CN111096091A

CN111096091A - Electronic device cooling system

Info

Publication number: CN111096091A
Application number: CN201880059353.5A
Authority: CN
Inventors: 科曼·巴拉克里希纳·纳姆拜尔; 布莱恩·雷内·霍纳; 安德鲁·查尔斯·贝利; 保罗·安德鲁·尤斯凯维奇
Original assignee: Johnson Controls Technology Co
Current assignee: Johnson Controls Tyco IP Holdings LLP
Priority date: 2017-07-19
Filing date: 2018-07-19
Publication date: 2020-05-01
Also published as: CN116261308A; JP7412064B2; TW201909720A; JP2022177184A; EP3656190A1; TWI826384B; JP2020528217A; KR20200024932A; KR102435795B1; WO2019018681A1

Abstract

An electronics cooling system (42) having a hermetically sealed electronics enclosure (40) is disclosed. The system (42) includes a heat exchanger (116) that exchanges heat between a first cooling fluid (108) within the electronics enclosure (40) and a second cooling fluid (118) of a vapor compression system (14). A fan (124) circulates the first cooling fluid (108) within the electronics enclosure (40). The electronics cooling system (42) may also include a baffle system (126) within the electronics enclosure (40) that directs the first cooling fluid (108) through one or more electronic components (114) disposed within the electronics enclosure (40) to cool the one or more electronic components (114).

Description

Electronic device cooling system

Cross Reference to Related Applications

The present application claims priority and benefit from U.S. provisional application serial No. 62/534,627 entitled "ELECTRONICS COOLING SYSTEM" filed on 2017, 7, 19, which is hereby incorporated by reference in its entirety for all purposes.

Background

The present application relates generally to a system for cooling an enclosure containing electronic devices.

Refrigeration systems are used in a variety of applications, such as residential, commercial, and industrial air conditioning systems. These systems may include a number of different components, such as motors, compressors, valves, and the like. Some or all of these components may be controlled by electronics. Electronic devices use electronic components such as resistors, transistors, digital signal processors, programmable logic controllers, analog-to-digital converters, inductors, transformers, IGBTs, diodes, and integrated circuits to control the flow of electrical energy and signals. Unfortunately, the operation and life of these electronic components may be adversely affected by heat, moisture, industrial fumes/gases, and/or dust.

Disclosure of Invention

In one general aspect, an electronics cooling system has a hermetically sealed electronics enclosure. The system includes a heat exchanger that exchanges heat between a first cooling fluid within the electronics enclosure and a second cooling fluid of the vapor compression system. A fan circulates a first cooling fluid within the electronics enclosure. The electronics cooling system may further include a baffle system within the electronics enclosure that directs the first cooling fluid in a controlled manner across one or more electronic components disposed within the electronics enclosure to cool the one or more electronic components.

In another aspect, a system has an electronics cooling system. The electronics cooling system includes a hermetically sealed electronics enclosure. The system includes a heat exchanger that exchanges heat between a first cooling fluid within the electronics enclosure and a second cooling fluid of the vapor compression system. A fan circulates a first cooling fluid within the electronics enclosure. The electronics cooling system may also include a baffle system within the electronics enclosure that directs the first cooling fluid through one or more electronic components disposed within the electronics enclosure to cool the one or more electronics components. The system includes a vapor compression system that produces a second cooling fluid. The heat exchanger exchanges heat between the first cooling fluid and the second cooling fluid. In some embodiments, the second cooling fluid is augmented by a third cooling fluid.

In another aspect, an electronics cooling system includes an electronics enclosure that stores one or more electronic components for controlling a vapor compression system (e.g., an electric motor). The electronics enclosure is hermetically sealed. The electronics cooling system includes a barrier system located within an electronics enclosure. The barrier system directs a first cooling fluid across the one or more electronic components to cool the one or more electronic components.

Drawings

FIG. 1 is a perspective view of a building that may utilize a heating, ventilation, air conditioning and refrigeration (HVAC & R) system according to one aspect of the present disclosure;

FIG. 2 is a perspective view of a vapor compression system coupled to an electronics cooling system in accordance with an aspect of the present disclosure;

FIG. 3 is a schematic view of a vapor compression system coupled to an electronics cooling system in accordance with an aspect of the present disclosure;

FIG. 4 is a schematic view of a vapor compression system coupled to an electronics cooling system in accordance with an aspect of the present disclosure;

FIG. 5 is a cross-sectional view of an electronic device cooling system in accordance with an aspect of the present disclosure;

FIG. 6 is a cross-sectional view of an electronic device cooling system in accordance with an aspect of the present disclosure;

FIG. 7 is a partial cross-sectional view of the electronics cooling system within line 7-7 of FIG. 6 in accordance with an aspect of the present disclosure;

FIG. 8 is a partial cross-sectional view of the electronics cooling system within line 7-7 of FIG. 6 in accordance with an aspect of the present disclosure;

FIG. 9 is a cross-sectional view of an electronic device cooling system in accordance with an aspect of the present disclosure;

FIG. 10 is a cross-sectional view of an electronic device cooling system in accordance with an aspect of the present disclosure;

FIG. 11 is a front view of a baffle system of an electronics cooling system in accordance with an aspect of the present disclosure; and is

Fig. 12 is a front view of a baffle system of an electronics cooling system in accordance with an aspect of the present disclosure.

Detailed Description

Embodiments of the present disclosure include an electronics cooling system that cools and protects electronics from moisture, industrial gases/fumes, and dust. The electronics cooling system includes a hermetically sealed (or nearly hermetically sealed) electronics enclosure to seal a first cooling fluid circulating within the electronics enclosure from interacting with a fluid surrounding the enclosure. For example, the first cooling fluid may be air and the electronics enclosure seals this air and eliminates or reduces the interaction of air within the electronics enclosure with moist or dirty air outside the electronics enclosure. As the first cooling fluid circulates within the electronics enclosure, the first cooling fluid removes heat by forced convection to cool the electronics. The first cooling fluid releases this energy in the heat exchanger to a second cooling fluid (e.g., water, refrigerant). The second cooling fluid may be from a vapour compression system, such as from a chiller forming part of a heating, ventilation, air conditioning and refrigeration (HVAC & R) system. Since the electronic device cooling system is hermetically sealed, the electronic device cooling system will cool and protect the electronic devices from direct exposure to outside air in various environments (e.g., industrial areas, marine areas, desert areas, tropical areas, coastal areas, etc.).

The second cooling fluid may be driven through the heat exchanger by a pressure differential, and/or may be driven by a pump. For example, the pressure differential may result from fluidly coupling the electronics cooling system between opposite ends of the evaporator tube bundle. In this manner, a small portion of the higher pressure second cooling fluid flowing through the evaporator is transferred to the electronics cooling system. The second cooling fluid flows through the electronics cooling system heat exchanger to cool the first cooling fluid from the then lower pressure second cooling fluid exiting the evaporator tube bundle before the first cooling fluid is withdrawn from the electronics cooling system. In some embodiments, the supply and return lines of the electronics cooling system may be coupled to other locations in the HVAC & R system to create a pressure differential across the second cooling fluid electronics cooling system that is driven without a pump. The electronics cooling system may thus not use a pump to drive the second cooling fluid through the heat exchanger, thereby reducing potential manufacturing and/or operating costs while increasing reliability of the electronics cooling system. However, in some embodiments, the second cooling fluid may be driven through the electronics cooling system by a pump. In still other embodiments, the pump may be assisted by a pressure differential in the HVAC & R system.

Turning now to the drawings, FIG. 1 is a perspective view of an embodiment of an environment for a heating, ventilation, air conditioning and refrigeration (HVAC & R) system 10 in a building 12. A similar arrangement may also be applicable to ocean-going vessels. The HVAC & R system 10 may include a vapor compression system 14 (e.g., chiller) that supplies a cooling liquid that may be used to cool the building 12. The HVAC & R system 10 may also include a boiler 16 that supplies warm liquid to heat the building 12, and an air distribution system 18 that circulates air through the building 12. The air distribution system 18 may also include an air return duct 20, an air supply duct 22, and/or an air handler 24. In some embodiments, the air handler 24 may include a heat exchanger connected to the boiler 16 and the vapor compression system 14 by a conduit 26. Depending on the mode of operation of the HVAC & R system 10, the heat exchanger in the air handler 24 may receive heated liquid from the boiler 16 or cooled liquid from the vapor compression system 14. The HVAC & R system 10 is shown with a separate air handler 24 on each floor 28 of the building 12, but in other embodiments, the HVAC & R system 10 may include an air handler 24 and/or other components that may be shared between two or more floors 28.

Fig. 2 and 3 illustrate an embodiment of a vapor compression system 14 that may be used in the HVAC & R system 10. Specifically, fig. 2 is a perspective view of vapor compression system 14, and fig. 3 is a schematic view of vapor compression system 14. The vapor compression system 14 may circulate refrigerant through a circuit beginning with a compressor 32. The circuit may also include a condenser 34, expansion valve(s) or device(s) 36, and an evaporator 38. The vapor compression system 14 may further include an electronics enclosure 40 that stores a plurality of different electronics for operating the vapor compression system 14. Some of the electronics that may be stored in electronics housing 40 include digital (a/D) converter(s), microprocessor(s), non-volatile memory(s), interface board(s), and the like. As will be explained in more detail below, the electronics enclosure 40 forms a portion of the cooling electronics of the electronics cooling system 42 discussed above. In some embodiments, the electronics enclosure 40 is a hermetically sealed container that reduces and/or prevents exposure of the electronics to wet and dirty environments. In some embodiments, the electronics enclosure 40 may be the same enclosure that contains a motor Variable Speed Drive (VSD)52 or that contains components that control magnetic bearings of the motor.

Some examples of fluids that may be used as refrigerants in vapor compression system 14 are Hydrofluorocarbon (HFC) based refrigerants (e.g., R-410A, R-407, R-134a, Hydrofluoroolefins (HFO), R1233zd, R1234ze), "natural" refrigerants (e.g., ammonia (NH 3 zd)₃) R-717, carbon dioxide (CO)₂) R-744), or a hydrocarbon based refrigerant, water vapor, or any suitable refrigerant. In some embodiments, the vapor compression system 14 may be configured to efficiently utilize a refrigerant having a normal boiling point of about 19 degrees celsius (86 degrees fahrenheit) at one atmosphere pressure (relative to an intermediate pressure refrigerant such as R-134a, also referred to as a low pressure refrigerant). As used herein, "normal boiling point" may refer to the boiling point temperature measured at one atmosphere of pressure.

In some embodiments, the vapor compression system 14 may use one or more of the following components: variable speed drive(s) 52, motor 50, compressor 32, condenser 34, expansion valve or condensing device 36, and/or evaporator 38. A motor 50 drives the compressor 32 and may be powered by a Variable Speed Drive (VSD) 52. VSD52 receives Alternating Current (AC) power having a particular fixed line voltage and fixed line frequency from an AC power source and provides power having a variable voltage and frequency to motor 50. In other embodiments, the motor 50 may be powered directly by an AC or Direct Current (DC) power source. The motor 50 can include any type of electric motor that can be powered by the VSD52 or directly from an AC or DC power source, such as a switched reluctance motor, an induction motor, an electronically commutated permanent magnet motor, or other suitable motor. In some embodiments, the compressor 32 and/or motor 50 may use magnetic bearings 54 to reduce friction and/or noise during operation and increase compressor/motor reliability. The magnetic bearing 54 may be controlled by electronics housed within the electronics housing 40. As explained above, the electronics enclosure 40 may protect the electronics from dust and moisture, while the electronics cooling system 42 cools the electronics using a cooling fluid (e.g., water, refrigerant) supplied by the vapor compression system 14.

The compressor may be a positive displacement device 32 that compresses a refrigerant vapor and delivers the vapor through a discharge passage to a condenser 34. In some embodiments, the compressor 32 may be a centrifugal compressor. The refrigerant vapor delivered by the compressor 32 to the condenser 34 may transfer heat to a cooling fluid (e.g., water or air) in the condenser 34. The refrigerant vapor may condense to a refrigerant liquid in the condenser 34 as a result of heat transfer with the cooling fluid. Liquid refrigerant from the condenser 34 may flow through an expansion device 36 to an evaporator 38. In the embodiment illustrated in fig. 3, the condenser 34 is water cooled and includes a tube bundle 55 connected to a cooling tower 56 (or body of water surrounding the vessel) that supplies a cooling fluid to the condenser 34.

The liquid refrigerant delivered to the evaporator 38 may absorb heat from another cooling fluid, which may or may not be the same cooling fluid used in the condenser 34. The liquid refrigerant in the evaporator 38 may undergo a phase change from liquid refrigerant to refrigerant vapor. As shown in the embodiment shown in fig. 3, the evaporator 38 may include a tube bundle 58 coupled to a cooling fluid supply line 60S and a return line 60R. Supply line 60S and return line 60R connect cooler 14 to cooling load 62. A cooling fluid (e.g., water, ethylene glycol, calcium chloride brine, sodium chloride brine, or any other suitable fluid) for the evaporator 38 enters the evaporator 38 via a return line 60R and exits the evaporator 38 via a supply line 60S. Evaporator 38 may reduce the temperature of the cooling fluid in tube bundle 58 via heat transfer with the refrigerant. The tube bundle 58 in the evaporator 38 can include a plurality of tubes and/or a plurality of tube bundles. In any event, vapor refrigerant flows from the evaporator 38 and returns to the compressor 32 through a suction line to complete the cycle.

As illustrated, the electronics cooling system 42 may be coupled to a tube bundle 58 in the evaporator 38 to receive a flow of cooling fluid from the HVAC & R system 10. The electronics cooling system 42 uses a cooling fluid (e.g., water) from the HVAC & R system 10 to cool the electronics within the electronics enclosure 40. As explained above, the electronics cooling system 42 may not include a pump, and may instead use a pressure differential in the HVAC & R system 10 to drive a flow of cooling fluid through the electronics cooling system 42. For example, a supply line 64 of the electronics cooling system 42 may tap into the end of the tube bundle 58 that receives the cooling fluid flowing through the return line 60R. After passing through the electronics cooling system 42, the cooling fluid increases in temperature and pressure as it absorbs energy from the electronics disposed within the electronics enclosure 40. The cooling fluid then returns through return line 66 to the supply line side of the tube bundle 58. At this location in the evaporator 38, the pressure of the cooling fluid in the evaporator 38 will be lower than the pressure of the cooling fluid diverted from the evaporator 38 through the supply line 64. Without a pump, this pressure differential drives the flow of cooling fluid through the electronics cooling system 42.

In some embodiments, supply line 64 and return line 66 of electronics cooling system 42 may be coupled to other locations in vapor compression system 14 to create a pressure differential that drives cooling fluid through electronics cooling system 42. For example, the supply line 64 (i.e., the dashed supply line 64) may receive the cooling fluid (e.g., refrigerant) exiting the condenser 34 after passing through an expansion valve/device 68. Supply line 64 directs the cooling fluid through electronics cooling system 42 where it cools the first fluid or electronics through the cold plate/cold plate before exiting through return line 66 (i.e., dashed return line 66). Since the cooling fluid exiting expansion valve 68 is at a higher pressure than the cooling fluid in evaporator 38, return line 66 may then return the cooling fluid (i.e., refrigerant) to evaporator 38, the pressure differential driving the flow of cooling fluid through electronics cooling system 42 without a pump.

However, in some embodiments, the cooling fluid may be driven through the electronics cooling system 42 by one or more pumps 72. In still other embodiments, the pump(s) 72 may be assisted by a pressure differential in the HVAC & R system 10.

Fig. 4 is a schematic diagram of the vapor compression system 14 with an intermediate circuit 84 coupled between the condenser 34 and the evaporator 38. The intermediate loop 84 may have an inlet line 88 fluidly connected directly to the condenser 34. In other embodiments, the inlet line 88 may be indirectly fluidly coupled to the condenser 34. As shown in the illustrated embodiment of fig. 4, the inlet line 88 includes a first expansion device 86 positioned upstream of an intermediate vessel 90. In some embodiments, the intermediate vessel 90 may be a flash tank (e.g., a flash intercooler). In other embodiments, the intermediate vessel 90 may be configured as a direct expansion heat exchanger or an economizer. In the embodiment illustrated in fig. 4, the intermediate vessel 90 functions as a flash tank, and the first expansion device 86 is configured to reduce the pressure (e.g., expand) of the liquid refrigerant received from the condenser 34. During the expansion process, a portion of the liquid may vaporize, and thus the intermediate container 90 may be used to separate the vapor from the liquid received from the first expansion device 86. In addition, the intermediate container 90 may further expand the liquid refrigerant as the liquid refrigerant experiences a pressure drop upon entering the intermediate container 90 (e.g., due to a rapid increase in volume upon entering the intermediate container 90). Vapor in the intermediate vessel 90 may be drawn by the compressor 32 through an inlet line 94 to an intermediate pressure port of the compressor 32. In other embodiments, the vapor in the intermediate vessel 90 may be drawn to an intermediate section of the compressor 32. The liquid collected in the intermediate container 90 may have a lower enthalpy than the liquid refrigerant exiting the condenser 34 due to expansion in the expansion device 86 and/or the intermediate container 90. Liquid from intermediate vessel 90 can then flow in line 92 through second expansion device 36 to evaporator 38.

As illustrated, the electronics cooling system 42 receives cooling fluid from the vapor compression system 14. By using a heat exchanger, the electronics cooling system 42 uses a cooling fluid to cool the electronics within the electronics enclosure 40. As explained above, electronics cooling system 42 may not include a pump, and may instead use a pressure differential in vapor compression system 14 to drive a flow of cooling fluid through electronics cooling system 42. For example, a supply line 96 to the electronics cooling system 42 may tap into the line 92 carrying liquid cooling fluid (i.e., refrigerant) from the intermediate container 90 to the evaporator 38. After passing through electronics cooling system 42, the temperature of the cooling fluid increases. The cooling fluid is returned through line 98 to the evaporator 38, which is at a lower pressure than the cooling fluid flowing through line 92. As illustrated, the return line 98 is coupled to the evaporator 38. Since the cooling fluid exiting line 92 is at a higher pressure than the pressure in evaporator 38, the pressure differential drives the flow of cooling fluid through electronics cooling system 42 without a pump. However, in some embodiments, the pump 72 may assist and/or drive the cooling fluid (i.e., liquid refrigerant from the evaporator 38) through the supply line 95 to the electronics cooling system 42 and return the cooling fluid to the evaporator 38 through the return line 97.

Fig. 5 is a cross-sectional view of an embodiment of an electronics cooling system 42. As explained above, the electronics enclosure 40 forms part of the electronics cooling system 42. The electronics enclosure 40 is a hermetically sealed container that reduces and/or prevents exposure of the electronics to moisture, industrial fumes/gases, and dust in the environment. As illustrated, the electronics housing 40 includes a first housing 100 coupled to a second housing 102. The first housing 100 and the second housing 102 are fluidly coupled together by an outlet 104 and an inlet 106. In some embodiments, there may be multiple inlets 106 and outlets 104 (e.g., 2, 3, 4, 5, or more). The outlet 104 and the inlet 106 enable a cooling fluid 108 (e.g., air) to circulate between a first cavity 110 in the first housing 100 and a second cavity 112 in the second housing 102 to cool the electronics 114. The electronic devices 114 may include microchips, integrated circuits, power supplies, transistors, resistors, inductors, transformers, IGBTs, and the like. Advantageously, the electronics cooling system 42 limits and/or prevents direct interaction between the cooling fluid 108 and fluid outside of the electronics enclosure 40. In this manner, the electronics enclosure 40 can prevent and/or reduce exposure of the electronics 114 to moisture, industrial fumes/gases, and/or dust in the environment. For example, the cooling fluid 108 (e.g., air) may not be exposed to moist/humid air circulating around the exterior of the electronics enclosure 40.

To remove heat from the cooling fluid 108, the electronics cooling system 42 includes a heat exchanger 116 (e.g., a gas-to-liquid heat exchanger). The heat exchanger 116 receives a second cooling fluid 118 through a supply line 120. The second cooling fluid 118 comes from the vapor compression system 14 and may be a refrigerant, water, or the like. In the heat exchanger 116, the second cooling fluid 118 exchanges energy with the first cooling fluid 108 circulating in the electronics enclosure 40. After exchanging energy in the heat exchanger 116, the second cooling fluid 118 leaves the heat exchanger 116 at a higher temperature. The second cooling fluid 118 then exits the electronics cooling system 42 to be carried to the HVAC & R system 10 via a return line 122.

After exiting the heat exchanger 116, the first cooling fluid 108 is driven into the second enclosure 102 using a fan 124. More specifically, the fan 124 draws the first cooling fluid 108 through the heat exchanger 116, and then blows the first cooling fluid 108 through the outlet 104 and into the inlet chamber 152. After passing through the outlet 104, the first cooling fluid 108 contacts the baffle system 126. As illustrated, the baffle system 126 redirects the flow of the cooling fluid 108 and controls the flow of the cooling fluid through the second enclosure 102. The baffle system 126 includes a baffle 128 and a baffle 130. A baffle 130 is coupled to second housing 102 and spaces baffle 128 a distance 132 from housing wall 134. In certain embodiments, the distance 132 may be selected to optimize the flow and pressure drop of the cooling fluid 108. In addition to spacing baffle 128 from shell wall 134, baffle 130 also spaces outlet 104 from inlet 106 to form an inlet plenum 152 and an outlet plenum 154. Accordingly, when the cooling fluid 108 exits the first enclosure 100 through the outlet 104, the baffle 130 prevents the first cooling fluid 108 from flowing directly to the inlet 106 without passing through the baffle 128 and the attached electronics 114.

As the first cooling fluid 108 exits the outlet 104, it contacts the aft face 136 of the baffle 128. The first cooling fluid 108 is thus directed upward in the inlet chamber 152 in the axial direction 138 (e.g., vertical). As the first cooling fluid 108 flows upward, it passes over the baffle 128. After passing through the baffle 128, the first cooling fluid 108 flows in an axial direction 140 (e.g., downward). This produces a cascading cooling effect that cools the electronic devices 114 as the first cooling fluid 108 flows in the direction 140. The first cooling fluid 108 then flows around the bottom of the baffle 128 where it contacts the wall 134 of the second housing 102. The wall 134 and the baffle 128 direct the first cooling fluid 108 upward in the axial direction 138 through the outlet chamber 154. As explained above, the baffle 130 prevents direct fluid flow between the outlet 104 and the inlet 106. The first cooling fluid 108 is thus driven through the inlet 106 and into the heat exchanger 116 where it again exchanges energy with the second cooling fluid 118.

Since the electronics enclosure 40 is hermetically sealed, moisture in the first cooling fluid 108 may not increase. However, the initial moisture in the first cooling fluid 108 may condense within the cavity 110 where the heat exchanger 116 and the supply line 120 create the coldest surfaces. To facilitate removal of liquid from the electronics enclosure 40, the electronics cooling system 42 includes a condensate breather valve 142. The condensate breather valve 142 enables liquid to exit the electronics enclosure 40 while preventing and/or reducing external (ambient) fluid flow into the electronics enclosure 40. A condensate breather valve 142 may be disposed in the first enclosure 100 to trap liquid condensed in the first cooling fluid 108 as it exits the heat exchanger 116. In other words, as the first cooling fluid 108 exits the heat exchanger 116, liquid may condense out of the first cooling fluid 108 and fall to the bottom of the first enclosure 100 in the direction 140 due to gravity. The liquid may then flow to a condensate breather valve 142 where it is directed out of first housing 100 in direction 140. This process may thus produce dry, cool air in

cavities

110 and 112 that cools electronics 114 and protects the electronics from moisture. Further, to facilitate condensation and the resulting separation from any condensate cold electronics 114, a heat exchanger 116 is disposed within the first enclosure 100. As explained above and referring to fig. 5, the first and

second housings

100, 102 are separated by a wall 134 that prevents minimal condensate formed in the first housing 100 from flowing into the second housing 102.

In some embodiments, the first housing 100 and the second housing 102 are separate housings coupled together. For example, the first housing 100 and the second housing 102 may be coupled together by fasteners 144. When coupled, the first housing 100 and the second housing 102 may form a fluid-tight seal that prevents and/or reduces the ingress of external (environmental) fluids into the electronics housing 40. The sealing element 156 may be used to form a fluid tight seal, such as using gaskets, welding, polymer seals (e.g., O-rings, etc.), brazing, adhesives, and the like. In some embodiments, the first housing 100 and the second housing 102 can be integral (e.g., one-piece) with each other. Although the first housing 100 and the second housing 102 are illustrated as having different dimensions, in some embodiments they may be the same size.

To facilitate access to

cavities

110 and 112, first housing 100 and second housing 102 may have access panels. For example, the first enclosure 100 may include a fan access panel 146. The fan access panel 146 is coupled to the first enclosure 100 by one or more fasteners 148 (e.g., threaded fasteners such as bolts, screws). The fan access panel 146 enables access for replacement and/or maintenance of the fan 124. When coupled to the housing 40, the fan access panel 146 forms a fluid-tight seal with the first housing 100 using gaskets, brazing, adhesives, and the like to prevent and/or reduce contact with fluids surrounding the exterior of the electronics housing 40. The electronics 114 may also be accessed through a housing panel 150 coupled to the second housing 102. The housing panel 150 may likewise be coupled to the second housing 102 by fasteners (e.g., threaded fasteners such as bolts, screws, etc.). The housing panel 150 may also form a fluid-tight seal with the second housing 102 using gaskets, brazing, adhesives, etc. to prevent and/or reduce contact with fluids surrounding the exterior of the electronics housing 40.

Fig. 6 is a cross-sectional view of an embodiment of an electronics cooling system 42. The electronics cooling system 42 in fig. 6 circulates a first cooling fluid 108 through the first enclosure 100 and the second enclosure 102 to cool the electronics 114. However, to provide additional cooling, the electronics cooling system 42 may include one or more cooling (cold) plates 170. The cooling (cold) plate 170 may enhance heat transfer from the one or more electronic components 114. For example, some electronic components 114 may generate more heat than other electronic components. These electronic components 114 may thus increase the heat transfer requirements of the electronics cooling system 42. Accordingly, the electronics cooling system 42 may include a cooling (cold) plate 170 to enable more direct transfer of heat from the electronics to the second cooling fluid 118. As shown in fig. 6, the cooling (cold) plate 170 may directly receive and circulate the second cooling fluid 118. The supply line 120 and the return line 122 may include respective T-

fittings

172 and 174. As shown in fig. 6, the T-

joints

172, 174 enable the second cooling fluid 118 to flow into and out of the heat exchanger 116 and the cooling (cold) plate 170. The second cooling fluid 118 may be water or a refrigerant.

Since the cooling (cold) plate 170 is located within the second enclosure 102, the cooling (cold) plate 170 may form a condensate within the second enclosure 102. To reduce potential contact between the condensate formed by the cooling (cold) plate 170 and the electronic device 114, the cooling (cold) plate 170 may be positioned at the bottom of the baffle 128 along direction 140. Accordingly, if condensate forms on the cooling (cold) plate 170, the condensate may fall to the bottom of the second housing 102 in direction 140 without contacting any other electronics 114. To remove the condensate, the second housing 102 may include a second

condensate breather valve

142, 176. As explained above, the condensate breather valve 176 enables the electronics cooling system 42 to remove liquid from the first enclosure 100 and/or the second enclosure 102. However, in some embodiments, the cooling (cold) plate 170 may not form a condensate within the second enclosure 102 due to the heat exchanger 116 and the supply line 120 condensing out of moisture in the cooling fluid 108 before the cooling fluid reaches the second enclosure 102.

In some embodiments, electronics cooling system 42 may include an additional barrier system 126 to contain and cool more electronic components 114. As illustrated in fig. 6, the electronics cooling system 42 includes a first baffle system 126 coupled to the wall 134 of the second enclosure 102 and a second baffle system 126 coupled to the enclosure panel 150. The baffles 128 of the respective first and second baffle systems 126 may be spaced apart by a distance 178 to facilitate the flow of the first cooling fluid 108 through the electronic device 114. The distance 178 may be optimized to promote the desired heat transfer from the electronic device 114 to the cooling fluid 108.

Fig. 7 is a partial cross-sectional view of an embodiment of the electronics cooling system 42 within line 7-7 of fig. 6. As explained above, the electronics cooling system 42 in fig. 7 circulates the first cooling fluid 108 through the first enclosure 100 and the second enclosure 102 to cool the electronics 114. To provide additional cooling, the electronics cooling system 42 may include one or more cooling (cold) plates 170. The cooling (cold) plate 170 may enhance heat transfer from the one or more electronic components 114. For example, some electronic components 114 may generate more heat than other electronic components. Accordingly, the electronics cooling system 42 may include a cooling (cold) plate 170 to enable more direct transfer of heat from the electronics to the second cooling fluid 118. However, rather than splitting the flow of the second cooling fluid 118, the electronics cooling system 42 may first direct the second cooling fluid 118 to the cold (cold) plate 170 before redirecting the second cooling fluid 118 to flow through the heat exchanger 116.

Fig. 8 is a partial cross-sectional view of an embodiment of the electronics cooling system 42 within line 7-7 of fig. 6. As explained above, to provide additional cooling, the electronics cooling system 42 may include one or more cooling (cold) plates 170. The cooling (cold) plate 170 may enhance heat transfer from the one or more electronic components 114. However, rather than first directing the second cooling fluid 118 to the cold (cold) plate 170, the electronics cooling system 42 may first direct the second cooling fluid 118 to the heat exchanger 116, after which the second cooling fluid 118 is directed to the cold (cold) plate 170. By first directing the second cooling fluid 118 through the heat exchanger 116, the electronics cooling system 42 may heat the second cooling fluid 118 and reduce condensation in the second enclosure 102 while cooling the one or more electronic components 114.

Fig. 9 is a cross-sectional view of an embodiment of an electronics cooling system 42. As explained above, the electronics cooling system 42 may include one or more cooling (cold) plates 170. The cooling (cold) plate 170 may enhance heat transfer from the one or more electronic components 114. For example, some electronic components 114 may generate more heat than other electronic components. These electronic components 114 may thus increase the heat transfer requirements of the electronics cooling system 42. However, the cooling (cold) plate 170 may be separately supplied with the third cooling fluid 200. The third cooling fluid 200 flows into and out of the cold plate 170 through respective supply and return

lines

202 and 204. In some embodiments, the second cooling fluid 118 and the third cooling fluid 200 may be the same cooling fluid. For example, the second cooling fluid 118 and the third cooling fluid 200 may be water, a refrigerant, or the like. In another embodiment, the second cooling fluid 118 and the third cooling fluid 200 may be different. For example, the second cooling fluid 118 may be water and the third cooling fluid 200 may be a refrigerant, or vice versa.

Fig. 10 is a cross-sectional view of an embodiment of an electronics cooling system 42. In some embodiments, the baffle system 126 may include one or more additional guide plates 220. The guide plate 220 assists in controlling the flow of the first cooling fluid 108 through the second housing 102. As illustrated, the guide plate 220 is coupled to an inner surface 222 of a top plate 224 of the second housing 102. Guide plate 220 extends away from inner surface 222 in direction 140. The guide plate 220 may extend over a portion or the entire baffle 128 to direct the flow of the first cooling fluid 108. As illustrated, the first cooling fluid 108 flows upward and over the baffle 128. After passing through the baffle 128, the first cooling fluid 108 contacts the surface 226 of the guide plate 220. The guide plate 220 directs the first cooling fluid 108 downward in the direction 140 and past the electronic device 114. In this manner, the guide plates 220 concentrate the flow of the first cooling fluid 108 over the electronic devices 114 to facilitate heat transfer. In some embodiments, a distance 228 between a surface 226 of the guide plate 220 and the baffle 128 may be increased or decreased to control the characteristics of the fluid flow over the electronic device 114. The increased flow velocity may increase turbulence, resulting in more heat transfer from the electronic device 114. For example, by decreasing the distance 228, the guide plate 220 may increase the flow velocity of the first cooling fluid 108 over the electronic device 114. Likewise, if the distance 228 is increased, the guide plate 220 may decrease the flow velocity of the first cooling fluid 108 over the electronic device 114. In this manner, electronics cooling system 42 may use guide plates 220 to direct and customize heat transfer between first cooling fluid 108 and electronics 114.

As illustrated, the surface 226 of the guide plate 220 is flat; however, in some embodiments, the surface 226 may be curved or otherwise shaped to promote heat transfer at different locations along the guide plate 220. For example, the distance 230 between the guide plate 220 and the baffle 128 may be increased and/or decreased at different points along the length 230 to customize and/or optimize heat transfer across different electronic devices 114 (e.g., increase or decrease flow velocity across different electronic devices 114). In some embodiments, rather than varying the curvature of the guide plate 220 at different points along the length 230 of the guide plate 220, the guide plate 220 may include protrusions 232 and/or recesses 234. The protrusions 232 and depressions 234 may similarly control the flow rate and flow rate of the first cooling fluid 108 over a particular electronic component 114, and thus control the heat transfer characteristics.

To access the electronics 114, the guide plate 220 may be removably coupled with the second housing 102. For example, the guide plate 220 may be coupled to the second housing 102 by a snap connection, a bayonet connection, or the like. In some embodiments, the guide plate 220 may be removably coupled using fasteners (e.g., threaded fasteners).

FIG. 11 is a front view of an embodiment of the baffle system 126. As illustrated, the baffle 128 can have another shape than rectangular or square. For example, the baffle 128 may have an irregular shape to control the flow of the first cooling fluid 108 over the electronic device 114. In fig. 11, plate 128 includes

rectangular cutouts

250 and 252 at respective ends 254 and 256 of baffle 128. However, the

cutouts

250, 252 may be located at different positions along the length 258 of the baffle 128, have different sizes, and/or have different shapes (e.g., semi-circular, triangular, square, etc.) in order to customize/control the flow of the first cooling fluid 108 over the electronic device 114. As illustrated, because the cutout 252 is larger than the cutout 250, the baffle 128 directs more of the first cooling fluid 108 through the electronic device 114 at or near the end 256 of the baffle 128. It should be noted that the

cutouts

250, 252 may be placed anywhere on the baffle 128 above and/or below the baffle 130 to control the flow of the first cooling fluid 108 over the electronic devices 114.

In some embodiments, the baffle 128 may also include an aperture 260. The apertures 260 enable the first cooling fluid 108 to pass through the apertures 260 rather than flowing up and over the baffle 128. This enables a customized and/or optimized fluid flow of the first cooling fluid 108 over the particular electronic device 114. Although two apertures 260 are shown in fig. 11, in other embodiments, there may be a different number of apertures 260, such as 1, 3, 4, 5, 6, 7, 8, 9, 10, or more. Further, the apertures 260 may have different shapes and/or sizes in order to customize and/or optimize the flow of the first cooling fluid 108 over the electronic device 114.

FIG. 12 is a front view of an embodiment of the baffle system 126. As illustrated, the baffle system 126 includes a baffle 128 and a baffle 130. As seen in fig. 11, rather than using irregularly shaped baffles 128 and/or apertures 260 to control the flow of the first cooling fluid 108, the baffle system 126 includes an adjustable baffle 280. Adjustable barrier 280 is coupled to

respective ends

254 and 256 of baffle 128. The adjustable barrier 280 may be vertically repositioned along

directions

138 and 140 to customize the flow of the first cooling fluid 108 over the electronic device 114. While fig. 12 uses the adjustable barrier 280 to control the flow of the first cooling fluid 108, in some embodiments, the barrier system 126 may include a combination of the adjustable barrier 280, the aperture 260, and the

notches

250 and 252 to control the flow of the first cooling fluid 108 over the electronic device 114.

While only certain features and embodiments of the disclosure have been shown and described, many modifications and changes may occur to those skilled in the art (e.g., variations in sizes, dimensions, structures, shapes and proportions of the various elements, values of parameters (e.g., temperatures, pressures, etc.), mounting arrangements, use of materials, colors, orientations, etc.) without materially departing from the novel teachings and advantages of the subject matter recited in the claims. The order or sequence of any process or method steps may be varied or re-sequenced according to alternative embodiments. It is, therefore, to be understood that the appended claims are intended to cover all such modifications and changes as fall within the true spirit of the invention. Furthermore, in an effort to provide a concise description of the exemplary embodiments, all features of an actual implementation may not have been described (i.e., those unrelated to the presently contemplated best mode of carrying out the invention or those unrelated to enabling the claimed invention). It should be appreciated that in the development of any such actual implementation, as in any engineering or design project, numerous implementation-specific decisions may be made. Such a development effort might be complex and time consuming, but would nevertheless be a routine undertaking of design, fabrication, and manufacture for those of ordinary skill having the benefit of this disclosure, without undue experimentation.

Claims

1. An electronic device cooling system comprising:

an electronics enclosure, wherein the electronics enclosure is hermetically sealed;

a heat exchanger configured to exchange heat between a first cooling fluid within the electronics enclosure and a second cooling fluid of a vapor compression system;

a fan configured to circulate the first cooling fluid within the electronics enclosure; and

a barrier system located within the electronics enclosure, wherein the barrier system is configured to direct the first cooling fluid through one or more electronic components disposed within the electronics enclosure to cool the one or more electronic components.

2. The system of claim 1, comprising a condensate breather valve coupled to the electronics enclosure, wherein the condensate breather valve is configured to release liquid condensed in the electronics enclosure.

3. The system of claim 1, wherein the electronics enclosure comprises a first enclosure, and the first enclosure is configured to hold the heat exchanger and the fan.

4. The system of claim 3, wherein the electronics enclosure comprises a second enclosure, and the second enclosure is configured to support the barrier system and hold the one or more electronic components.

5. The system of claim 4, wherein the first enclosure and the second enclosure are fluidly coupled together via an inlet and an outlet, and wherein the inlet and outlet enable the first cooling fluid to circulate between the first enclosure and the second enclosure.

6. The system of claim 5, wherein the baffle system comprises a baffle and a baffle coupled to the baffle, and wherein the baffle is positioned between the inlet and the outlet to force the first cooling fluid to flow through the baffle.

7. The system of claim 6, wherein the baffle system comprises an adjustable baffle coupled to the baffle, wherein the adjustable baffle is configured to move relative to the baffle to adjust the flow of the second cooling fluid over the one or more electronic components.

8. The system of claim 1, comprising a cooling plate coupled to the barrier system, wherein the cooling plate is configured to couple to the one or more electronic components and cool the one or more electronic components.

9. The system of claim 8, wherein the cooling plate is configured to receive a third cooling fluid from the vapor compression system to cool the one or more electronic components.

10. The system of claim 9, wherein the first cooling fluid and the third cooling fluid are different.

11. A system, comprising:

an electronic device cooling system, the electronic device cooling system comprising:

a heat exchanger;

a fan configured to circulate a first cooling fluid within the electronics enclosure; and

a barrier system located within the electronics enclosure, wherein the barrier system is configured to direct the first cooling fluid through one or more electronic components to cool the one or more electronic components; and

a vapor compression system configured to produce a second cooling fluid;

wherein the heat exchanger is configured to exchange heat between the first cooling fluid and the second cooling fluid.

12. The system of claim 11, wherein the vapor compression system is a chiller.

13. The system of claim 12, wherein the second cooling fluid is water.

14. The system of claim 12, wherein the second cooling fluid is a refrigerant.

15. The system of claim 11, comprising the one or more electronic components, wherein the one or more electronic components are configured to control operation of the vapor compression system.

16. An electronic device cooling system comprising:

an electronics enclosure configured to store one or more electronic components for controlling a vapor compression system, wherein the electronics enclosure is hermetically sealed; and

a barrier system located within the electronics enclosure, wherein the barrier system is configured to direct a first cooling fluid through the one or more electronic components to cool the one or more electronic components.

17. The system of claim 16, wherein the barrier system comprises a partition that couples the barrier system to the electronics enclosure.

18. The system of claim 17, comprising a baffle coupled to the bulkhead, wherein the baffle is configured to support the electronic component.

19. The system of claim 18, comprising an adjustable barrier coupled to the baffle, wherein the adjustable barrier is configured to be coupled to the baffle at different positions to control the flow of the first cooling fluid over the electronic component.

20. The system of claim 18, wherein the baffle defines one or more apertures that direct the first cooling fluid through the electronic component.