TWI825559B - Through-type heat dissipation device for electronic equipment - Google Patents

Abstract

A through-type heat dissipation device for electronic equipment, including a through-channel that passes through the box and defines a contact area that contacts the heating element. The through-channel has a first port and a second port, wherein the first port corresponds to the A first opening on the first side wall of the box, and the second port corresponds to a second opening on the second side wall of the box. A forced convection device is combined with the through channel to form a forced fluid in the through channel so as to conduct the heat energy generated by the heating element out of the internal space of the box through the through channel.

Description

Through-type heat dissipation device for electronic equipment

The present invention relates to a heat dissipation device for electronic equipment, and in particular to a through-type heat dissipation device for electronic equipment.

In the design of various electronic devices, electronic components are generally arranged on a circuit board or a carrier board. When electronic components are working, they generate considerable heat energy. Especially in today's high-frequency electronic components or high-current electronic components, their thermal energy is greater. In order to prevent electronic devices from overheating, heat dissipation structures are generally designed so that the heat energy of electronic components can be properly dissipated to ensure normal operation of the electronic devices.

In order to meet the needs of various electronic devices, manufacturers have developed various heat dissipation designs. However, for electronic devices that must be watertight or airtight, general heat dissipation structures cannot meet the needs. Therefore, how to design a heat dissipation structure that is particularly suitable for electronic devices in confined spaces has become a very important issue for the industry.

There are three common ways to dissipate heat from a closed box: 1. Metal directly conducts heat out of the box: This type of conventional heat dissipation structure is simple, but has too many shortcomings. 2. Heat pipe: This type of conventional heat dissipation structure mainly includes heat pipes, heat sinks, and fans. The heat from the heat source in the box is exported through the heat pipe, and then transferred to the heat sink outside the box for heat dissipation. This type of heat dissipation structure relies on the phase change of the vapor phase fluid and liquid phase fluid inside the heat pipe to conduct the heat energy to the condensation end, where it is then dissipated by heat sinks and fans. 3. Liquid cooling device: This type of conventional heat dissipation structure mainly includes a liquid cooling head, a water pump, a liquid pipeline, and a heat dissipation module. The heat source in the box conducts heat to the outside through the liquid cooling head. This type of heat dissipation structure is complex, which limits its application fields. Furthermore, there is uneven temperature at different heat source locations.

Therefore, one object of the present invention is to provide a through-type heat dissipation device for electronic equipment, which is particularly suitable for electronic modules with water-tight or air-tight boxes for heat dissipation.

In order to achieve the above object, the present invention provides a through-type heat dissipation device, which includes a through-passage that passes through the box of the electronic device and defines a contact area to contact the heating element of the electronic device. The through-passage has a first port and a A second port, wherein the first port corresponds to a first opening of the first side wall of the box, and the second port corresponds to a second opening of the second side wall of the box. A forced convection device is combined with the through channel to form a forced fluid in the through channel so as to conduct the heat energy generated by the heating element out of the internal space of the box through the through channel.

Wherein, the inner wall of the through channel includes a plurality of inner fins, and the outer wall of the through channel includes a plurality of outer fins.

Wherein, the first opening of the through channel corresponds to the second opening.

Wherein, the first opening of the through channel is connected to the second opening but does not correspond to the second opening.

Among them, the through-channel is a straight-through structure with one of a U-shaped section and a turning section, which can be adapted to the internal space of the box or the location of the heating element or the electronic/mechanical components configured in the box. of obstruction.

Wherein, the forced convection device includes at least a first fan disposed at the first port of the through channel and corresponding to the first opening of the first side wall; at least a second fan disposed at the second port of the through channel and corresponds to the second opening of the second side wall.

In another embodiment of the present invention, the first port of the through channel corresponds to the first opening of the first side wall of the box, and the second port corresponds to the second opening of the second side wall of the box. A forced convection device is combined with the first opening of the first side wall and the second opening of the second side wall to form a forced fluid in the through channel to pass the thermal energy generated by the heating element through the through channel. Channels are derived from this interior space of the cabinet.

In terms of effects, the through-channel in the through-type heat dissipation device of the present invention is combined with the forced convection device to form a forced fluid in the through-channel, so that the heat energy generated by the heating element of the electronic module in the box is passed through the forced fluid and The guidance of the through channel is led out from the internal space of the box, so as to achieve a good heat dissipation effect.

Referring to FIGS. 1 to 5 , the first embodiment of the present invention shows an electronic module 2 housed inside a box 1 , and the electronic module 2 includes at least one heating element 21 . The present invention combines a through-type heat dissipation device 3 in the box 1 to provide heat dissipation for the heat energy generated by the heating element 21 of the electronic module 2 . Preferably, the heating element 21 can be supported and positioned by a plurality of support rods 22 and protrude a distance from the electronic module 2 .

According to different applicable occasions, the box 1 is a box surrounded by two corresponding first side walls 11 and second side walls 12, two corresponding front plates and back plates, a top plate, and a bottom plate, and A watertight box with good watertightness or an airtight box with good airtightness to form a sealed internal space inside the box 1 so that the electronic module 2 accommodated in the box 1 will not be affected by moisture or use Environmental influence or electromagnetic field influence of the occasion.

The through-type heat dissipation device 3 includes a through-channel 31 that passes through the first side wall 11 and the second side wall 12 of the box 1 and forms a first opening 111 and a second opening in the first side wall 11 and the second side wall 12 respectively. 121.

The outer wall of the through channel 31 may include a plurality of outer fins 313 , and the inner wall of the through channel 31 may include a plurality of inner fins 314 to enhance the heat dissipation performance of the through channel 31 .

Referring to FIGS. 6 and 7 at the same time, FIG. 6 shows an exploded perspective view of the relevant components of the first embodiment of the present invention when separated, and FIG. 7 shows an exploded perspective view of the relevant components of the through-type heat dissipation device 3 of the present invention when separated. As shown in the figure, the through channel 31 defines a contact area and is at least partially in contact with the heating element 21 . A first port 311 is formed at one end of the through channel 31, and the first port 311 corresponds to the first opening 111 of the first side wall 11, and a second port 312 is formed at the other end of the through channel 31, and The second port 312 corresponds to the second opening 121 of the second side wall 12 .

The through channel 31 is also combined with a forced convection device 4 to form a forced fluid inside the through channel 31 to conduct the heat generated by the heating element 21 out of the box 1 . The forced flow system generated by the forced convection device 4 can be either a gas flow or a liquid flow.

Taking the air flow type of forced fluid as an example, the forced convection device 4 may include a first fan 41 coupled to the first port 311 of the through channel 31 and a second fan 42 coupled to the second port 312 of the through channel 31 . The first fan 41 may be an air inlet fan, and the second fan 42 may be an air outlet fan. During implementation, the first fan 41 may be combined with only the first port 311 or the second fan 42 may be combined with the second port 312 .

Furthermore, in the embodiment shown in the figures, the first opening 111 of the first side wall 11 corresponds to the second opening 121 of the second side wall 12, so that the through channel 31 has a through-type structure. In another embodiment, the first opening 111 of the first side wall 11 can also be designed to be connected to the second opening 121 but not corresponding to the second opening 121. For example, the through channel 31 has an L-shaped structure, and the first opening 111 of the first side wall 11 is connected to the second opening 121. A fan 41 and a second fan 42 are respectively located on mutually perpendicular side walls of the box 1 .

For example, the through channel 31 is configured in a U-shaped structure, so that the first port 311 and the second port 312 respectively correspond to the first opening 111 and the second opening 121 of the first side wall 11 of the box 1 .

In the above embodiment, the first fan 41 is coupled to the first port 311 of the through channel 31 and the second fan 42 is coupled to the second port 312 of the through channel 31 . In a modified embodiment, the first fan 41 can also be directly coupled to the first opening 111 of the first side wall 11 and the second fan 42 can be coupled to the second opening 121 of the second side wall 12 .

Figure 8 shows a cross-sectional view of a second embodiment of the present invention. The components of this embodiment are substantially the same as those of the first embodiment, so the same components are marked with the same component numbers for correspondence. In this embodiment, in response to the internal space of the box 1 or the arrangement position of the heating element 21 or the obstruction of the electronic/mechanical components 5 arranged in the box 1, the structure of the through channel 31 can also be designed accordingly. It has a curved or arc-shaped path structure, and is not limited to the straight-through structure shown in Figure 4. In this embodiment, the structure of the through channel 31 has a U-shaped section 31 a, which allows the contact area of the through channel 31 to contact the heating element 21 and avoid the electronic/mechanical component 5 .

Figure 9 shows a cross-sectional view of a third embodiment of the present invention. In this embodiment, similarly, in response to the internal space of the box 1 or the arrangement position of the heating element 21 or the obstruction of the electronic/mechanical components 5 arranged in the box 1, the structure of the through channel 31 can also be adapted to The ground is designed to have a curved or arc-shaped path structure, and is not limited to the straight-through structure shown in Figure 4. In this embodiment, the structure of the through channel 31 has a turning section 31 b, which allows the contact area of the through channel 31 to contact the heating element 21 and avoid the electronic/mechanical component 5 .

The above embodiments are only illustrative of the structural design of the present invention and are not intended to limit the present invention. Anyone skilled in the art can modify and change the above embodiments within the structural design and spirit of the present invention, but these changes still fall within the spirit of the present invention and the patent scope defined below. Therefore, the protection scope of the present invention should be as listed in the patent application scope mentioned below.

1: Box 11: First side wall 111: First opening 12: Second side wall 121: Second opening 2: Electronic module 21: Heating element 22: Support rod 3: Through-type heat dissipation device 31: Through passage 31a: U-shaped section 31b: Turning section 311: first port 312: Second port 313: Outer fins 314: Inner fin 4: Forced convection device 41: First fan 42: Second fan 5: Electronic/mechanical components

Figure 1 shows a perspective view of the first embodiment of the present invention. Figure 2 shows a front view of the first embodiment of the present invention. Figure 3 shows a cross-sectional view of section A-A in Figure 1 . Figure 4 shows a cross-sectional view of section B-B in Figure 1 . FIG. 5 shows a cross-sectional view of section C-C in FIG. 2 . FIG. 6 shows an exploded perspective view of each relevant component of the first embodiment of the present invention when it is separated. FIG. 7 shows an exploded perspective view of the relevant components of the through-type heat dissipation device in the first embodiment of the present invention when the components are separated. Figure 8 shows a cross-sectional view of a second embodiment of the present invention. Figure 9 shows a cross-sectional view of a third embodiment of the present invention.

11: First side wall 111: First opening 12: Second side wall 121: Second opening 21: Heating element 22: Support rod 3: Through-type heat dissipation device 31: Through passage 311: first port 312: Second port 313: Outer fins 41: First fan 42: Second fan

Claims (9)

A through-type heat dissipation device for electronic equipment, used to provide heat dissipation for the heat energy generated by the heating element of the electronic module housed in the internal space of a box, characterized in that the through-type heat dissipation device includes: the box, It has an airtight/watertight sealed internal space, and the electronic module is configured in the sealed internal space; a through channel that penetrates the box and defines a contact area on an outer wall of the through channel, at least a part of the contact area In contact with the heating element, the through-channel is a closed channel and is airtightly/watertightly isolated from the closed internal space of the box, and both ends of the closed channel of the through-channel are respectively formed with a first port and a first port. a second port, wherein the first port corresponds to a first opening of the first side wall of the box, and the second port corresponds to a second opening of the second side wall of the box; a forced convection device, Combined with the through-channel, a forced fluid is formed inside the through-channel, so that the thermal energy generated by the heating element is exported through the contact area and the forced fluid formed inside the through-channel. The through-type heat dissipation device for electronic equipment as claimed in claim 1, wherein the inner wall of the through-channel includes a plurality of inner fins. The through-type heat dissipation device for electronic equipment as claimed in claim 1, wherein the outer wall of the through-channel includes a plurality of outer fins. The through-type heat dissipation device for electronic equipment as claimed in claim 1, wherein the first opening of the through-channel corresponds to the second opening. The through-type heat dissipation device for electronic equipment as claimed in claim 1, wherein the first opening of the through-channel is connected to the second opening but does not correspond to the second opening. The through-type heat dissipation device for electronic equipment as claimed in claim 1, wherein the forced convection device includes at least a first fan disposed at the first port of the through-channel and corresponding to the first side wall. The first opening; at least a second fan is disposed at the second port of the through-channel and corresponds to the second opening of the second side wall. The through-type heat dissipation device for electronic equipment as described in claim 1, wherein the heating element is supported and positioned by a plurality of support rods and protrudes from the electronic module for a distance. The through-type heat dissipation device for electronic equipment as claimed in claim 1, wherein the forced fluid is one of air flow or liquid flow. The through-type heat dissipation device for electronic equipment as claimed in claim 1, wherein the through-channel is one of a straight-through structure, a U-shaped section, and a turning section.

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