JP2001128321A - Cooling device for switchboard - Google Patents

Cooling device for switchboard

Info

Publication number
JP2001128321A
JP2001128321A JP30409599A JP30409599A JP2001128321A JP 2001128321 A JP2001128321 A JP 2001128321A JP 30409599 A JP30409599 A JP 30409599A JP 30409599 A JP30409599 A JP 30409599A JP 2001128321 A JP2001128321 A JP 2001128321A
Authority
JP
Japan
Prior art keywords
switchboard
plate
ventilation duct
closed chamber
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP30409599A
Other languages
Japanese (ja)
Inventor
Nobuhiro Kurio
信広 栗尾
Kosuke Morita
浩資 森田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nissin Electric Co Ltd
Original Assignee
Nissin Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissin Electric Co Ltd filed Critical Nissin Electric Co Ltd
Priority to JP30409599A priority Critical patent/JP2001128321A/en
Publication of JP2001128321A publication Critical patent/JP2001128321A/en
Pending legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To introduce external air into a switchboard and reduce the cost and size of the switchboard, while the switchboard is protected from dust, salt, etc., without using an expensive special filters, etc., even if the switchboard is used in an severe environment which requires countermeasures against dusts and salt damage. SOLUTION: There are provided an enclosed chamber 13 which is placed in a switchboard 1 and isolated from the atmosphere, an aeration dust 18 both whose ends are connected with the suction inlet 5a and exhaust outlet 6 of the switchboard 1, a ventilation fan 10 which makes the air flow from the suction inlet 8a to the aeration duct 18, an aperture 21 formed in the wall surface of the duct 18 and a radiation plate 22 which is attached t the aperture 21, whose front surface heater (a power semiconductor module 24) is placed in the enclosed chamber 13 and whose rear surface heater is placed in the duct 18.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、外気を導入して冷
却する配電盤の冷却装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a switchboard cooling device for cooling by introducing outside air.

【0002】[0002]

【従来の技術】従来、たとえば塵埃・塩害対策が必要な
劣悪環境下に設置された閉鎖型自立配電盤等の配電盤に
あっては、電子回路を含む制御回路部だけでなく、主回
路部の電力用半導体や抵抗体等の発熱体がそれらの影響
を受けないようにして盤内を冷却するため、つぎに説明
する第1,第2の冷却装置を備える。
2. Description of the Related Art Conventionally, in a switchboard such as a closed-type self-contained switchboard installed in a bad environment where dust and salt damage countermeasures are required, not only a control circuit section including an electronic circuit but also a power supply of a main circuit section. In order to cool the inside of the panel so that the heating elements such as semiconductors and resistors are not affected by the heating elements, first and second cooling devices described below are provided.

【0003】まず、第1の冷却装置は、配電盤全体を完
全密閉構造にし、盤内各部を外気から完全に遮断して塵
埃や塩分の盤内への侵入を防止し、腐食・錆等の進行を
防ぎ、盤内に設置した電子冷却装置,エアコンディショ
ナ,クーラー等により、盤内全体を冷却する。
[0003] First, the first cooling device has a completely enclosed structure of the switchboard, completely shuts off the inside of the switchboard from the outside air to prevent dust and salt from entering the switchboard, and prevents corrosion and rust from progressing. The entire inside of the panel is cooled by an electronic cooling device, air conditioner, cooler, etc. installed in the panel.

【0004】第2の冷却装置は、配電盤の吸気口に塵埃
・塩害対策用の特殊フィルタを取付けて塵埃,塩分を除
去しつつ、盤内に設けた冷却ファンにより、吸気口から
盤内に外気を導入して排気口から排気し、盤内を冷却す
る。
[0004] The second cooling device is equipped with a special filter for dust and salt damage prevention at the intake of the switchboard to remove dust and salt, and the outside air is introduced from the intake to the inside of the panel by the cooling fan provided in the panel. Is introduced and exhausted from the exhaust port to cool the inside of the panel.

【0005】[0005]

【発明が解決しようとする課題】前記従来の冷却装置の
場合、つぎに説明する問題点がある。まず、従来の前記
第1の装置にあっては、密閉した盤内の発熱量が盤表面
からの熱放射による自然冷却を上回った場合、盤内を許
容温度以下に保つため、発熱量に見合った電子冷却装
置,エアコンディショナ等を設ける必要がある。
The above-mentioned conventional cooling device has the following problems. First, in the first device of the related art, when the calorific value in the closed panel exceeds natural cooling by heat radiation from the panel surface, the inside of the panel is kept at an allowable temperature or less. It is necessary to provide an electronic cooling device, an air conditioner, and the like.

【0006】そのため、電子冷却装置,エアコンディシ
ョナ等として大型,大容量のものが必要になり、多大の
費用(イニシャルコスト及びランニングコスト)がかか
るとともに、配電盤がサイズアップして大型化する問題
点がある。
For this reason, a large-sized and large-capacity electronic cooling device, an air conditioner, and the like are required, resulting in a large cost (initial cost and running cost) and an increase in the size and size of the switchboard. There is.

【0007】また、従来の前記第2の装置にあっては、
吸気フィルタとしての塵埃・塩害対策用の特殊フィルタ
は極めて高価であり、しかも、この特殊フィルタを使用
しても、塵埃や塩分の盤内への侵入を完全に防止するこ
とが困難であるため、多大の費用を要するとともに、十
分な塵埃・塩害対策を施すことができない問題点があ
る。
[0007] In the conventional second device,
Special filters for dust / salt damage as intake filters are extremely expensive, and even with this special filter, it is difficult to completely prevent dust and salt from entering the panel. There is a problem that a great deal of cost is required and sufficient measures against dust and salt damage cannot be taken.

【0008】本発明は、塵埃・塩害対策が必要な劣悪環
境下にあっても、高価な特殊フィルタを使用することな
く、塵埃や塩分の影響を受けないように、配電盤内に外
気を導入し、安価に、しかも、配電盤の小型化を図って
盤内を冷却することを課題とする。
The present invention introduces outside air into a switchboard so as not to be affected by dust and salt without using an expensive special filter even in a bad environment requiring measures against dust and salt damage. Another object of the present invention is to reduce the size of the switchboard at low cost and to cool the inside of the switchboard.

【0009】[0009]

【課題を解決するための手段】前記の課題を解決するた
めに、本発明の配電盤の冷却装置においては、配電盤内
に設けられ,外気から遮断された密閉室と、両端が配電
盤の吸気口と排気口とに連通した通気ダクトと、吸気口
から通気ダクトを介して排気口に通風させる換気ファン
と、通気ダクトの壁面に形成された開口と、この開口に
取付けられ,表面の発熱体が密閉室に位置し,裏面の放
熱体が通気ダクトに位置した放熱板とを備える。
In order to solve the above-mentioned problems, in the cooling device for a switchboard according to the present invention, a closed chamber provided in the switchboard and shielded from the outside air, and both ends of which are provided with an inlet of the switchboard. A ventilation duct that communicates with the exhaust port, a ventilation fan that ventilates from the intake port to the exhaust port through the ventilation duct, and an opening formed in the wall of the ventilation duct; A radiator located in the chamber, and a radiator on the back side provided with a radiator plate located in the ventilation duct.

【0010】したがって、放熱板の表面の電力用半導体
モジュール等の発熱体は外気から遮断された密閉室に設
けられ、放熱板の裏面の放熱体が通気ダクトに位置す
る。
Therefore, the heat generating element such as the power semiconductor module on the surface of the heat radiating plate is provided in a closed room shielded from the outside air, and the heat radiating element on the rear surface of the heat radiating plate is located in the ventilation duct.

【0011】そして、換気ファンにより、外気が吸気口
から通気ダクトに導入されて放熱体を通り、この放熱体
を通った空気が排気口から外部に排気される。
Then, outside air is introduced into the ventilation duct from the intake port by the ventilation fan, passes through the radiator, and the air passing through the radiator is exhausted to the outside from the exhaust port.

【0012】この外気の導入及び排気により、通気ダク
トを冷却風が通流し、この冷却風により放熱体を通して
発熱体が冷却され、密閉室内の温度上昇が抑制される。
By the introduction and exhaust of the outside air, a cooling air flows through the ventilation duct, and the heating air is cooled by the cooling air through the radiator, thereby suppressing a rise in temperature in the closed chamber.

【0013】そして、外気に含まれた塵埃や塩分は通気
ダクトを通り、密閉室に侵入しないため、発熱体ととも
に制御回路部等の塵埃・塩害対策が必要な諸機器を密閉
室に収納することにより、吸気フィルタに塵埃・塩害対
策用の特殊フィルタを使用せず、十分な塵埃・塩害対策
を施すことができる。
[0013] Since dust and salt contained in the outside air pass through the ventilation duct and do not enter the closed chamber, it is necessary to store, in the closed chamber, various devices such as a control circuit unit and the like that need to take measures against dust and salt damage together with the heating element. Accordingly, sufficient dust and salt damage countermeasures can be taken without using a special filter for dust and salt damage countermeasures in the intake filter.

【0014】さらに、配電盤全体を完全密閉するのでな
く、盤内に外気を通流させて冷却する構造であるため、
配電盤内全体を冷却する大容量,大型の電子冷却装置,
エアコンディショナ等を設ける必要がない。
[0014] Further, since the entire distribution panel is not completely sealed, but is cooled by passing outside air through the panel,
A large-capacity, large-sized electronic cooling device that cools the entire inside of the switchboard,
There is no need to provide an air conditioner.

【0015】そのため、安価にし、しかも、配電盤を大
型化することなく、塵埃や塩分の影響を防止して盤内を
冷却することができる。
Therefore, the inside of the panel can be cooled while preventing the influence of dust and salt content at low cost and without increasing the size of the switchboard.

【0016】そして、通気ダクトは、密閉室を形成する
板体に断面コ字状の上下方向の枠体を取付けて形成する
ことが好ましい。
The ventilation duct is preferably formed by attaching a vertical frame having a U-shaped cross section to a plate forming a closed chamber.

【0017】この場合、密閉室を形成する板体が通気ダ
クトを構成するため、通気ダクトを通流する冷却風によ
り、放熱体だけでなく、密閉室壁面等も十分に冷却さ
れ、冷却性能が一層向上する。
In this case, since the plate forming the closed chamber forms a ventilation duct, not only the radiator but also the walls of the closed chamber are sufficiently cooled by the cooling air flowing through the ventilation duct, and the cooling performance is improved. Further improve.

【0018】また、配電盤の壁板の内側に仕切板を設
け、この仕切板の表側を密閉室とし、仕切板の裏側を通
気ダクトとしてもよい。
Further, a partition plate may be provided inside the wall plate of the switchboard, the front side of the partition plate may be a closed chamber, and the back side of the partition plate may be a ventilation duct.

【0019】そして、本発明は、放熱板の表面の発熱体
が、電力用半導体モジュールであるときに、極めて効果
的である。
The present invention is extremely effective when the heating element on the surface of the heat sink is a power semiconductor module.

【0020】[0020]

【発明の実施の形態】本発明の実施の形態について、図
1〜図10を参照して説明する。 (1形態)まず、請求項2の通気ダクトを備えた実施の
1形態について、図1〜図9を参照して説明する。図
1,図2,図3は閉鎖型自立配電盤1の外形を示した正
面図,平面図,側面図であり、この配電盤1は、台枠2
に前面が開口したキュービクル本体3を載置して形成さ
れる。
DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described with reference to FIGS. (First Embodiment) First, a first embodiment provided with the ventilation duct of claim 2 will be described with reference to FIGS. FIGS. 1, 2 and 3 are a front view, a plan view, and a side view, respectively, showing the external shape of a closed-type self-contained switchboard 1. The switchboard 1 includes a frame 2
The cubicle main body 3 having an open front surface is mounted thereon.

【0021】そして、本体3の前面開口は両開き構造の
扉4a,4bにより閉塞され、扉4a,4bは下部にフ
ィルタ付きの吸気口5a,5bを備える。また、本体3
の天板3aはほぼ中央にフィルタ付きの排気口6を備え
る。
The front opening of the main body 3 is closed by doors 4a and 4b of a double-opening structure, and the doors 4a and 4b are provided with intake ports 5a and 5b with a filter at the lower part. Also, body 3
The top plate 3a has an exhaust port 6 with a filter substantially at the center.

【0022】つぎに、図4,図5,図6は配電盤1の切
断正面図,切断平面図,切断側面図であり、それらの図
面において、3b,3cは本体3の両側板、3d,3e
は本体3の背面板,底板である。
FIGS. 4, 5, and 6 are a cut front view, a cut plan view, and a cut side view of the switchboard 1. In these drawings, 3b and 3c denote side plates of the main body 3 and 3d and 3e.
Denotes a back plate and a bottom plate of the main body 3.

【0023】そして、天板3aの下方に上板7を設け、
天板3aと上板7との間即ち本体3内の上部に排気部8
を形成する。
An upper plate 7 is provided below the top plate 3a.
An exhaust unit 8 is provided between the top plate 3 a and the upper plate 7, that is, in the upper part of the main body 3.
To form

【0024】この排気部8は前面が上部前板9により閉
塞され、排気口6に取付けられた換気ファン10を収容
する。
The exhaust unit 8 has a front surface closed by an upper front plate 9 and accommodates a ventilation fan 10 attached to the exhaust port 6.

【0025】つぎに、底板3eと上板7との間を中板1
1により前後に仕切り、中板11の前側で底板3eの上
方に、吸気口5a,5bのほぼ上端の位置に、仕切用の
水平な下板12を設ける。
Next, the middle plate 1 is moved between the bottom plate 3e and the upper plate 7.
1, a horizontal lower plate 12 is provided in front of the middle plate 11 and above the bottom plate 3e, at a position substantially at the upper end of the intake ports 5a and 5b.

【0026】そして、本体3の前面開口を前板14によ
り着脱自在に気密に閉塞し、本体3内の前面側に上板
7,中板11,下板12,両側板3b,3c及び前板1
4で囲まれた前面側の密閉室13を形成する。
The front opening of the main body 3 is detachably and airtightly closed by a front plate 14, and the upper plate 7, the middle plate 11, the lower plate 12, the both side plates 3b and 3c and the front plate 1
A closed chamber 13 on the front side surrounded by 4 is formed.

【0027】一方、底板3eと下板12との間を吸気口
5a,5bに連通した吸気部15とし、中板11の裏面
側に、上板7,中板11,背面板3d,底板3e及び両
側板3b,3cで囲まれた背面側の密閉室16を形成す
る。
On the other hand, the space between the bottom plate 3e and the lower plate 12 is defined as an air intake portion 15 communicating with the air inlets 5a and 5b. The upper plate 7, the middle plate 11, the rear plate 3d and the bottom plate 3e And a closed chamber 16 on the back side surrounded by both side plates 3b and 3c.

【0028】さらに、密閉室13を構成する板体として
の中板11の表面側に、断面コ字状の上下方向の3個の
枠体17を配設して取付け、3本の通気ダクト18を形
成する。
Further, three vertical frame members 17 having a U-shaped cross section are arranged and mounted on the surface side of the middle plate 11 as a plate member constituting the closed chamber 13, and three ventilation ducts 18 are provided. To form

【0029】また、上板7,下板12の各通気ダクト1
8の端部の位置に開口18a,18bを形成し、各通気
ダクト18を、吸気部15を介して吸気口5a,5bに
連通させ、排気部8を介して排気口6に連通させる。
Each of the ventilation ducts 1 of the upper plate 7 and the lower plate 12
Openings 18 a, 18 b are formed at the end positions of 8, and each ventilation duct 18 communicates with the intake ports 5 a, 5 b via the intake section 15, and communicates with the exhaust port 6 via the exhaust section 8.

【0030】そして、換気ファン10の運転により、吸
気口5a,5bから外気を導入し、吸気部15から各通
気ダクト18に冷却風を送風し、各通気ダクト18を通
った空気を排気部8から排気口6を介して外部に排気す
る。
By operating the ventilation fan 10, outside air is introduced from the intake ports 5 a and 5 b, cooling air is blown from the intake section 15 to each ventilation duct 18, and the air passing through each ventilation duct 18 is discharged to the exhaust section 8. To the outside through the exhaust port 6.

【0031】なお、図中の19は吸気口5a,5bに設
けたフィルタであり、従来装置の塵埃・塩害対策用の高
価な特殊フィルタでなく、排気口6の内側のフィルタ
(図示せず)と同様の簡易かつ安価な汎用のエアフィル
タからなる。
Reference numeral 19 in the drawing denotes a filter provided at the intake ports 5a and 5b, which is not an expensive special filter for dust and salt damage countermeasures of the conventional apparatus, but a filter (not shown) inside the exhaust port 6. It consists of a simple and inexpensive general-purpose air filter similar to.

【0032】ところで、密閉室13は3個の変換器ユニ
ット20を収容し、密閉室16は変圧器,開閉器等の主
回路機器を収容する。
The closed chamber 13 houses three converter units 20, and the closed chamber 16 houses main circuit devices such as a transformer and a switch.

【0033】そして、各通気ダクト18の前面壁を形成
する枠体17に開口21を形成し、各変換器ユニット2
0のアルミ,銅等のヒートシンクからなる放熱板22を
各開口21の前面側に気密に取付ける。
An opening 21 is formed in the frame 17 forming the front wall of each ventilation duct 18, and each converter unit 2
A heat radiating plate 22 made of a heat sink made of aluminum, copper, or the like is hermetically attached to the front side of each opening 21.

【0034】各変換器ユニット20は、例えばインバー
タ装置の主回路部及び制御回路部をモジュール化したも
のであり、図7の正面図,図8の平面図,図9の側面図
に示すように形成される。
Each converter unit 20 is, for example, a module obtained by modularizing a main circuit portion and a control circuit portion of an inverter device. As shown in the front view of FIG. 7, the plan view of FIG. 8, and the side view of FIG. It is formed.

【0035】そして、放熱板22の表面には、主回路部
の複数の電解コンデンサ23及び複数の電力用半導体モ
ジュール24と、それらのドライブ回路(信号インタフ
ェース回路)等を含む電子回路構成の制御回路部25と
が設けられ、これらの回路部は密閉室13内に位置す
る。
On the surface of the heat radiating plate 22, a control circuit of an electronic circuit configuration including a plurality of electrolytic capacitors 23 and a plurality of power semiconductor modules 24 of a main circuit portion and their drive circuits (signal interface circuits) is provided. A circuit 25 is provided in the closed chamber 13.

【0036】また、放熱板22の裏面には上下方向の多
数の放熱フィン26が設けられ、これらのフィン26は
各通気ダクト18に位置する。なお、ここでは放熱体と
して放熱フィン26の例を示したが、それに限らず、ヒ
ートパイプ等の放熱体であってもよいのは勿論である。
On the back surface of the heat radiating plate 22, a large number of heat radiating fins 26 are provided in the vertical direction. These fins 26 are located in each ventilation duct 18. Here, an example of the radiator fin 26 is shown as the radiator, but the radiator is not limited to this and may be a radiator such as a heat pipe.

【0037】そして、各通気ダクト18の冷却風の向き
は図7,図9の矢印に示すように、放熱フィン26に沿
う下から上又はその逆の上から下のいずれでもよいが、
ここでは吸気口5a,5bから排気口6に冷却風が通流
するため、冷却風の向きは下から上になる。
As shown by the arrows in FIGS. 7 and 9, the direction of the cooling air in each ventilation duct 18 may be from the bottom to the top along the radiating fins 26 or vice versa.
Here, since the cooling air flows from the intake ports 5a and 5b to the exhaust port 6, the direction of the cooling air is from bottom to top.

【0038】なお、変換器ユニット20の放熱フィン2
6の冷却風量を正確に設定して各通気ダクト18の風量
の均一化等を図るときは、各変換器ユニット20の放熱
フィン26に小型ファンを直接取付けることが好まし
い。
The radiation fins 2 of the converter unit 20
When the cooling air volume of 6 is accurately set and the air volume of each ventilation duct 18 is made uniform, it is preferable to directly attach a small fan to the radiation fin 26 of each converter unit 20.

【0039】そして、発熱体を形成する各変換器ユニッ
ト20は、主に電力用半導体24が熱を発生し、この熱
は放熱板22を介して放熱フィン26及び通気ダクト1
8の壁面に伝わり、密閉室13外に放出される。
In each converter unit 20 forming a heating element, heat is mainly generated by the power semiconductor 24, and the heat is transmitted through the heat radiating plate 22 to the radiating fin 26 and the ventilation duct 1.
8 and is discharged out of the closed chamber 13.

【0040】このとき、冷却風が放熱フィン26及び各
通気ダクト18の壁面を通ることから、各変換器ユニッ
ト20は、放熱フィン26の表面が冷却風によって強制
空冷され、十分に冷却される。
At this time, since the cooling air passes through the radiation fins 26 and the wall surfaces of the ventilation ducts 18, the converter units 20 are forcibly cooled by cooling air on the surfaces of the radiation fins 26, and are sufficiently cooled.

【0041】しかも、この形態の場合、密閉室13を囲
む一部の板,すなわち上板7,下板12や中板11,枠
体17等が、通気ダクト18の吸気部15,排気部8の
壁面を形成することから、これらの壁面を冷却風が通流
することによる熱伝達効果が極めて高く、冷却風によっ
て極めて効果的に冷却が行われる。
Moreover, in this embodiment, some of the plates surrounding the closed chamber 13, ie, the upper plate 7, the lower plate 12, the middle plate 11, the frame 17 and the like are formed by the intake unit 15 and the exhaust unit 8 of the ventilation duct 18. Since the cooling air flows through these wall surfaces, the heat transfer effect is extremely high, and the cooling air is extremely effectively cooled by the cooling air.

【0042】そのため、各変換器ユニット20の発熱に
基づく密閉室13の温度上昇を、密閉室13に大型の電
子冷却装置やエアコンディショナ等を設けたりすること
なく抑制することができ、外気を導入して密閉室13を
冷却し、密閉室13の許容発熱量を多くして密閉室13
の機器収納量(密度)を多くし、配電盤の小型化を図る
ことができる。なお、密閉室16も冷却風によって同様
の冷却が施される。
Therefore, a rise in the temperature of the sealed chamber 13 due to the heat generated by each of the converter units 20 can be suppressed without providing a large-sized electronic cooling device, an air conditioner, or the like in the sealed chamber 13, thereby reducing the outside air. The closed chamber 13 is introduced and cooled, the allowable heat generation of the closed chamber 13 is increased, and the closed chamber 13 is cooled.
Can increase the equipment storage amount (density) of the device and downsize the switchboard. The closed chamber 16 is similarly cooled by the cooling air.

【0043】そして、冷却風に塵埃や塩分が含まれてい
ても、これらが密閉室13,16内に侵入しないため、
吸気口5a,5bに高価な特殊フィルタを設けることな
く、変換器ユニット20等の制御回路部及び主回路部の
機器を、塵埃や塩分から確実に保護することができる。
Even if the cooling air contains dust and salt, they do not enter the closed chambers 13 and 16,
Without providing expensive special filters in the intake ports 5a and 5b, the control circuit unit such as the converter unit 20 and the equipment of the main circuit unit can be reliably protected from dust and salt.

【0044】したがって、従来の完全密閉構造の場合や
特殊フィルタを使用する場合に比して、イニシャルコス
ト及びランニングコストが少なく、しかも、配電盤1を
小型化して劣悪環境下での冷却を行うことができる。
Therefore, the initial cost and running cost are lower than those in the case of the conventional completely sealed structure and the case where a special filter is used, and the switchboard 1 can be downsized to perform cooling in a poor environment. it can.

【0045】ところで、密閉室13に収容する発熱体は
電力用半導体モジュールに限られるものでなく、例えば
ヒートシンク付きの抵抗体等であってもよいのは勿論で
ある。
The heating element housed in the closed chamber 13 is not limited to the power semiconductor module, but may be, for example, a resistor with a heat sink.

【0046】また、密閉室13を囲む上板7,下板1
2,中板11等の板体は、通常、他の板体と同様の鉄板
で形成するが、密閉室13内の発熱量が多い場合等に
は、冷却効果を一層高めるため、その厚みを薄くしたり
波板状等のフィン状に加工したり、熱伝導性の高い他の
金属部材等で形成したりすることが好ましい。
The upper plate 7 and the lower plate 1 surrounding the closed chamber 13
2. The plate body such as the middle plate 11 is usually formed of the same iron plate as the other plate bodies. However, when the calorific value in the closed chamber 13 is large, the thickness is increased to further enhance the cooling effect. It is preferable to make it thinner, process it into a fin shape such as a corrugated plate, or form it with another metal member having high thermal conductivity.

【0047】さらに、密閉室13内の発熱量が極めて多
い場合には、電子冷却装置やエアコンディショナ等によ
る密閉室13内の冷却を併用してもよく、この場合、通
気ダクト18を通流する冷却風で十分な冷却効果が得ら
れることから、電子冷却装置やエアコンディショナの冷
却負担が少なく、それらの小型化を図ることができ、安
価に冷却することができるとともに配電盤の小型化を図
ることができる。そして、通気ダクト18等の数や寸法
は実施の形態に限られるものではない。
Further, when the amount of heat generation in the closed chamber 13 is extremely large, cooling in the closed chamber 13 by an electronic cooling device or an air conditioner may be used together. Since the sufficient cooling effect can be obtained with the cooling wind, the cooling load on the electronic cooling device and the air conditioner is small, and they can be downsized. Can be planned. The number and dimensions of the ventilation ducts 18 and the like are not limited to the embodiment.

【0048】(他の形態)つぎに、請求項3の通気ダク
トを備えた実施の他の形態について、図10を参照して
説明する。図10の(a),(b),(c)は閉鎖配電
盤1’の切断正面図,切断平面図,切断側面図であり、
それらの図面において、図1〜図9の符号にダッシ
ュ(’)を付したものは、図1〜図9の各符号のものと
同一又は相当するものを示す。
(Other Embodiment) Next, another embodiment of the present invention having the ventilation duct of claim 3 will be described with reference to FIG. (A), (b), and (c) of FIG. 10 are a cut front view, a cut plan view, and a cut side view of the closed switchboard 1 '.
In those drawings, those with a dash (') added to the reference numerals in FIGS. 1 to 9 indicate the same or corresponding parts as those in FIGS. 1 to 9.

【0049】そして、配電盤1’は密閉室として、本体
3’内に密閉室13’のみを有し、この密閉室13’は
変換器ユニット20’を1個収納する。
The switchboard 1 'has only a closed chamber 13' in the main body 3 'as a closed chamber, and the closed chamber 13' accommodates one converter unit 20 '.

【0050】また、本体3’の前面には1枚の扉4’が
設けられ、扉4’の下部に1個の吸気口5’が設けられ
る。
One door 4 'is provided on the front surface of the main body 3', and one intake port 5 'is provided below the door 4'.

【0051】さらに、本体3’内においては、配電盤
1’の壁板の1つである背面板3dの前側に仕切板27
が設けられる。
Further, in the main body 3 ', a partition plate 27 is provided in front of a back plate 3d which is one of the wall plates of the switchboard 1'.
Is provided.

【0052】そして、上板7’,下板12’,前板1
4’,仕切板27及び両側板3b’,3c’により、仕
切板27の表面側に密閉室13’を形成し、仕切板27
の裏面側の仕切板27と背面板3d’との間に、吸気口
5’,排気口6’に連通した通気ダクト18’を形成す
る。
The upper plate 7 ', the lower plate 12', and the front plate 1
A closed chamber 13 'is formed on the surface side of the partition plate 27 by the 4', the partition plate 27, and both side plates 3b 'and 3c'.
A ventilation duct 18 'communicating with the intake port 5' and the exhaust port 6 'is formed between the partition plate 27 on the back side and the back plate 3d'.

【0053】また、仕切板27に開口28を形成し、こ
の開口28の前面側に変換器ユニット20’の放熱板2
2’を取付け、放熱板22’及びその表面の回路部を密
閉室13’内に位置させ、放熱板22’の裏面側の放熱
フィン26’を通気ダクト18’に位置させる。
An opening 28 is formed in the partition plate 27, and a heat radiating plate 2 of the converter unit 20 'is provided on the front side of the opening 28.
2 'is attached, the heat radiating plate 22' and the circuit portion on the surface thereof are positioned in the closed chamber 13 ', and the heat radiating fins 26' on the back side of the heat radiating plate 22 'are positioned in the ventilation duct 18'.

【0054】そして、換気ファン10’の換気により、
吸気口5’から吸気部15’,通気ダクト18’,排気
部8’を介して排気口6’に冷却風が通流し、この冷却
風により1形態の場合と同様の冷却を行う。
Then, by the ventilation of the ventilation fan 10 ',
Cooling air flows from the intake port 5 'to the exhaust port 6' through the intake section 15 ', the ventilation duct 18', and the exhaust section 8 ', and the cooling air performs the same cooling as in the first embodiment.

【0055】このとき、通気ダクト18’において、放
熱フィン26’と側板3b’,3c’との隙間を水平な
遮蔽板29a,29bにより閉塞し、通気ダクト18’
の冷却風が各放熱フィン26’を通り、それらの外側を
通り抜けることがないようにし、冷却風を有効に利用す
る。
At this time, in the ventilation duct 18 ', the gap between the radiation fin 26' and the side plates 3b ', 3c' is closed by the horizontal shielding plates 29a, 29b, and the ventilation duct 18 '
Is prevented from passing through the radiation fins 26 'and outside of the fins 26', and the cooling air is effectively used.

【0056】そして、この形態の場合は仕切板27によ
り盤内を前後に仕切って簡単に形成することができる利
点がある。
In the case of this embodiment, there is an advantage that the inside of the board can be partitioned back and forth by the partition plate 27 and can be easily formed.

【0057】ところで、密閉室13’に変換器ユニット
20’等の発熱体を複数収容した場合には、仕切板27
に各発熱体の放熱板を取付けることにより、同様に適用
できるのは勿論である。
When a plurality of heating elements such as the converter unit 20 'are accommodated in the closed chamber 13', the partition plate 27
It is needless to say that the present invention can be similarly applied by attaching a heat radiating plate for each heating element.

【0058】そして、本発明は屋内及び屋外に設置され
る種々の配電盤に適用することができる。
The present invention can be applied to various switchboards installed indoors and outdoors.

【0059】[0059]

【発明の効果】本発明は、以下に記載する効果を奏す
る。まず、配電盤1,1’内に密閉室13,13’を設
け、通気ダクト18,18’と、換気ファン10,1
0’と、ダクト18,18’の壁面の開口21,28に
取付けた放熱板22,22’とを備えたため、放熱板2
2,22’の表面の電力用半導体モジュール24,2
4’等の発熱体を外気から遮断された密閉室13,1
3’に設け、放熱板22,22’の裏面の放熱体を通気
ダクト18,18’に位置させることができる。
The present invention has the following effects. First, closed chambers 13, 13 'are provided in switchboards 1, 1', and ventilation ducts 18, 18 'and ventilation fans 10, 1' are provided.
0 ′ and the heat radiating plates 22 and 22 ′ attached to the openings 21 and 28 in the wall surfaces of the ducts 18 and 18 ′, the heat radiating plate 2
Power semiconductor modules 24, 2 on the surface of
A closed chamber 13, 1 in which a heating element such as 4 'is shielded from the outside air
3 ', the radiator on the back surface of the radiator plates 22, 22' can be located in the ventilation ducts 18, 18 '.

【0060】そして、換気ファン10,10’により、
外気を冷却風として、吸気口5a,5b,5’から通気
ダクト18,18’に導入し、この冷却風を放熱体を介
して排気口6,6’から外部に排気し、放熱体を通して
発熱体を放熱し、配電盤1,1’を冷却して密閉室1
3,13’の温度上昇を抑制することができる。
Then, by the ventilation fans 10, 10 ',
Outside air is introduced as cooling air into the ventilation ducts 18, 18 ′ from the intake ports 5 a, 5 b, 5 ′, and the cooling air is exhausted to the outside from the exhaust ports 6, 6 ′ via a radiator, and heat is generated through the radiator. Dissipates heat, cools switchboards 1 and 1 '
The temperature rise of 3, 13 'can be suppressed.

【0061】この場合、外気に含まれた塵埃や塩分は通
気ダクト18,18’を通り、密閉室13,13’に侵
入しないため、発熱体とともに制御回路部等の塵埃・塩
害対策が必要な諸機器を密閉室13,13’に収納する
ことにより、吸気口5a,5b,5’のフィルタに塵埃
・塩害対策用の高価な特殊フィルタを使用せず、十分な
塵埃・塩害対策を施すことができる。
In this case, since dust and salt contained in the outside air pass through the ventilation ducts 18 and 18 'and do not enter the closed chambers 13 and 13', it is necessary to take measures against dust and salt damage of the control circuit and the like together with the heating element. By storing various devices in the closed chambers 13 and 13 ', sufficient dust and salt damage countermeasures can be taken without using expensive special filters for dust and salt damage countermeasures in the filters of the intake ports 5a, 5b and 5'. Can be.

【0062】また、配電盤1,1’全体を完全密閉する
のでなく、盤内に外気を導入して冷却する構造であるた
め、盤内全体を冷却する大容量,大型の電子冷却装置,
エアコンディショナ等を設ける必要がなく、安価であ
り、しかも、配電盤1,1’の小型化を図ることができ
る。
Further, since the entire distribution boards 1, 1 'are not completely sealed, but are cooled by introducing outside air into the boards, a large-capacity, large-sized electronic cooling device for cooling the entire inside of the boards,
There is no need to provide an air conditioner or the like, and the cost is low, and the size of the switchboards 1 and 1 'can be reduced.

【0063】したがって、塵埃・塩害対策が必要な劣悪
環境下にあっても、高価な特殊フィルタを使用せず、塵
埃や塩分の影響を受けないようにして配電盤1,1’内
に外気を導入し、安価にし、しかも、配電盤1,1’の
小型化を図って冷却を行うことができる。
Therefore, even in a poor environment where dust and salt damage countermeasures are required, an outside air is introduced into the switchboards 1 and 1 'without using an expensive special filter so as not to be affected by dust and salt. In addition, cooling can be performed at a low cost, and at the same time, the size of the switchboards 1 and 1 'can be reduced.

【0064】そして、通気ダクト18は密閉室13を形
成する板体(中板11)に断面コ字状の上下方向の枠体
17を取付けて形成することが好ましく、この場合、密
閉室13を形成する板体が通気ダクト18を構成するた
め、通気ダクト18を通流する冷却風により、放熱体だ
けでなく、密閉室壁面等も十分に冷却され、冷却性能を
一層向上することができる。
The ventilation duct 18 is preferably formed by attaching a vertical frame 17 having a U-shaped cross section to a plate (intermediate plate 11) forming the closed chamber 13. Since the plate to be formed constitutes the ventilation duct 18, the cooling air flowing through the ventilation duct 18 sufficiently cools not only the radiator but also the wall surface of the closed chamber, so that the cooling performance can be further improved.

【0065】また、配電盤1’の壁板(背面板3d’)
の内側に仕切板27を設け、この仕切板27の表側を密
閉室13’とし、仕切板27の裏側を通気ダクト18’
としてもよく、この場合は簡単な構造で前記の通気ダク
ト18を設けた場合と同様の効果が得られる。
The wall plate of the switchboard 1 '(back plate 3d')
A partition plate 27 is provided on the inner side of the partition plate 27. The front side of the partition plate 27 is a closed chamber 13 ', and the back side of the partition plate 27 is a ventilation duct 18'.
In this case, the same effect as in the case where the ventilation duct 18 is provided with a simple structure can be obtained.

【0066】そして、本発明は、放熱板22,22’の
表面の発熱体が発熱量の多い電力用半導体モジュールで
あるときに好適である。
The present invention is suitable when the heating elements on the surfaces of the heat radiating plates 22 and 22 'are power semiconductor modules that generate a large amount of heat.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の実施の1形態の配電盤の正面図であ
る。
FIG. 1 is a front view of a switchboard according to an embodiment of the present invention.

【図2】図1の平面図である。FIG. 2 is a plan view of FIG.

【図3】図1の側面図である。FIG. 3 is a side view of FIG. 1;

【図4】図1の切断正面図である。FIG. 4 is a cut-away front view of FIG.

【図5】図1の切断平面図である。FIG. 5 is a cut-away plan view of FIG. 1;

【図6】図1の切断側面図である。FIG. 6 is a cut-away side view of FIG. 1;

【図7】図1の変換器ユニットの正面図である。FIG. 7 is a front view of the converter unit of FIG. 1;

【図8】図7の平面図である。FIG. 8 is a plan view of FIG. 7;

【図9】図7の側面図である。FIG. 9 is a side view of FIG. 7;

【図10】(a),(b),(c)は本発明の実施の他
の形態の配電盤の切断正面図,切断平面図,切断側面図
である。
FIGS. 10A, 10B, and 10C are a cut front view, a cut plan view, and a cut side view of a switchboard according to another embodiment of the present invention.

【符号の説明】[Explanation of symbols]

1,1’ 閉鎖型自立配電盤 5a,5b,5’ 吸気口 6,6’ 排気口 10,10’ 換気ファン 11 中板 17 枠板 18,18’ 通気ダクト 20,20’ 変換器ユニット 21,28 開口 22,22’ 放熱板 26,26’ 放熱フィン 27 仕切板 1,1 'Closed-type independent switchboard 5a, 5b, 5' Intake port 6, 6 'Exhaust port 10, 10' Ventilation fan 11 Middle plate 17 Frame plate 18, 18 'Vent duct 20, 20' Converter unit 21, 28 Openings 22, 22 'Heat radiating plates 26, 26' Heat radiating fins 27 Partition plate

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 配電盤内に設けられ,外気から遮断され
た密閉室と、 両端が配電盤の吸気口と排気口とに連通した通気ダクト
と、 前記吸気口から前記通気ダクトを介して前記排気口に通
風させる換気ファンと、 前記通気ダクトの壁面に形成された開口と、 前記開口に取付けられ,表面の発熱体が前記密閉室に位
置し,裏面の放熱体が前記通気ダクトに位置した放熱板
とを備えたことを特徴とする配電盤の冷却装置。
A closed chamber provided in a switchboard and isolated from outside air; a ventilation duct having both ends communicating with an intake port and an exhaust port of the switchboard; and the exhaust port from the intake port via the ventilation duct. A ventilation fan for ventilating the ventilation duct; an opening formed in the wall surface of the ventilation duct; a heat radiating plate attached to the opening, wherein a heating element on the surface is located in the closed chamber, and a radiator on the back face is located in the ventilation duct. And a cooling device for a switchboard.
【請求項2】 密閉室を形成する板体に断面コ字状の上
下方向の枠体を取付けて通気ダクトを形成したことを特
徴とする請求項1記載の配電盤の冷却装置。
2. The cooling device for a switchboard according to claim 1, wherein a ventilation duct is formed by attaching a vertical frame having a U-shaped cross section to the plate forming the closed chamber.
【請求項3】 配電盤の壁板の内側に仕切板を設け、前
記仕切板の表側を密閉室とし、前記仕切板の裏側を通気
ダクトとしたことを特徴とする請求項1記載の配電盤の
冷却装置。
3. The cooling of the switchboard according to claim 1, wherein a partition plate is provided inside the wall plate of the switchboard, a front side of the partition plate is a closed chamber, and a back side of the partition plate is a ventilation duct. apparatus.
【請求項4】 放熱板の表面の発熱体が、電力用半導体
モジュールであることを特徴とする請求項1,請求項2
又は請求項3記載の配電盤の冷却装置。
4. A power semiconductor module according to claim 1, wherein the heating element on the surface of the heat sink is a power semiconductor module.
Or the cooling device for a switchboard according to claim 3.
JP30409599A 1999-10-26 1999-10-26 Cooling device for switchboard Pending JP2001128321A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP30409599A JP2001128321A (en) 1999-10-26 1999-10-26 Cooling device for switchboard

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30409599A JP2001128321A (en) 1999-10-26 1999-10-26 Cooling device for switchboard

Publications (1)

Publication Number Publication Date
JP2001128321A true JP2001128321A (en) 2001-05-11

Family

ID=17928974

Family Applications (1)

Application Number Title Priority Date Filing Date
JP30409599A Pending JP2001128321A (en) 1999-10-26 1999-10-26 Cooling device for switchboard

Country Status (1)

Country Link
JP (1) JP2001128321A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009027817A (en) * 2007-07-18 2009-02-05 Fuji Electric Holdings Co Ltd Switchboard
CN102189310A (en) * 2010-03-10 2011-09-21 株式会社大亨 Power supply apparatus
JP2012023799A (en) * 2010-07-12 2012-02-02 Toshiba Mitsubishi-Electric Industrial System Corp Power conversion device
CN103354323A (en) * 2013-07-19 2013-10-16 万能亿自动化科技(苏州)有限公司 Heat dissipation apparatus for switch cabinet
WO2015133755A1 (en) * 2014-03-03 2015-09-11 주식회사 루비 Power conversion system using heat exchange type power device module
CN107611821A (en) * 2017-09-28 2018-01-19 中科电力装备集团有限公司 A kind of new distribution automation terminal
CN108429170A (en) * 2017-05-28 2018-08-21 杭州力谱科技有限公司 A kind of outdoor dustproof power distribution cabinet

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009027817A (en) * 2007-07-18 2009-02-05 Fuji Electric Holdings Co Ltd Switchboard
CN102189310A (en) * 2010-03-10 2011-09-21 株式会社大亨 Power supply apparatus
JP2012023799A (en) * 2010-07-12 2012-02-02 Toshiba Mitsubishi-Electric Industrial System Corp Power conversion device
CN103354323A (en) * 2013-07-19 2013-10-16 万能亿自动化科技(苏州)有限公司 Heat dissipation apparatus for switch cabinet
WO2015133755A1 (en) * 2014-03-03 2015-09-11 주식회사 루비 Power conversion system using heat exchange type power device module
CN108429170A (en) * 2017-05-28 2018-08-21 杭州力谱科技有限公司 A kind of outdoor dustproof power distribution cabinet
CN107611821A (en) * 2017-09-28 2018-01-19 中科电力装备集团有限公司 A kind of new distribution automation terminal

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