TW201909720A - Electronic device cooling system - Google Patents

Abstract

An electronics cooling system with an electronics enclosure that is hermetically sealed. The system includes a heat exchanger that exchanges heat between a first cooling fluid within the electronics enclosure and a second cooling fluid of a vapor compression system. A fan circulates the first cooling fluid within the electronics enclosure. The electronics cooling system may also include a baffle system within the electronics enclosure that directs the first cooling fluid over one or more electronic components disposed within the electronics enclosure to cool the one or more electronic components.

Description

   Electronic device cooling system        Cross-reference of related applications    

This application requires the priority and rights of the US Provisional Application Serial No. 62 / 534,627, entitled "ELECTRONICS COOLING SYSTEM", filed on July 19, 2017. The entire contents are incorporated into this article by reference.

The present application generally relates to a system for cooling a housing containing electronic devices.

The refrigeration system is used in various occasions, such as residential, commercial, and industrial air conditioning systems. Such systems may include many different components, such as motors, compressors, valves, etc. Some or all of these components can be controlled by electronic devices. Electronic devices use electronic components such as resistors, transistors, digital signal processors, programmable logic controllers, analog-to-digital converters, inductors, transformers, IGBTs, diodes, and integrated circuits to control the flow of electrical energy And signal. Unfortunately, the operation and life of such electronic components may be adversely affected by heat, moisture, industrial smoke / gas, and / or dust.

In a general aspect, an electronic device cooling system has a hermetically sealed electronic device housing. The system includes a heat exchanger that exchanges heat between the first cooling fluid within the electronics enclosure and the second cooling fluid of the vapor compression system. The fan circulates the first cooling fluid within the housing of the electronic device. The electronic device cooling system may further include a barrier system located in the electronic device housing, the barrier system guiding the first cooling fluid through one or more electronic components disposed in the electronic device housing in a controlled manner to cool The one or more electronic components.

In another aspect, a system having an electronic device cooling system. The electronic device cooling system includes a hermetically sealed electronic device housing. The system includes a heat exchanger that exchanges heat between the first cooling fluid within the electronics enclosure and the second cooling fluid of the vapor compression system. The fan circulates the first cooling fluid within the housing of the electronic device. The electronic device cooling system may further include a barrier system located in the electronic device housing, the barrier system guiding the first cooling fluid through one or more electronic components arranged in the electronic device enclosure to cool the Describe one or more electronic device components. The system includes a vapor compression system that generates a second cooling fluid. The heat exchanger exchanges heat between the first cooling fluid and the second cooling fluid. In some embodiments, the second cooling fluid is enhanced by a third cooling fluid.

In another aspect, an electronic device cooling system includes an electronic device housing that stores one or more electronic components for controlling a vapor compression system (eg, electric motor). The electronic device housing is hermetically sealed. The electronic device cooling system includes a barrier system located in the electronic device housing. The barrier system directs the first cooling fluid through the one or more electronic components to cool the one or more electronic components.

10‧‧‧HVAC & R system

12‧‧‧ building

14‧‧‧Vapor compression system

16‧‧‧Boiler

18‧‧‧Air distribution system

20‧‧‧Air return duct

22‧‧‧Air supply pipe

24‧‧‧Air processor

26‧‧‧Pipeline

28‧‧‧Floor

32‧‧‧Compressor

34‧‧‧Condenser

36‧‧‧Expansion valve or condensation device / expansion device / second expansion device

38‧‧‧Evaporator

40‧‧‧Electronic device housing

42‧‧‧Electronic device cooling system

50‧‧‧Motor

52‧‧‧Variable speed motor drive (VSD)

54‧‧‧Magnetic bearing

55, 58‧‧‧ tube bundle

56‧‧‧cooling tower

60S, 64, 95, 96, 120, 202‧‧‧ supply pipeline

60R, 66, 97, 122, 204 ‧‧‧ return pipeline

62‧‧‧Cooling load

68‧‧‧Expansion valve / expansion device

72‧‧‧Pump

84‧‧‧Intermediate circuit

86‧‧‧First expansion device

88, 94‧‧‧ inlet pipeline

90‧‧‧Intermediate container

92, 98‧‧‧ pipeline

100‧‧‧The first shell

102‧‧‧Second shell

104‧‧‧Export

106‧‧‧ entrance

108‧‧‧First cooling fluid

110‧‧‧ First cavity

112‧‧‧The second cavity

114‧‧‧Electronic device

116‧‧‧ Heat exchanger

118‧‧‧Second cooling fluid

124‧‧‧Fan

126‧‧‧Ball system

128‧‧‧Baffle

130‧‧‧Partition

132, 178, 228, 230 ‧‧‧ distance

134‧‧‧Housing wall

136‧‧‧ rear face

138、140‧‧‧Axial direction

142‧‧‧Condensate breathing valve

144‧‧‧fastener

146‧‧‧Fan enters the panel

148‧‧‧fastener

150‧‧‧Enclosure panel

152‧‧‧ Entrance chamber

154‧‧‧ out of the oral cavity

156‧‧‧Sealing element

170‧‧‧cooling (cold) plate

172、174‧‧‧T joint

200‧‧‧Third cooling fluid

220‧‧‧Guide plate

222‧‧‧Inner surface

224‧‧‧Top plate

226‧‧‧Surface

232‧‧‧protrusion

234‧‧‧Sag

250, 252‧‧‧ incision

254、256‧‧‧End

258‧‧‧Length

260‧‧‧ Orifice

280‧‧‧ adjustable partition

Figure 1 is a perspective view of a building that can utilize heating, ventilation, air conditioning, and refrigeration (HVAC & R) systems according to one aspect of the disclosure; Figure 2 is a vapor compression coupled to an electronic device cooling system according to an aspect of the disclosure Perspective view of the system; Figure 3 is a schematic view of a vapor compression system coupled to an electronic device cooling system according to an aspect of the present disclosure; Figure 4 is a schematic view of a vapor compression system coupled to an electronic device cooling system according to an aspect of the present disclosure; 5 is a cross-sectional view of an electronic device cooling system according to an aspect of the disclosure; FIG. 6 is a cross-sectional view of an electronic device cooling system according to an aspect of the disclosure; FIG. 7 is an electronic device cooling system according to an aspect of the disclosure 6 is a partial cross-sectional view within line 7-7; FIG. 8 is a partial cross-sectional view within line 7-7 of FIG. 6 of an electronic device cooling system according to an aspect of the disclosure; FIG. 9 is an aspect according to the disclosure 10 is a cross-sectional view of an electronic device cooling system; FIG. 10 is a cross-sectional view of an electronic device cooling system according to an aspect of the disclosure; FIG. 11 is a party according to the disclosure View of the baffle before the system electronics cooling system; and FIG. 12 in accordance with previous compartment based electronics cooling system according to an aspect of the disclosed system block view.

Embodiments of the present disclosure include an electronic device cooling system that cools electronic devices and protects the electronic devices from moisture, industrial gas / flue gas, and dust. The electronic device cooling system includes a hermetically sealed (or nearly hermetically sealed) electronic device housing to seal the first cooling fluid circulating within the electronic device housing from interaction with the fluid surrounding the housing. For example, the first cooling fluid may be air, and the electronics enclosure seals this air, and eliminates or reduces the interaction of the air inside the electronics enclosure with the humid or dirty air outside the electronics enclosure. As the first cooling fluid circulates within the electronic device housing, the first cooling fluid removes heat by forced convection to cool the electronic device. The first cooling fluid releases this energy to the second cooling fluid (eg, water, refrigerant) in the heat exchanger. The second cooling fluid may come from a vapor compression system, such as from a cooler that forms part of a heating, ventilation, air conditioning, and refrigeration (HVAC & R) system. Since the electronic device cooling system is hermetically sealed, the electronic device cooling system will cool and protect the electronic devices without direct exposure in various environments (eg, industrial areas, marine areas, desert areas, tropical areas, coastal areas, etc.) For outside air.

The second cooling fluid may be driven through the heat exchanger by a pressure difference, and / or may be driven by a pump. For example, the pressure difference can be created by fluidly coupling the electronics cooling system between the opposite ends of the evaporator tube bundle. In this way, a small portion of the higher pressure second cooling fluid flowing through the evaporator is transferred to the electronic device cooling system. The second cooling fluid flows through the electronic device cooling system heat exchanger to cool the first cooling by the then lower pressure second cooling fluid leaving the evaporator tube bundle before the first cooling fluid is extracted from the electronic device cooling system fluid. In some embodiments, the supply and return lines of the electronics cooling system can be coupled to other locations in the HVAC & R system to create a pressure differential across the electronics cooling system that drives the second cooling fluid without a pump. The electronic device cooling system may therefore not use a pump to drive the second cooling fluid through the heat exchanger, thereby reducing potential manufacturing and / or operating costs while increasing the reliability of the electronic device cooling system. However, in some embodiments, the second cooling fluid may be driven through the electronics cooling system by a pump. In still other embodiments, the pump may be assisted by the pressure difference in the HVAC & R system.

Turning now to the drawings, FIG. 1 is a perspective view of an embodiment of an environment for a heating, ventilation, air conditioning, and refrigeration (HVAC & R) system 10 in a building 12. Similar arrangements can also be applied to ocean-going ships. The HVAC & R system 10 may include a vapor compression system 14 (eg, a cooler) that supplies cooled liquid that can be used to cool the building 12. The HVAC & R system 10 may also include a boiler 16 that supplies warm liquid to heat the building 12 and an air distribution system 18 that circulates air through the building 12. The air distribution system 18 may also include an air return duct 20, an air supply duct 22, and / or an air handler 24. In some embodiments, the air handler 24 may include a heat exchanger connected to the boiler 16 and the vapor compression system 14 by piping 26. Depending on the operating mode of the HVAC & R system 10, the heat exchanger in the air handler 24 may receive heated liquid from the boiler 16 or cooled liquid from the vapor compression system 14. The HVAC & R system 10 is shown as having a separate air handler 24 on each floor 28 of the building 12, but in other embodiments, the HVAC & R system 10 may include a common between two or more floors 28 The air handler 24 and / or other components.

2 and 3 illustrate an embodiment of a vapor compression system 14 that can be used in HVAC & R system 10. Specifically, FIG. 2 is a perspective view of the vapor compression system 14, and FIG. 3 is a schematic view of the vapor compression system 14. The vapor compression system 14 may circulate the refrigerant through the circuit starting with the compressor 32. The circuit may also include a condenser 34, an expansion valve (s) or device (s) 36, and an evaporator 38. The vapor compression system 14 may further include an electronic device housing 40 that stores a plurality of different electronic devices for operating the vapor compression system 14. Some electronic devices that can be stored in the electronic device housing 40 include a digital converter (A / D), a microprocessor (s), one or more non-volatile memories, (s) Interface panel, etc. As will be explained in more detail below, the electronic device housing 40 forms part of the cooling electronic device of the electronic device cooling system 42 discussed above. In some embodiments, the electronic device housing 40 is a hermetically sealed container that reduces and / or prevents the electronic device from being exposed to a wet and dirty environment. In some embodiments, the electronics housing 40 may be the same as the housing containing the motor variable speed drive (VSD) 52 or the housing containing the components that control the magnetic bearings of the motor.

Some examples of fluids that can be used as refrigerants in the vapor compression system 14 are hydrofluorocarbon (HFC) -based refrigerants (such as R-410A, R-407, R-134a, hydrofluoroolefins (HFO), R1233zd, of R1234ze), "natural" refrigerants (e.g., ammonia _{(NH 3), R-717} , carbon dioxide _{(CO 2), R-744} ), or a hydrocarbon refrigerant, water vapor, or any suitable refrigerant. In some embodiments, the vapor compression system 14 may be configured to effectively utilize a refrigerant having a standard boiling point of about 19 degrees Celsius (86 degrees Fahrenheit) at one atmospheric pressure (as opposed to medium-pressure refrigerants such as R-134a, etc. (Called low-pressure refrigerant). As used herein, "standard boiling point" may refer to the boiling temperature measured at one atmospheric pressure.

In some embodiments, the vapor compression system 14 may use one or more of the following components: variable speed drive (s) 52, motor 50, compressor 32, condenser 34, expansion valve or condensing device 36, and / or Evaporator 38. The motor 50 drives the compressor 32 and may be powered by a variable speed drive (VSD) 52. The VSD 52 receives AC power having a specific fixed line voltage and fixed line frequency from an alternating current (AC) power source, and supplies power having a variable voltage and frequency to the motor 50. In other embodiments, the motor 50 may be directly powered by AC or direct current (DC) power. Motor 50 may include any type of electric motor that may be powered by VSD 52 or directly powered by an AC or DC power source, such as a switched reluctance motor, induction motor, electronically commutated permanent magnet motor, or other suitable motor. In some embodiments, the compressor 32 and / or motor 50 may use magnetic bearings 54 to reduce friction and / or noise during operation and increase compressor / motor reliability. The magnetic bearing 54 can be controlled by the electronic device housed in the electronic device housing 40. As explained above, the electronic device housing 40 can protect electronic devices from dust and moisture, and the electronic device cooling system 42 uses cooling fluid (eg, water, refrigerant) supplied by the vapor compression system 14 to cool the electronic devices .

The compressor may be a volumetric device 32 that compresses refrigerant vapor and delivers the vapor to the condenser 34 through the discharge passage. In some embodiments, the compressor 32 may be a centrifugal compressor. The refrigerant vapor delivered by the compressor 32 to the condenser 34 may transfer heat to the cooling fluid (eg, water or air) in the condenser 34. As a result of heat transfer with the cooling fluid, the refrigerant vapor may be condensed into a refrigerant liquid in the condenser 34. The liquid refrigerant from the condenser 34 can flow through the expansion device 36 to the evaporator 38. In the embodiment shown in FIG. 3, the condenser 34 is water-cooled and includes a tube bundle 55 connected to a cooling tower 56 (or a body of water surrounding the container) that supplies cooling fluid to the condenser 34.

The liquid refrigerant delivered to the evaporator 38 may absorb heat from another cooling fluid, which may or may not be the same cooling fluid used in the condenser 34. The liquid refrigerant in the evaporator 38 may undergo a phase change from liquid refrigerant to refrigerant vapor. As shown in the embodiment shown in FIG. 3, the evaporator 38 may include a tube bundle 58 coupled to the cooled fluid supply line 60S and the return line 60R. The supply line 60S and the return line 60R connect the cooler 14 to the cooling load 62. The cooling fluid of the evaporator 38 (eg, water, ethylene glycol, calcium chloride brine, sodium chloride brine, or any other suitable fluid) enters the evaporator 38 via the return line 60R and exits the evaporator 38 via the supply line 60S. The evaporator 38 may reduce the temperature of the cooling fluid in the tube bundle 58 via heat transfer with the refrigerant. The tube bundle 58 in the evaporator 38 may include multiple tubes and / or multiple tube bundles. In any case, the vapor refrigerant flows out of the evaporator 38 and returns to the compressor 32 through the suction line to complete the cycle.

As shown, the electronics cooling system 42 may be coupled to the tube bundle 58 in the evaporator 38 to receive the flow of cooling fluid from the HVAC & R system 10. The electronic device cooling system 42 uses a cooling fluid (eg, water) from the HVAC & R system 10 to cool the electronic devices within the electronic device housing 40. As explained above, the electronic device cooling system 42 may not include a pump, and may instead use the pressure differential in the HVAC & R system 10 to drive the flow of cooling fluid through the electronic device cooling system 42. For example, the supply line 64 of the electronic device cooling system 42 may access the end of the tube bundle 58 that receives the cooling fluid flowing through the return line 60R. After passing through the electronic device cooling system 42, the cooling fluid increases in temperature and pressure as it absorbs energy from the electronic devices disposed within the electronic device housing 40. The cooling fluid then returns to the supply line side of the tube bundle 58 through the return line 66. At this position in evaporator 38, the pressure of the cooling fluid in evaporator 38 will be lower than the pressure of the cooling fluid transferred from evaporator 38 through supply line 64. Without a pump, this pressure differential drives the flow of cooling fluid through the electronics cooling system 42.

In some embodiments, the supply line 64 and return line 66 of the electronic device cooling system 42 may be coupled to other locations in the vapor compression system 14 to create a pressure differential that drives the cooling fluid through the electronic device cooling system 42. For example, the supply line 64 (ie, the dashed supply line 64) may receive the cooling fluid (eg, refrigerant) leaving the condenser 34 after passing through the expansion valve / expansion device 68. The supply line 64 directs the cooling fluid through the electronic device cooling system 42 where the cooling fluid cools the first fluid through the cooling plate / cold plate before leaving through the return line 66 (ie, the dotted line return line 66) or Electronic devices. Since the cooling fluid leaving the expansion valve 68 is at a higher pressure than the cooling fluid in the evaporator 38, the return line 66 can then return the cooling fluid (ie, refrigerant) to the evaporator 38, without the pump, the pressure The differential drives the flow of cooling fluid through the electronics cooling system 42.

However, in some embodiments, one or more pumps 72 may drive the cooling fluid through the electronics cooling system 42. In still other embodiments, the pump (s) 72 may be assisted by the pressure difference in the HVAC & R system 10.

FIG. 4 is a schematic diagram of vapor compression system 14 with an intermediate circuit 84 incorporated between condenser 34 and evaporator 38. The intermediate circuit 84 may have an inlet line 88 directly fluidly connected to the condenser 34. In other embodiments, the inlet line 88 may be indirectly fluidly coupled to the condenser 34. As shown in the embodiment shown in FIG. 4, the inlet line 88 includes a first expansion device 86 positioned upstream of the intermediate container 90. In some embodiments, the intermediate container 90 may be a flash tank (eg, flash intercooler). In other embodiments, the intermediate vessel 90 may be configured as a direct expansion heat exchanger or economizer. In the embodiment shown in FIG. 4, the intermediate container 90 serves as a flash tank, and the first expansion device 86 is configured to reduce the pressure (eg, expansion) of the liquid refrigerant received from the condenser 34. During the expansion process, a portion of the liquid may vaporize, and therefore the intermediate container 90 may be used to separate the vapor from the liquid received from the first expansion device 86. In addition, since the liquid refrigerant experiences a pressure drop when entering the intermediate container 90 (for example, due to the rapid increase in volume when entering the intermediate container 90), the intermediate container 90 can further expand the liquid refrigerant. The vapor in the intermediate container 90 may be drawn by the compressor 32 to the intermediate pressure port of the compressor 32 through the inlet line 94. In other embodiments, the vapor in the intermediate container 90 may be drawn to the intermediate section of the compressor 32. Due to the expansion in the expansion device 86 and / or the intermediate container 90, the liquid collected in the intermediate container 90 may have a lower enthalpy than the liquid refrigerant leaving the condenser 34. The liquid from the intermediate container 90 can then flow through the second expansion device 36 to the evaporator 38 in line 92.

As shown, the electronic device cooling system 42 receives the cooling fluid from the vapor compression system 14. By using a heat exchanger, the electronic device cooling system 42 uses a cooling fluid to cool the electronic devices in the electronic device housing 40. As explained above, the electronic device cooling system 42 may not include a pump, and may instead use the pressure difference in the vapor compression system 14 to drive the flow of cooling fluid through the electronic device cooling system 42. For example, the supply line 96 to the electronic device cooling system 42 may be connected to a line 92 that transports liquid cooling fluid (ie, refrigerant) from the intermediate container 90 to the evaporator 38. After passing through the electronic device cooling system 42, the temperature of the cooling fluid increases. The cooling fluid returns to evaporator 38 through line 98, which is at a lower pressure than the cooling fluid flowing through line 92. As shown, the return line 98 is coupled to the evaporator 38. Since the cooling fluid leaving line 92 is at a higher pressure than the pressure in the evaporator 38, in the absence of a pump, the pressure differential drives the flow of cooling fluid through the electronics cooling system 42. However, in some embodiments, the pump 72 may assist and / or drive the cooling fluid (ie, liquid refrigerant from the evaporator 38) through the supply line 95 to the electronic device cooling system 42 and pass the cooling fluid through the return line 97 Return to evaporator 38.

FIG. 5 is a cross-sectional view of an embodiment of an electronic device cooling system 42. As explained above, the electronic device housing 40 forms part of the electronic device cooling system 42. The electronic device housing 40 is a hermetically sealed container that reduces and / or prevents the electronic device from being exposed to moisture, industrial smoke / gas, and dust in the environment. As shown, the electronic device housing 40 includes a first housing 100 that is coupled to a second housing 102. The first housing 100 and the second housing 102 are fluidly coupled together through an outlet 104 and an inlet 106. In some embodiments, there may be multiple inlets 106 and outlets 104 (eg, 2, 3, 4, 5, or more). The outlet 104 and the inlet 106 enable a cooling fluid 108 (eg, air) to circulate between the first cavity 110 in the first housing 100 and the second cavity 112 in the second housing 102 to cool the electronic device 114. The electronic device 114 may include microchips, integrated circuits, power supplies, transistors, resistors, inductors, transformers, IGBTs, and the like. Advantageously, the electronic device cooling system 42 limits and / or prevents direct interaction between the cooling fluid 108 and the fluid outside the electronic device housing 40. In this way, the electronic device housing 40 can prevent and / or reduce the exposure of the electronic device 114 to moisture, industrial smoke / gas, and / or dust in the environment. For example, the cooling fluid 108 (eg, air) may not be exposed to humid / humid air circulating around the outside of the electronic device housing 40.

To remove heat from the cooling fluid 108, the electronic device cooling system 42 includes a heat exchanger 116 (eg, a gas to liquid heat exchanger). The heat exchanger 116 receives the second cooling fluid 118 through the supply line 120. The second cooling fluid 118 comes from the vapor compression system 14 and may be refrigerant, water, or the like. In the heat exchanger 116, the second cooling fluid 118 exchanges energy with the first cooling fluid 108 circulating in the electronic device housing 40. After exchanging energy in the heat exchanger 116, the second cooling fluid 118 leaves the heat exchanger 116 at a higher temperature. The second cooling fluid 118 then leaves the electronics cooling system 42 and is transported to the HVAC & R system 10 through the return line 122.

After leaving the heat exchanger 116, a fan 124 is used to drive the first cooling fluid 108 into the second housing 102. More specifically, the fan 124 sucks the first cooling fluid 108 through the heat exchanger 116 and then blows the first cooling fluid 108 through the outlet 104 and into the inlet chamber 152. After passing through the outlet 104, the first cooling fluid 108 contacts the barrier system 126. As shown, the barrier system 126 redirects the flow of cooling fluid 108 and controls the flow of cooling fluid through the second housing 102. The baffle system 126 includes a baffle 128 and a baffle 130. The baffle 130 is coupled to the second housing 102 and spaces the baffle 128 from the housing wall 134 at a distance 132. In some embodiments, the distance 132 may be selected to optimize the flow and pressure drop of the cooling fluid 108. In addition to spacing the baffle 128 from the housing wall 134, the partition 130 also spaces the outlet 104 from the inlet 106 to form an inlet chamber 152 and an outlet chamber 154. Accordingly, when the cooling fluid 108 leaves the first housing 100 through the outlet 104, the partition 130 prevents the first cooling fluid 108 from flowing directly to the inlet 106 without passing through the baffle 128 and the attached electronic device 114.

When the first cooling fluid 108 leaves the outlet 104, the first cooling fluid contacts the rear face 136 of the baffle 128. The first cooling fluid 108 is thus directed upward in the axial direction 138 (eg, vertical) in the inlet chamber 152. When the first cooling fluid 108 flows upward, it passes the baffle 128. After passing the baffle 128, the first cooling fluid 108 flows in the axial direction 140 (eg, downward). When the first cooling fluid 108 flows in the direction 140, this produces a cascade cooling effect that cools the electronic device 114. The first cooling fluid 108 then flows around the bottom of the baffle 128 where the first cooling fluid contacts the wall 134 of the second housing 102. The wall 134 and the baffle 128 guide the first cooling fluid 108 upward in the axial direction 138 through the exit chamber 154. As explained above, the partition 130 prevents direct fluid flow between the outlet 104 and the inlet 106. The first cooling fluid 108 is thus driven through the inlet 106 and into the heat exchanger 116 where it exchanges energy with the second cooling fluid 118 again.

Since the electronic device case 40 is hermetically sealed, the moisture in the first cooling fluid 108 may not increase. However, the initial moisture in the first cooling fluid 108 may condense within the cavity 110 where the heat exchanger 116 and the supply line 120 produce the coldest surface. To facilitate removal of liquid from the electronics housing 40, the electronics cooling system 42 includes a condensate breathing valve 142. The condensate breathing valve 142 enables liquid to leave the electronics housing 40 while preventing and / or reducing external (environmental) fluid flow into the electronics housing 40. The condensate breathing valve 142 may be placed in the first housing 100 to capture the liquid condensed in the first cooling fluid 108 as it leaves the heat exchanger 116. In other words, as the first cooling fluid 108 leaves the heat exchanger 116, liquid may condense out of the first cooling fluid 108 and fall to the bottom of the first housing 100 in the direction 140 due to gravity. The liquid may then flow to the condensate breathing valve 142 where it is directed out of the first housing 100 in the direction 140. This process can therefore produce dry cold air in the cavities 110 and 112 that cools the electronic device 114 and protects the electronic device from moisture. In addition, in order to promote condensation and form a separation from any condensate cold electronics 114, the heat exchanger 116 is placed within the first housing 100. As explained above and referring to FIG. 5, the first shell 100 and the second shell 102 are separated by a wall 134 that prevents the minimal condensate formed in the first shell 100 from flowing into the second shell 102.

In some embodiments, the first housing 100 and the second housing 102 are coupled together as separate housings. For example, the first housing 100 and the second housing 102 may be coupled together by fasteners 144. When coupled, the first housing 100 and the second housing 102 may form a fluid-tight seal that prevents and / or reduces external (environmental) fluid from entering the electronic device housing 40. The sealing element 156 may be used to form a fluid-tight seal, such as using gaskets, welding, polymer seals (e.g., O-rings, etc.), brazing, adhesives, and the like. In some embodiments, the first housing 100 and the second housing 102 may be integrated with each other (eg, in one piece). Although the illustrated first housing 100 and second housing 102 have different sizes, in some embodiments they may be the same size.

To facilitate access to the cavities 110 and 112, the first housing 100 and the second housing 102 may have access panels. For example, the first housing 100 may include a fan access panel 146. The fan entry panel 146 is coupled to the first housing 100 by one or more fasteners 148 (eg, threaded fasteners like bolts, screws). The fan access panel 146 enables access to the replacement and / or maintenance of the fan 124. When coupled to the housing 40, the fan entry panel 146 forms a fluid-tight seal with the first housing 100 using gaskets, brazing, adhesives, etc. to prevent and / or reduce fluid contact with the outside of the housing 40 surrounding the electronic device. The electronic device 114 can also be accessed by the housing panel 150 coupled to the second housing 102. The housing panel 150 may likewise be coupled to the second housing 102 by fasteners (eg, threaded fasteners like bolts, screws, etc.). The housing panel 150 may also form a fluid-tight seal with the second housing 102 using gaskets, brazing, adhesives, etc. to prevent and / or reduce fluid contact with the outside of the electronic device housing 40.

FIG. 6 is a cross-sectional view of an embodiment of an electronic device cooling system 42. The electronic device cooling system 42 in FIG. 6 circulates the first cooling fluid 108 through the first housing 100 and the second housing 102 to cool the electronic device 114. However, in order to provide additional cooling, the electronic device cooling system 42 may include one or more cooling (cold) plates 170. The cooling (cold) plate 170 may improve heat transfer from one or more electronic components 114. For example, some electronic components 114 may generate more heat than other electronic components. Such electronic components 114 may thus increase the heat transfer requirements of the electronic device cooling system 42. Therefore, the electronic device cooling system 42 may include a cooling (cold) plate 170 to enable more direct heat transfer from the electronic device to the second cooling fluid 118. As shown in FIG. 6, the cooling (cold) plate 170 may directly receive the second cooling fluid 118 and circulate it. The supply line 120 and the return line 122 may include corresponding T-joints 172 and 174. As shown in FIG. 6, the T-shaped joints 172, 174 enable the second cooling fluid 118 to flow into and out of the heat exchanger 116 and the cooling (cold) plate 170. The second cooling fluid 118 may be water or refrigerant.

Since the cooling (cold) plate 170 is located in the second housing 102, the cooling (cold) plate 170 may form condensate in the second housing 102. To reduce potential contact between the condensate formed by the cooling (cold) plate 170 and the electronic device 114, the cooling (cold) 170 may be positioned at the bottom of the baffle 128 in the direction 140. Accordingly, if condensate is formed on the cooling (cold) plate 170, the condensate may fall to the bottom of the second housing 102 in the direction 140 without contacting any other electronic device 114. To remove condensate, the second housing 102 may include second condensate breathing valves 142, 176. As explained above, the condensate breathing valve 176 enables the electronics cooling system 42 to remove liquid from the first housing 100 and / or the second housing 102. However, in some embodiments, since the heat exchanger 116 and the supply line 120 condense out of the moisture in the cooling fluid before the cooling fluid 108 reaches the second housing 102, the cooling (cold) plate 170 may be inside the second housing 102 No condensate formed.

In some embodiments, the electronic device cooling system 42 may include an additional barrier system 126 to house and cool more electronic components 114. As shown in FIG. 6, the electronic device cooling system 42 includes a first barrier system 126 coupled to the wall 134 of the second housing 102 and a second barrier system 126 coupled to the housing panel 150. The baffles 128 of the respective first and second barrier systems 126 may be spaced apart by a distance 178 to facilitate the flow of the first cooling fluid 108 through the electronics 114. The distance 178 may be optimized to facilitate the required heat transfer from the electronic device 114 to the cooling fluid 108.

7 is a partial cross-sectional view of the embodiment of the electronic device cooling system 42 within line 7-7 of FIG. As explained above, the electronic device cooling system 42 in FIG. 7 circulates the first cooling fluid 108 through the first housing 100 and the second housing 102 to cool the electronic device 114. To provide additional cooling, the electronic device cooling system 42 may include one or more cooling (cold) plates 170. The cooling (cold) plate 170 may improve heat transfer from one or more electronic components 114. For example, some electronic components 114 may generate more heat than other electronic components. Therefore, the electronic device cooling system 42 may include a cooling (cold) plate 170 to enable more direct heat transfer from the electronic device to the second cooling fluid 118. However, before redirecting the second cooling fluid 118 to flow through the heat exchanger 116, the electronic device cooling system 42 may first direct the second cooling fluid 118 to the cooling (cold) plate 170 instead of causing the flow of the second cooling fluid 118 Shunt.

8 is a partial cross-sectional view of the embodiment of the electronic device cooling system 42 within line 7-7 of FIG. As explained above, in order to provide additional cooling, the electronic device cooling system 42 may include one or more cooling (cold) plates 170. The cooling (cold) plate 170 may improve heat transfer from one or more electronic components 114. However, the electronic device cooling system 42 may first direct the second cooling fluid 118 to the heat exchanger 116, after which the second cooling fluid 118 is directed to the cooling (cold) plate 170 instead of first guiding the second cooling fluid 118 Lead to the cooling (cold) plate 170. By first directing the second cooling fluid 118 through the heat exchanger 116, the electronic device cooling system 42 can heat the second cooling fluid 118 and reduce condensation in the second housing 102 while cooling one or more electronic components 114.

9 is a cross-sectional view of an embodiment of an electronic device cooling system 42. As explained above, the electronic device cooling system 42 may include one or more cooling (cold) plates 170. The cooling (cold) plate 170 may improve heat transfer from one or more electronic components 114. For example, some electronic components 114 may generate more heat than other electronic components. Such electronic components 114 may thus increase the heat transfer requirements of the electronic device cooling system 42. However, the cooling (cold) plate 170 may be separately supplied with the third cooling fluid 200. The third cooling fluid 200 flows into and out of the cooling (cold) plate 170 through corresponding supply lines 202 and return lines 204. In some embodiments, the second cooling fluid 118 and the third cooling fluid 200 may be the same cooling fluid. For example, the second cooling fluid 118 and the third cooling fluid 200 may be water, refrigerant, or the like. In another embodiment, the second cooling fluid 118 and the third cooling fluid 200 may be different. For example, the second cooling fluid 118 may be water, and the third cooling fluid 200 may be a refrigerant, or vice versa.

10 is a cross-sectional view of an embodiment of an electronic device cooling system 42. In some embodiments, the barrier system 126 may include one or more additional guide plates 220. The guide plate 220 assists in controlling the flow of the first cooling fluid 108 through the second housing 102. As shown, the guide plate 220 is coupled to the inner surface 222 of the top plate 224 of the second housing 102. The guide plate 220 extends away from the inner surface 222 in the direction 140. The guide plate 220 may extend over a part or the entire baffle 128 to guide the flow of the first cooling fluid 108. As shown, the first cooling fluid 108 flows upward and flows through the baffle 128. After passing the baffle 128, the first cooling fluid 108 contacts the surface 226 of the guide plate 220. The guide plate 220 guides the first cooling fluid 108 down the direction 140 and past the electronic device 114. In this way, the guide plate 220 concentrates the flow of the first cooling fluid 108 on the electronic device 114 to promote heat transfer. In some embodiments, the distance 228 between the surface 226 of the guide plate 220 and the baffle 128 may be increased or decreased to control the characteristics of the fluid flow on the electronic device 114. The increased flow velocity may increase turbulence, causing more heat to be transferred from the electronic device 114. For example, by reducing the distance 228, the guide plate 220 can increase the flow speed of the first cooling fluid 108 on the electronic device 114. Likewise, if the distance 228 is increased, the guide plate 220 may reduce the flow speed of the first cooling fluid 108 on the electronic device 114. In this way, the electronic device cooling system 42 may use the guide plate 220 to guide and customize the heat transfer between the first cooling fluid 108 and the electronic device 114.

As shown, the surface 226 of the guide plate 220 is flat; however, in some embodiments, the surface 226 may be curved or otherwise shaped to promote heat transfer at different locations along the guide plate 220. For example, the distance 230 between the guide plate 220 and the baffle 128 may increase and / or decrease at different points along the length 230 to customize and / or optimize the heat transfer on different electronic devices 114 (eg, increase Or reduce the flow velocity on different electronic devices 114). In some embodiments, the guide plate 220 may include protrusions 232 and / or recesses 234 instead of changing the curvature of the guide plate at different points along the length 230 of the guide plate 220. The protrusion 232 and the recess 234 may similarly control the flow speed and flow rate of the first cooling fluid 108 on the specific electronic component 114, and thus control the heat transfer characteristics.

To access the electronic device 114, the guide plate 220 may be removably coupled with the second housing 102. For example, the guide plate 220 may be coupled to the second housing 102 by a snap connection, a bayonet connection, or the like. In some embodiments, the guide plate 220 may be removably coupled using fasteners (eg, threaded fasteners).

FIG. 11 is a front view of an embodiment of the barrier system 126. As shown, the baffle 128 may have another shape than rectangular or square. For example, the baffle 128 may have an irregular shape to control the flow of the first cooling fluid 108 on the electronic device 114. In FIG. 11, the plate 128 includes rectangular cutouts 250 and 252 at corresponding ends 254 and 256 of the baffle 128. However, the cutouts 250, 252 may be located at different positions along the length 258 of the baffle 128, have different sizes, and / or different shapes (eg, semicircular, triangular, square, etc.) to customize / control the first cooling The flow of the fluid 108 on the electronic device 114. As shown, because the cut 252 is larger than the cut 250, the baffle 128 directs more of the first cooling fluid 108 through the electronic device 114 at or near the end 256 of the baffle 128. It should be noted that the cutouts 250, 252 may be placed on the baffle 128 at any position above and / or below the baffle 130 to control the flow of the first cooling fluid 108 on the electronic device 114.

In some embodiments, the baffle 128 may also include an orifice 260. The orifice 260 enables the first cooling fluid 108 to pass through the orifice 260 instead of flowing upward and through the baffle 128. This enables a customized and / or optimized fluid flow of the first cooling fluid 108 on specific electronic devices 114. Although two orifices 260 are shown in FIG. 11, in other embodiments, there may be different numbers of orifices 260, such as 1, 3, 4, 5, 6, 7, 8 , 9, 10 or more. In addition, the orifice 260 may have different shapes and / or sizes in order to customize and / or optimize the flow of the first cooling fluid 108 on the electronic device 114.

Figure 12 is a front view of an embodiment of the barrier system 126. As shown, the barrier system 126 includes a baffle 128 and a baffle 130. As seen in FIG. 11, the barrier system 126 includes an adjustable barrier 280 instead of using irregularly shaped baffles 128 and / or orifices 260 to control the flow of the first cooling fluid 108. The adjustable barrier 280 is coupled to the respective ends 254 and 256 of the baffle 128. The adjustable baffle 280 may be vertically repositioned in directions 138 and 140 to customize the flow of the first cooling fluid 108 on the electronic device 114. Although FIG. 12 uses an adjustable barrier 280 to control the flow of the first cooling fluid 108, in some embodiments, the barrier system 126 may include an adjustable barrier 280, an orifice 260, and cutouts 250 and 252. Combined to control the flow of the first cooling fluid 108 on the electronic device 114.

Although only certain features and embodiments of the present disclosure are shown and described, those skilled in the art can think of many modifications and changes (for example, the size, dimensions, structure, shape and ratio of various elements, and the values of parameters (for example, Temperature, pressure, etc.), installation arrangements, use of materials, changes in color, orientation, etc.) without substantially departing from the novel teachings and advantages of the subject matter described in the scope of the patent application. The order or sequence of any process or method steps may be changed or reordered according to alternative embodiments. Therefore, it should be understood that the scope of the attached patent application is intended to cover all such modifications and changes as falling within the true spirit of the present invention. Furthermore, in order to provide a brief description of the exemplary embodiments, all features of the actual implementation may not be described (ie, those features that are not related to the best mode currently contemplated for carrying out the invention or those that are not related to the realization of the protected invention ). It should be understood that in the development of any such actual implementation (as in any project or design), a large number of implementation-specific decisions must be made. Such development work may be complicated and time-consuming, but for ordinary technicians who benefit from this disclosure, this is still conventional design, production, and manufacturing work without undue experimentation.

Claims (20)

    An electronic device cooling system includes: an electronic device housing, wherein the electronic device housing is hermetically sealed; a heat exchanger, the heat exchanger is configured as a first cooling fluid and vapor in the electronic device housing Heat is exchanged between the second cooling fluid of the compression system; a fan configured to circulate the first cooling fluid within the electronics housing; and a barrier system, the barrier system is located in the electronic Within the device housing, wherein the barrier system is configured to direct the first cooling fluid through one or more electronic components disposed within the electronic device housing to cool the one or more electronic components.         The system of claim 1, comprising a condensate breathing valve coupled to the electronics housing, wherein the condensate breathing valve is configured to release liquid condensed in the electronics housing .         The system of claim 1, wherein the electronic device housing includes a first housing, and the first housing is configured to hold the heat exchanger and the fan.         The system of claim 3, wherein the electronic device housing includes a second housing, and the second housing is configured to support the barrier system and hold the one or more electronic components.         The system of claim 4, wherein the first housing and the second housing are fluidly coupled together via an inlet and an outlet, and wherein the inlet and outlet enable the first cooling fluid to The first casing and the second casing circulate.         The system of claim 5, wherein the barrier system includes a baffle plate and a baffle plate coupled to the baffle plate, and wherein the baffle plate is positioned between the inlet and the outlet to The first cooling fluid is forced to flow through the baffle.         The system of claim 6, wherein the barrier system includes an adjustable barrier that is coupled to the baffle, wherein the adjustable barrier is configured relative to The baffle moves to regulate the flow of the second cooling fluid on the one or more electronic components.         The system of claim 1, comprising a cooling plate coupled to the barrier system, wherein the cooling plate is configured to be coupled to the one or more electronic components and cool the one or Multiple electronic components.         The system of claim 8, wherein the cooling plate is configured to receive a third cooling fluid from the vapor compression system to cool the one or more electronic components.         The system of claim 9, wherein the first cooling fluid and the third cooling flow system are different.         A system includes: an electronic device cooling system including: an electronic device housing, wherein the electronic device housing is hermetically sealed; a heat exchanger; a fan, the fan configured to cool the first Fluid circulates within the electronic device housing; and a barrier system located within the electronic device housing, wherein the barrier system is configured to direct the first cooling fluid through one or more electrons Components to cool the one or more electronic components; and a vapor compression system configured to generate a second cooling fluid; wherein the heat exchanger is configured to Heat is exchanged between the second cooling fluids.         The system according to claim 11, wherein the vapor compression system is a cooler.         The system according to claim 12, wherein the second cooling stream system water.         The system of claim 12, wherein the second cooling flow system refrigerant.         The system of claim 11, including the one or more electronic components, wherein the one or more electronic components are configured to control operation of the vapor compression system.         An electronic device cooling system includes: an electronic device housing configured to store one or more electronic components for controlling a vapor compression system, wherein the electronic device housing is hermetically sealed; and a barrier The barrier system is located within the electronics enclosure, wherein the barrier system is configured to direct a first cooling fluid through the one or more electronic components to cool the one or more electronic components.         The system of claim 16, wherein the barrier system includes a barrier that couples the barrier system to the electronics enclosure.         The system of claim 17, comprising a baffle plate coupled to the baffle plate, wherein the baffle plate is configured to support the electronic component.         The system of claim 18, including an adjustable baffle coupled to the baffle, wherein the adjustable baffle is configured to be coupled to the baffle at different positions A baffle to control the flow of the first cooling fluid on the electronic component.         The system of claim 18, wherein the baffle defines one or more holes that direct the first cooling fluid through the electronic component.