 34. The liquid refrigerant in the evaporator 38 may undergo a phase change from the liquid refrigerant to a refrigerant vapor. As shown in the illustrated embodiment of FIG. 3, the evaporator 38 may include a tube bundle 58 that couples to a chilled fluid supply line 60S and a return line 60R. The supply line 60S and the return line 60R connect the chiller 14 to a cooling load 62. The cooling fluid of the evaporator 38 (e.g., water, ethylene glycol, calcium chloride brine, sodium chloride brine, or any other suitable fluid) enters the evaporator 38 via return line 60R and exits the evaporator 38 via supply line 60S. The evaporator 38 may reduce the temperature of the cooling fluid in the tube bundle 58 via thermal heat transfer with the refrigerant. The tube bundle 58 in the evaporator 38 can include a plurality of tubes and/or a plurality of tube bundles. In any case, the vapor refrigerant exits the evaporator 38 and returns to the compressor 32 by a suction line to complete the cycle.

[0027] As illustrated, the electronics cooling system 42 may couple to the tube bundle 58 in the evaporator 38 to receive a flow of cooling fluid from the HVAC&R system 10. The electronics cooling system 42 uses the cooling fluid (e.g., water) from the HVAC&R system 10 to cool electronics within the electronics enclosure 40. As explained above, the electronics cooling system 42 may not include a pump and may instead use differences in pressure in the HVAC&R system 10 to drive the flow of the cooling fluid through the electronics cooling system 42. For example, a supply line 64 of the electronics cooling system 42 may tap into an end of the tube bundle 58 that receives the cooling fluid flowing through the return line 60R. After passing through the electronics cooling system 42, the temperature and pressure of the cooling fluid increases as it absorbs energy from the electronics disposed within the electronics enclosure 40. The cooling fluid is then returned to the supply line side of the tube bundle 58 through a return line 66. At this location in the evaporator 38, the pressure of the cooling fluid in the evaporator 38 will be lower than the pressure of the cooling fluid diverted from the evaporator 38 through supply line 64. This difference in pressure drives the flow of the cooling fluid through the electronics cooling system 42 without a pump.

[0028] In some embodiments, the supply and return lines 64, 66 of the electronics cooling system 42 may couple to other locations in the vapor compression system 14 to form a pressure differential that drives the cooling fluid through the electronics cooling system 42. For example, a supply line 64 (i.e., dashed supply line 64) may receive a cooling fluid (e.g., refrigerant) exiting the condenser 34 after it passes through an expansion valve/device 68. The supply line 64 directs the cooling fluid through the electronics cooling system 42 where it cools the first fluid or electronics through a chill/cold plates before exiting through the return line 66 (i.e., dashed return line 66). The return line 66 may then return the cooling fluid (i.e., refrigerant) to the evaporator 38 because the cooling fluid exiting the expansion valve 68 is at a higher pressure than the cooling fluid in the evaporator 38, the pressure difference drives the flow of the cooling fluid through the electronics cooling system 42 without a pump.

[0029] However, in some embodiments the cooling fluid may be driven through the electronics cooling system 42 with one or more pumps 72. In still other

embodiments, the pump(s) 72 may be assisted by a pressure differential in the HVAC&R system 10.

[0030] FIG. 4 is a schematic of the vapor compression system 14 with an intermediate circuit 84 incorporated between condenser 34 and the evaporator 38. The intermediate circuit 84 may have an inlet line 88 that is directly fluidly connected to the condenser 34. In other embodiments, the inlet line 88 may be indirectly fluidly coupled to the condenser 34. As shown in the illustrated embodiment of FIG. 4, the inlet line 88 includes a first expansion device 86 positioned upstream of an intermediate vessel 90. In some embodiments, the intermediate vessel 90 may be a flash tank (e.g., a flash intercooler). In other embodiments, the intermediate vessel 90 may be configured as a direct expansion heat exchanger or economizer. In the illustrated embodiment of FIG. 4, the intermediate vessel 90 is used as a flash tank, and the first expansion device 86 is configured to lower the pressure of (e.g., expand) the liquid refrigerant received from the condenser 34. During the expansion process, a portion of the liquid may vaporize, and thus, the intermediate vessel 90 may be used to separate the vapor from the liquid received from the first expansion device 86. Additionally, the intermediate vessel 90 may provide for further expansion of the liquid refrigerant because of a pressure drop experienced by the liquid refrigerant when entering the intermediate vessel 90 (e.g., due to a rapid increase in volume experienced when entering the intermediate vessel 90). The vapor in the intermediate vessel 90 may be drawn by the compressor 32 through an inlet line 94 to an intermediate pressure port of the compressor 32. In other embodiments, the vapor in the intermediate vessel 90 may be drawn to an intermediate stage of the compressor 32. The liquid that collects in the intermediate vessel 90 may be at a lower enthalpy than the liquid refrigerant exiting the condenser 34 because of the expansion in the expansion device 86 and/or the intermediate vessel 90. The liquid from intermediate vessel 90 may then flow in line 92 through a second expansion device 36 to the evaporator 38.

[0031] As illustrated, the electronics cooling system 42 receives a cooling fluid from the vapor compression system 14. The electronics cooling system 42 uses the cooling fluid to cool electronics within the electronics enclosure 40 using a heat exchanger. As explained above, the electronics cooling system 42 may not include a pump and instead may use differences in pressure in the vapor compression system 14 to drive the flow of the cooling fluid through the electronics cooling system 42. For example, the supply line 96 to the electronics cooling system 42 may tap into the line 92 carrying liquid cooling fluid (i.e., refrigerant) from the intermediate vessel 90 to the evaporator 38. After passing through the electronics cooling system 42, the temperature of the cooling fluid increases. The cooling fluid is returned through line 98 to the evaporator 38 which is at a lower pressure than the cooling fluid flowing through line 92. As illustrated, the return line 98 couples to the evaporator 38. Because the cooling fluid exiting line 92 is at a higher pressure than the pressure in the evaporator 38 the difference in pressure drives the flow of the cooling fluid through the electronics cooling system 42 without a pump. However, in some embodiments a pump 72 may assist and/or drive cooling fluid (i.e., liquid refrigerant from the evaporator 38) through the supply line 95 to the electronics cooling system 42 and return the cooling fluid to the evaporator 38 through return line 97.

[0032] FIG. 5 is a cross-sectional view of an embodiment of the electronics cooling system 42. As explained above, the electronics enclosure 40 forms part of the electronics cooling system 42. Electronics enclosure 40 is a hermetically sealed container that reduces and/or blocks exposure of the electronics to moisture, industrial fumes/gases and dirt in the environment. As illustrated, the electronics enclosure 40 includes a first enclosure 100 coupled to a second enclosure 102. The first and second enclosures 100, 102 are fluidly coupled together with an outlet 104 and an inlet 106. In some embodiments, there may be multiple inlets 106 and outlets 104 (e.g., 2, 3, 4, 5, or more). The outlet 104 the inlet 106 enable a cooling fluid 108 (e.g., air) to circulate between a first cavity 110 in the first enclosure 100 and a second cavity 1 12 in the second enclosure 102 to cool electronics 1 14. The electronics 1 14 may include microchips, integrated circuits, power supplies, transistors, resistors, inductors, transformers, IGBTs, etc. Advantageously, the electronics cooling system 42 limits and/or blocks direct interaction between the cooling fluid 108 and fluids outside of the electronics enclosure 40. In this way, electronics enclosure 40 is able to block and/or reduce exposure of the electronics 114 to moisture, industrial fumes/gases and/or dirt in the environment. For example, the cooling fluid 108 (e.g., air) may not be exposed to moist/humid air circulating around outside the electronics enclosure 40.

[0033] In order to remove heat from the cooling fluid 108, electronics cooling system 42 includes a heat exchanger 1 16 (e.g., gas to liquid heat exchanger). The heat exchanger 116 receives a second cooling fluid 1 18 through a supply line 120. The second cooling fluid 1 18 comes from the vapor compression system 14 and may be a refrigerant, water, etc. In the heat exchanger 116, the second cooling fluid 1 18 exchanges energy with the first cooling fluid 108 circulating in the electronics enclosure 40. After exchanging energy in the heat exchanger 1 16, the second cooling fluid 118 exits the heat exchanger 1 16 at a higher temperature. The second cooling fluid 118 is then carried away from the electronics cooling system 42 through return line 122 to the HVAC&R system 10.

[0034] After exiting the heat exchanger 1 16, the first cooling fluid 108 is driven into the second enclosure 102 using a fan 124. More specifically, the fan 124 draws the first cooling fluid 108 through the heat exchanger 116, and then blows the first cooling fluid 108 through the outlet 104 and into the inlet plenum 152. After passing through the outlet 104, the first cooling fluid 108 contacts a baffles system 126. As illustrated, the baffle system 126 redirects and controls the flow of the cooling fluid 108 through the second enclosure 102. The baffle system 126 includes a baffle plate 128 and a separation plate 130. The separation plate 130 couples to the second enclosure 102 and spaces the baffle plate 128 a distance 132 from the enclosure wall 134. In certain embodiments, the distance 132 may be selected to optimize flow and pressure drop of the cooling fluid 108. In addition to spacing the baffle plate 128 away from the enclosure wall 134, the separation plate 130 also separates the outlet 104 from the inlet 106 to form inlet and outlet plenums 152, 154. Accordingly, as the cooling fluid 108 exits the first enclosure 100 through the outlet 104, the separation plate 130 blocks the first cooling fluid 108 from flowing directly to the inlet 106 without passing over the baffle plate 128 and the attached electronics 1 14.

[0035] As the first cooling fluid 108 exits the outlet 104, it contacts a rear face 136 of the baffle plate 128. The first cooling fluid 108 is therefore directed upward in axial direction 138 (e.g., vertical) in the inlet plenum 152. As first cooling fluid 108 flows up, it passes over the baffle plate 128. After passing over the baffle plate 128, the first cooling fluid 108 flows in axial direction 140 (e.g., downward). This creates a cascading cooling effect that cools the electronics 1 14 as the first cooling fluid 108 flows in direction 140. The first cooling fluid 108 then flows around the bottom of the baffle plate 128 where it contacts the wall 134 of the second enclosure 102. The wall 134 and baffle plate 128 direct the first cooling fluid 108 upward in axial direction 138 through the outlet plenum 154. As explained above, the separation plate 130 blocks direct fluid flow between the outlet 104 and the inlet 106. The first cooling fluid 108 is therefore driven through the inlet 106 and into the heat exchanger 116 where it again exchanges energy with the second cooling fluid 118.

[0036] Because the electronics enclosure 40 is hermetically sealed, the moisture in the first cooling fluid 108 may not increase. However, the original moisture in the first cooling fluid 108 may condense within cavity 110 where the heat exchanger 1 16 and supply line 120 create the coldest surfaces. To facilitate removal of liquid from the electronics enclosure 40, the electronics cooling system 42 includes a condensate breather valve 142. The condensate breather valve 142 enables liquid to exit the electronics enclosure 40 while blocking and/or reducing outside (ambient) fluid flow into the electronics enclosure 40. The condensate breather valve 142 may be placed in the first enclosure 100 in order to catch liquid that condenses in the first cooling fluid 108 as it exits the heat exchanger 116. In other words, as the first cooling fluid 108 exits the heat exchanger 116, liquid may condense from the first cooling fluid 108 and fall in direction 140 due to gravity to the bottom of the first enclosure 100. The liquid may then flow to the condensate breather valve 142 where it is directed out of the first enclosure 100 in direction 140. This process may therefore create a dry, cool air in the cavities 110 and 1 12 that cools and protects the electronics 1 14 from moisture. Furthermore, to facilitate condensation away from as well as separation of any condensate that forms from the electronics 114, the heat exchanger 1 16 is placed within the first enclosure 100. As explained above and seen in FIG. 5, the first and second enclosures 100, 102 are separated by the wall 134 which blocks the minimal condensate formed in the first enclosure 100 from flowing into the second enclosure 102.

[0037] In some embodiments, the first enclosure 100 and the second enclosure 102 are separate enclosures that couple together. For example, the first and second enclosures 100, 102 may be coupled together with fasteners 144. When coupled, the first and second enclosures 100, 102 may form a fluid tight seal that blocks and/or reduces outside (ambient) fluid from entering the electronics enclosure 40. Fluid tight seal may be formed using a sealing element 156 such as a gasket, a weld, a polymeric seal (eg. O-ring etc.), a braze, an adhesive, etc. In some embodiments, the first and second enclosures 100, 102 may be integral (e.g., one-piece) with one another. While the illustrated first and second enclosures 100, 102 have different sizes, in some embodiments they may be the same size.

[0038] To facilitate access to the cavities 1 10 and 1 12, the first and second enclosures 100, 102 may have access panels. For example, the first enclosure 100 may include a fan access panel 146. The fan access panel 146 couples to the first enclosure 100 with one or more fasteners 148 (e.g., threaded fasteners such as bolts, screws). The fan access panel 146 enables access for replacement and/or maintenance of the fan 124. When coupled to the enclosure 40, the fan access panel 146 forms a fluid tight seal using a gasket, a braze, an adhesive etc. with the first enclosure 100 to block and/or reduce contact with fluids around the exterior of the electronics enclosure 40. The electronics 114 may also be accessed through an enclosure panel 150 that couples to the second enclosure 102. The enclosure panel 150 may likewise couple to the second enclosure 102 with fasteners (e.g., threaded fasteners such as bolts, screws, etc.). The enclosure panel 150 may also form a fluid tight seal with the second enclosure 102 to block and/or reduce contact with fluids around the exterior of the electronics enclosure 40 using a gasket, a braze, an adhesive etc.

[0039] FIG. 6 is a cross-sectional view of an embodiment of the electronics cooling system 42. The electronics cooling system 42 in FIG. 6 circulates the first cooling fluid 108 through first and second enclosures 100, 102 to cool the electronics 1 14. However, to provide additional cooling, the electronics cooling system 42 may include one or more chill (cold) plates 170. The chill (cold) plates 170 may increase heat transfer from one or more electronic components 114. For example, some electronics components 1 14 may generate more heat than others. These electronics components 114 may therefore increase the heat transfer requirements of the electronics cooling system 42. The electronics cooling system 42 may therefore include the chill (cold) plates 170 to enable a more direct heat transfer from electronics to the second cooling fluid 118. The chill (cold) plates 170 may directly receive and circulate the second cooling fluid 1 18 as shown in Fig 6. The supply line 120 and the return line 122 may include respective T-joints 172 and 174. The T-joints 172, 174 enable the second cooling fluid 118 to flow to and from the heat exchanger 116 and chill (cold) plates 170, as shown in Fig 6. The secondary cooling fluid 1 18 may be water or refrigerant.

[0040] Because the chill (cold) plates 170 are located within the second enclosure 102, the chill (cold) plates 170 may form condensate within the second enclosure 102. To reduce potential contact between condensate formed by the chill (cold) plates 170 and the electronics 1 14, the chill (cold) plate 170 may be positioned at the bottom of the baffle plate 128 in direction 140. Accordingly, if condensate forms on the chill (cold) plate 170, the condensate may fall in direction 140 to the bottom of the second enclosure 102 without contacting any other electronics 114. To remove the condensate, the second enclosure 102 may include a second breather condensate valves 142, 176. As explained above, the breather condensate valve 176 enables the electronics cooling system 42 to remove liquid from the first and/or second enclosures 100, 102. However, in some embodiments the chill (cold) plate 170 may not form condensate within the second enclosure 102 because the heat exchanger 1 16 and supply line 120 condense moisture out of the cooling fluid 108 before it reaches the second enclosure 102.

[0041] In some embodiments, the electronics cooling system 42 may include additional baffle systems 126 to accommodate and cool more electronic components 114. As illustrated in Figure 6, the electronics cooling system 42 includes a first baffle system 126 coupled to the wall 134 of the second enclosure 102 and a second baffle system 126 coupled to the enclosure panel 150. The baffle plates 128 of the respective first and second baffle systems 126 may be spaced apart a distance 178 to facilitate the flow of the first cooling fluid 108 over the electronics 114. The distance 178 may be optimized to facilitate the required heat transfer from the electronics 1 14 to the cooling fluid 108.

[0042] FIG. 7 is a partial cross-sectional view of an embodiment of the electronics cooling system 42 within line 7-7 of FIG. 6. As explained above, the electronics cooling system 42 in FIG. 7 circulates the first cooling fluid 108 through first and second enclosures 100, 102 to cool the electronics 114. To provide additional cooling, the electronics cooling system 42 may include one or more chill (cold) plates 170. The chill (cold) plates 170 may increase heat transfer from one or more electronic components 114. For example, some electronics components 114 may generate more heat than others. The electronics cooling system 42 may therefore include the chill (cold) plates 170 to enable a more direct heat transfer from the electronics to the second cooling fluid 118. However, instead of splitting the flow of the second cooling fluid 118. The electronics cooling system 42 may first direct the second cooling fluid 118 to the chill (cold) plates 170 before redirecting the second cooling fluid 118 to flow through the heat exchanger 116.

[0043] FIG. 8 is a partial cross-sectional view of an embodiment of the electronics cooling system 42 within line 7-7 of FIG. 6. As explained above, to provide additional cooling the electronics cooling system 42 may include one or more chill (cold) plates 170. The chill (cold) plates 170 may increase heat transfer from one or more electronic components 114. However, instead of first directing the second cooling fluid 118 to the chill (cold) plates 170. The electronics cooling system 42 may first direct the second cooling fluid 118 to the heat exchanger 116 after which the second cooling fluid 118 is then directed to the chill (cold) plates 170. By first directing the second cooling fluid 118 through the heat exchanger 116, the electronics cooling system 42 may heat the second cooling fluid 118 and reduce condensation in the second enclosure 102 while cooling one or more electronic components 114.

[0044] FIG. 9 is a cross-sectional view of an embodiment of the electronics cooling system 42. As explained above, the electronics cooling system 42 may include one or more chill (cold) plates 170. The chill (cold) plates 170 may increase heat transfer from one or more electronic components 114. For example, some electronics components 114 may generate more heat than others. These electronic components 114 may therefore increase the heat transfer requirements of the electronics cooling system 42. However, the chill (cold) plates 170 may be separately supplied with a third cooling fluid 200. The third cooling fluid 200 flows to and from the chill (cold) plates 170 through respective supply and return lines 202 and 204. In some embodiments, the second cooling fluid 118 and the third cooling fluid 200 may be the same cooling fluid. For example the second and third cooling fluids 118, 200 may be water, refrigerant, etc. In another embodiment, the second and third cooling fluids 118, 200 may be different. For example, the second cooling fluid 118 may be water, while the third cooling fluid 200 may be refrigerant, or vice versa.

[0045] FIG. 10 is a cross-sectional view of an embodiment of the electronics cooling system 42. In some embodiments, the baffle system 126 may include one or more additional guide plates 220. The guide plate 220 assists in controlling the flow of the first cooling fluid 108 through the second enclosure 102. As illustrated, guide plate 220 couples to an interior surface 222 of the top plate 224 of the second enclosure 102. The guide plate 220 extends away from the interior surface 222 in direction 140. The guide plate 220 may extend over a portion or over the entire baffle plate 128 to guide the flow of the first cooling fluid 108. As illustrated, the first cooling fluid 108 flows up and over the baffle plate 128. After passing over the baffle plate 128, the first cooling fluid 108 contacts the surface 226 of the guide plate 220. The guide plate 220 directs the first cooling fluid 108 downward in direction 140 and over electronics 114. In this way, the guide plate 220 focuses the flow of the first cooling fluid 108 over the electronics 1 14 to facilitate heat transfer. In some embodiments, a distance 228 between the surface 226 of the guide plate 220 and the baffle plate 128 may be increased or decreased to control characteristics of the fluid flow over electronics 114. An increased flow velocity may increase turbulence leading to greater heat transfer from the electronics 1 14. For example, by decreasing the distance 228, the guide plate 220 may increase the flow velocity of the first cooling fluid 108 over the electronics 1 14. Likewise, if the distance 228 is increased, the guide plate 220 may decrease the flow velocity of the first cooling fluid 108 over the electronics 114. In this way, the electronics cooling system 42 may use the guide plate 220 to direct and customize heat transfer between the first cooling fluid 108 and the electronics 114.

[0046] As illustrated, the surface 226 of the guide plate 220 is flat; however, in some embodiments, surface 226 may be curved or otherwise shaped to facilitate heat transfer at different positions along the guide plate 220. For example, the distance 230 between the guide plate 220 and the baffle plate 128 may increase and/or decrease at different points along the length 230 to customize and/or optimize heat transfer over different electronics 114 (e.g., increase or decrease flow velocity over different electronics 114). In some embodiments, instead of changing the curvature of the guide plate 220 at different points along its length 230, the guide plate 220 may include protrusions 232 and/or recesses 234. The protrusions 232 and recesses 234 may similarly control the flow velocity and rate of the first cooling fluid 108 over specific electronic components 114, and thus the heat transfer characteristics.

[0047] In order to access the electronics 1 14, the guide plate 220 may be removably coupled from the second enclosure 102. For example, the guide plate 220 may couple to the second enclosure 102 with a snap fit connection, bayonet connection, etc. In some embodiments, the guide plate 220 may be removably coupled using fasteners (e.g., threaded fasteners).

[0048] FIG. 1 1 is a front view of an embodiment of the baffle system 126. As illustrated baffle plate 128 may have another shape other than rectangular or square. For example, the baffle plate 128 may have an irregular shape to control the flow of the first cooling fluid 108 over the electronics 114. In FIG. 11 , the plate 128 includes rectangular cutouts 250 and 252 at respective ends 254 and 256 of the baffle plate 128. However, the cutouts 250, 252 may be at different positions along the length 258 of the baffle plate 128, have different sizes, and/or different shapes (e.g., semicircular, triangular, square, etc.) in order to customize/control the flow of the first cooling fluid 108 over the electronics 114. As illustrated, because the cutout 252 is larger than cutout 250, the baffle plate 128 directs more of the first cooling fluid 108 over the electronics 1 14 on or near end 256 of the baffle plate 128. It should be noted that the cutouts 250, 252 may be placed in any position on the baffle plate 128 above and/or below the separation plate 130 to control the flow of the first cooling fluid 108 over the electronics 1 14.

[0049] In some embodiments, the baffle plate 128 may also include apertures 260. The apertures 260 enable the first cooling fluid 108 to pass through the aperture 260 instead of flowing up and over the baffle plate 128. This enables customized and/or optimized fluid flow of the first cooling fluid 108 over specific electronics 1 14. While two apertures 260 are shown in FIG. 11 , in other embodiments there may be different numbers of apertures 260 such as 1, 3, 4, 5, 6, 7, 8, 9, 10 or more. Furthermore, the apertures 260 may have different shapes and/or sizes in order to customize and/or optimized the flow of the first cooling fluid 108 over electronics 114.

[0050] FIG. 12 is a front view of an embodiment of the baffle system 126. As illustrated, baffle system 126 includes the baffle plate 128 and the separation plate 130. Instead of using an irregular shaped baffle plate 128 and/or apertures 260 to control the flow of the first cooling fluid 108, as seen in FIG. 11 , the baffle system 126 includes adjustable baffles 280. The adjustable baffles 280 couple to respective ends 254 and 256 of the baffle plate 128. The adjustable baffles 280 may be vertically repositioned in directions 138 and 140 to customize the flow of the first cooling fluid 108 over the electronics 1 14. While FIG. 12 uses the adjustable baffles 280 to control the flow of the first cooling fluid 108, in some embodiments the baffle system 126 may include a combination of adjustable baffles 280, apertures 260, and cutouts 250 and 252 to control the flow of the first cooling fluid 108 over the electronics 1 14.

[0051] While only certain features and embodiments of the present disclosure have been illustrated and described, many modifications and changes may occur to those skilled in the art (e.g., variations in sizes, dimensions, structures, shapes and proportions of the various elements, values of parameters (e.g., temperatures, pressures, etc.), mounting arrangements, use of materials, colors, orientations, etc.) without materially departing from the novel teachings and advantages of the subject matter recited in the claims. The order or sequence of any process or method steps may be varied or re-sequenced according to alternative embodiments. It is, therefore, to be understood that the appended claims are intended to cover all such modifications and changes as fall within the true spirit of the invention. Furthermore, in an effort to provide a concise description of the exemplary embodiments, all features of an actual implementation may not have been described (i.e., those unrelated to the presently contemplated best mode of carrying out the invention, or those unrelated to enabling the claimed invention). It should be appreciated that in the development of any such actual implementation, as in any engineering or design project, numerous

implementation specific decisions may be made. Such a development effort might be complex and time consuming, but would nevertheless be a routine undertaking of design, fabrication, and manufacture for those of ordinary skill having the benefit of this disclosure, without undue experimentation.

Claims

CLAIMS:

1. An electronics cooling system, comprising:

an electronics enclosure, wherein the electronics enclosure is hermetically sealed;

a heat exchanger configured to exchange heat between a first cooling fluid within the electronics enclosure and a second cooling fluid of a vapor compression system;

a fan configured to circulate the first cooling fluid within the electronics enclosure; and

a baffle system within the electronics enclosure, wherein the baffle system is configured to direct the first cooling fluid over one or more electronic components disposed within the electronics enclosure to cool the one or more electronic components.

2. The system of claim 1, comprising a condensate breather valve coupled to the electronics enclosure, wherein the condensate breather valve is configured to release liquid that condenses in the electronics enclosure.

3. The system of claim 1, wherein the electronics enclosure comprises a first enclosure, and the first enclosure is configured to hold the heat exchanger and the fan.

4. The system of claim 3, wherein the electronics enclosure comprises a second enclosure, and the second enclosure is configured to support the baffle system and hold the one or more electronic components.

5. The system of claim 4, wherein the first enclosure and the second enclosure fiuidly couple together via an inlet and an outlet, and wherein the inlet and outlet enable the first cooling fluid to circulate between the first and second enclosures.

6. The system of claim 5, wherein the baffle system comprises a baffle plate and a separation plate coupled to the baffle plate, and wherein the separation plate is positioned between the inlet and the outlet to force the first cooling fluid to flow over the baffle plate.

7. The system of claim 6, wherein the baffle system comprises an adjustable baffle coupled to the baffle plate, wherein the adjustable baffle is configured to move relative to the baffle plate to adjust flow of the second cooling fluid over the one or more electronic components.

8. The system of claim 1, comprising a chill plate coupled to the baffle system, wherein the chill plate is configured to couple to and cool the one or more electronic components.

9. The system of claim 8, wherein the chill plate is configured to receive a third cooling fluid from the vapor compression system to cool the one or more electronic components.

10. The system of claim 9, wherein the first cooling fluid and the third cooling fluid are different.

11. A system, comprising:

an electronics cooling system, comprising:

a heat exchanger;

a fan configured to circulate a first cooling fluid within the electronics enclosure; and

a baffle system within the electronics enclosure, wherein the baffle system is configured to direct the first cooling fluid over one or more electronic components to cool the one or more electronic components; and

a vapor compression system configured to generate a second cooling fluid; wherein the heat exchanger is configured to exchange heat between the first cooling fluid and the second cooling fluid.

12. The system of claim 11, wherein the vapor compression system is a chiller.

13. The system of claim 12, wherein the second cooling fluid is water.

14. The system of claim 12, wherein the second cooling fluid is refrigerant.

15. The system of claim 11, comprising the one or more electronic components, wherein the one or more electronic components are configured to control an operation of the vapor compression system.

16. An electronics cooling system, comprising:

an electronics enclosure configured to store one or more electronic components used to control a vapor compression system, wherein the electronics enclosure is hermetically sealed; and

a baffle system within the electronics enclosure, wherein the baffle system is configured to direct a first cooling fluid over the one or more electronic components to cool the one or more electronic components.

17. The system of claim 16, wherein the baffle system comprises a separation plate that couples the baffle system to the electronics enclosure.

18. The system of claim 17, comprising a baffle plate coupled to the separation plate, wherein the baffle plate is configured to support the electronic components.

19. The system of claim 18, comprising adjustable baffles coupled to the baffle plate, wherein the adjustable baffles are configured to couple to the baffle plate at different positions to control a flow of the first cooling fluid over the electronic components.

20. The system of claim 18, wherein the baffle plate defines one or more apertures that direct the first cooling fluid over the electronic components.