TWM519266U - Interface card module - Google Patents

Abstract

An interface card module suited for an electronic device is provided. The interface module includes an interface card, a bracket, and a cooling assembly. The interface card has a plate body and at least one connector disposed at an edge of the plate body. The bracket assembled at the edge of the plate body has at least one first opening and at least one second opening, wherein the connector passing through the first opening, and a distance between the first opening and the plate body is less than another distance between the second opening and the plate body. At least a portion of the cooling assembly is disposed on the plate body, and the cooling assembly has at least one piping passing through the second opening.

Description

Interface card module

The novel creation is related to an interface card module.

According to the previous, the central processing unit (CPU), the chipset, the display card and the peripheral electronic components of the computer are operating slowly, and the air-cooled heat sink composed of the heat sink and the cooling fan is sufficient for the heat dissipation device. However, in recent years, with the continuous improvement of the clock, and the clock and heat are directly proportional. Therefore, the above-mentioned heat sink is limited by the space limitation of the casing, and it has become increasingly difficult to follow the improvement of the operating speed of the central processing unit and the chipset, thereby effectively solving the problem of heat dissipation.

With the interface cards currently used in personal computers, such as display cards, as the processing function and speed increase, the interface card is processed for a period of time, and the processing chip will generate high temperature due to continuous high-frequency oscillation. If the heat is not released in time, it is easy to cause damage to the processing chip. Accordingly, on the processing chip of the interface card, a heat dissipating device such as a heat dissipating fin is usually disposed, and the heat energy generated by the processing wafer is transferred to the heat dissipating fin by heat transfer to improve the heat dissipation efficiency of the processing chip, and The processing wafer is maintained at a normal operating temperature range.

However, as the processing speed of the processing wafer increases, the conventional heat dissipating device that dissipates heat by the heat dissipating fins cannot be applied. Therefore, the prior art has disclosed a water-cooling heat dissipating device, but the application still has the following disadvantages: First, Since the components such as the hydraulic pump and the heat sink are fixed in the mainframe of the computer and are far away from the interface card, it is necessary to use a long infusion tube to connect the components to make the computer host that is already crowded. The box is more crowded and is not suitable for the installation of other peripheral devices. Moreover, when the user needs to replace the interface card, the liquid cooling box that is closely attached to the processing chip must be removed before the interface card can be replaced, because the components of the water-cooled heat sink are filled. There is coolant (or water), so in the process of disassembling or installing the liquid cooling box, it is easy to pull the infusion tubes, causing leakage of the coolant, and damage the electronic components in the mainframe of the computer, so that the interface card is removed. It is very difficult to change.

Based on the above, how to provide a sufficient cooling effect of the interface card without hindering the configuration of the components in the chassis of the electronic device and facilitating the disassembly and assembly of the user is a problem that the relevant personnel need to consider and solve.

The invention provides an interface card module, which has a cooling component disposed on the interface card, and the pipeline of the cooling component is inserted along with the bracket of the interface card, thereby providing the interface card and the cooling component to be modularized and then disassembled And the convenience of loading.

The interface card module created by the present invention is suitable for electronic devices. The interface card module includes an interface card, a bracket, and a cooling assembly. The interface card has a plate body and at least one connector, wherein the connector is located at a side edge of the plate body. The bracket is assembled to the side edge, the bracket has at least one first opening and at least one second opening, wherein the distance of the first opening relative to the board body is smaller than the distance of the second opening relative to the board body, and the connector is disposed in the first opening . At least a portion of the cooling assembly is disposed on the plate. The cooling assembly has at least one conduit that extends through the second opening.

In an embodiment of the present invention, the cooling assembly further has at least one pipe joint connecting the at least one pipeline. The pipe joint is disposed on the bracket and is disposed through the second opening.

In an embodiment of the present invention, the electronic device has a chassis. The interface card module is adapted to be disposed inside the chassis and assembled to the chassis by the bracket. The at least one first opening and the at least one second opening respectively communicate with the inside and the outside of the chassis.

In an embodiment of the present invention, the bracket has a plurality of second openings, and the cooling assembly includes a liquid cooling member, a plurality of first conduits, and a plurality of conduit couplings. The liquid cooling member is disposed on the plate body to thermally contact at least one heat source of the interface card. The liquid cooling member has a first outlet and a first inlet. The first conduit is connected to the first outlet and the first inlet, respectively. The pipe joints are disposed on the brackets and respectively disposed through the second openings. The pipe joint is correspondingly connected to the first pipe.

In an embodiment of the present invention, each of the pipe joints has a locking portion, and the cooling assembly further includes a plurality of lock attachments respectively sleeved on the first pipe and locked to the lock portion to join the pipe The road joint member and the first pipeline.

In an embodiment of the present invention, the cooling assembly further includes a heat sink and a plurality of second conduits. The heat sink has a second outlet and a second inlet, the second pipeline is connected to the second outlet and the second inlet, respectively, and the second pipeline is respectively connected to the pipeline joint.

In an embodiment of the present invention, the cooling assembly further has at least one pipe joint connecting at least one pipe. The at least one second opening has an open profile, and the pipe joint is snapped onto the second opening.

In an embodiment of the present invention, the interface card module includes a plurality of second openings, wherein a distance of a portion of the second openings relative to the board is not equal to a distance of the other portion of the second openings relative to the board.

In an embodiment of the present invention, the height of the pipeline relative to the plate body and the height of the second opening relative to the plate body coincide with each other.

Based on the above, the interface card module provides a heat dissipation effect on at least one heat source disposed on the board body by disposing at least a portion of the cooling assembly on the board body of the interface card, and the bracket has a first opening and a second The opening, wherein the first opening is for passing through a connector disposed on the board body, and the second opening is for allowing a pipeline of the cooling assembly to pass therethrough. Accordingly, by modularizing the cooling component and the interface card, the user can simultaneously complete the assembly of the cooling component by installing the interface card module on the electronic device, that is, the user does not need to separately install the interface card. The cooling assembly is provided to effectively improve the efficiency and convenience of the assembly, while avoiding other problems that may be caused during the disassembly and assembly process due to the additional installation of the cooling assembly.

The above described features and advantages of the present invention will become more apparent and understood from the following description.

1 is a schematic view showing the assembly of an interface card module according to an embodiment of the present invention. 2 is a schematic view of the interface card module of FIG. 1 in another perspective, wherein FIG. 2 omits some of the components of FIG. 1 to facilitate identification of structural features. Referring to FIG. 1 and FIG. 2 simultaneously, in the embodiment, the interface card module 100 is adapted to be installed in the chassis 120 of the electronic device. For example, in the case of a personal computer, the interface card module 100 is, for example, a display card module installed in the chassis 120. However, the embodiment is not limited thereto. The interface card module 100 includes an interface card 110 and a bracket 130. The bracket 130 is assembled to the side edge S1 of the board 112 of the interface card 110, and the rear bracket 130 is assembled to the chassis 120 to fix the interface card 110. Inside the chassis 120. The interface card 110 also has a connector 114 that is disposed on the side edge S1 of the board body 112 (on the same side as the bracket 130) to allow the connector 114 to pass through the bracket 130, whereby the user can thereby externally device (for example, a display) Connected to the connector 114, the effect of the interface card 110 is achieved.

In detail, FIG. 3 is an exploded view of the interface card module of FIG. 1. Referring to FIG. 2 and FIG. 3 simultaneously, as described above, the interface card 110 is, for example, a display card, and a plurality of electronic components 116 are disposed on the board 112 (only one of them is represented), and when the interface card 110 is operated It becomes a source of heat generation. The following description is made by taking a display wafer (i.e., the electronic component labeled 116 in Fig. 3) as a main heat source.

In this embodiment, the interface card module 100 further includes a cooling assembly 140 for providing a cooling effect to the aforementioned electronic component 116 as a heat source. Further, the cooling assembly 140 includes a liquid cooling member 142, a plurality of first conduits 144, a plurality of conduit bonds 146, a plurality of second conduits 141, and a heat sink 148. The liquid cooling member 142 is a structural member provided with a plurality of internal flow paths (not shown) and is used to abut (thermally contact) the electronic component 116 as the heat source. The heat sink 148 also has an internal flow path (not shown), and the heat sink 148 further includes a heat dissipation fin 148a and a fan (not shown), and the internal flow path flows through the heat dissipation fin 148a and the fan.

Furthermore, as shown in FIG. 3, the liquid cooling member 142 has a first inlet E1 and a first outlet E2 to communicate with the internal flow path (not shown), and the coolant or water is adapted to flow into the liquid cooling from the first inlet E1. The piece 142 then flows out of the liquid cooling member 142 from the first outlet E2, so that the liquid cooling member 142 can absorb heat from the electronic component 116 and achieve a heat dissipation effect on the electronic component 116. The heat sink 148 has a second inlet E3 and a second outlet E4, which are also in communication with an internal flow path (not shown), and the heat or liquid that absorbs heat is adapted to flow from the second inlet E3 into the heat sink 148 and from the second outlet. E4 flows out of the heat sink 148, and during the process of flowing through the heat sink fins 148a and the fan, the heat of the coolant or water is released to the heat sink 148 to cool down, and the cooled coolant or water can be removed from the heat sink. The second outlet E4 flows into the liquid cooling member 142 again via the first inlet E1. Accordingly, the coolant or water can form a circulation between the liquid cooling member 142 and the heat sink 148, and the electronic component 116 is continuously dissipated.

On the other hand, one of the first lines 144 of the cooling assembly 140 is connected between the line joint 146 and the first inlet E1, and the other first line 144 is connected between the line joint 146 and the first outlet E2. between. Furthermore, the second conduits 141 are respectively connected to the pipe couplings 146, wherein a second conduit 141 is connected between the pipe coupling 146 and the second inlet E3 of the heat sink 148, and the other second pipe The passage 141 is connected between the pipe coupling 146 and the second outlet E4 of the heat sink 148 to complete the circulation path of the coolant or water in the cooling assembly 140.

As such, the coolant or water in the cooling assembly 140 can be driven by a pump (not shown) in the liquid cooling member 142, the first conduit 144, the conduit coupling 146, the second conduit 141, and The heat dissipating members 148 flow between the heat radiating members 142 by the heat conduction of the liquid cooling member 142, and then the cooling liquid is absorbed by the liquid cooling member 142, and then transferred to the heat dissipating member 148 by the circulation, thereby utilizing the heat dissipating fins 148a and The fan cools the coolant at this point and then transfers it back to the liquid cooling member 142.

It is to be noted that, in order to achieve a better heat dissipation effect, the liquid cooling member 142 of the cooling assembly 140 is disposed on the board body 112 of the interface card 110, and the heat dissipating member 148 is not provided, so that the interface card module 100 can be smoothly performed. The bracket 130 of the interface card module 100 has a plurality of first openings 132 and second openings 134. When the brackets 130 are assembled to the chassis 120, the first openings 132 and the second openings 134 are respectively connected to the chassis 120. The first opening 132 is configured to allow the connector 114 disposed on the board 112 to be disposed for the interface card 110 to be electrically connected to the external device, and the first opening 132 is opposite to the board 112. The distance of the second opening 134 is less than or equal to the distance between the second opening 134 and the plate body 112, so that the first pipe 144, the second pipe 141 and the pipe coupling 146 of the cooling assembly 140 are adapted to be pierced and coupled to the bracket 130. At the second opening 134.

In this way, the bracket 130 of the present embodiment has a multi-layer opening structure with different relative distances based on the board body 112, so that the connector 114 can pass out from the first opening 132 closer to the board body 112, which can avoid The electrical connection distance between the connector 114 and the board 112 is too long to cause unnecessary interference or poor transmission of the electrical signal, and the cooling unit 140 can have a larger distance than the board 112. Passing through the second opening 134 of the bracket 130 to simultaneously reach the connector 114 and can be disposed at a height corresponding to the setting condition of the liquid cooling member 142 and the electronic component 116 relative to the board 112, that is, the pipeline (the The height of a line 144 and the second line 141) relative to the plate body 112 and the height of the second opening 134 relative to the plate body 112 can coincide with each other to avoid interference with the structure of the cooling assembly 140 and the connector 112. .

In other words, in the present embodiment, the pipe joint 146 is disposed on the bracket 130 with its fixing portion 146a and substantially stuck in the second opening 134, and the pipe structure facing the inside of the casing It is adapted to be connected to the first line 144 and its piping structure towards the outside of the housing is adapted to be connected to the second line 141. As a result, the liquid cooling member 142, the first conduit 144 and the conduit coupling member 146 of the cooling assembly 140 are substantially disposed on the interface card 110 and the bracket 130, thereby allowing the interface card 110 and the cooling assembly to be configured in this manner. The module 140 is modularized, that is, the user only needs to pay attention to assembling the interface card 110 and the bracket 130 disposed on the side edge S1 to the chassis 120 of the electronic device, and then the heat sink 148 from the outside of the chassis 120 through the second conduit. 141 is connected to the pipe joint member 146, and the installation effect of the interface card 110 and the cooling assembly 140 can be simultaneously achieved without separately adding an additional cooling member to the interface card 110.

In addition, the cooling assembly 140 further includes a plurality of lock attachments 143 respectively sleeved on the first pipe 144 and locked to the locking portion 146b of the pipe coupling 146 for connecting the pipe joint 146 with the first pipe The roads 144 are combined and fixed together.

4 is a partial schematic view of an interface card module according to another embodiment of the present invention. Referring to FIG. 4, the bracket 230 of the present embodiment includes a plurality of second openings 232, 234, wherein a portion of the second openings 232 are located above the first opening 232, that is, the second opening 232 is opposite to the previous embodiment. The distance between the board 112 is greater than the distance of the first opening 132 relative to the board 112, and the other part of the second opening 234 is also located above the second opening 232 to form a second opening 232, 234 of two layers. That is, the distance of the other portion of the second opening 234 relative to the plate body 112 is greater than the distance of the second portion of the second opening 232 relative to the plate body 112. In other words, the position of the second opening 232, 234 on the bracket 230 is not limited herein. For the bracket 230, the first opening 132 in the first layer is passed as the connector 114 of the interface card 110. In addition, the second openings 232, 234 above the second layer can be used to pass the piping of the cooling assembly as in the previous embodiment.

FIG. 5 is a partial schematic view of an interface card module according to another embodiment of the present invention. Referring to FIG. 5, the bracket 330 of the present embodiment has a second opening 332 having an open contour, as shown in the figure, but not limited thereto. The pipe joint member 146 of the foregoing embodiment can be locked in a one-way direction (as shown in the downward direction), so that the fixing portion 146a is snapped into the U-shaped groove as shown, thereby facilitating the installation of the user. Cool the piping of the assembly. In another embodiment, not shown, the pipe joint can still be fastened to the second opening of the bracket (the U-shaped groove shown) by means of a snap member. Accordingly, any of the prior art is sufficient to know the fastening structure for snapping, and can be suitably used in the present embodiment.

In summary, in the above embodiment of the present invention, the interface card, the bracket and the cooling assembly are modularized, so that the user can simultaneously complete at least part of the cooling assembly while assembling the interface card. Installation, in order to save time for the user to install the cooling components in the chassis of the electronic device, to improve assembly efficiency and convenience, and to avoid the possibility of mistakes when installing additional cooling components.

Furthermore, in the structure of the interface card module of the present invention, a multi-layer opening having different heights relative to the board body is formed on the bracket based on the board body of the interface card, wherein the lower layer opening is installed The connector is used, and the opening of the higher layer can be passed corresponding to the height of the liquid cooling member and the pipeline of the cooling assembly with respect to the plate body, so that the interference between the cooling assembly and the connector can be avoided. In one embodiment, the opening in the bracket is a closed contour, while in other embodiments, the opening may also be an open contour to allow the conduit coupling to be snapped into the opening. In other words, after the user assembles the interface card module into the chassis, the assembly of the cooling assembly can be smoothly completed by simply connecting the corresponding pipe and the heat sink to the pipe joint on the bracket outside the chassis. Process to achieve a simplified process and improve convenience.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the novel creation, and any person skilled in the art can make some changes without departing from the spirit and scope of the novel creation. Retouching, the scope of protection of this new creation is subject to the definition of the scope of the patent application attached.

100‧‧‧Interface card module
110‧‧‧Interface card
112‧‧‧ board
114‧‧‧Connector
116‧‧‧Electronic components
120‧‧‧Chassis
130, 230, 330‧‧‧ bracket
132‧‧‧ first opening
134, 232, 234, 332‧‧‧ second opening
140‧‧‧cooling components
141‧‧‧Second line
142‧‧‧ liquid cooling parts
143‧‧‧Lock attachment
144‧‧‧First line
146‧‧‧ Pipe joints
146a‧‧‧Fixed Department
146b‧‧‧Locking Department
148‧‧‧Solder parts
148a‧‧‧heat fins
E1‧‧‧ first entrance
E2‧‧‧ first exit
E3‧‧‧ second entrance
E4‧‧‧ second exit
S1‧‧‧ side edge

1 is a schematic view showing the assembly of an interface card module according to an embodiment of the present invention. 2 is a schematic view of the interface card module of FIG. 1 from another perspective. 3 is a schematic exploded view of the interface card module of FIG. 1. 4 is a partial schematic view of an interface card module according to another embodiment of the present invention. FIG. 5 is a partial schematic view of an interface card module according to another embodiment of the present invention.

110‧‧‧Interface card

112‧‧‧ board

114‧‧‧Connector

120‧‧‧Chassis

130‧‧‧ bracket

140‧‧‧cooling components

141‧‧‧Second line

142‧‧‧ liquid cooling parts

143‧‧‧Lock attachment

144‧‧‧First line

148‧‧‧Solder parts

148a‧‧‧heat fins

S1‧‧‧ side edge

Claims (9)

An interface card module is applicable to an electronic device. The interface card module comprises: an interface card having a plate body and at least one connector, wherein the connector is located at a side edge of the plate body; The bracket has at least one first opening and at least one second opening, wherein the distance of the first opening relative to the board is less than or equal to the distance of the second opening relative to the board, the connector The first opening is disposed in the first opening; and a cooling component is at least partially disposed on the plate body, the cooling component having at least one pipeline passing through the second opening. The interface card module of claim 1, wherein the cooling assembly further has at least one pipeline coupling member connected to the at least one pipeline, wherein the pipeline coupling member is disposed on the bracket and is disposed in the first Two openings. The interface card module of claim 1, wherein the electronic device has a chassis, the interface card module is adapted to be disposed inside the chassis, and is assembled to the chassis by the bracket, the at least one The first opening and the at least one second opening respectively communicate with the inside and the outside of the chassis. The interface card module of claim 1, wherein the bracket has a plurality of second openings, and the cooling assembly comprises: a liquid cooling member disposed on the plate body to thermally contact at least one of the interface cards a heat source, the liquid cooling member has a first outlet and a first inlet; a plurality of first conduits respectively connected to the first outlet and the first inlet; and a plurality of conduit joints disposed on the bracket and respectively The second opening is disposed, and the pipeline joints are correspondingly connected to the first pipelines. The interface card module of claim 4, wherein each of the pipe joints has a locking portion, and the cooling assembly further comprises: a plurality of lock accessories respectively sleeved on the first pipes And locking to the locking portions to combine the pipe joints with the first pipes. The interface card module of claim 4, wherein the cooling assembly further comprises: a heat sink having a second outlet and a second inlet; and a plurality of second conduits connected to the second The outlet is connected to the second inlet, and the second conduits are respectively connected to the pipeline joints. The interface card module of claim 1, wherein the cooling assembly further has at least one pipe joint connecting the at least one pipe, the at least one second opening having an open contour, the pipes A coupling member is placed on the second opening. The interface card module of claim 1, wherein the bracket has a plurality of second openings, wherein a portion of the second openings are separated from the board by a distance that is not equal to another portion of the second openings The distance from the board. The interface card module of claim 1, wherein the height of the pipe relative to the plate body and the height of the second opening relative to the plate body coincide with each other.