M286410 八、新型說明： 【新型所屬之技術領域】 本新型是有關於一種電源供應器，且特別是有關於一 種具有冷卻功能之電源供應器。 【先前技術】 電子裝置之電力來源途徑一般是由發電廠輸送至插 座，電源供應器連接至插座上，主要針對交流電進行整流、 變壓及濾波等處理流程，最後再提供給各裝置。尤其在電 腦系統中’其同時供應多數裝置運作所須之電源。電源供 應器之位置’一般設計是靠近中央處理單元，且電源供應 器與中央處理單元（centrai processing unit ; CPU)二者間通 常不會有交互作用，係為各自獨立運作。 中央處理單元運作時會產生大量的熱能，因此通常配 備有一散熱裝置，例如一 CPU散熱風扇，以降低因溫度過 同而導致το件失效之情形。在上述電源供應器與中央處理 單70獨立運作的情形下，CPU散熱風扇所吸引用來冷卻中 央處理單元之氣流係來自電腦系統内部，然而此吸引氣流 心響了對於中央處理單元冷卻之效果，若此吸引氣流之溫 f越低，在冷卻效果上必然越佳。一般電腦系統運作時内 紅衣見’皿度由於内部元件會產生熱，因而溫度比外部環 兄胍度’或稱室溫為高，也因此僅依靠cpu風扇來對中央 處理單元降溫之方式有其限制。 、 【新型内容】 M286410 因此本新型的目的就是在提供一種具有冷卻功能之電 源供應器，不只具有電源供應之功能，更有提供冷卻效果 之功能。 本新型的另一目的是在提供一種具有冷卻功能之電源 供應器，在一般電腦系統配置架構裡，加強對於中央處理 早元之散熱效率。 根據本新型之上述目的，提出一種具有冷卻功能之電 源供應器。具有冷卻功能之電源供應器包含一電源供應器 殼體、一致冷晶片與一冷側散熱構件。致冷晶片配置於電 源供應器设體之一致冷晶片設置面開口，冷側朝向電源供 應器殼體外部，熱側朝向電源供應器殼體内部。一冷側散 熱構件搞接於冷側，並突出至電源供應器殼體外部，藉此 與電源供應器殼體外部之空氣進行熱交換，降低殼體外部 空氣之溫度。 依照本新型一較佳實施例，電源供應器更包含一集熱 腔體，具有一第一通道開口與一第二通道開口。電源供應 器殼體更具有一外部開口與一内部開口，分別連接第一通 道開口與第二通道開口，且第一通道開口與外部開口之間 設置一風扇，藉此集中熱側之熱量並將熱量引導至殼體之 外部。 電源供應器更結合一溫度控制模組以及一溼度控制模 組。溫度控制模組偵測一溫度資訊，並依據此溫度資訊調 節風扇電源，以進行風扇轉速之控制。濕度控制模組偵測 一漁度資訊，並依據此濕度資訊調節致冷晶片電源，以進 行致冷晶片輸出功率之控制。 M286410 本創作之電源供應器藉由整合致冷晶片達到了在使用 ，源供應器時，額外提供冷卻线内部溫度之功能，尤其 是在現行大部分的電腦架構下，電源供應器裝設之位置已 屬規格化’本創作充分利用了現行規格化之電源供應器配 置，使中央處理單元風扇得以吸取經過熱交換，因而有較 低度之系統内氣流，也因此提升了對中央處理單元之冷 卻效率。 【實施方式】 本創作係為一種具有冷卻功能之電源供應器，藉由一 致冷晶片與電源供應器之整合，在電源供應之功能外更附 加了冷卻系統氣流之功能。以下將以圖式及詳細說明清楚 闡釋本創作之精神，如熟悉此技術之人員在瞭解本創作之 較佳實施例後，當可由本創作所教示之技術，加以改變及 修飾’其並不脫離本創作之精神與範圍。 同時參照第1A與1B圖，第1A圖係繪示依照本新型 之電源供應器一較佳實施例的爆炸圖，第1B圖係繪示依照 本新型之電源供應器一較佳實施例中一部分組件之平面視 圖。本創作之具有冷卻功能之電源供應器主要包含一電源 供應器殼體100、一致冷晶片120與一冷侧散熱構件13〇。 電源供應器殼體100具有一致冷晶片設置面開口 106。致冷 晶片120裝設於致冷晶片設置面開口 1〇6，具有一冷側122 與一熱側124，熱侧124突出至電源供應器殼體1〇〇之内 部’冷侧散熱構件130與冷側122耦接，且突出至電源供 應器殼體100之外部，用以加速冷側122之熱交換。 7 M286410 於一較佳實施例中，電源供應器包含一電源供應器殼 體100、一電源供應單元110與一集熱腔體140,電源供應 器殼體100由一第一蓋板l〇〇a與一第二蓋板100b配合構 成，第二蓋板100b具有一第一外部開口 102a、一第二外部 開口 102b以及一内部開口 104,其中第二外部開口 102b 有一網狀結構。電源供應單元110設置於電源供應器殼體 100内部，包含一電源供應器風扇114與一電路模組112， 電源供應器風扇114裝設於該電路模組112上，例如位於 邊緣之位置，並鄰接或突出於第一外部開口 102a。一電源 供應器開關174控制電源供應器之啟動，且當電源供應器 啟動時，電源供應器風扇114也同時運轉。 集熱腔體140具有一集熱通道144,且其兩端為一第一 通道開口 144a與一第二通道開口 144b，分別鄰接或突出於 第二外部開口 l〇2b與内部開口 104。第一蓋板100a上具有 一致冷晶片設置面108,致冷晶片設置面108開設有一致冷 晶片設置面開口 106,致冷晶片120位於此致冷晶片設置面 開口 106。致冷晶片120之冷側122耦接一冷側散熱構件 130，此冷側散熱構件130較佳具有至少一凹陷結構132， 於凹陷結構132中更包含一突起134,藉此累積更多冷源能 量。 致冷晶片120之熱侧124更耦接一熱側鰭片136,突出 於電源供應器殼體100之内部範圍，較佳地，更包含一連 接侧壁146,與腔體側壁142相耦合，用以將熱側鰭片136 籠罩，使熱量集中於集熱通道144中，降低甚至防止熱量 散逸至電源供應單元110。更佳地，連接側壁146及/或腔 8 M286410 體側壁142使用絕熱材質。集熱腔體140内部更可舖設鋁 箔148，加強防止輻射熱之發散。 集熱腔體140兩端開口 144a、144b更分別設置一第一 風扇150a與一第二風扇150b，第一風扇150a設置於第一 通道開口 144a，第二風扇150b設置於第二通道開口 144b。 第二風扇150b除了吸取電腦系統内部氣流至集熱通道 144,同時幫助推動集熱通道144内之熱氣流朝向第一風扇 150a，第一風扇150a則將集熱通道144内之熱氣流排出於 系統之外。 電源供應器可搭配一致冷晶片開關176,控制致冷晶片 120之啟動或關閉，並以一線路連接至一發光裝置180，當 致冷晶片開關176處於開啟狀態時，亦即其電子線路接通， 發光裝置180也同時接通而發光，提示使用者致冷晶片120 之開啟。 電源供應器裝置於一系統時，兩外部開口 102a、102b 朝向外部環境，内部開口 104朝向系統内部環境。裝置於 一電腦系統中，致冷晶片設置面108係靠近中央處理單元 (未圖示）。 參考第2A與2B圖，其分別繪示依照本新型之電源供 應器另一較佳實施例中溫度控制系統與濕度控制系統的示 意圖。本創作之電源供應器更整合一溫度控制模組210a及 一溼度控制模組210b，構成一溫度控制系統與一溼度控制 系統。溫度控制模組210a監測環境溫度，並依據環境溫度 控制風扇電源230a，例如設定一段或多段溫度標準，對應 至不同之風扇轉速，以降低風扇240a運轉之噪音。 9 M286410 本實施例中溫度控制模組210a包含一溫度感測 器 212a 與一溫度調節器214a。溫度感測器212a感測一環境溫度， 例如設置於熱側鰭片附近或其上，如第丨3圖所示之溫度感 測器170b，將感測之溫度資訊傳遞至溫度調節器2Ma，溫 度調節器214a依據此溫度資訊調節風扇電源23〇a之電源 供給狀態，例如升高或降低電流或電壓，進而控制風扇24〇a 之轉速。 溼度控制模組21 〇b監測系統之溼度資訊，例如相對溼 度。由於當相對溼度達1〇〇%時，會有露點效應，相對溼度 越高，露點溫度越高，因此溼度控制模組21〇b依據所偵測 知到的’屋度資訊來調節致冷晶片電源23〇b對於致冷晶片 240b的電源供給。當偵測到環境溼度越高，溼度控制模組 210b便調節致冷晶片電源23〇b，使致冷晶片24〇b之輸出 功率下降，防止溫度過低而到達露點溫度。 本實施例中溼度控制模組21〇b包含一溼度感測器 212b與一溼度調節器214b，溼度感測器21%感測一溼度 資訊’較佳地，如第1B圖所示，溼度感測器17〇a設置於 冷侧散熱構件122與第一蓋板1〇〇a所形成之一狹缝16〇 中，例如貼附在第一蓋板l〇〇a或者冷侧散熱構件130，此 處由於結構之特殊性通常有較低溫度。溼度調節器21朴接 受、並依據此座度資訊調節致冷晶片電源23〇b對致冷晶片 240b之電源供給，使致冷晶片24〇b之功率改變。 上述之致冷晶片電源與風扇電源可利用電源供應單元 作為電力來源’或者各有獨立之電源裝置，此為熟習於此 技藝者可輕易思及之簡單變化。本實施例中，溼度控制模 M286410 組以及溫度控制模組整合於一控制電路板170上（繪示於第 1A 圖）。 參考第3圖，其繪示應用本新型之電源供應器於一電 腦系統之示意圖。本創作之電源供應器應用於一電腦系統 時，例如一直立式桌上型（desktop)電腦，電源供應器310 之位置靠近機殼300之上方，且擺設之方向係為：冷側散 熱構件314所在之一側朝向CPU風扇330，圖中為CPU風 扇330之上方。致冷晶片312運作時，冷側吸熱使周圍溫 度降低，冷側散熱構件314則加強了鄰近之系統氣流340 之熱交換，因此主機板320上之CPU風扇330在吸取系統 氣流340以進行對中央處理單元之冷卻時，系統氣流340 一部分來自於與冷侧散熱構件314已進行熱交換、因而有 較低溫度之冷側周圍之空氣，中央處理單元之冷卻效果因 此大幅提升。 參考第4圖，其繪示本新型之電源供應器另一較佳實 施例中冷測散熱構件的示意圖。於另一較佳實施例中，冷 側散熱構件形成一延伸靠近中央處理單元470之結構，包 含一基座402、一連結部404與一散熱體406。基座402耦 合於致冷晶片420之冷侧422,連結部404連接於基座402, 較佳地，以樞接方式相連接，使連結部404可相對於基座 402進行一左右轉動，即第一轉動方向412。散熱體406耦 合於連結部404,且可相對於連結部404轉動，如圖之第二 轉動方向414，係以一轉盤408控制轉動。 散熱體406之散熱體末端406a形成一具有通孔430之 結構，促進冷熱交換。冷側散熱構件以一良好導熱材料做 11 M286410 成，較佳於基座402、連結部404以及一部分散熱體406 之外表面塗佈一皮革漆作為絕熱之用，使冷源集中於散熱 體末端406a散發。冷側422之冷源經基座402與連結部 404，最後傳至散熱體406，藉由此種冷側散熱構件將使得 系統内冷卻氣流之效果更加集中於中央處理單元470周 圍，使中央處理單元470的冷卻效果更好。 參考第4B圖，其繪示第4A圖中冷測散熱構件另一態 樣的示意圖。依據第4A圖之實施例，冷測散熱構件另一態 樣為，散熱體406更耦合於中央處理單元470上之一 CPU 散熱片472，例如散熱體末端406a被包覆於CPU散熱片 472内部，直接將冷源導入CPU散熱片472，使致冷晶片 420所產生之冷源以最直接之方式冷卻CPU散熱片472, 對於中央處理單元470的冷卻效果更是一大提升。其中散 熱體末端406a可利用良好導熱材料以細絲型態包裝成束， 如此較容易調整其延伸範圍，例如將銅絲或鋁絲以絕熱且 彈性之材料包裝，並曝露出一部分使其包覆於CPU散熱片 472内部。 由上述本新型較佳實施例可知，應用本新型具有下列 優點。本創作之電源供應器藉由整合一致冷晶片，使電腦 系統運作時額外具有冷卻系統内部氣流之功能，進而使中 央處理單元之風扇所吸取之氣流為一低溫氣流，因此提高 了對於中央處理單元之散熱效率。更藉由溼度控制系統之 配合達到防止露點溫度產生，提高裝置使用之安全性。 雖然本新型已以一較佳實施例揭露如上，然其並非用 以限定本新型，任何熟習此技藝者，在不脫離本新型之精 12 M286410 神和範圍内，當可作各種之更動與潤飾，因此本新型之保 護範圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 為讓本新型之上述和其他目的、特徵、優點與實施例 能更明顯易懂，所附圖式之詳細說明如下·· 第1A圖係繪示依照本新型之電源供應器一較佳實施 例的爆炸圖。 第1B圖係繪示依照本新型之電源供應器一較佳實施 例中一部分組件之平面視圖。 第2A圖係繪示依照本新型之電源供應器另一較佳實 施例中溫度控制系統的示意圖。 第2B圖係繪示依照本新型之電源供應器另一較佳實 施例中溼度控制系統的示意圖。 第3圖係繪示應用本新型之電源供應器於一電腦系統 之示意圖。 第4A圖係繪示依照本新型之電源供應器另一較佳實 施例中冷測散熱構件的示意圖。 第4B圖係繪示第4A圖中冷測散熱構件另一態樣的示 意圖。 【主要元件符號說明】 100:電源供應器殼體 100a:第一蓋板 l〇〇b:第二蓋板 l〇2a:第一外部開口 13 M286410M286410 VIII. New description: [New technical field] The present invention relates to a power supply, and in particular to a power supply having a cooling function. [Prior Art] The power source of the electronic device is generally transmitted from the power plant to the socket, and the power supply is connected to the socket, and is mainly used for rectification, voltage transformation and filtering of the alternating current, and finally supplied to each device. Especially in the computer system, it supplies the power required for most devices to operate at the same time. The location of the power supply unit is generally designed to be close to the central processing unit, and the power supply and the central processing unit (CPU) generally do not interact and operate independently. When the central processing unit operates, it generates a lot of heat. Therefore, it is usually equipped with a heat sink, such as a CPU cooling fan, to reduce the failure of the τ. In the case where the above power supply and the central processing unit 70 operate independently, the airflow that the CPU cooling fan attracts to cool the central processing unit comes from the inside of the computer system, but the suction airflow sounds the effect of cooling the central processing unit. If the temperature f of the suction airflow is lower, the cooling effect is inevitably better. In general, when the computer system is in operation, the red clothes are seen as 'the degree of heat generated by the internal components, so the temperature is higher than the external ring brother' or the room temperature is high. Therefore, only the cpu fan is used to cool the central processing unit. Its limits. [New Content] M286410 Therefore, the purpose of this new type is to provide a power supply with cooling function, which not only has the function of power supply, but also provides the function of cooling effect. Another object of the present invention is to provide a power supply with a cooling function to enhance the heat dissipation efficiency of the central processing unit in the general computer system configuration architecture. According to the above object of the present invention, a power supply having a cooling function is proposed. The power supply having a cooling function includes a power supply housing, a uniform cold wafer, and a cold side heat dissipating member. The chilled wafer is disposed in a uniform cold wafer setting surface opening of the power supply unit, the cold side facing the outside of the power supply housing and the hot side facing the inside of the power supply housing. A cold side heat dissipating member is attached to the cold side and protrudes to the outside of the power supply housing, thereby exchanging heat with the air outside the power supply housing to lower the temperature of the air outside the housing. According to a preferred embodiment of the present invention, the power supply further includes a heat collecting chamber having a first passage opening and a second passage opening. The power supply housing further has an outer opening and an inner opening respectively connecting the first passage opening and the second passage opening, and a fan is disposed between the first passage opening and the outer opening, thereby concentrating heat on the hot side and The heat is directed to the outside of the housing. The power supply unit is further combined with a temperature control module and a humidity control module. The temperature control module detects a temperature information and adjusts the fan power based on the temperature information to control the fan speed. The humidity control module detects the fisheye information and adjusts the power of the cooled chip based on the humidity information to control the output power of the cooled wafer. M286410 The power supply of this creation achieves the function of additionally providing the internal temperature of the cooling line by using the integrated cooling chip, especially in the current majority of the computer architecture, the location of the power supply installation. Has been standardized' This creation makes full use of the current standardized power supply configuration, so that the central processing unit fan can be sucked through the heat exchange, thus having a lower system airflow, thus improving the cooling of the central processing unit effectiveness. [Embodiment] This creation is a cooling power supply. By integrating the cold chip with the power supply, the function of the cooling system airflow is added in addition to the power supply function. The spirit of the present invention will be clearly explained in the following drawings and detailed descriptions. Those skilled in the art, after having understood the preferred embodiments of the present invention, may be modified and modified by the teachings of the present invention. The spirit and scope of this creation. 1A and 1B, FIG. 1A is an exploded view of a preferred embodiment of a power supply according to the present invention, and FIG. 1B is a partial view of a preferred embodiment of the power supply according to the present invention. A plan view of the component. The power supply with cooling function of the present invention mainly comprises a power supply housing 100, a uniform cold wafer 120 and a cold side heat dissipating member 13A. The power supply housing 100 has a uniform cold wafer setting face opening 106. The cooling chip 120 is mounted on the cooling chip setting surface opening 〇6, has a cold side 122 and a hot side 124, and the hot side 124 protrudes to the inside of the power supply housing 1 ' 'cold side heat dissipating member 130 and The cold side 122 is coupled and protrudes outside of the power supply housing 100 to accelerate heat exchange of the cold side 122. 7 M286410 In a preferred embodiment, the power supply includes a power supply housing 100, a power supply unit 110, and a heat collecting chamber 140. The power supply housing 100 is covered by a first cover. The a cover plate 100b has a first outer opening 102a, a second outer opening 102b and an inner opening 104. The second outer opening 102b has a mesh structure. The power supply unit 110 is disposed inside the power supply housing 100 and includes a power supply fan 114 and a circuit module 112. The power supply fan 114 is mounted on the circuit module 112, for example, at an edge. Adjacent or protruding from the first outer opening 102a. A power supply switch 174 controls the activation of the power supply, and when the power supply is activated, the power supply fan 114 also operates simultaneously. The heat collecting chamber 140 has a heat collecting passage 144, and has a first passage opening 144a and a second passage opening 144b at both ends thereof, respectively adjoining or protruding from the second outer opening l2b and the inner opening 104. The first cover 100a has a uniform cold wafer setting surface 108, and the cooling wafer setting surface 108 is provided with a uniform cold wafer setting surface opening 106, and the cooling wafer 120 is located at the cooling wafer setting surface opening 106. The cold side of the cooling fins 120 is coupled to a cold side heat dissipating member 130. The cold side heat dissipating member 130 preferably has at least one recessed structure 132, and further includes a protrusion 134 in the recessed structure 132, thereby accumulating more cold sources. energy. The hot side 124 of the cooling chip 120 is further coupled to a hot side fin 136 protruding from the inner range of the power supply housing 100, and preferably further including a connecting side wall 146 coupled to the cavity sidewall 142. The heat side fins 136 are shrouded to concentrate heat in the heat collecting passages 144 to reduce or even prevent heat from being dissipated to the power supply unit 110. More preferably, the connecting side wall 146 and/or the cavity 8 M286410 body side wall 142 are made of a heat insulating material. The inside of the heat collecting chamber 140 can be further provided with an aluminum foil 148 to enhance the prevention of the radiant heat. The first fan 150a and the second fan 150b are respectively disposed on the two ends 144a and 144b of the heat collecting chamber 140. The first fan 150a is disposed in the first passage opening 144a, and the second fan 150b is disposed in the second passage opening 144b. The second fan 150b not only draws the internal airflow of the computer system to the heat collecting passage 144, but also helps to push the hot airflow in the heat collecting passage 144 toward the first fan 150a, and the first fan 150a discharges the hot airflow in the heat collecting passage 144 to the system. Outside. The power supply can be coupled with a uniform cold wafer switch 176 to control the activation or shutdown of the cryo-wafer 120 and connected to a illuminating device 180 in a line. When the chilled wafer switch 176 is in an open state, that is, its electronic circuit is turned on. The illuminating device 180 is also turned on at the same time to emit light, prompting the user to turn on the cold wafer 120. When the power supply unit is in a system, the two outer openings 102a, 102b face the external environment and the inner opening 104 faces the internal environment of the system. The device is in a computer system with a cooled wafer setting surface 108 adjacent to a central processing unit (not shown). Referring to Figures 2A and 2B, there are shown schematic views of a temperature control system and a humidity control system in accordance with another preferred embodiment of the power supply of the present invention. The power supply of the present invention further integrates a temperature control module 210a and a humidity control module 210b to form a temperature control system and a humidity control system. The temperature control module 210a monitors the ambient temperature and controls the fan power source 230a according to the ambient temperature, for example, setting one or more temperature standards corresponding to different fan speeds to reduce the noise of the fan 240a. 9 M286410 The temperature control module 210a in this embodiment includes a temperature sensor 212a and a temperature regulator 214a. The temperature sensor 212a senses an ambient temperature, for example, disposed near or on the hot side fin, and the temperature sensor 170b shown in FIG. 3 transmits the sensed temperature information to the temperature adjuster 2Ma. The temperature regulator 214a adjusts the power supply state of the fan power source 23A according to the temperature information, such as raising or lowering the current or voltage, thereby controlling the rotational speed of the fan 24a. The humidity control module 21 〇b monitors the humidity information of the system, such as relative humidity. Since the dew point effect occurs when the relative humidity reaches 1%, the higher the relative humidity, the higher the dew point temperature, so the humidity control module 21〇b adjusts the cooling chip according to the detected 'house information”. The power supply 23〇b supplies power to the cooled wafer 240b. When the higher the ambient humidity is detected, the humidity control module 210b adjusts the cold chip power supply 23〇b to lower the output power of the cooled wafer 24〇b, preventing the temperature from being too low to reach the dew point temperature. In this embodiment, the humidity control module 21〇b includes a humidity sensor 212b and a humidity adjuster 214b, and the humidity sensor 21% senses a humidity information 'better, as shown in FIG. 1B, the humidity sense The detector 17〇a is disposed in one of the slits 16〇 formed by the cold-side heat dissipating member 122 and the first cover plate 〇〇a, for example, attached to the first cover plate 10a or the cold-side heat dissipation member 130, Here, the temperature is usually lower due to the particularity of the structure. The humidity regulator 21 receives and adjusts the power supply of the cooled wafer power supply 23b to the cooled wafer 240b according to the position information, so that the power of the cooled wafer 24b is changed. The above described cold chip power supply and fan power supply may utilize the power supply unit as a source of power or each of the separate power supply units, which is a simple change that can be easily considered by those skilled in the art. In this embodiment, the humidity control module M286410 and the temperature control module are integrated on a control circuit board 170 (shown in FIG. 1A). Referring to Fig. 3, there is shown a schematic diagram of a power supply of the present invention applied to a computer system. When the power supply of the present invention is applied to a computer system, such as a desktop computer, the power supply 310 is located above the casing 300, and the direction of the arrangement is: the cold side heat dissipating member 314 One side faces the CPU fan 330, which is above the CPU fan 330. When the cooling wafer 312 is in operation, the cold side heat absorption causes the ambient temperature to decrease, and the cold side heat dissipating member 314 enhances the heat exchange of the adjacent system air stream 340, so that the CPU fan 330 on the motherboard 320 is sucking the system air stream 340 for centering. When the processing unit is cooled, a portion of the system airflow 340 comes from the air that has been heat exchanged with the cold side heat dissipating member 314 and thus has a lower temperature, and the cooling effect of the central processing unit is thus greatly enhanced. Referring to Fig. 4, there is shown a schematic view of a cold-measuring heat dissipating member in another preferred embodiment of the power supply of the present invention. In another preferred embodiment, the cold side heat dissipating member forms a structure extending toward the central processing unit 470, and includes a base 402, a connecting portion 404 and a heat sink 406. The pedestal 402 is coupled to the cold side 422 of the chilled wafer 420, and the connecting portion 404 is coupled to the pedestal 402. Preferably, the connecting portion 404 is pivotally connected to allow the connecting portion 404 to rotate left and right relative to the pedestal 402. The first direction of rotation 412. The heat sink 406 is coupled to the joint portion 404 and rotatable relative to the joint portion 404. The second rotation direction 414 is controlled by a turntable 408. The heat sink end 406a of the heat sink 406 forms a structure having a through hole 430 to promote cold and heat exchange. The cold side heat dissipating member is made of a good heat conductive material of 11 M286410. Preferably, the outer surface of the base 402, the joint portion 404 and a part of the heat sink 406 is coated with a leather paint for heat insulation, so that the cold source is concentrated at the end of the heat sink. 406a is distributed. The cold source of the cold side 422 passes through the base 402 and the joint portion 404, and finally passes to the heat sink 406. The cold side heat dissipating member will make the effect of the cooling airflow in the system more concentrated around the central processing unit 470, so that the central processing The cooling effect of unit 470 is better. Referring to Fig. 4B, there is shown a schematic view of another aspect of the cold-measuring heat dissipating member of Fig. 4A. According to the embodiment of FIG. 4A, in another aspect, the heat sink 406 is further coupled to one of the CPU heat sinks 472 of the central processing unit 470. For example, the heat sink end 406a is wrapped inside the CPU heat sink 472. The cold source is directly introduced into the CPU heat sink 472, so that the cold source generated by the cold wafer 420 cools the CPU heat sink 472 in the most direct manner, and the cooling effect on the central processing unit 470 is greatly improved. The heat sink end 406a can be bundled in a filament form by using a good heat conductive material, so that it is easier to adjust the extension range, for example, the copper wire or the aluminum wire is wrapped in an insulating and elastic material, and a part of the copper wire is covered to cover it. Inside the CPU heat sink 472. It will be apparent from the above-described preferred embodiments of the present invention that the application of the present invention has the following advantages. The power supply of the present invention integrates the uniform cold chip, so that the computer system operates additionally with the function of cooling the internal airflow of the system, so that the airflow drawn by the fan of the central processing unit is a low-temperature airflow, thereby improving the central processing unit. Heat dissipation efficiency. Moreover, the humidity control system can be combined to prevent the dew point temperature from being generated, and the safety of the device is improved. Although the present invention has been disclosed in a preferred embodiment as above, it is not intended to limit the present invention, and any person skilled in the art can make various changes and retouchings without departing from the scope of the present invention. Therefore, the scope of protection of this new type is subject to the definition of the scope of the patent application. BRIEF DESCRIPTION OF THE DRAWINGS In order to make the above and other objects, features, advantages and embodiments of the present invention more obvious, the detailed description of the drawings is as follows: Figure 1A shows the power supply according to the present invention. An exploded view of a preferred embodiment. Figure 1B is a plan view showing a portion of the components of a preferred embodiment of the power supply in accordance with the present invention. Fig. 2A is a schematic view showing a temperature control system in another preferred embodiment of the power supply according to the present invention. Fig. 2B is a schematic view showing a humidity control system in another preferred embodiment of the power supply according to the present invention. Figure 3 is a schematic diagram showing the application of the power supply of the present invention to a computer system. Fig. 4A is a schematic view showing a cold-measuring heat-dissipating member in another preferred embodiment of the power supply device according to the present invention. Fig. 4B is a view showing another aspect of the cold heat radiating member in Fig. 4A. [Description of main component symbols] 100: Power supply housing 100a: First cover l〇〇b: Second cover l〇2a: First external opening 13 M286410
102b ··第二外部開口 104 ： 106 :致冷晶片設置面開口 108 ： 110 :電源供應單元 112 ： 114 :電源供應器風扇 120 ： 122 :冷侧 124 ： 130 :冷侧散熱構件 132 ： 134 :突起 136 ： 140 :集熱腔體 142 ： 144 :集熱通道 144a 144b :第二通道開口 146 ： 148 :鋁箔 150a 150b :第二風扇 160 ： 170 :控制電路板 174 ： 176 :致冷晶片開關 180 ： 210a :溫度控制模組 210b 212a :溫度感測器 212b 214a :溫度調節器 214b 230a :風扇電源 230b 240a :風扇 240b 300 :機殼 310 ： 312 :致冷晶片 314 ： 320 :主機板 330 ： 340 :系統氣流 402 ··基座 404 ： 406 :散熱體 406a 内部開口 致冷晶片設置面 電路模組 致冷晶片 熱側 凹陷結構 熱側鰭片 腔體側壁 :第一通道開口 連接側壁 :第一風扇 狹缝 電源供應器開關 發光裝置 :溼度控制模組 :溼度感測器 :溼度調節器 :致冷晶片電源 :致冷晶片 電源供應器 冷側散熱構件 CPU風扇 連結部 :末端 M286410 408 :轉盤 412 ： 414 ： 第二轉動方向 420 ： 422 ： 冷側 430 ： 470 ： 中央處理單元 472 ： 第一轉動方向 致冷晶片 通孔 CPU散熱片102b · second external opening 104: 106: refrigerating wafer setting surface opening 108: 110: power supply unit 112: 114: power supply fan 120: 122: cold side 124: 130: cold side heat dissipating member 132: 134: The protrusion 136 : 140 : the heat collecting cavity 142 : 144 : the heat collecting channel 144 a 144b : the second channel opening 146 : 148 : the aluminum foil 150 a 150b : the second fan 160 : 170 : the control circuit board 174 : 176 : the cooling chip switch 180 : 210a : temperature control module 210b 212a : temperature sensor 212b 214a : temperature regulator 214b 230a : fan power supply 230b 240a : fan 240b 300 : casing 310 : 312 : cooling chip 314 : 320 : motherboard 330 : 340 : system airflow 402 · pedestal 404: 406: heat sink 406a internal opening chilling wafer setting surface circuit module cooling chip hot side recess structure hot side fin cavity side wall: first channel opening connecting side wall: first fan Slit power supply switch illuminator: humidity control module: humidity sensor: humidity regulator: cold chip power supply: cold chip power supply cold side heat dissipation CPU fan coupling portion: end M286410 408: dial 412: 414: second rotational direction 420: 422: cold side 430: 470: a central processing unit 472: a first rotational direction through wafer via refrigerant CPU heatsink
1515